TWI627400B - Defective rejection method for passive component batch detection and rejection system thereof - Google Patents

Abstract

A defective component rejection method for passive component batch detection and a rejection system thereof, the method comprising: first providing a tape carrier carrying and adhering a plurality of passive components; and secondly performing defect detection of the passive components to obtain at least a detection information of the position of the defective component defect; then performing at least one passive component defect rejection, analyzing the detection information by a defect rejection system, and automatically removing the corresponding passive component defect from the tape carrier, In order to fully automate the entire passive component defect rejection process, the rejection efficiency is improved and the correct rate is eliminated.

Description

Defective rejection method for passive component batch detection and its rejection system

The invention relates to a defect rejection method for a passive component batch detection and a rejection system thereof, and particularly relates to a method for automatically eliminating one or more passive component defect elimination and rejection and a rejection system thereof according to the detection result.

At present, most of the defect rejection schemes for electronic component detection are applied to a single-row conveyor belt, mainly by placing the electronic components to be tested on the carrier of the single-row conveyor belt, and in the single row type. The defect detection device and the defect rejection device are respectively arranged in the traveling direction of the conveyor belt, and after the defect detection is performed, the defective product is recorded at the position of the conveyor belt carrier, and the carrier transport carrying the defective product is rejected by the defect. In the case of the device, the electronic components on the carrier are blown away from the single-row conveyor.

However, the defect culling device described above is not applicable to a load-bearing structure having a plurality of electronic components to be tested on the same carrier, because a plurality of electronic components on the carrier may have only a small number of defective products. Defects are excluded and cannot be picked out and excluded. Therefore, after a plurality of electronic components are mounted on a carrier for detection, only the defective product can be manually removed from the carrier, so that it is difficult to obtain improvement in rejection efficiency and rejection accuracy.

The object of the present invention is to apply a defect rejection system by reading and analyzing After the defect detection test information, the position of the passive component defect is converted, and the mechanical structure of the defect rejection system is automatically driven, and the passive component defect of the position is removed from the tape carrier.

The technical solution of the passive component defect rejection method of the present invention is that the present invention provides a defect rejection method for passive component batch detection, the steps of which include: providing a carrier and adhering in a two-dimensional array or an irregular arrangement a tape carrier of the passive components; performing defect detection of the passive components to obtain a detection information including at least one location of the defective component defect having defects; performing at least one passive component defect removal, to a defective product The reject system parses the detection information and removes the corresponding passive component defect from the tape carrier.

In one embodiment, the defect rejection system is a reciprocating ejector mechanism that strikes the passive component defect, thereby moving the passive component defect away from the tape carrier, and the defect rejection system is blown. The nozzle mechanism blows the passive component defect away from the tape carrier or draws the passive component defect away from the tape carrier by an air suction nozzle mechanism.

In one embodiment, the adhesive tape of the adhesive tape adheres to the passive component is a hot melt adhesive, and the defective reject system is an electric heating or UV illumination local heating mechanism, and the corresponding passive component defect is adhered. The area heats or illuminates the UV light to relieve adhesion, thereby causing the passive component defect to detach from the tape carrier.

In one embodiment, the defect rejection system further includes a blade, and the adhesive position of the tape carrier corresponding to the passive component defect is previously pre-cut by the blade before the passive component defect is removed from the tape carrier. Delineating at least one opening, or the defect rejection system further comprises a laser cutting mechanism, and before the passive component defect is removed from the tape carrier, the blade corresponds to the passive component defect Adhesive position of the tape carrier At least one opening.

In an embodiment, the detection information is image or numerical data.

In an embodiment, after the step of removing at least one passive component defect, the method further includes a securing step of detecting whether the passive component defect of the passive component defect location in the detection information is completely removed, or To detect whether any of the passive components except the location of the passive component defects in the detection information are rejected.

In one embodiment, the defect rejection system is moved using a multi-axis robotic arm or a multi-axis motion platform device.

