JP2021163777A - Mounter - Google Patents

Abstract

To provide a mounter capable of increasing the efficiency of maintenance work for removing foreign matter adhering to a push-up pin and capable of suppressing a failure caused by the adhesion of the foreign matter.SOLUTION: A head control part 54 controls a head unit 25, to allow the execution of a part mounting operation for mounting a part on a substrate supported by a push-up pin 282 and to allow the execution of a pin conveyance operation for conveying the push-up pin 282 from a push-up plate 281 to a pin station 29, after the completion of the part mounting operation. During the execution of the pin conveyance operation of the head unit 25, a first imaging part 31 performs a first pin imaging operation for imaging the push-up pin 282 sucked and held by the suction nozzle 2511 of the head unit 25 from the lower side, to acquire a pin inspection image G2. An analysis part 56 analyzes the presence/absence of the adhesion of the foreign matter to the push-up pin 282 on the basis of the pin inspection image G2.SELECTED DRAWING: Figure 1

Description

The present invention relates to a mounting machine including a head unit for mounting components on a substrate supported by push-up pins.

Conventionally, mounting machines for mounting electronic components (hereinafter, simply referred to as “components”) on a substrate such as a printed wiring board have been known. This type of mounting machine includes a board support unit that supports a board and a head unit that mounts components on the board. The board support unit includes a push-up plate and a push-up pin that is detachably mounted on the upper surface of the push-up plate. The board support unit supports the board from below by push-up pins erected on the push-up plate.

By the way, foreign matter such as parts may fall on the push-up plate for some reason. In this case, foreign matter on the push-up plate may adhere to the push-up pin. If foreign matter adheres to the push-up pin, the support performance of the substrate may deteriorate. Furthermore, when the push-up pin is replaced, the push-up pin is held by the head unit, and when the head unit is moved to the pin station for storing the push-up pin in this state, it adheres to the push-up pin. Foreign matter may interfere with the structure of the mounting machine. Further, the push-up pin cannot be stored in the pin station in the normal posture due to a foreign substance, which may cause interference between the push-up pin stored in the pin station and the head unit.

Therefore, maintenance work such as removing foreign matter adhering to the push-up pin is regularly performed by the operator. For example, when minute parts such as chip parts are present as foreign substances, it is difficult for the operator to visually find such foreign substances. Therefore, the maintenance work is a complicated work for the operator.

As a technique for solving such a problem, Patent Document 1 discloses that a sweep-out member for sweeping out foreign matter on a push-up plate is installed, and Patent Document 2 discloses air injection for injecting air to blow off foreign matter. It is disclosed to set up a department.

Japanese Patent No. 6012067 Japanese Patent No. 3719062

However, even if the sweep-out member disclosed in Patent Document 1 or the air injection portion disclosed in Patent Document 2 is used, the foreign matter on the push-up plate cannot be completely removed, and instead, the foreign matter on the push-up plate cannot be completely removed. A phenomenon that disperses foreign matter may occur. Therefore, it is not possible to improve the efficiency of the maintenance work by the operator, and it is not possible to suppress the occurrence of problems such as a phenomenon in which the supporting performance of the substrate is deteriorated due to foreign matter adhering to the push-up pin.

The present invention has been made in view of such circumstances, and an object of the present invention is to improve the efficiency of maintenance work such as removing foreign matter adhering to the push-up pin, and to be caused by the adhering of the foreign matter. It is an object of the present invention to provide a mounting machine capable of suppressing the occurrence of such a defect.

The mounting machine according to one aspect of the present invention has a main body frame, a head unit having a suction nozzle and movably provided on the main body frame, a push-up plate arranged on the main body frame, and the push-up. A push-up pin that is erected on a plate and supports the substrate from below, a pin station that is arranged on the main body frame and stores the push-up pin that is not used to support the substrate, and an image pickup that captures an imaging target. A pin transfer operation in which the head unit is moved between the image pickup unit that performs an operation to acquire an inspection image and the push-up plate and the pin station, and the push-up pin that is attracted and held by the suction nozzle is conveyed. It includes a head control unit to be executed and an analysis unit that analyzes an inspection image acquired by the imaging unit. The imaging unit is arranged on the main body frame, and during the transfer of the push-up pin from the push-up plate to the pin station in response to the pin transfer operation by the head unit, the lower end portion of the push-up pin is pressed. It includes a first imaging unit that acquires a pin inspection image by performing a first pin imaging operation for imaging from below as an imaging target. The analysis unit analyzes the presence or absence of foreign matter adhering to the push-up pin based on the pin inspection image acquired in response to the first pin imaging operation, and outputs the analysis result.

According to this mounting machine, the head control unit controls the head unit and executes a pin transfer operation for transporting push-up pins from the push-up plate to the pin station. During the execution of the pin transfer operation of the head unit, the first imaging unit performs a pin inspection by performing a first pin imaging operation of imaging the lower end of the push-up pin sucked and held by the suction nozzle of the head unit from below. Get an image. Based on the pin inspection image obtained in this way, the analysis unit analyzes the presence or absence of foreign matter adhering to the push-up pin and outputs the analysis result.

Even if the foreign matter adhering to the push-up pin is a minute foreign matter that is difficult to be visually detected by the operator, a region corresponding to the foreign matter appears in the pin inspection image acquired by the first imaging unit. Therefore, the analysis result based on the pin inspection image output from the analysis unit accurately indicates the presence or absence of foreign matter adhering to the push-up pin. By confirming such analysis results, the operator can easily grasp whether or not foreign matter is attached to the push-up pin, and if foreign matter is attached, remove the foreign matter. Maintenance work can be performed efficiently. As a result, there is a phenomenon that the support performance of the board is deteriorated due to foreign matter adhering to the push-up pin, and when the push-up pin is stored in the pin station, the push-up pin stored in the pin station interferes with the head unit. It is possible to suppress the occurrence of problems such as the phenomenon that occurs.

