JP6425054B1 - Imaging method and resin sealing apparatus in resin sealing apparatus - Google Patents

Abstract

The present invention provides an imaging method and a resin sealing device in a resin sealing device capable of easily specifying the cause when a defect of a product occurs in a production process of the resin sealing device.
A resin sealing device for a semiconductor package includes a lead frame as a base material and a material supply unit 1 for conveying a resin tablet as a resin material for resin sealing to a predetermined position. The material supply unit 1 is provided with a transport unit camera 13 and a wire check camera 14 as imaging means for imaging a lead frame. In the transport unit camera 13, imaging information of a moving image is acquired for each lead frame transported by the transport unit 111.
[Selected figure] Figure 2

Description

  The present invention relates to an imaging method and a resin sealing device in a resin sealing device.

  In a resin sealing apparatus that manufactures a semiconductor package by resin molding, each operation until resin sealing is performed on a substrate on which a semiconductor element is mounted is stored as a product through a plurality of units.

  The unit that constitutes this resin sealing apparatus includes a material supply unit that supplies a base material and a resin material, an importer that conveys the base material and the like to the resin sealing unit, and a resin seal that performs resin sealing of the base material. There is a stop unit. Depending on the type of the resin sealing device, a preheating unit is provided which heats the base material before being transported to the resin sealing unit.

  In addition, as a unit that handles molded products in which the base material is resin-sealed, a cleaner unit (unloader) that transports molded products and cleans molds, a conveyer unit that removes unnecessary portions such as culls and runners, There is a product storage unit that stores molded products from which unnecessary parts have been removed.

  An inspection is performed to confirm whether the product stored after the work in each of these units meets the required quality. In addition, when a defect occurs in a product, control of the production process is performed in order to identify and respond to the cause.

  As a method of managing the production process in such a resin encapsulation apparatus, a resin encapsulation apparatus as described in Patent Document 1 has been proposed which records time information and molding conditions related to the production process.

  The resin sealing device described in Patent Document 1 includes a control unit, a storage unit, a display unit, and an input unit. In addition, the resin sealing device includes a detection unit that detects a state related to the molding die and another state (for example, operation information) in the resin sealing device as a detected value.

  Further, the control unit records the values detected and input by the detection unit, the input unit, and the like in the storage unit. For example, in the storage unit, the time required for each molding process, the time when the process was performed, the number of times molding is performed, molding conditions at each molding, and the like are recorded.

  In this resin sealing device, the information recorded in the storage unit is used to manage mold parts including a mold. Further, the molding conditions can be easily corrected by linking the molding conditions to the molded product and enabling output as product information.

JP, 2017-87648, A

  However, with the resin sealing device described in Patent Document 1, with regard to a product in which a defect has occurred, history information regarding time molded by the resin sealing device and lot number information indicating a production unit in which the product is included Although it can confirm, it was difficult to pinpoint the cause leading to a malfunction.

  That is, in the plurality of units constituting the resin sealing device, it was not possible to check which unit had an abnormal phenomenon leading to a malfunction of the product during the operation of the unit.

  Therefore, when a defect is found in the product inspection, it becomes necessary to confirm the production process of each unit. As a result, a great deal of effort and time may be spent on checking the operation and state of each unit.

  In addition, abnormal phenomena during operation of the unit leading to product defects may not be reproduced at the time of verification. Therefore, until the occurrence of an abnormal phenomenon is seen in the work of the unit, or until the operator makes a tentative decision that the abnormal phenomenon does not occur, the operation confirmation and the processing of the base material in one unit are performed. I have done it repeatedly.

  Furthermore, since the operation of transferring the base material or the molded article is commonly performed in each unit, an abnormal phenomenon during the transfer may occur in any unit. As a result, it has become more difficult to identify the unit in which the abnormality has occurred.

  From the above points, it is strongly required to secure traceability of each product in order to promptly cope with a defect of the product in the production process by the resin sealing device.

  The present invention has been made in view of the above points, and in the production process of a resin sealing device, when a defect of a product occurs, the resin sealing device capable of easily identifying the cause thereof It is an object of the present invention to provide an imaging method and a resin sealing device in the above.

  In order to achieve the above object, the present invention resin-seals a material supply unit for conveying a substrate on which a semiconductor element is mounted to a predetermined position, and the substrate conveyed by the material supply unit. And an in-loader for conveying to the resin-sealed unit, wherein at least one of a conveyance path of the base by the material supply unit and a conveyance path of the base by the in-loader is provided. And a step of imaging the substrate while moving at substantially the same direction as the substrate and at substantially the same speed.

  Here, by imaging the substrate by at least a part of the conveyance route of the substrate by the material supply unit and the conveyance route of the substrate by the in-loader, the state and the movement of the substrate before being resin-sealed are captured Imaging information can be obtained. That is, the substrate before being resin-sealed is imaged as it is being transported by the material supply unit or the in-loader, and a phenomenon causing damage or deformation to the substrate is captured and confirmed as imaging information. It becomes possible.

  In addition, by imaging the substrate while moving in substantially the same direction as the substrate and at substantially the same speed, imaging information as a stationary image in which the substrate does not move substantially in a state where the relative velocity to the substrate is close to zero. You can get As a result, it is easy to confirm how the substrate is transported. If the deviation from the direction in which the base material is transported or the speed at which the base material is transported is large, the imaging information in which the appearance of the base material is difficult to check will result.

  Here, “moving in substantially the same direction as the base material and at substantially the same speed” means that the imaging means of the base material is attached to the material supply unit or the in-loader, and the movement of the imaging means is supplied The method includes a method of causing a unit or an in-loader to carry, and a method of providing a moving means separately driven from the material supply unit and the in-loader, and attaching and moving an imaging means of the substrate to the moving means.

  In addition, “imaging” as used herein basically means that the state and movement of the transported substrate are recorded as a moving image, but in addition to this, it may include an aspect of recording a still image. .

  In addition, when imaging the state in which the substrate is at rest in at least a part of the transport route of the substrate by the material supply unit and the transport route of the substrate by the inloader, only by the state or movement of the substrate being transported. Instead, it becomes easy to obtain imaging information focused on the fine structure of the substrate. As a result, it is possible to confirm the presence or absence of abnormality in the fine structure portion of the substrate.

  In addition, in the case of imaging a molded article while moving in substantially the same direction as the molded article and at substantially the same speed in at least a part of the conveyance path for conveying the molded article in which the substrate is resin-sealed by the resin sealing unit. The imaging information which captured the state and movement can be acquired not only about a base material but also about the molded article after resin sealing of the base material. That is, it is possible to image how the molded product is transported, and to grasp and confirm as a pickup information a phenomenon that causes damage or deformation to the molded product.

  In addition, by imaging the molded product while moving at substantially the same direction as the molded product and at substantially the same speed, imaging information as a fixed image in which the molded product does not move substantially in a state where the relative speed to the molded product is near zero. You can get As a result, it is easy to check how the molded product is transported. If the deviation from the direction in which the molded article is conveyed or the speed at which the molded article is conveyed is large, the imaging information in which the appearance of the molded article is difficult to check will result.

  Here, “moving in substantially the same direction as the molded product and at substantially the same speed” means that the imaging unit is attached to the apparatus for transporting the molded product and the apparatus moves the imaging unit. The method includes a method of providing a moving means separately driven from the device for conveying the molded product, and attaching and moving an imaging means of the molded product to the moving means.