The invention provides a defective component rejection system for passive component batch detection, comprising: a space moving unit for driving a moving mechanism according to a culling command to accurately move within a working range of a 3-dimensional space coordinate; a tape carrier positioning unit for positioning a tape carrier that has been subjected to batch detection and having a plurality of passive components, correspondingly positioned within the working range; a component release unit is disposed on the mobile unit and After receiving the transport to the position of the passive component having the defect, the culling instruction is used to remove the passive component defect from the tape carrier; an input unit for reading or receiving the batch detection The passive component generates one of the detection information, the detection information includes a location of at least one defective component defect having a defect; a processing unit electrically connecting the input unit, the spatial mobile unit, and the component separation unit, For analyzing the detection information, and correspondingly converting the position of the defective component with defects into the space movement The culling command is generated after the coordinate position of the working range of the unit, and the culling command includes an instruction to move the component out of the cell to a coordinate position of the corresponding working range and an instruction to cause the component to be detached from the cell.

The invention is characterized in that the invention can be based on batch type passive component defect detection The detection information automatically analyzes the relative position of the passive component defect, and then removes the passive component defect by the mechanical structure of the defect rejection system, and the entire passive component defect elimination process is completely automated, which can improve the rejection efficiency and eliminate Correct rate. In addition, the present invention further detects, after the defective product rejection system rejects the passive component defect, further detecting whether the passive component defect is completely rejected or detected in the batch detection information except the passive component defect location. Whether any of the passive components are rejected, thus ensuring the correct rate of automated rejection.

10‧‧‧ tape carrier

11‧‧‧ glue layer

111‧‧‧Hot melt adhesive

20‧‧‧ Passive components

21‧‧‧ Passive component defects

30‧‧‧Defective reject system

301‧‧‧Space Mobile Unit

3011‧‧‧Mobile agencies

3012‧‧‧Scope of work

302‧‧‧ Tape carrier positioning unit

303‧‧‧Component separation unit

304‧‧‧ input unit

305‧‧‧Processing unit

31‧‧‧ thimble mechanism

32‧‧‧Blowing nozzle mechanism

33‧‧‧ Inhalation nozzle mechanism

34‧‧‧blade

341‧‧‧section shape

35‧‧‧Laser cutting mechanism

36‧‧‧Electrical local heating mechanism

37‧‧‧UV-illuminated local illumination mechanism

38‧‧‧ openings

A‧‧‧Test information

B‧‧‧ omitting instructions

Steps S10~Step S30‧‧‧Steps for rejecting defective parts of batch components

Step S40‧‧‧Steps to ensure the defective product rejection method for passive component batch detection

1 is a flow chart of steps of an embodiment of a method for rejecting defective parts of a passive component of the present invention; FIG. 2 is an irregular part of a passive component rejection method for passive component batch detection according to the present invention; FIG. 3 is a plan view showing the passive component defect detection method of the passive component batch detection method according to the embodiment of the present invention; FIG. 3 is a passive component two-dimensional array arrangement arrangement method of the passive component batch detection method of the present invention. And a schematic diagram of a passive component defect is detected; FIG. 4 is a schematic block diagram of an embodiment of a passive component rejection system for passive component batch detection according to the present invention; FIG. 5 is a schematic diagram of a passive component batch detection defect of the present invention. FIG. 6 is a schematic diagram of a method for removing defective components of a passive component batch detection according to an embodiment of the present invention; FIG. A schematic diagram of the nozzle mechanism blowing the passive component defect away from the tape carrier; FIG. 7 is a schematic diagram of the passive component rejection method for passive component batch detection according to an embodiment of the present invention. FIG. 8 is a schematic diagram of a method for removing a defective component from a passive component batch detection method according to an embodiment of the present invention; FIG. 9 is a schematic diagram of removing an adhesive component from a tape carrier by an electrothermal local heating mechanism; The invention discloses a schematic diagram of the defective component rejection method of the passive component batch detection according to an embodiment. The schematic diagram of removing the passive component defect from the tape carrier by the photothermal local heating mechanism; FIG. 10 is a defect rejection of the passive component batch detection according to the present invention. FIG. 11 is a schematic view showing the bottom surface of the adhesive tape of the cutting tape carrier of FIG. 10; FIG. 12 is a schematic diagram of the defective component of the passive component batch detection according to the present invention; In one embodiment, a laser cutting mechanism pre-cuts the adhesive position of the tape carrier.