The mounting machine may be configured to be arranged on the main body frame and further include a component supply unit for supplying components. Then, the head control unit moves the head unit between the component supply unit and the substrate supported by the push-up pin, and mounts the component sucked and held by the suction nozzle on the board. At the same time, the head unit is made to execute the pin transfer operation after the component mounting operation is completed.

In this aspect, one head unit can perform two operations, a component mounting operation and a pin transfer operation.

The mounting machine may further include a component drop determination unit that determines whether or not there is a possibility of component drop during execution of the component mounting operation by the head unit. Then, when the component drop determination unit determines that there is a possibility of the component falling, the first imaging unit performs the first pin imaging operation, and the component drop determination unit may cause the component to fall. If it is determined that there is no such operation, the first pin imaging operation is omitted.

In this aspect, the first pin imaging operation by the first imaging unit is performed according to the determination result of the component drop determination unit. If the judgment result of the part drop determination unit is a result indicating that there is no possibility of the part falling during the execution of the part mounting operation by the head unit, no foreign matter such as a part has fallen on the push-up plate. There is a high possibility that there is no foreign matter adhering to the push-up pin. In such a case, the first pin imaging operation by the first imaging unit is omitted. As a result, the excessive execution of the first pin imaging operation by the first imaging unit is suppressed, and the excessive execution of the analysis operation by the analysis unit is also suppressed accordingly. Therefore, when the push-up pin is stored in the pin station, the time required for each operation of the first imaging unit and the analysis unit can be shortened as much as possible.

The mounting machine may further include a height abnormality determining unit for determining the presence or absence of height abnormality of the push-up pin stored in the pin station. Then, when the head control unit determines that there is a height abnormality by the height abnormality determination unit, the head in a state where a specific push-up pin corresponding to the height abnormality is sucked and held by the suction nozzle. The unit is moved from the pin station to the first imaging unit, and when the specific push-up pin is conveyed in response to the movement of the head unit, the first imaging unit of the specific push-up pin A pin inspection image is acquired by performing a second pin imaging operation of imaging the lower end portion from the lower side, and the analysis unit obtains the specific pin inspection image based on the pin inspection image acquired in response to the second pin imaging operation. The presence or absence of foreign matter adhering to the push-up pin is analyzed, and the analysis result is output.

The push-up pin that arrives at the pin station by the pin transfer operation of the head unit is stored in the pin station by the lowering operation of the head unit or the like. At this time, if a foreign substance has fallen on the pin station, a phenomenon may occur in which the foreign substance adheres to the push-up pin. In this case, in the lowering operation of the head unit when the push-up pin is stored in the pin station, the lowering to the normal lowering position is prevented, and the push-up pin height abnormality occurs. That is, when the push-up pin is stored in the pin station, if the height abnormality determination unit determines that there is a height abnormality, foreign matter that has fallen on the pin station may adhere to the push-up pin. ..

Therefore, when the height abnormality determination unit determines that there is a height abnormality, the head control unit moves the head unit holding the push-up pin from the pin station to the first imaging unit. When the head unit arrives at the first imaging unit, the first imaging unit performs a second pin imaging operation to image the lower end of the push-up pin sucked and held by the suction nozzle of the head unit from below to perform a pin inspection image. To get. Based on the pin inspection image obtained in this way, the analysis unit analyzes the presence or absence of foreign matter adhering to the push-up pin and outputs the analysis result. By confirming such an analysis result, the operator can easily grasp whether or not the foreign matter that has fallen on the pin station is attached to the push-up pin, and if the foreign matter is attached. The maintenance work for removing the foreign matter can be efficiently performed.

In the above mounting machine, the image pickup unit includes a second image pickup unit arranged in the head unit, and the head control unit analyzes the analysis result that no foreign matter adheres to the specific push-up pin. When output from the unit, the head unit is moved from the first imaging unit to the pin station, and when the head unit arrives at the pin station, the second imaging unit moves upward with the pin station as an imaging target. A station imaging operation for imaging from the side is performed to acquire a station inspection image, and the analysis unit analyzes the presence or absence of foreign matter in the pin station based on the station inspection image and outputs the analysis result. You may.

If the analysis result of the analysis unit based on the pin inspection image acquired in response to the second pin imaging operation of the first imaging unit is that there is no foreign matter adhering, the push-up pin is stored in the pin station. At times, it is assumed that the foreign matter that had fallen on the pin station did not adhere to the push-up pin. In this case, it is assumed that the foreign matter is still dropped on the pin station. Therefore, the head control unit moves the head unit in which the second imaging unit is arranged from the first imaging unit to the pin station. When the head unit arrives at the pin station, the second imaging unit performs a station imaging operation for imaging the pin station from above to acquire a station inspection image. Based on the station inspection image obtained in this way, the analysis unit analyzes the presence or absence of foreign matter in the pin station and outputs the analysis result. By confirming such analysis results, the operator can easily grasp whether or not foreign matter has fallen on the pin station, and if foreign matter has fallen, maintenance to remove the foreign matter. Work can be done efficiently.

In the above mounting machine, the analysis unit refers to a reference image corresponding to the push-up pin in a state where no foreign matter is attached, and performs an image comparison process for comparing the reference image and the pin inspection image, or the reference. By performing pattern matching processing between the image and the pin inspection image, the presence or absence of foreign matter adhering to the push-up pin may be analyzed.