  In addition, in the case of imaging the base material by the transport path of the base material by the material supply unit and the transport path of the base material by the in-loader, imaging information of the base material may be obtained by each unit. it can. As a result, it becomes easier to identify a unit in which an abnormal phenomenon leading to a product failure has occurred. That is, by imaging the base material in the transportation route of the material supply unit, it is possible to image an abnormality in transportation in the material supply unit and to easily confirm the presence or absence of an abnormality in the substrate at the time of being supplied as the material. . In addition, by imaging the base material in the transport path of the in-loader, it is possible to image an abnormality in transport of the base material in the in-loader, and also between the in-loader and the material supply unit, the in-loader and the resin sealing unit It becomes easy to confirm abnormality etc. at the time of reception or delivery of the substrate between.

  Further, in order to achieve the above object, a resin sealing device according to the present invention comprises a material supply unit for conveying a substrate on which a semiconductor element is mounted to a predetermined position, and the substrate conveyed by the material supply unit. And an inloader for conveying the substrate to a resin sealing unit for resin sealing, wherein the resin sealing device is attached to at least one of the material supply unit and the inloader to image the substrate. It has a substrate imaging means.

  Here, the substrate imaging means for imaging the substrate is attached to at least one of the material supply unit and the in-loader to cause the movement of the substrate imaging means to be responsible for driving the material supply unit and the in-loader. The structure for providing the substrate imaging means can be simplified. In addition, it is possible to obtain imaging information that captures the state and movement of the base material before being resin-sealed.

  Further, by providing the substrate imaging means attached to at least one of the material supply unit and the in-loader, it is possible to obtain imaging information as a stationary image in which the substrate hardly moves with the relative speed to the substrate being close to zero. Can. As a result, it is easy to confirm how the substrate is transported.

  Further, in order to achieve the above object, a resin sealing device according to the present invention comprises a material supply unit for conveying a substrate on which a semiconductor element is mounted to a predetermined position, and the substrate conveyed by the material supply unit. And an in-loader for conveying the substrate to a resin-sealed unit for resin-sealing the substrate, wherein the material-feeding unit conveys the substrate and the in-loader conveys the substrate. A moving means movable in substantially the same direction as the base while being synchronized with a movement of the base being conveyed along at least a part of a path, and attached to the moving means, imaging the base And a substrate imaging means.

  Here, along at least a part of the conveyance path of the substrate by the material supply unit and the conveyance path of the substrate by the inloader, the substrate can be moved in substantially the same direction as the substrate while being synchronized with the movement of the conveyance. The moving means can provide a structure capable of tracking the substrate fed by the material supply unit or the in-loader. Further, since the moving means is configured to be movable along the transport path of the base material, the moving means can move while maintaining the distance to the base material to be transported.

  The substrate imaging means for imaging the substrate is synchronized with the movement of the substrate being conveyed along at least a part of the conveyance path of the substrate by the material supply unit and the conveyance path of the substrate by the in-loader. However, by being attached to the moving means movable in substantially the same direction as the substrate, the moving means and the substrate imaging means move with the relative velocity to the substrate close to zero while keeping the distance to the substrate. Since the substrate is photographed, it is possible to obtain imaging information as a stationary image in which the substrate does not move substantially. As a result, it is easy to confirm how the substrate is transported. When the direction in which the base material is transported or the shift with respect to the movement in which the base material is transported is large, the imaging information in which the appearance of the base material is difficult to check is obtained. The term "synchronization" as used herein means to synchronize the timing at which the moving means moves and the timing at which the base material to be transported moves.

  The substrate is heated and deformed if it has a preheating unit that heats the substrate and the inloader receives the heated substrate and receives the substrate to be heated. The state of the substrate can be imaged. When the substrate is heated, temperature changes may cause deformation such as warping of the substrate. When the base material is significantly deformed, it is possible to image the occurrence of a transport failure in which the in-loader can not receive the base material and to confirm it later.

  Further, the molded article imaging means for imaging the molded article is attached to at least one of the unloader, the conveyer unit, and the product storage unit, thereby causing the movement of the molded article imaging means to be driven by the unloader or the like. It is possible to simplify the structure for providing molded article imaging means. In addition, it is possible to obtain imaging information that captures the state and movement of a molded article after resin sealing.

  Further, as the molded product imaging means is attached to at least one of the unloader, the conveyer unit, and the product storage unit, the molded product is hardly moved with the relative speed to the molded product close to zero. Imaging information can be obtained. As a result, it is easy to check how the molded product is transported.

  Further, when the molded product imaging means for picking up the molded product is attached to the unloader which receives from the resin sealing unit and conveys the molded product obtained by resin sealing the base material with the resin sealing unit, the molded product imaging means The means moves together with the unloader, which makes it easier to grasp the state and movement of the article conveyed by the unloader. That is, while imaging the molded article to be transported, it is possible to confirm the deformation and damage in the appearance of the resin-sealed molded article, and the occurrence of the resin leakage at the time of the resin sealing.

  In addition, when the molded product imaging means for imaging the molded product is delivered from the unloader to remove the unnecessary resin portion of the molded product, and is attached to the conveyer unit for transporting the molded product. In this case, the molded product imaging means moves together with the digger unit, and it becomes easier to grasp the state and movement of the molded product transported by the digger unit. That is, while imaging the cast to be conveyed, it is possible to confirm the occurrence of deformation and damage of the cast before and after the removal of unnecessary resin parts such as culls and runners.

  When the molded product imaging means for imaging molded products is attached to the product storage unit which receives and conveys the molded product from the digger unit, the molded product imaging means moves together with the product storage unit. It becomes easier to grasp the state and movement of the molded product transported by the product storage unit. That is, it is possible to confirm an abnormality in conveyance of a molded product from which unnecessary resin parts such as culls and runners have been removed, and occurrence of deformation and damage of the molded product. In addition, the degree of removal of the unnecessary resin portion of the molded article can also be confirmed.

  Further, while synchronized with the movement of the molded article along at least a part of the conveyance path of the molded article by the unloader, the conveyance path of the molded article by the conveyer unit, and the conveyance path of the molded article by the product storage unit, The moving means movable in substantially the same direction as the molded product can provide a structure capable of tracking the substrate transported by the unloader, the conveyer unit or the product storage unit. Further, since the moving means is configured to be movable along the conveying path of the molded product, the moving means can move while maintaining the distance to the molded article to be conveyed.

  Further, the molded product imaging means for imaging the molded product may be molded along at least a part of the molded product conveyance path by the unloader, the molded product conveyance path by the digator unit, and the molded product conveyance path by the product storage unit. By being attached to the moving means movable in substantially the same direction as the molded article in synchronization with the movement of the article being conveyed, the moving means and the molded article imaging means maintain the distance to the molded article while maintaining the distance to the molded article. Since the molded article is photographed by moving with the relative velocity close to zero, it is possible to obtain imaging information as a stationary image in which the molded article does not move substantially. As a result, it is easy to check how the molded product is transported. If the direction in which the molded product is transported or the deviation with respect to the movement of the molded product is increased, it becomes imaging information which makes it difficult to check the appearance of the molded product.

  In addition, when identification information capable of identifying the substrate is given to the substrate, and imaging information generated by imaging the substrate or the molded article is linked with the identification information, the individual substrate or the molding is formed. The product can be identified by the identification information.

  In addition, when there is a plurality of imaging information, when the imaging information processing and recording unit integrates and records imaging information linked to common identification information, the same base material and molded product are imaged. Information can be collectively recorded in one piece of information, and the task of confirming imaging information can be facilitated.