The embodiments of the present invention are described in detail below with reference to the accompanying drawings, in which FIG. The components shown are not drawn in the number, shape, size ratio, etc. at the time of implementation, and the actual size of the implementation is a selective design, and the component layout form may be more complicated.

First, please refer to FIG. 1 to FIG. 5. In the embodiment of the present invention, the defective component rejection method for the passive component batch detection includes the following steps:

Step S10: providing a tape carrier 10 carrying and adhering a plurality of passive components 20, wherein at least one surface of the tape carrier 10 has a glue layer 11, and the passive components to be detected The 20 series is adhered to the adhesive layer 11 of the tape carrier 10 in a two-dimensional array arrangement or an irregular arrangement.

Step S20: performing defect detection of the passive components 20 to detect a detection information A including at least one location of the defective passive component 21 having a defect, wherein the defect may be a defective product that does not meet the detection standard. Or, it is impossible to confirm whether the re-confirmation of the detection standard is met. The defect detection of the passive components 20 may be a detection device such as ultrasonic defect detection, appearance image defect detection or electrical connection defect detection, and obtained after the above defect detection. The detection information A can be image type image data or numerical data.

Step S30: performing culling of at least one passive component defect 21, reading and parsing the detection information A by an input unit of the defective reject system 30, and further locating the defective passive component defect 21 (for example, a relative After the coordinate point or coordinate range of a reference datum on the tape carrier corresponds to or is converted to a coordinate position in a range in which the multi-axis robot or multi-axis motion platform of the defect rejection system 30 can move, the drive The defective rejects the multi-axis robotic arm or multi-axis motion platform of system 30 to remove corresponding passive component defects 21 from the tape carrier 10.

It is to be noted that, after performing the above step S30, the present invention may further include a securing step, that is, step S40: applying a detecting means (for example, the image of the tape carrier 10 after the passive component defect 21 is removed by image detection. Comparing the images of the tape carrier 10 before the rejection of the passive component defect 21 with each other) detecting whether the passive component defect 21 of the position of the passive component defect 21 in the detection information A of the batch is completely rejected, or detecting the batch Whether or not any of the passive components 20 except the position of the passive component defect 21 is rejected in the detection information A, thereby ensuring that the defective reject system 30 can eliminate the passive component defect 21 of the batch. Rely on sex.

Specifically, please refer to FIG. 4 again. The defective component rejecting system 30 for passive component batch detection comprises: a space moving unit 301, a tape carrier positioning unit 302, a component detaching unit 303, an input unit 304, and a processing unit 305. The space moving unit 301 is configured to drive a moving mechanism 3011 according to a culling command B to accurately move within a working range 3012 of a 3-dimensional space coordinate; the tape carrier positioning unit is configured to perform batch type The tape carrier 10 that is loaded and adhered to the plurality of passive components 20 is correspondingly positioned within the working range 3012; the component detaching unit 303 is disposed on the moving mechanism 3011 and is transported to the passive component defect having defects After the product 21 is located, according to the culling command B, the passive component defect 21 is removed from the tape carrier 10; the input unit 304 is configured to read or receive the passive components 20 by the batch detection. And one of the output information A, the detection information A includes at least one location of the defective passive component defect 21; the processing unit is electrically connected to the input unit, the spatial mobile unit and the component is separated from the unit, To analyze the detection information A loaded by the input unit 304, and accordingly, the location of the passive component defect 21 having the defect (generally corresponding to the tape carrier 10) After the specific coordinate point is converted to the coordinate position of the working range 3012 of the spatial moving unit 301, the culling instruction B is generated, and the culling instruction B includes moving the component detaching unit 303 to the corresponding working range. The command of the coordinate position of 3012 and the command to disengage the component from the unit 303 to perform the culling operation.

In detail, as shown in Figure 5. The defect rejecting system 30 (the component detaching unit 303) is moved by a reciprocating ejector mechanism 31 to the position of the passive component defect 21 and impacted, thereby moving the passive component defect away from the tape carrier. 10.

In an embodiment, as shown in FIG. The defective reject system 30 The detachment unit 303) blows the passive component defect 21 away from the tape carrier 10 by a blow nozzle mechanism 32 that moves to the position of the passive component defect 21, or the defect rejection system 30, as shown in FIG. The passive component defect 21 is sucked away from the tape carrier 10 by an inhalation nozzle mechanism 33 moving to the position of the passive component defect 21.