In this aspect, the analysis unit can analyze the presence or absence of foreign matter adhering to the push-up pin by performing image comparison processing or pattern matching processing.

As described above, according to the present invention, it is possible to improve the efficiency of maintenance work such as removing foreign matter adhering to the push-up pin, and to suppress the occurrence of defects due to the adhering of the foreign matter. A mounting machine can be provided.

It is a block diagram of the mounting machine which concerns on one Embodiment of this invention. It is a top view which shows the structure of the mounting machine main body. It is a figure which shows the part of a head unit in an enlarged manner. It is a figure which shows the structure of the substrate support unit schematicly. It is a figure for demonstrating the image acquired by the imaging operation of the 1st imaging unit. It is a figure explaining the operation when a pin recovery process is executed by a mounting machine. It is a figure explaining the operation when a pin recovery process is executed by a mounting machine. It is a flowchart which shows the processing flow of the pin recovery processing. It is a flowchart which shows the processing flow of the pin recovery processing.

FIG. 1 is a block diagram of a mounting machine 1 according to an embodiment of the present invention. The mounting machine 1 is a device for producing an electronic circuit board on which electronic components (hereinafter referred to as “components”) are mounted on a printed circuit board (hereinafter referred to as “board”). The electronic circuit board produced by the mounting machine 1 is carried into an inspection machine (not shown), and the inspection machine inspects the mounting state of parts on the board. The mounting machine 1 includes a mounting machine main body 2 and a control device 5. The mounting machine main body 2 constitutes a structural portion for performing component mounting operations and the like. The control device 5 controls the component mounting operation of the mounting machine main body 2.

First, the mounting machine main body 2 will be described with reference to FIGS. 2, 3 and 4 in addition to FIG. FIG. 2 is a plan view showing the configuration of the mounting machine main body 2, and FIG. 3 is an enlarged view showing a portion of the head unit 25. Further, FIG. 4 is a diagram schematically showing the configuration of the substrate support unit 28. In the following, the directional relationship will be described using XY Cartesian coordinates that are orthogonal to each other on the horizontal plane.

A solder paste pattern is printed on the substrate PP before the components are mounted by the mounting machine main body 2. That is, the mounting machine main body 2 mounts the components on the substrate PP on which the solder paste pattern is printed by the pattern forming apparatus. The mounting machine main body 2 includes a main body frame 21, a conveyor 23, a component supply unit 24, a head unit 25, and a board support unit 28.

The main body frame 21 is a structure in which each part constituting the mounting machine main body 2 is arranged, and is formed in a substantially rectangular shape in a plan view from a direction (vertical direction) orthogonal to both the X-axis direction and the Y-axis direction. Has been done. The conveyor 23 extends in the X-axis direction and is arranged on the main body frame 21. The conveyor 23 conveys the substrate PP in the X-axis direction. The substrate PP conveyed on the conveyor 23 is positioned by the substrate support unit 28 at a predetermined working position (a component mounting position where components are mounted on the substrate PP).

As shown in FIG. 4, the board support unit 28 includes a push-up plate 281, a push-up pin 282, and an elevating device 283. The elevating device 283 mainly has a support column 2831 whose upper end is moved up and down in the vertical direction by an air cylinder or the like, and a plate-shaped fixing base 2832 fixed substantially horizontally to the upper end of the support column 2831. It is installed at the position of. The push-up plate 281 is a flat plate fixed to the fixing base 2832. That is, the push-up plate 281 is arranged on the main body frame 21 via the fixing base 2832. A push-up pin 282 is erected on the upper surface of the push-up plate 281. The upper surface of the push-up plate 281 may be a flat surface or may have a plurality of recesses formed therein. In the case of a flat surface, the push-up pin 282 is erected directly on the upper surface of the push-up plate 281. On the other hand, when a plurality of recesses are formed, the push-up pin 282 is erected while being fitted in the recesses. The push-up pin 282 is a pin-shaped member erected on the upper surface of the push-up plate 281. The push-up pin 282 has a magnetic attraction portion 2821 (lower end portion) and a pin body 2822 extending linearly from the magnetic attraction portion 2821. The push-up pin 282 supports the substrate PP from below by the tip of the pin body 2822 in a state where the push-up pin 282 is arranged on the upper surface of the push-up plate 281 by magnetic attraction of the magnetic attraction portion 2821.

Further, as shown in FIG. 2, a pin station 29 is arranged on the main body frame 21. The pin station 29 is a portion in which the push-up pin 282, which is not used to support the substrate PP, is stored in a standing posture with the magnetic attraction portion 2821 down.

The component supply unit 24 is arranged with the conveyor 23 interposed therebetween in the + Y side and −Y side of the main body frame 21 in the Y-axis direction. The component supply unit 24 is an area in which a plurality of feeders 24F are mounted side by side in the main body frame 21, and each feeder is held for each component to be held by the mounting head 251 provided in the head unit 25 described later. The set position on the 24th floor is divided. The feeder 24F is detachably attached to the component supply unit 24. The feeder 24F is not particularly limited as long as it holds a plurality of parts and can supply the held parts to a predetermined component supply position set in the feeder, and is, for example, a tape feeder. The tape feeder is a feeder configured to include a reel on which a parts storage tape for storing parts is wound at predetermined intervals, and to supply parts by sending out the parts storage tape from the reel.