  In addition, the imaging information discrimination unit records the reference information serving as a reference, and compares the imaging information generated by imaging the base material or the molded article with the reference information to determine the difference in the appearance of the base material or the molded article. When it discriminate | determines, generation | occurrence | production of the malfunction in a base material or a molded article is detectable based on a discrimination | determination result. That is, it becomes possible to confirm the occurrence of the failure at the timing when the base material or the molded product is transported in each unit.

  In addition, the resin sealing unit has a mold for resin sealing in which the substrate is sandwiched between the mold mating surfaces and the resin is sealed, and the unloader cleans the mold mating surface after resin-sealing the substrate. When the cleaner portion and the mold image pickup means for picking up an image of the same mold mating surface after the cleaner portion has been cleaned, it is possible to confirm the adhesion of dust and the like on the surface of the mold after resin sealing. As a result, when resin sealing is performed, when a defect occurs in a product sealed with resin by trapping dust, it is easy to identify the cause.

  The imaging method and the resin sealing device in the resin sealing device according to the present invention can easily identify the cause when a product failure occurs in the production process of the resin sealing device. ing.

It is a planar view schematic explanatory drawing which shows an example of the resin sealing device of a semiconductor package. BRIEF DESCRIPTION OF THE DRAWINGS It is planar view schematic explanatory drawing which shows 1st Embodiment of the resin sealing device which concerns on this invention. It is a block diagram which shows the outline of the terminal for monitoring. It is a planar view schematic explanatory drawing which shows a material supply unit in 2nd Embodiment of the resin sealing device which concerns on this invention, an in-loader, and a part of press unit. It is a flowchart which shows the flow to completion of imaging and inspection processes, such as a base material etc., in a resin sealing device.

Hereinafter, with reference to the drawings, modes for carrying out the present invention (hereinafter, referred to as “embodiments”) will be described.
In the present embodiment, with reference to FIG. 1, the position of the digger unit 5 with respect to the product storage unit 6 is referred to as “rear” or “backward”, and the position of the product storage unit 6 with respect to the Or "forward". Also, let the position of the unloader 4 with respect to the inloader 2 be “right” or “right” and the position of the inloader 2 with respect to the unloader 4 be “left” or “left”. Further, with reference to FIG. 1, the front side of the paper surface is referred to as “upper” or “upper” in the vertical direction, and the back of the paper surface is referred to as “lower” or “downward” in the vertical direction.

(Resin sealing device)
First, with reference to FIG. 1, an outline of various units constituting a resin sealing device for a semiconductor package will be described. Further, with reference to FIG. 2, the structure of a resin sealing device A in which imaging units (cameras) are provided in various units of the resin sealing device shown in FIG. 1 will be described. The resin sealing device A shown in FIG. 2 is a first embodiment of the present invention.

  As shown in FIG. 1, the resin sealing device for a semiconductor package is a material supply unit for conveying a lead frame as a base material and a resin tablet as a resin material for resin sealing (both not shown) to a predetermined position. 1 and an in-loader 2 for transporting the lead frame and the resin tablet supplied by the material supply unit 1 to the press unit 7. Further, the resin sealing apparatus takes out the molded product after resin sealing from the press unit 7 by resin sealing the lead frame on which the semiconductor element (not shown) is mounted, and conveys it to the conveyer unit 5 The unloader 4 is provided. The press unit 7 is an example of a resin sealing unit.

  Furthermore, the resin sealing device comprises a degator unit 5 for removing unnecessary portions of the resin, such as culls and runners, from the molded product, and a finished molded product from which the unnecessary part is removed from the molded product (hereinafter referred to as “semi-finished product Product storage unit 6 for transporting and storing the The resin sealing apparatus further includes a preheating unit 3 for heating the lead frame before being transported to the press unit 7.

(Material supply unit)
The material supply unit 1 has a lead frame supply device 11 and a resin tablet supply device 12.

  In addition, the lead frame supply device 11 transports the lead frame backward toward the cutout unit 110 that feeds the lead frame from a lead frame magazine (not shown) in which a plurality of lead frames are loaded, and the rotating unit 112 described later. And a rotating portion 112 for rotating the direction of the lead frame transported from the transporting portion 111 from the direction substantially parallel to the longitudinal direction to the direction substantially parallel to the lateral direction. There is.

  Further, the position of the lead frame on the rotating portion 112 in a state where the longitudinal direction of the lead frame is substantially parallel to the left and right direction corresponds to the lead frame holding portion (not shown) of the inloader 2 described later. It will be the position to come to receive.

  Moreover, the resin tablet supply apparatus 12 is an apparatus which arranges and arranges the resin tablet supplied. The position where the resin tablet of the resin tablet supply device 12 is disposed is the position where the resin tablet holding portion (not shown) of the in-loader 2 described later receives the resin tablet.

  Further, the transport unit 111 moves between the cutout unit 110 and the rotating unit 112 along a guide unit 111 a installed substantially in parallel with the front-rear direction. The transport unit 111 grips the end edge portion of the lead frame, pulls the lead frame rearward, and transports the lead frame to the rotating unit 112.

Note that represents the direction in which the conveyance unit 111 moves in the arrow _{Y 11.} Also, it represents the direction in which the rotating part 112 is rotated in the arrow _{R 11.}

  Here, the material supply unit 1 does not necessarily have to be configured by the cutting unit 110, the transport unit 111, and the rotating unit 112, and the lead frame and the resin tablet can be supplied to the in-loader 2 It is enough.

  In addition, the transport unit 111 does not necessarily grip the end edge portion of the lead frame and pull the lead frame backward to transport the lead frame to the rotating unit 112. For example, a configuration may be adopted in which the lead frame is placed on the belt conveyor and conveyed backward.

(In loader)
The in-loader 2 has a lead frame holding portion and a resin tablet holding portion (all not shown).

  The lead frame holding unit can receive and hold the lead frame positioned on the rotating unit 112 of the lead frame supply device 11, and can deliver and receive the lead frame with the preheating unit 3. Further, the lead frame holding portion can deliver the lead frame received from the preheating unit 3 to resin sealing molds 710, 720, and 730 described later. The lead frame holding portion is configured to be able to hold the lead frame with a chuck portion (not shown) interposed therebetween.

  Further, the resin tablet holding portion can receive and hold the resin tablets arranged in the resin tablet supply device 12, and can deliver the resin tablets to resin sealing molds 710, 720, 730 described later.

The direction in which the in-loader 2 moves is represented by an arrow X ₂ (left-right direction) and an arrow Y ₂ (front-rear direction).

(Press unit)
The press unit 7 includes a first press unit 71, a second press unit 72, and a third press unit 73. Each of the press units 71, 72, 73 has a resin sealing mold 710, a resin sealing mold 720, and a resin sealing mold 730, respectively.

  The lead frame and the resin tablet are conveyed to the respective resin molds 710, 720, 730, and the lead frame is resin-sealed by each mold to form a semiconductor package on which a semiconductor element (not shown) is mounted. The press unit 7 or the like may be provided at one place or two or four or more places. The semiconductor packages formed by the press units 71, 72, 73 may be of the same type or of different types in the press units 71, 72, 73.

(Unloader and preheat unit)
The unloader 4 has a molded article holding portion and a cleaner portion (both not shown).

  The molded article holding portion can take out and hold the molded article sealed with the resin by the respective resin sealing molds 710, 720, 730, and can deliver the molded article to the degating unit 50 described later. In addition, the cleaner portion removes foreign substances such as dust adhering to the surfaces of the respective resin molds 710, 720, 730 after resin sealing.