In an embodiment, as shown in FIG. The adhesive layer 10 adheres the adhesive layer 10 of the passive component 20 to a hot melt adhesive (when heated to a specific temperature, the fixed colloid can be liquefied, thereby releasing the adhesive state), and the defective reject system 30 (the component The disengagement unit 303) is heated by the electrothermal local heating mechanism 36 (as shown in FIG. 8) to the adhesive layer 11 of the corresponding passive component defect 21 to remove the adhesiveness of the hot melt adhesive. The passive component defect 21 is detached from the tape carrier 10.

In another embodiment, as shown in FIG. The adhesive layer 10 of the adhesive tape carrier 10 is adhered to the ultraviolet light-melting adhesive (which is irradiated with UV light to release the adhesive state), and the defect rejection system 30 (the component release unit 303) is UV-illuminated. The local illumination mechanism 37 (shown in FIG. 9) irradiates the adhesive layer 11 of the corresponding passive component defect 21 with UV light to remove the adhesion of the ultraviolet melt adhesive, thereby making the passive component defective. The article 21 is detached from the tape carrier 10.

In addition, in practice, the adhesive layer 11 of the tape carrier 10 has a certain degree of adhesion, which can increase the removal of the passive component defect 21 to a certain extent, so before the passive component defect 21 is removed. The tape carrier 10 at the position of the passive component defect 21 can be cut open to an opening 38 in advance to moderately reduce the fixing strength of the passive component defect 21, as shown in FIGS. 10 and 11 : the defect rejection system 30 A blade 34 may be further included, and the blade 34 may be previously used before the passive component defect 21 is removed from the tape carrier 10 (of course, The moving mechanism 3011 performs movement to draw at least one opening 38 of the adhesive position of the tape carrier 10 corresponding to the passive component defect 21. Of course, in FIGS. 10 and 11, the cross-sectional shape 341 of the blade 34 is a cross type. Therefore, the opening 38 cut out in FIG. 11 has the same shape, and in the present invention, the sectional shape 341 of the blade 34 is not limited to the cross type, and the adhesion of the adhesive position of the adhesive layer 10 of the tape carrier 10 is lowered. The shape of the opening or slotting is feasible. Furthermore, as shown in FIG. 12, the manner in which the tape carrier 10 is cut may be as follows: the defect rejecting system 30 further includes a laser cutting mechanism 35 (of course, it may be moved by the moving mechanism 3011). And before the passive component defect 21 is removed from the tape carrier 10, the adhesive position of the tape carrier 10 corresponding to the passive component defect 21 is previously cut out by laser to at least one opening 38.

The embodiments or examples of the technical means used herein are not intended to limit the scope of implementation of the patent. All changes and modifications in accordance with the scope of this patent application, or in accordance with the scope of this patent, are covered by this patent.

Claims (15)