The head unit 25 is held by the moving frame 27. A fixed rail 261 extending in the Y-axis direction and a ball screw shaft 262 rotationally driven by the Y-axis servomotor 263 are arranged on the main body frame 21. The moving frame 27 is arranged on the fixed rail 261, and the nut portion 271 provided on the moving frame 27 is screwed onto the ball screw shaft 262. Further, the moving frame 27 is provided with a guide member 272 extending in the X-axis direction and a ball screw shaft 273 driven by the X-axis servomotor 274. The head unit 25 is movably held by the guide member 272, and a nut portion provided on the head unit 25 is screwed onto the ball screw shaft 273. Then, the moving frame 27 moves in the Y-axis direction by the operation of the Y-axis servomotor 263, and the head unit 25 moves in the X-axis direction with respect to the moving frame 27 by the operation of the X-axis servomotor 274. There is. That is, the head unit 25 can move in the Y-axis direction with the movement of the moving frame 27, and can move in the X-axis direction along the moving frame 27.

The head unit 25 is movable between the component supply unit 24 and the substrate PP supported by the push-up pin 282, and is also movable between the push-up plate 281 and the pin station 29. The head unit 25 moves between the component supply unit 24 and the board PP to execute a component mounting operation for mounting the components on the board PP. When this component mounting operation is completed and the production of the electronic circuit board is completed, the head unit 25 moves between the push-up plate 281 and the pin station 29, so that the push-up arranged on the push-up plate 281 is completed. A pin transfer operation for transporting the pin 282 to the pin station 29 is executed. That is, the head unit 25 executes two operations, a component mounting operation and a pin transfer operation. The head unit for component mounting operation and the head unit for pin transfer operation may be provided separately.

As shown in FIG. 3, the head unit 25 includes a plurality of mounting heads 251. Each mounting head 251 takes out a component from the component supply unit 24 and mounts (mounts) the extracted component on the substrate PP at the time of executing the component mounting operation. On the other hand, at the time of executing the pin transfer operation, each mounting head 251 takes out the push-up pin 282 from the push-up plate 281 and stores the taken-out push-up pin 282 in the pin station 29. The mounting head 251 is equipped with a suction nozzle 2511 at its tip (lower end). The suction nozzle 2511 includes a component holding nozzle capable of sucking and holding parts and a pin holding nozzle capable of sucking and holding the push-up pin 282. The suction nozzle 2511 can communicate with any of the negative pressure generator, the positive pressure generator, and the atmosphere via the electric switching valve. That is, the negative pressure is supplied to the suction nozzle 2511 to enable the suction nozzle 2511 to suck and hold (take out) the component or the push-up pin 282, and then the positive pressure is supplied to the component or the push-up. The suction holding of the pin 282 is released.

The mounting head 251 can be raised and lowered in the Z-axis direction (vertical direction) with respect to the frame of the head unit 25, and can be rotated around the head axis extending in the Z-axis direction. The mounting head 251 can move up and down along the Z-axis direction between a suctionable position where suction and holding by the suction nozzle 2511 of the component or push-up pin 282 can be held and a retracted position on the upper side with respect to the suctionable position. Is. That is, when the component or push-up pin 282 is attracted and held by the suction nozzle 2511, the mounting head 251 descends from the retracted position toward the suctionable position and sucks and holds the component or push-up pin 282 at the suctionable position. .. On the other hand, the mounting head 251 after holding the suction of the component or the push-up pin 282 rises from the suctionable position toward the retracted position. Further, the mounting head 251 is located in the Z-axis direction between a mounting mountable position where components sucked and held by the suction nozzle 2511 can be mounted at a predetermined mounting position on the substrate PP and the retracted position. It can be raised and lowered along. Alternatively, the mounting head 251 is located in the Z-axis direction between a retractable position in which the push-up pin 282 sucked and held by the suction nozzle 2511 can be stored in a predetermined position of the pin station 29 and the retracted position. It can be raised and lowered along.

As shown in FIG. 1, the mounting machine main body 2 further includes an imaging unit 3 and a notification unit 4. The notification unit 4 is a display unit composed of, for example, a liquid crystal display or the like, and notifies (displays) information such as an analysis result by the analysis unit 56 of the control device 5 described later.

The imaging unit 3 acquires an inspection image by performing an imaging operation for imaging an image-imaging object. As shown in FIG. 2, the imaging unit 3 includes a first imaging unit 31, a second imaging unit 32, and a third imaging unit 33.

The first image pickup unit 31 is installed between the component supply unit 24 and the conveyor 23 on the main body frame 21, and includes, for example, an image pickup element such as a CMOS (Complementary metallic-oxide-semicondutor) or a CCD (Charged-coupled device). It is an image sensor. When the head unit 25 is executing the component mounting operation, the first imaging unit 31 is moving the head unit 25 from the component supply unit 24 toward the substrate PP supported by the push-up pin 282. , The component sucked and held by the suction nozzle 2511 of the mounting head 251 is imaged from below to acquire the first component recognition image. The first component recognition image acquired by the first imaging unit 31 is stored in the storage unit 60 of the control device 5 described later, and is referred to when the component drop determination unit 57 determines the component drop. On the other hand, when the head unit 25 is executing the pin transfer operation, the first imaging unit 31 pushes the magnetic attraction unit 2821 of the push-up pin 282 during the transfer of the push-up pin 282 according to the pin transfer operation. A pin inspection image is acquired by performing a pin imaging operation for imaging from the lower side. The pin inspection image acquired by the first imaging unit 57 is stored in the storage unit 60 of the control device 5 described later, and is referred to in the analysis operation by the analysis unit 56.