  Further, the preheat unit 3 is integrally provided to the unloader 4. The preheating unit 3 heats the lead frame delivered from the in-loader 2 and preliminarily heats it before resin sealing. By this heating, deformation of the lead frame due to heat at the time of molding is suppressed.

The direction in which the unloader 4 and the preheating unit 3 move is represented by an arrow X ₄ (left-right direction) and an arrow Y ₄ (front-rear direction).

  Here, the resin sealing device does not necessarily have to include the preheating unit 3. For example, if the lead frame has a shape, a size, or a material that is not easily deformed by heat during molding, the preheating unit 3 may not be provided.

  Further, the unloader 4 does not necessarily have to be integrally provided with the preheating unit 3. When the preheating unit 3 is provided in the resin sealing device, the position where the preheating unit 3 is provided can be changed as appropriate.

(Diger unit)
The digger unit 5 has a degate portion 50 for removing unnecessary portions of resin such as culls, runners and gates from molded articles. In the gate portion 50, unnecessary portions of the resin are removed according to the quality required for the semifinished product.

Further, the conveyer unit 5 moves along a guide portion (not shown) installed in parallel in the left-right direction. Note that represents the direction of de-Gator unit 5 is moved in the arrow X _5.

(Product storage unit)
The product storage unit 6 has a pickup unit 61 for holding the semi-finished product from which the unnecessary part has been removed from the molded product by the gate unit 50, and a recovery magazine unit 62 for containing the semi-finished product.

  The pickup unit 61 receives and holds the semi-finished product from the digger unit 5 and transports it to the collection magazine unit 62. In the recovery magazine unit 62, the transported semi-finished product is stored in a recovery magazine (not shown), and after the required number of semi-finished products are stored, the entire recovery magazine is recovered to the outside of the resin sealing device.

Further, the pickup unit 61 moves between the conveyer unit 5 and the collection magazine unit 62 along a guide unit (not shown) disposed substantially in parallel with the front-rear direction. Note that represents the direction in which the pickup unit 61 moves in the arrow Y _6.

  Then, the structure of resin sealing device A which provided the imaging means in the resin sealing device mentioned above is explained.

(Imaging means in material supply unit)
As shown in FIG. 2, the material supply unit 1 is provided with a transport unit camera 13 and a wire check camera 14 as imaging means for imaging a lead frame.

  The transport unit camera 13 is an imaging device that is attached to the transport unit 111 and monitors a state until the lead frame delivered from the lead frame magazine by the cutout unit 110 is transported to the rotation unit 112. In addition, in FIG. 2, the code | symbol 13 which showed the figure and the leader line with a dotted line represents the camera 13 for conveyance parts when the conveyance part 111 is located ahead.

  In the transport unit camera 13, imaging information of a moving image is acquired for each lead frame transported by the transport unit 111. The imaging information is transmitted and recorded to a monitoring terminal 8 (see FIG. 3) described later.

  Further, in the camera 13 for the transport unit, for example, the state of the lead frame which has been sent out from the lead frame magazine and stopped and the manner in which the transport portion 111 grips the edge portion of the lead frame is gripped and the lead frame is transported. A state, a state of the lead frame which is conveyed to the rotating portion 112 and is stationary, and the like are imaged. At this time, the appearance of the lead frame and the appearance of the bonding wire are also imaged.

  By imaging these, when transported by the transport unit 111, the lead frame may jump, or the transport unit 111 may come in contact with the bonding wire, which may lead to damage to the lead frame or the bonding wire. The phenomenon can be acquired as imaging information of a moving image related to the lead frame.

  In FIG. 2, an example of the range imaged by the transport unit camera 13 is illustrated using hatching indicated by reference numeral 13 a.

  The wire check camera 14 is fixedly disposed above the transport path of the lead frame of the transport unit 111, and captures an image of the semiconductor element of the transported lead frame and the shape of the bonding wire wired from the semiconductor element. It is.

  The wire check camera 14 obtains still image pickup information on the shapes of the semiconductor elements and the bonding wires of the individual lead frames transported by the transport unit 111. The imaging information is transmitted and recorded to the monitoring terminal 8 described later.

  The wire check camera 14 can obtain the presence or absence of deformation of the bonding wire as imaging information of a still image by imaging the shapes of the semiconductor element and the bonding wire of the lead frame sent from the lead frame magazine.

  Here, the material supply unit 1 does not necessarily have to be provided with the wire check camera 14. However, at the time when the lead frame is transported by the transport unit 111 when there is a defect in the semi-finished product, it is easy to confirm whether or not there is a problem with the bonding wire, Preferably, 14 is provided.

  Further, the position at which the transport unit camera 13 is attached to the transport unit 111 and the range in which the camera captures an image are not limited. It is sufficient if the camera 13 for conveyance part moves integrally with the conveyance part 111, and the state of the lead frame conveyed can be acquired as imaging information of a moving image. Therefore, these contents can be changed as appropriate. In addition, the number of conveyance unit cameras 13 is not limited to one, and a plurality of conveyance unit cameras 13 may be provided according to the specification of the conveyance unit 111.

  In addition, it is not necessary for the transport unit camera 13 to image all the paths through which the lead frame in the material supply unit 1 is transported. For example, if there is a range in which a transport failure is likely to occur, the state in which the lead frame is transported may be captured by limiting the range.

(Imaging means in in-loader)
As shown in FIG. 2, the in-loader 2 is provided with two in-loader cameras 21 as imaging means for imaging a lead frame.

  The in-loader camera 21 is attached to the lower part of the in-loader 2 and the lead frame is transported from the rotating part 112 to the pre-heating unit 4, the pre-heating unit 4 through the first press unit 71, and the second press unit 72. , And an imaging device that monitors the state of being transported to each of the third press units 73.

  Further, the two in-loader cameras 21 correspond to the two lead frames held by the in-loader holding unit, and one camera is configured to pick up an image of conveyance of one lead frame.

  The in-loader camera 21 acquires moving image imaging information for the two lead frames transported by the in-loader 2. The imaging information is transmitted and recorded to the monitoring terminal 8 described later.

  In the in-loader camera 21, for example, the in-loader holding unit chucks and holds the lead frame positioned in the rotating unit 112, or the lead frame held in the in-loader holding unit is transported. Images of the lead frame being placed on the preheat unit 4 from the inloader holding portion are imaged.

  In the in-loader camera 21, the in-loader holding unit chucks and holds the lead frame positioned in the preheating unit 4, or the lead frame is heated and deformed in the pre-heating unit 3, in-loader holding The appearance of the lead frame being placed on each of the resin sealing molds 710, 720, and 730 is imaged from the unit. At this time, the appearance of the lead frame and the appearance of the bonding wire are also imaged.

  By imaging these, it is possible to lead to damage to the lead frame and the bonding wire, such as a mistake in receiving and delivering the lead frame during transport by the in-loader 2 or a phenomenon in which the in-loader 2 contacts the bonding wire. Anomalous phenomena that are characteristic can be acquired as imaging information of a moving image related to the lead frame.

  In FIG. 2, an example of the range captured by the in-loader camera 21 is illustrated using hatching indicated by reference numeral 21 a.

  Here, the position at which the in-loader camera 21 is attached to the in-loader 2 and the range to be imaged by the camera are not limited. It is sufficient if the in-loader camera 21 moves integrally with the in-loader 2 and the state of the lead frame to be transported can be acquired as moving image imaging information. Therefore, these contents can be changed as appropriate. Further, the number of in-loader cameras 21 is not limited to two, and one camera may be provided or three or more cameras may be provided according to the specification of the in-loader 2.