A defect rejection method for passive component batch detection, the method comprising: providing a tape carrier carrying and adhering a plurality of passive components arranged in a two-dimensional array or irregularly arranged; performing defect detection of the passive components to Detecting, at a time, a piece of detection information of at least one passive component defect having a defect in the passive component; performing at least one passive component defect rejection, and analyzing the detection information by a defect rejection system, further After the location of the defective passive component defect is corresponding to the coordinate position of the defect rejection system, the defective rejection system is driven to remove the corresponding passive component defect from the tape carrier, and the defect rejection system is applied. A multi-axis robotic arm or a multi-axis motion platform device performs the movement of the corresponding passive component defect position to perform the rejection of the passive component defect. The defective product rejection method for passive component batch detection according to claim 1, wherein the defect rejection system is a reciprocating ejector mechanism that strikes the passive component defect, and the passive component is further The defective product is removed from the tape carrier. The defect rejection method for batch component detection of the passive component according to claim 1, wherein the defect rejection system blows the passive component defect away from the tape carrier by a blow nozzle mechanism, or The passive component defect is aspirated from the tape carrier by an air suction nozzle mechanism. The defective product rejection method for passive component batch detection according to the second or third aspect of the patent application, wherein the defect rejection system further comprises a blade, and the passive component defect is removed from the tape carrier Previously, the adhesive position of the tape carrier corresponding to the passive component defect is previously drawn by the blade to at least one opening. The defect rejection method for batch component detection according to the second or third aspect of the patent application, wherein the defect rejection system further comprises a laser cutting mechanism, and the defective component is removed from the passive component Before the tape carrier, the adhesive position of the tape carrier corresponding to the passive component defect is cut out by at least one opening in advance by laser. The defect rejection method for batch component detection of the passive component according to claim 1, wherein the adhesive layer of the adhesive tape adheres to the passive component is a hot melt adhesive, and the defective rejection system is electrically heated. The local heating mechanism heats the adhesive layer of the corresponding adhesive component defect area to release the adhesiveness of the hot melt adhesive, thereby removing the passive component defect from the tape carrier. The defect rejection method for batch component detection of the passive component according to claim 1, wherein the adhesive layer of the adhesive tape adheres to the passive component is an ultraviolet light-melting adhesive, and the defective rejection system is UV-coated. The illumination type local illumination mechanism irradiates the glue layer of the corresponding passive component defect area with UV light to remove the adhesion of the ultraviolet light-melt glue, thereby removing the passive component defect from the tape carrier. The defect rejection method for batch component detection of the passive component according to claim 1, wherein the defect detection of the passive components is an ultrasonic defect detection, an appearance image defect detection or an electrical connection defect detection. The defect rejection method for batch component detection of the passive component as described in claim 1, wherein the detection information is image or numerical data. The method for rejecting the defective component batch detection according to the first aspect of the patent application, after the step of removing at least one passive component defect, further comprises a securing step, and applying a detecting means to detect the batch Passive position of passive component defect in the detection information Whether all of the defective parts of the component are rejected, or whether any of the passive components except the position of the passive component defect are detected in the detection information of the batch is rejected. A defective component rejection system for passive component batch detection, comprising: a space moving unit for driving a moving mechanism to accurately move in a working range of a 3-dimensional space coordinate according to a culling command; a tape carrier a positioning unit, configured to position a tape carrier that has been subjected to batch detection and adhered to a plurality of passive components arranged in a two-dimensional array or irregularly arranged in the working range; The moving mechanism is adapted to remove the passive component defect from the tape carrier according to the culling instruction after being transported to the position of the passive component having the defect; and an input unit for reading or receiving the The batch test detects a batch of the passive components to generate one of the detection information, the detection information includes a location of at least one defective component defect having a defect; and a processing unit electrically connected to the input unit, the The space moving unit and the component are separated from the unit for analyzing the detection information, and according to the defect of the passive component defect having defects After the position conversion corresponds to the coordinate position of the working range of the space moving unit, the culling instruction is generated, and the culling instruction includes an instruction to move the component off the unit to a coordinate position of the corresponding working range, and the component is detached from the unit. Excluding the action instruction, the space moving unit is a multi-axis robot arm or a multi-axis motion platform device. The defective component rejection system for batch component detection according to claim 11, wherein the component release unit is a ejector mechanism, and the mobile unit moves to the passive through the space After the component defect, the passive component defect is impacted according to the culling command, and the passive component defect is moved away from the tape carrier. The defective component rejection system for passive component batch detection according to claim 11, wherein the component release unit is a blow nozzle mechanism, and after moving to the passive component defect through the space moving unit, Disposing the passive component defect from the tape carrier according to the culling instruction, or the component detaching unit is an air suction nozzle mechanism, and after moving to the passive component defect through the space moving unit, according to the culling instruction, The passive component defect picks up the tape carrier. The defect rejection system for batch component detection of the passive component according to claim 11, wherein the adhesive layer of the adhesive tape adheres to the passive component is a hot melt adhesive, and the component is separated from the unit. The electrothermal local heating mechanism for heating the adhesive layer of the passive component defect area to dissipate the adhesion of the hot melt adhesive. The defect rejection system for batch component detection of the passive component according to claim 11, wherein the adhesive layer of the adhesive tape adheres to the passive component is an ultraviolet light-melting glue, and the component is separated from the unit. The adhesive layer of the passive component defect is irradiated with UV light to remove the UV-light localized illumination mechanism of the adhesive of the ultraviolet light-melting adhesive.