The second image pickup unit 32 is an image pickup camera arranged in the head unit 25 and provided with an image pickup element such as CMOS or CCD. When the head unit 25 is executing the component mounting operation, the second imaging unit 32 displays the marks in order to recognize various marks attached to the upper surface of the substrate PP supported by the push-up pin 282. Image from above. By recognizing the mark on the substrate PP by the second imaging unit 32, the amount of displacement of the substrate PP with respect to the origin coordinates is detected. On the other hand, when the head unit 25 is executing the pin transfer operation, the second imaging unit 32 performs a station imaging operation of imaging the pin station 29 from above with the pin station 29 as an imaging target to acquire a station inspection image. The station inspection image acquired by the second imaging unit 32 is stored in the storage unit 60 of the control device 5 described later, and is referred to in the analysis operation by the analysis unit 56.

The third image pickup unit 33 is an image pickup camera arranged in the head unit 25 and provided with an image pickup element such as CMOS or CCD. When the head unit 25 is executing the component mounting operation, the third imaging unit 33 takes an image from the side of the component held by the suction nozzle 2511 immediately before mounting the component on the substrate PP. 2 Acquire a part recognition image. The second component recognition image acquired by the third imaging unit 33 is stored in the storage unit 60 of the control device 5 described later, and is referred to when the component drop determination unit 57 determines the component drop.

The control device 5 is composed of a CPU (Central Processing Unit), a ROM (Read Only Memory) for storing a control program, a RAM (Random Access Memory) used as a work area of the CPU, and the like. The control device 5 controls the operation of each component of the mounting machine main body 2 by the CPU executing the control program stored in the ROM. As shown in FIG. 1, the control device 5 has a substrate transfer control unit 51, a substrate support control unit 52, a component supply control unit 53, a head control unit 54, and an imaging control unit 55 as main functional configurations. It includes an analysis unit 56, a component drop determination unit 57, a height abnormality determination unit 58, a notification control unit 59, and a storage unit 60.

The board transfer control unit 51 controls the transfer operation of the substrate PP by the conveyor 23. The board transfer control unit 51 stops the transfer operation of the substrate PP by the conveyor 23 when the component mounting operation by the head unit 25 is completed and the production of the electronic circuit board is completed. The board support control unit 52 controls the support operation of the board PP by the board support unit 28. When the production of the electronic circuit board is completed, the board support control unit 52 stops the support operation of the board PP by the board support unit 28. The component supply control unit 53 controls the component supply operation of each of the plurality of feeders 24F arranged in the component supply unit 24. When the production of the electronic circuit board is completed, the component supply control unit 53 stops the component supply operation by the feeder 24F.

The head control unit 54 controls the head unit 25 to execute the component mounting operation and the pin transfer operation by the head unit 25. The image pickup control unit 55 controls the image pickup operation by the first image pickup unit 31, the second image pickup unit 32, and the third image pickup unit 33 that constitute the image pickup unit 3. The notification control unit 59 controls the notification operation by the notification unit 4.

In the storage unit 60, as information generated during the component mounting operation by the head unit 25, the first component recognition image of the first imaging unit 31, the second component recognition image of the third imaging unit 33, and the suction nozzle 2511 are components. Information on the negative pressure level of the negative pressure generator when the image is sucked and held is stored. Further, the storage unit 60 stores the pin inspection image of the first imaging unit 31 and the station inspection image of the second imaging unit 32 as information generated during the pin transfer operation by the head unit 25.

When the head unit 25 executes the pin transfer operation, the analysis unit 56 reads the pin inspection image and the station inspection image from the storage unit 60 and performs an analysis process for analyzing each image. The details of the analysis process of the analysis unit 56 will be described later.

The component drop determination unit 57 performs a component drop determination process for determining whether or not there is a possibility of a component falling during the component mounting operation of the head unit 25 when the pin transfer operation is executed by the head unit 25. Specifically, the component drop determination unit 57 drops the component based on the negative pressure level of the negative pressure generator when the suction nozzle 2511 sucks and holds the component supplied by the feeder 24F stored in the storage unit 60. Determine if there is a possibility of In this case, if the negative pressure level of the suction nozzle 2511 is lower than the reference level, the component drop determination unit 57 recognizes that a component suction error has occurred when the component supplied by the feeder 24F is suctioned, and the component drops. Judge that there is a possibility. Further, the component drop determination unit 57 determines whether or not there is a possibility of component drop based on the inspection result of the inspection machine that inspects the produced electronic circuit board. In this case, the component drop determination unit 57 recognizes that a component non-mounting error has occurred if there is a non-mounted portion in the mounted state of the component on the electronic circuit board, and determines that there is a possibility of component dropping. Further, the component drop determination unit 57 can drop a component based on the first component recognition image of the first imaging unit 31 and the second component recognition image of the third imaging unit 33 stored in the storage unit 60. Determine the presence or absence of sex. In this case, if the first component recognition image shows the recognition result with the component and the second component recognition image shows the recognition result without the component, the component drop determination unit 57 is attracted and held by the suction nozzle 2511. It is recognized that a holding error has occurred before mounting the existing component on the substrate PP, and it is determined that there is a possibility that the component may fall.

The height abnormality determination unit 58 performs a height abnormality determination process for determining the presence or absence of a height abnormality of the push-up pin 282 stored in the pin station 29 when the pin transfer operation is executed by the head unit 25. When the height abnormality determination unit 58 stores the push-up pin 282 sucked and held by the suction nozzle 2511 at a predetermined position of the pin station 29, whether or not the mounting head 251 is lowered until it reaches the retractable position. Based on, the presence or absence of height abnormality is determined. In this case, when the push-up pin 282 is stored in the pin station 29, the height abnormality determining unit 58 determines that there is a height abnormality when the mounting head 251 cannot be lowered until it reaches the retractable position. ..