  In addition, it is not necessary for the in-loader camera 21 to image all the paths through which the lead frame is transported by the in-loader 2. For example, if there is a range in which a transport failure is likely to occur, the state in which the lead frame is transported may be captured by limiting the range.

(Imaging means in the preheat unit)
As shown in FIG. 2, two preheating unit cameras 31 are provided in the preheating unit 3 as an imaging unit for imaging a lead frame.

  The camera 31 for the preheating unit is attached to the preheating unit 3, transported from the inloader 2, the state of the lead frame heated by the preheating unit 3, and the state of the lead frame heated and received by the inloader 2. It is an imaging device to monitor.

  The two preheat unit cameras 31 correspond to the two lead frames heated by the preheat unit 3, and one camera is configured to pick up an image of one lead frame.

  In the camera 31 for preheating units, the imaging information of a moving image is acquired about two lead frames which the preheating unit 3 heats. The imaging information is transmitted to and recorded in a monitoring terminal described later.

  In the preheating unit camera 31, for example, a state in which the lead frame is placed from the inloader holding portion to the preheating unit 4, a state in which the inloader holding portion chucks and holds the lead frame positioned in the preheating unit 3, etc. Is imaged. At this time, the appearance of the lead frame and the appearance of the bonding wire are also imaged.

  By imaging these, a lead frame deformed due to a mistake in receiving or delivering a lead frame between the in-loader 2 and the preheating unit 3 or a large warpage, etc. comes into contact with the in-loader 2 An abnormal phenomenon such as a phenomenon which may lead to damage to the lead frame or the bonding wire can be acquired as imaging information of a moving image related to the lead frame.

  In FIG. 2, an example of the range imaged by the preheat unit camera 31 is illustrated using hatching indicated by reference numeral 31 a.

  Here, the position at which the preheating unit camera 31 is attached to the preheating unit 3 and the range of imaging by the camera are not limited. It is sufficient if the state of the lead frame heated by the preheating unit 3 can be acquired as imaging information of a moving image. Therefore, these contents can be changed as appropriate. Further, the number of cameras 31 for preheat unit is not limited to two, and one camera may be provided or three or more cameras may be provided according to the specification of preheat unit 3.

(Imaging means in the unloader)
As shown in FIG. 2, the unloader 4 is provided with an unloader camera 41 as an imaging means for imaging a molded product after being resin-sealed. In addition, the unloader 4 is provided with a mold camera 42 as an imaging means for imaging the mold surfaces of the resin sealing molds 710, 720, 730.

  The unloader camera 41 is an imaging device that is attached to the lower part of the unloader 2 and monitors a state in which a molded product is transported from the resin sealing molds 710, 720, and 730 to the digator unit 5.

  In addition, in the unloader camera 41, imaging information of a moving image is acquired for a molded product transported by the unloader 4. The imaging information is transmitted to and recorded in a monitoring terminal described later.

  In the unloader camera 41, for example, the molded product holding portion takes out the molded product molded by the resin sealing mold 710, or the molded product held by the molded product holding unit is transported. The appearance of the molded product being placed on the digger unit 5 from the molded product holding portion is imaged. In addition, the appearance of the molded product at this time is also imaged.

  By imaging these, there is a possibility that the molded article may be damaged, such as a mistake in taking out or delivering the molded article during conveyance by the unloader 4, a phenomenon in which the unloader 4 comes in contact with the resin molding portion An abnormal phenomenon can be acquired as imaging information of a moving image related to the molded article. In addition, the appearance of the molded product after resin sealing can be confirmed, and the presence or absence of the occurrence of resin leakage or the like at the time of resin sealing can also be confirmed.

  The camera for mold 42 is attached to the upper and lower sides of the unloader 4, and the imaging information of the moving image of the mold surface of the mold for resin sealing 710, 720, 730 cleaned by the cleaner portion of the unloader 4 after resin sealing. Is acquired. The imaging information is transmitted to and recorded in a monitoring terminal described later.

  In the mold camera 42, by imaging the mold surfaces of the resin sealing molds 710, 720 and 730 cleaned by the cleaner section, presence or absence of foreign matter such as dust on the mold surface is taken as imaging information It can be acquired.

  In FIG. 2, an example of the range imaged by the mold camera 42 is illustrated using hatching indicated by reference numeral 42 a.

  Here, the unloader 4 does not necessarily have to be provided with the mold camera 42. However, as described above, by imaging the presence or absence of foreign matter such as dust on the surface of the mold for resin sealing 710, 720, 730 cleaned by the cleaner portion, dust during resin sealing It is preferable that the camera for a mold 42 be provided to the unloader 4 in order to make it easy to identify the cause when a malfunction of a semi-finished product occurs in the bite and the like.

  Further, the position at which the mold camera 42 is attached to the unloader 4 and the range of imaging by the camera are not limited. It is sufficient if the state of the mold surface of the resin sealing mold 710, 720, 730 can be acquired as imaging information of a moving image. Therefore, these contents can be changed as appropriate. Further, the number of mold cameras 42 is not limited to one, and a plurality of mold cameras 42 may be provided in accordance with the specifications of the unloader 4.

  Further, the position at which the unloader camera 41 is attached to the unloader 4 and the range in which the camera captures an image are not limited. It is sufficient if the unloader camera 41 moves integrally with the unloader 4 and the state of the conveyed molded article can be acquired as moving image imaging information. Therefore, these contents can be changed as appropriate. Further, the number of unloader cameras 41 is not limited to one, and a plurality of unloader cameras 41 may be provided in accordance with the specifications of the unloader 4.

  In addition, it is not necessary for the unloader camera 41 to image all the paths through which the molded article in the unloader 4 is transported. For example, as long as there is a range in which a transport failure easily occurs, the state in which a molded product is transported may be imaged by limiting the range.

(Imaging means in the dgator unit)
As shown in FIG. 2, the inloader 2 is provided with a camera 51 for a digator unit as an imaging means for imaging a molded product.

  The camera 51 for the diverter unit is attached to the diverter unit 5 and the molded product is transported by the conveyer unit 5, the molded product transported from the unloader 4 and delivered to the gate unit 50 (no need for resin It is an imaging device to monitor the state of the semi-finished product from which the unnecessary part of the resin has been removed by the degating unit 50).

  In the camera 51 for the diverter unit, imaging information of a moving image is acquired for the molded product and the semi-finished product transported by the conveyer unit 5. The imaging information is transmitted to and recorded in a monitoring terminal described later.

  Further, in the camera 51 for the conveyer unit, for example, a state in which a molded product is delivered from the unloader 4 to the gate 5, a state in which an unnecessary portion of resin is removed from the molded portion, removal of an unnecessary portion The appearance and the like of the front and rear molded articles are imaged.

  By taking an image of these, it is possible to make a mistake when transferring a molded product between the unloader 4 and the conveyer unit 5, a defect when transporting a molded product or a semi-finished product by the conveyer unit 5, etc. An abnormal phenomenon that may lead to damage of a semifinished product or the semifinished product can be acquired as imaging information of a moving image of the article or semifinished product.

  In FIG. 2, an example of the range imaged by the camera 51 for a degator unit is illustrated using hatching indicated by reference numeral 51 a.