When the component mounting operation by the head unit 25 is completed and the production of one electronic circuit board is completed, the setup work for the next production is performed. As the setup work, the feeder 24F arranged in the parts supply unit 24 is replaced with the feeder 24F for the next production, and the push-up pin 282 arranged on the push-up plate 281 is pushed up for the next production. Examples include pin replacement work for replacing the pin 282. The pin replacement work includes a pin recovery process for moving and collecting the push-up pin 282 from the push-up plate 281 to the pin station 29, and moving the push-up pin 282 for the next production from the pin station 29 to the push-up plate 281. It includes a pin mounting process for mounting. The pin recovery process and the pin mounting process are automatically performed by the moving operation of the head unit 25 or the like under the control of the control device 5.

The control device 5 executes a pin recovery process in which the push-up pin 282 is stored in the pin station 29 and collected when the head unit 25 executes the pin transfer operation. This pin recovery process will be described with reference to FIGS. 5 to 7, 8A and 8B. FIG. 5 is a diagram for explaining an image acquired by the imaging operation of the first imaging unit 31. 6 and 7 are diagrams for explaining the operation when the pin recovery process is executed by the mounting machine 1. 8A and 8B are flowcharts showing a processing flow of pin recovery processing.

After the component mounting operation by the head unit 25 is completed, the head control unit 54 recognizes that the pin-holding suction nozzle 2511 is mounted on the mounting head 251 (step s1). Then, the head control unit 54 moves the head unit 25 above the push-up plate 281 (step s2). When the head unit 25 arrives above the push-up plate 281, as shown in FIG. 6, the head control unit 54 lowers the mounting head 251 to suck and hold the push-up pin 282 by the suction nozzle 2511 (step s3). ..

In a state where the push-up pin 282 on the push-up plate 281 is sucked and held by the suction nozzle 2511, the component drop determination unit 57 determines whether or not the component drop determination mode is set (step s4). When the component drop determination mode is set (YES in step s4), the component drop determination unit 57 determines whether or not there is a possibility of component drop when the head unit 25 executes the component mounting operation. The determination process is performed (step s5). On the other hand, when the component drop determination mode is not set (NO in step s4), the component drop determination process by the component drop determination unit 57 is omitted. When the component drop determination unit 57 determines that there is a possibility of component drop in the component drop determination process (YES in step s6), or when the component drop determination mode is not set (NO in step s4), step s7 Proceed to.

In step s7, as shown in FIG. 6, the head control unit 54 causes the head unit 25 to execute the pin transfer operation. Specifically, the head control unit 54 moves the head unit 25 from the push-up plate 281 to the pin station 29 via the first imaging unit 31. As a result, the push-up pin 282 sucked and held by the suction nozzle 2511 is conveyed from the push-up plate 281 to the pin station 29 via the first imaging unit 31 in response to the pin transfer operation of the head unit 25. ..

When passing through the first image pickup unit 31 during the transfer of the push-up pin 282, the image pickup control unit 55 controls the first image pickup unit 31 and takes an image from the lower side with the magnetic attraction unit 2821 as the image pickup target. The first pin imaging operation is executed to acquire the pin inspection image G2 (FIG. 5 (B)) (step s8). The first imaging unit 31 sets imaging conditions such as illumination conditions so that the pin region G22 corresponding to the magnetic attraction unit 2821 to be imaged in the pin inspection image G2 is a bright region having a predetermined brightness value or more. At this time, in the pin inspection image G2, the background region G21 is a dark region having a brightness value less than the predetermined luminance value. Further, when the foreign matter PM is attached to the magnetic attraction portion 2821 (see FIG. 6), the foreign matter region G23 corresponding to the foreign matter PM in the pin inspection image G2 becomes a dark region having a brightness value less than the predetermined brightness value. The reference image G1 (FIG. 5A) corresponding to the magnetic attraction portion 2821 in a state where no foreign matter PM is attached is an image including a background region G11 in a dark region and a pin region G12 in a bright region.

When the pin inspection image G2 is acquired in response to the first pin imaging operation of the first imaging unit 31, the analysis unit 56 determines whether or not foreign matter PM is attached to the magnetic attraction unit 2821 based on the pin inspection image G2. The analysis process to be analyzed is performed, and the analysis result is output (step s9). The analysis unit 56 analyzes the presence or absence of foreign matter PM adhering to the magnetic attraction unit 2821 by performing an image comparison process that compares the reference image G1 and the pin inspection image G2. The image comparison processing includes an area comparison process for comparing the area of the bright region between the reference image G1 and the pin inspection image G2, and a process for comparing the similarity between the brightness histograms of the reference image G1 and the pin inspection image G2. Examples include a process of acquiring a difference image between the reference image G1 and the pin inspection image G2 and extracting a feature amount in the difference image. For example, when the area comparison process is adopted as the image comparison process, the analysis unit 56 uses the magnetic attraction unit 2821 when the area of the bright area of the pin inspection image G2 is smaller than the area of the bright area of the reference image G1. It is determined that foreign matter PM is attached to the surface. The analysis unit 56 may be configured to analyze the presence or absence of foreign matter PM adhering to the magnetic attraction unit 2821 by performing a pattern matching process between the reference image G1 and the pin inspection image G2.