  Here, the position at which the camera 51 for the digether unit is attached to the digether unit 5 and the range of imaging by the camera are not limited. It is sufficient as long as the camera 51 for the diverter unit moves integrally with the conveyer unit 5 and the state of the conveyed molded product or semi-finished product can be acquired as imaging information of a moving image. Therefore, these contents can be changed as appropriate. Also, the number of cameras 51 for the diverter unit is not limited to one, and a plurality of cameras may be provided in accordance with the specifications of the digger unit 5.

  In addition, it is not necessary for the camera 51 for the diverter unit to image all the paths along which the molded product or the semifinished product is transported by the conveyer unit 5. For example, as long as there is a range in which a transport failure easily occurs, the state in which a molded product or a semi-finished product is transported may be imaged by limiting the range.

(Imaging means in product storage unit)
As shown in FIG. 2, the product storage unit 6 is provided with a product storage unit camera 63 as an imaging unit for capturing an image of a semi-finished product.

  The product storage unit camera 63 is attached to the product storage unit 6 and monitors the state of the semi-finished product transferred by the pickup unit 61 and transferred to the collection magazine unit 62 in a state where the semi-finished product is transferred by the pickup unit 61 An imaging device.

  In the product storage unit camera 63, imaging information of a moving image is acquired for the semi-finished product conveyed by the pickup unit 61. The imaging information is transmitted to and recorded in a monitoring terminal described later.

  Further, in the product storage unit camera 63, for example, a state in which the pickup unit 61 receives a semi-finished product from the digger unit 5, an appearance of the semi-finished product, and the like are imaged.

  By imaging these, it leads to damage of a semi-finished product, such as a mistake at the time of delivery of a semi-finished product between the digger unit 5 and the pickup unit 61, a defect when transporting the semi-finished product by the pick-up unit 61 A possible abnormal phenomenon can be acquired as imaging information of the semi-finished product moving image. In addition, it is also possible to confirm the appearance of the semi-finished product and check the remaining condition of the car, the runner, the gate and the like.

  In FIG. 2, an example of the range captured by the product storage unit camera 63 is illustrated using hatching indicated by reference numeral 63 a.

  Here, the position at which the product storage unit camera 63 is attached to the product storage unit 6 and the range in which the camera captures an image are not limited. It is sufficient if the product storage unit camera 63 moves integrally with the product storage unit 6 and the status of the conveyed semi-finished product can be acquired as imaging information of a moving image. Therefore, these contents can be changed as appropriate. Further, the number of product storage unit cameras 63 is not limited to one, and a plurality of product storage unit cameras 63 may be provided according to the specification of the product storage unit 6.

  Further, it is not necessary for the product storage unit camera 63 to image all the paths along which the semifinished product is transported by the product storage unit 6. For example, as long as there is a range in which a transport failure easily occurs, the state in which a semi-finished product is transported may be imaged by limiting the range.

  Here, the resin sealing device A does not necessarily have the transport unit camera 13, the wire check camera 14, the inloader camera 21, the preheat unit camera 31, the unloader camera 41, the mold camera 42, and the digiter unit. It is not necessary to provide all of the cameras 51 for the camera 51 and the camera 63 for the product storage unit. For example, only the transport unit camera 13 and the in-loader camera 21 are provided, and only the transport of the lead frame is imaged, or only the in-loader camera 21 and the unloader camera 41 are provided. It may be a mode which picturizes conveyance of a lead frame and a cast. That is, the type of camera to be installed can be appropriately selected according to the application. However, bonding wires and lead frames before resin sealing have portions exposed to the outside without being sealed with resin, and compared to molded products and semi-finished products after resin sealing, they are damaged or deformed due to transport problems. It is preferable that an imaging means be provided in a part of the path for conveying the lead frame by the material supply unit 1 or the in-loader 2 since this is likely to occur.

  Moreover, although the imaging unit is not provided in the press unit 7 in the resin sealing device A described above, it is conceivable to provide an imaging unit in the press unit and acquire the appearance of resin sealing as imaging information of a moving image.

  Subsequently, an imaging method in the resin sealing device A will be described. In addition, the imaging method of the resin sealing apparatus demonstrated here is an example of the imaging method of the resin sealing apparatus to which this invention is applied.

  First, in the material supply unit 1, the transport unit camera 13 attached to the transport unit 111 captures an image of the lead frame transported by the transport unit 111. The transport unit camera 13 captures an image of the lead frame while moving at the same speed in the same direction as the transported lead frame.

  The transport camera 13 acquires moving image information as a fixed image in which the state of the lead frame can be easily confirmed. This moving image information can capture the presence or absence of an abnormal phenomenon during conveyance by the conveyance unit 111.

  In addition, the wire check camera 14 fixedly disposed above the transport path of the lead frame in the transport unit 111 captures an image of the lead frame. The wire check camera 14 captures a still image of the lead frame in a stationary state before the transport unit 111 starts transport. In this still image, the detailed shapes of the semiconductor element and the bonding wire in the lead frame can be confirmed.

  In the in-loader 2, the in-loader camera 21 attached to the in-loader 2 captures an image of a lead frame which is held and transported by the lead frame holder. The in-loader camera 21 picks up a lead frame while moving at substantially the same speed in substantially the same direction as the lead frame to be conveyed.

  The in-loader camera 21 acquires moving image information as a fixed image in which the state of the lead frame can be easily confirmed. The in-loader camera 21 obtains moving image information that allows confirmation of a state in which the lead frame is heated and deformed. This moving image information can catch the presence or absence of an abnormal phenomenon at the time of conveyance by the in-loader 2. In addition, it is possible to capture the state of reception and delivery of the lead frame between the rotating unit 112, the preheating unit 3, and the press units 71, 72, 73, and the inloader 2.

  In the preheating unit 3, the camera 31 for the preheating unit attached to the preheating unit 3 captures an image of the state in which the lead frame is heated. The preheat unit camera 31 can also capture the state of reception and delivery of the lead frame with the in-loader 2.

  In the unloader 4, after the unloader camera 41 attached to the unloader 4 is resin-sealed by the resin-sealing molds 710, 720, 730, it is held by the molded product holding portion and conveyed. Take an image of the molded article. The unloader camera 41 captures a molded product while moving at substantially the same speed in substantially the same direction as the conveyed molded product.

  The unloader camera 41 acquires moving image information as a fixed image in which the state of the molded product can be easily confirmed. This moving image information can catch the presence or absence of an abnormal phenomenon during transportation by the unloader 4. In addition, it is possible to capture the appearance of taking out the molded product from each of the resin sealing molds 710, 720, and 730, and the appearance of delivery of the lead frame between the conveyer unit 5 and the unloader 4.

  Further, in the unloader 4, the mold camera 42 attached to the unloader 4 is cleaned by the cleaner portion of the unloader 4 after resin sealing, and the mold surface of the resin sealing mold 710, 720, 730 Capture the image. The mold camera 42 acquires moving image information that allows confirmation of the presence or absence of foreign matter such as dust on the surface of the mold.

  In the digger 5, the camera 51 for the digger attached to the digger 5 captures an image of the molded product conveyed by the digger 5. The camera 51 for a dagger captures an image of a molded article while moving at substantially the same speed in substantially the same direction as the conveyed molded article.

  Moving image information as a fixed image in which the state of the molded product can be easily confirmed is acquired by the camera 51 for a dagger. This moving image information can catch the presence or absence of an abnormal phenomenon at the time of conveyance by the digator 5. In addition, it is also possible to capture a state in which unnecessary portions of the resin are removed from the molded product in the gate portion 50.

  In the product storage unit 6, the product storage unit camera 63 attached to the product storage unit 6 captures an image of a semi-finished product conveyed by the pickup unit 61. The product storage unit camera 63 captures an image of a semifinished product while moving at substantially the same speed in substantially the same direction as the semifinished product to be transported.

  The product storage unit camera 63 acquires moving image information as a fixed image in which the state of the semi-finished product can be easily confirmed. This moving image information can catch the presence or absence of an abnormal phenomenon at the time of conveyance by the pickup unit 61. In addition, it is also possible to capture how the pickup unit 61 receives a semi-finished product.

  With the above content, it is possible to image how the lead frame, the molded article and the semifinished product are transported in the resin sealing apparatus A.

Then, the structure in connection with the processing of the imaging information of each imaging means mentioned above is demonstrated.
The resin sealing device A includes a monitoring terminal 8 (see FIG. 3) that processes imaging information. The monitoring terminal 8 is configured to be able to transmit and receive information to and from each camera provided in the resin sealing device A via wired or wireless communication (see FIG. 3).

  Further, the monitoring terminal 8 has an imaging information processing recording unit 81. The imaging information processing and recording unit 81 integrates and records a plurality of imaging information captured by each camera as imaging information linked to specific identification information based on the identification information added to one lead frame. . That is, imaging information unique to each lead frame is recorded for all lead frames sealed by the resin sealing device, and the imaging information can be managed as one data.

  Further, the identification information of the lead frame used here is not particularly limited as long as the individual lead frames (molded articles and semi-finished products) sealed by the resin sealing apparatus can be identified. For example, the manufacturing lot number of the lead frame, the unit name, the number indicating the order sent out from the lead frame magazine, or the like can be set in combination or alone. Also, if identification information (code number) is attached to the lead frame itself, this can also be used. The identification information is recorded in the imaging information processing recording unit 81.

  Further, the imaging information recorded in the imaging information processing recording unit 81 is configured to be deleted after being stored for a certain period. With this configuration, the capacity of the information recorded in the imaging information processing recording unit 81 can be easily maintained at a certain amount or less, and management of imaging information can be facilitated. The period during which the imaging information is erased can be appropriately set in accordance with the timing at which the inspection of the quality of the semifinished product is completed.

  The monitoring terminal 8 also has an imaging unit control unit 82 (see FIG. 3). The imaging unit control unit 82 is a part that adjusts the imaging condition of each camera. For example, the operator can set conditions such as the imaging range of each camera, the timing of imaging, the imaging time, and the like via the imaging unit control unit 82.

  Further, the monitoring terminal 8 has an abnormality determination unit 83 (see FIG. 3). The abnormality determination unit 83 compares the image data of a normal appearance such as a lead frame with the imaging information captured by each camera, and determines the presence or absence of an abnormality in the lead frame reflected in the imaging information.

  For example, on the basis of image data of a molded article having a normal appearance in the imaging range, minimum and maximum ranges are provided for position coordinates of the outer shape of the molded article that can be regarded as a normal appearance and set as a reference range. Then, the appearance of the molded product after resin sealing is imaged by the unloader camera 41, and information of position coordinates obtained from the image data of the molded product shown in the imaging information and information of position coordinates of the reference range On the other hand, when the reference range is exceeded, it is judged as abnormal. If this determination is performed during conveyance of the molded product, it is possible to stop the resin sealing device A based on the determination result of the abnormality and immediately perform the confirmation operation of the device.

  In addition, when the resin sealing device A is stopped, the imaging information processing and recording unit 81 receives imaging information such as a lead frame processed by a unit provided with a sensor mechanism that has detected an abnormality that has caused the stop. Recorded as stop imaging information.

  The stop of the resin sealing device A means, for example, that the sensor mechanism detects that the lead frame holding portion of the inloader 2 has failed to hold the lead frame and the resin sealing device A is stopped. is there. According to this configuration, the worker can confirm the imaging information at the time of stop, and can immediately identify and respond to the cause.

  Here, the monitoring terminal 8 is not necessarily provided, and it is not necessary to be able to transmit and receive information with each camera. For example, the imaging information of each camera may be transmitted to the server, and recording and processing of the imaging information may be performed on the server.

Subsequently, in a resin sealing device to which the present invention is applied, the second embodiment described below can also be adopted.
The difference from the resin sealing device A in the resin sealing device B according to the second embodiment is in the structure in which the imaging means is installed. In the resin sealing apparatus B, the lead frame supply device 11, the resin tablet supply device 12, the cutout portion 110, the transport portion 111, the rotation portion 112, and the first press unit 71 are the members shown in FIG. Since they have the same configuration, they are denoted by the same reference numerals, and the detailed description thereof is omitted.

  As shown in FIG. 4, in the material supply unit 1B of the resin sealing device B, a transport unit camera 13B is provided as an imaging unit for imaging a lead frame. The transport unit camera 13B is fixed to a movable body 130B movable along the rail portion 130. In addition, the movement of the movable body 130B is controlled so as to be movable in the material supply unit 1B in accordance with the direction and speed at which the lead frame is conveyed.

  A state in which the lead frame sent out from the lead frame magazine by the cutout unit 110 is conveyed to the rotation unit 112 by moving the conveyance unit camera 13B along with the movement of the conveyance unit 111 together with the movable body 130B. Can be monitored. In FIG. 4, the direction in which the transport unit camera 13B moves is indicated by an arrow Y.

  As shown in FIG. 4, an in-loader camera 21B is provided in the in-loader 2B of the resin sealing device B as an imaging means for imaging a lead frame. The in-loader camera 21 B is fixed to a movable body 210 B movable along the rail portion 210. In addition, the movement of the moving body 210B is controlled so that the in-loader 2B can move in accordance with the direction and speed at which the lead frame is transported. The lead frame holding portion and the resin tablet holding portion in the in-loader 2B have the same configuration as the in-loader 2 described above.

  By moving the in-loader camera 21B together with the movable body 210B in accordance with the movement of the in-loader 2B, it is possible to monitor the state in which the lead frame is held and transported by the in-loader holding unit. In FIG. 4, the direction in which the in-loader camera 21B moves is indicated by an arrow X.

  As described above, in the resin sealing device to which the present invention is applied, unlike the configuration in which the imaging device is provided in the conveyance device for conveying the lead frame, the moving body having another drive is provided, and the imaging device is provided in this moving body. It is also possible to image the state of conveyance of the lead frame. In the resin sealing apparatus B, the material supply unit 1B and the inloader 2B have been described by way of example, but in the preheat unit, the unloader, the conveyer unit and the product storage unit, moving bodies of different drive are similarly provided. An aspect of imaging a molded article or a semifinished product can also be adopted.

  Subsequently, an imaging method in the resin sealing device B will be described. In addition, the imaging method of the resin sealing apparatus demonstrated here is an example of the imaging method of the resin sealing apparatus to which this invention is applied.

  First, in the material supply unit 1, the transport unit camera 13 </ b> B provided on the movable body 130 </ b> B movable in the front-rear direction along the rail unit 130 captures an image of the lead frame transported by the transport unit 111. The conveyance unit camera 13B captures an image of the lead frame while moving at substantially the same speed in substantially the same direction as the lead frame to be conveyed integrally with the movable body 130B.

  Moving image information as a fixed image in which the state of the lead frame can be easily checked is acquired by the transport unit camera 13B. This moving image information can capture the presence or absence of an abnormal phenomenon during conveyance by the conveyance unit 111.