It is assumed that the analysis unit 56 outputs an analysis result indicating that no foreign matter PM is attached to the magnetic attraction unit 2821 (YES in step s10). In this case, the head control unit 54 lowers the mounting head 251 in a state where the head unit 25 arrives at the pin station 29, and stores the push-up pin 282 sucked and held by the suction nozzle 2511 in the pin station 29 ( Step s11).

On the other hand, it is assumed that the analysis unit 56 outputs an analysis result indicating that foreign matter PM is attached to the magnetic adsorption unit 2821 (NO in step s10). In this case, the head control unit 54 stops the operation of the head unit 25 when it arrives at the pin station 29 (step s101). At this time, the notification control unit 59 controls the notification unit 4 to notify the magnetic attraction unit 2821 of warning information indicating that foreign matter PM is attached (step s102).

Even if the foreign matter PM adhering to the magnetic attraction portion 2821 of the push-up pin 282 is a minute foreign matter that is difficult to be visually detected by the operator, the pin inspection image G2 acquired by the first imaging unit 31 is clear. Within the range of the pin region G22 of the region, the foreign matter region G23 corresponding to the foreign matter PM appears as a dark region. Therefore, the analysis result based on the pin inspection image G2 output from the analysis unit 56 accurately indicates the presence or absence of foreign matter PM adhering to the push-up pin 282. By confirming such an analysis result, the operator can easily grasp whether or not the foreign matter PM is attached to the push-up pin 282, and if the foreign matter PM is attached, the foreign matter is found. Maintenance work to remove PM can be performed efficiently. As a result, the phenomenon of deteriorating the support performance of the substrate PP due to the foreign matter PM adhering to the push-up pin 282 and the push-up pin stored in the pin station 29 when the push-up pin 282 is stored in the pin station 29. It is possible to suppress the occurrence of problems such as a phenomenon in which the 282 and the head unit 25 interfere with each other.

When the component drop determination unit 57 determines in step s6 that there is no possibility of component drop (NO in step s6), foreign matter PM such as components has not fallen on the push-up plate 281. There is a high possibility that foreign matter PM does not adhere to the push-up pin 282. Therefore, when the component drop determination unit 57 determines that there is no possibility of component drop, the imaging control unit 55 omits the execution of the first pin imaging operation by the first imaging unit 31, and accordingly. The analysis unit 56 omits the execution of the analysis process. As a result, the excessive execution of the first pin imaging operation by the first imaging unit 31 is suppressed, and accordingly, the execution of the excessive analysis operation by the analysis unit 56 is also suppressed. Therefore, when the push-up pin 282 is stored in the pin station 29, the time required for each operation of the first imaging unit 31 and the analysis unit 56 can be shortened as much as possible. In this case, each process from step s7 to step s10 is omitted. Then, the head control unit 54 lowers the mounting head 251 in a state where the head unit 25 arrives at the pin station 29, and stores the push-up pin 282 sucked and held by the suction nozzle 2511 in the pin station 29 (step). s11).

During the lowering operation of the mounting head 251 when the push-up pin 282 is stored in the pin station 29, the height abnormality determination unit 58 determines whether or not the push-up pin 282 has an abnormality in height (step s12). When the height abnormality determination unit 58 determines that there is no height abnormality (YES in step s13), the control device 5 has completed storing all the push-up pins 282 scheduled to be collected in the pin station 29. Whether or not it is determined (step s14). When all the push-up pins 282 have been stored in the pin station 29 (YES in step s14), the control device 5 ends the pin recovery process. On the other hand, when the storage of all the push-up pins 282 in the pin station 29 is not completed (NO in step s14), the process is returned to the above step s2, and each process after the step s2 is repeated. Is done.

If the foreign matter PM has fallen on the pin station 9 when the push-up pin 282 is stored in the pin station 29, a phenomenon may occur in which the foreign matter PM adheres to the magnetic attraction portion 2821 of the push-up pin 282. In this case, in the lowering operation of the mounting head 251 when the push-up pin 282 is stored in the pin station 29, the lowering to the normal lowering position is prevented, and the height abnormality of the push-up pin 282 occurs. That is, when the push-up pin 282 is stored in the pin station 29, if the height abnormality determination unit 58 determines that there is a height abnormality (NO in step s13), the foreign matter PM that has fallen on the pin station 29 May adhere to the push-up pin 282.

Therefore, as shown in FIG. 7, the head control unit 54 sucks and holds the specific push-up pin 282 corresponding to the height abnormality by the suction nozzle 2511, and the head unit 25 is sucked and held by the pin station 29 to the first imaging unit. Move to 31 (step s131). When the specific push-up pin 282 is conveyed to the first imaging unit 31 in response to the movement of the head unit 25, the imaging control unit 55 controls the first imaging unit 31 to control the specific push-up pin 282. The pin inspection image G2 is acquired by executing the second pin imaging operation of imaging from the lower side with the magnetic attraction unit 2821 as the imaging target (step s132).

When the pin inspection image G2 is acquired in response to the second pin imaging operation of the first imaging unit 31, the analysis unit 56 determines whether or not foreign matter PM is attached to the magnetic attraction unit 2821 based on the pin inspection image G2. The analysis process to be analyzed is performed, and the analysis result is output (step s133).

It is assumed that the analysis unit 56 outputs an analysis result indicating that foreign matter PM is attached to the magnetic adsorption unit 2821 (YES in step s134). In this case, the head control unit 54 stops the operation of the head unit 25 when it arrives at the first imaging unit 31 (step s135). At this time, the notification control unit 59 controls the notification unit 4 to notify the magnetic attraction unit 2821 of warning information indicating that foreign matter PM is attached (step s136). By confirming such an analysis result, the operator can easily grasp whether or not the foreign matter PM that has fallen on the pin station 29 is attached to the specific push-up pin 282, and the foreign matter PM can be grasped. If the foreign matter PM is attached, the maintenance work for removing the foreign matter PM can be efficiently performed.

On the other hand, it is assumed that the analysis unit 56 outputs an analysis result indicating that no foreign matter PM is attached to the magnetic adsorption unit 2821 (NO in step s134). In this case, it is assumed that the foreign matter PM that had fallen on the pin station 29 did not adhere to the push-up pin 282 when the push-up pin 282 was stored in the pin station 29. In this case, it is assumed that the foreign matter PM is still dropped on the pin station 20. Therefore, as shown in FIG. 7, the head control unit 54 moves the head unit 25 from the first imaging unit 31 to the pin station (step s1341).

When the head unit 25 arrives at the pin station 29, the imaging control unit 55 controls the second imaging unit 32 and executes a station imaging operation of imaging the pin station 29 from above with the pin station 29 as an imaging target to acquire a station inspection image. (Step s1342). Based on the station inspection image thus acquired, the analysis unit 56 analyzes the presence or absence of the foreign matter PM in the pin station 29 and outputs the analysis result (step s1343). By confirming such an analysis result, the operator can easily grasp whether or not the foreign matter PM has fallen on the pin station 29, and if the foreign matter PM has fallen, the foreign matter PM has fallen. Maintenance work can be performed efficiently.

1 Mounting machine 2 Mounting machine Main body 21 Main body frame 24 Parts supply unit 25 Head unit 251 Mounting head 2511 Suction nozzle 28 Board support unit 281 Push-up plate 282 Push-up pin 29 Pin station 3 Imaging unit 31 1st imaging unit 32 2nd imaging Unit 33 Third imaging unit 4 Notification unit 5 Control device 54 Head control unit 55 Imaging control unit 56 Analysis unit 57 Parts drop determination unit 58 Height abnormality determination unit 59 Notification control unit G1 Reference image G2 Pin inspection image PM Foreign matter

Claims (6)

Body frame and
A head unit that has a suction nozzle and is movably provided on the main body frame,
The push-up plate placed on the main body frame and
A push-up pin that is erected on the push-up plate and supports the substrate from below,
A pin station that is arranged on the main body frame and stores the push-up pins that are not used to support the substrate.
An imaging unit that acquires an inspection image by performing an imaging operation that captures an imaging target,
A head control unit that moves the head unit between the push-up plate and the pin station and executes a pin transfer operation for transporting the push-up pin that is sucked and held by the suction nozzle.
An analysis unit that analyzes an inspection image acquired by the imaging unit is provided.
The imaging unit is arranged on the main body frame, and during the transfer of the push-up pin from the push-up plate to the pin station in response to the pin transfer operation by the head unit, the lower end portion of the push-up pin is pressed. It includes a first imaging unit that acquires a pin inspection image by performing a first pin imaging operation for imaging from below as an imaging target.
The analysis unit is a mounting machine that analyzes the presence or absence of foreign matter adhering to the push-up pin based on the pin inspection image acquired in response to the first pin imaging operation, and outputs the analysis result. A component supply unit arranged on the main body frame and supplying components is further provided.
The head control unit moves the head unit between the component supply unit and the substrate supported by the push-up pin, and executes a component mounting operation of mounting the component sucked and held by the suction nozzle on the board. The mounting machine according to claim 1, wherein the head unit executes the pin transfer operation after the component mounting operation is completed. Further, a component drop determination unit for determining whether or not there is a possibility of component drop during execution of the component mounting operation by the head unit is provided.
When the component drop determination unit determines that there is a possibility of component dropping, the first imaging unit performs the first pin imaging operation, and the component drop determination unit determines that there is no possibility of component drop. The mounting machine according to claim 2, wherein the first pin imaging operation is omitted when the determination is made. Further, a height abnormality determining unit for determining the presence or absence of a height abnormality of the push-up pin stored in the pin station is provided.
When the height abnormality determination unit determines that there is a height abnormality, the head control unit sucks and holds a specific push-up pin corresponding to the height abnormality by the suction nozzle. , Moved from the pin station to the first imaging unit,
When the specific push-up pin is conveyed in response to the movement of the head unit, the first imaging unit performs a second pin imaging operation for imaging the lower end of the specific push-up pin from below. Get the pin inspection image,
The analysis unit analyzes the presence or absence of foreign matter adhering to the specific push-up pin based on the pin inspection image acquired in response to the second pin imaging operation, and outputs the analysis result. The mounting machine according to any one of 3 to 3. The imaging unit includes a second imaging unit arranged in the head unit.
When the analysis result is output from the analysis unit that the specific push-up pin is free of foreign matter, the head control unit moves the head unit from the first imaging unit to the pin station.
When the head unit arrives at the pin station, the second imaging unit performs a station imaging operation of imaging the pin station from above with the pin station as an imaging target to acquire a station inspection image.
The mounting machine according to claim 4, wherein the analysis unit analyzes the presence or absence of foreign matter in the pin station based on the station inspection image and outputs the analysis result. The analysis unit refers to a reference image corresponding to the push-up pin in a state where no foreign matter is attached, and performs an image comparison process for comparing the reference image and the pin inspection image, or the reference image and the pin inspection image. The mounting machine according to any one of claims 1 to 5, which analyzes the presence or absence of foreign matter adhering to the push-up pin by performing the pattern matching process of the above.

Images