  In the in-loader 2B, the in-loader camera 21B provided on the movable body 210B movable in the left-right direction along the rail portion 210 captures an image of the lead frame transported by the in-loader 2B. The in-loader camera 21B captures an image of the lead frame while moving at substantially the same speed in substantially the same direction as the lead frame to be conveyed together with the moving body 210B.

  The in-loader camera 21B acquires moving image information as a fixed image in which the state of the lead frame can be easily confirmed. This moving image information can catch the presence or absence of an abnormal phenomenon at the time of transportation by the in-loader 2B. In addition, the lead frame is received between the rotating unit 112, the preheating unit (not shown in FIG. 4), and each of the press units 71, 72, 73 (in FIG. 4, the press units 72, 73 are omitted) We can catch the situation of delivery.

  With the above content, it is possible to image how the lead frame is transported in the resin sealing device B.

  Hereinafter, with reference to FIG. 5, the flow until the completion of the imaging and inspection steps of the base material and the like in the resin sealing device to which the present invention is applied will be described.

(Step S1)
The resin sealing device A captures an image of a lead frame, a molded article, and a semi-finished product by a camera provided in each unit of the resin sealing device A.
(Step S2)
When the resin sealing device A detects an abnormality by the sensor mechanism or the like and stops its operation, the process proceeds to step S3. If the resin sealing device A does not detect an abnormality, the process proceeds to step S4.

(Step S3)
Regarding a unit provided with a sensor mechanism that has detected an abnormality that causes a stop of the resin sealing device A, the resin sealing device A picks up imaging information (image information at the time of stopping) of a camera attached to the unit It records in the process recording part 81.
The operator confirms the stop imaging information, sees the operation status of the unit, and analyzes the cause of the abnormality. If the problem is corrected, the resin sealing apparatus A returns the process between step S1 and step S2.

(Step S4)
When resin sealing by the resin sealing device A is completed (for example, completion of resin sealing of a production lot of one lead frame), the resin sealing device A is configured to use each camera based on the identification information given to the lead frame. The imaging information captured in step (c) is integrated into one data and recorded in the imaging information processing recording unit 81.

(Step S5)
The resin sealing device A inspects the quality of the semifinished product. If there is a defect in the semifinished product, the process proceeds to step S6. If there is no defect in the semi-finished product, the monitoring process is completed.

(Step S6)
The operator confirms the imaging information integrated and recorded based on the identification information for the semi-finished product having the defect. From the content of the imaging information, the unit that caused the abnormality is identified.
Analyze the cause of the abnormality by looking at the operation status etc. of the unit. If the problem is corrected, the resin sealing device A ends the monitoring process.

  According to the above flow, the lead frame, the molded article and the semifinished product in the resin sealing device A can be monitored. In resin-sealed apparatus A, by recording the state in which a lead frame or the like is processed in each unit as imaging information of a moving image, when a defect of a semi-finished product occurs in the later inspection process, based on the imaging information, The task of identifying the cause of the abnormality can be easily performed.

As described above, the imaging method in the resin sealing device according to the present invention can easily identify the cause when a product failure occurs in the production process of the resin sealing device. ing.
Moreover, when the defect of a product generate | occur | produces in the manufacturing process of a resin sealing device, the resin sealing device which concerns on this invention can specify the cause easily.

DESCRIPTION OF SYMBOLS 1 material supply unit 11 lead frame supply apparatus 110 cutout part 111 conveyance part 111a guide part 112 rotation part 12 resin tablet supply apparatus 13 camera for conveyance part 13B camera for conveyance part 130 rail part 130B moving body 14 camera for wire check 2 in Loader 21 In-loader camera 21 B In-loader camera 210 Rail part 210 B Moving object 3 Pre-heat unit 31 Camera for pre-heat unit 4 Un-loader 41 Un-loader camera 42 Mold camera 5 De-gator unit 50 Di-gate unit 51 For Di-ger unit Camera 6 product storage unit 61 pickup section 62 collection magazine section 63 camera for product storage unit 7 press unit 71 first press unit 710 resin sealing mold 7 2 second press unit 720 resin sealing mold 73 third press unit 730 resin sealing mold 8 monitoring terminal 81 imaging information processing recording unit 82 imaging unit control unit 83 abnormality determination unit

Claims (11)

A material supply unit for conveying a substrate having a semiconductor element mounted thereon to a predetermined position; and an in-loader for conveying the substrate conveyed by the material supply unit to a resin sealing unit for resin-sealing the substrate. An imaging method in a resin sealing apparatus including:
At least a part of the transport route of the base material by the material supply unit and the transport route of the same base substrate by the in-loader, the same base material is imaged while moving in substantially the same direction and at substantially the same speed An imaging method in the resin sealing device. At least a portion of the transport path of the substrate by the material supply unit and the transport path of the same substrate by the in-loader,
A step of imaging the state in which the substrate is stationary before the step of imaging the substrate while moving in substantially the same direction as the substrate and at substantially the same speed
Or
The resin sealing device according to claim 1, further comprising a step of imaging the state in which the substrate is stationary after the step of imaging the substrate while moving in substantially the same direction as the substrate and at substantially the same speed. Imaging method. The molded product is imaged while moving at substantially the same direction as the molded product and at substantially the same speed in at least a part of a transport path for transporting the molded product in which the base material is resin-sealed by the resin sealing unit The imaging method in the resin sealing device according to claim 1 or 2 comprising a process. The substrate according to claim 1, 2 or 3, wherein the substrate is imaged by the conveyance route of the substrate by the material supply unit and the conveyance route of the substrate by the in-loader. Imaging method in a resin sealing device. A material supply unit for conveying a substrate having a semiconductor element mounted thereon to a predetermined position; and an in-loader for conveying the substrate conveyed by the material supply unit to a resin sealing unit for resin-sealing the substrate. A resin sealing device comprising
The transport path of the base by the material supply unit and the transport path of the base by the in-loader are at substantially the same direction as the base while being synchronized with the transport of the base. Moving means movable to
And a substrate imaging unit attached to the moving unit for imaging the substrate
Resin sealing device . And a preheating unit for heating the base material and for receiving the same base material which has been heated.
It has a preheated substrate imaging means for imaging the substrate to be heated
The resin sealing device according to claim 5 . An unloader which receives from the resin sealing unit a molded article obtained by sealing the base material with the resin sealing unit from the resin sealing unit and is transported, and the molded article is delivered from the unloader, so that the molded article is unnecessary. And a product storage unit configured to remove the resin part and transfer the molded product, and a product storage unit to receive and transfer the molded product from the digger unit.
Movement of the molded product being conveyed along at least a part of the conveying path of the molded article by the unloader, the conveying path of the molded article by the conveyer unit, and the conveying path of the molded article by the product storage unit Moving means movable in substantially the same direction as the molded product while being synchronized with
It has a molded article imaging means attached to the moving means and imaging the molded article
The resin sealing device according to claim 5 . An unloader for receiving from the resin-sealed unit a molded article in which the substrate is resin-sealed by the resin-sealed unit for resin-sealing the base on which the semiconductor element is mounted and transporting the molded article from the unloader A conveyer unit for delivering the molded article, removing the unnecessary resin portion of the molded article, and a product storage unit for delivering the molded article from the conveyer unit for delivery; a comprises Ru resin sealing device,
Movement of the molded product being conveyed along at least a part of the conveying path of the molded article by the unloader, the conveying path of the molded article by the conveyer unit, and the conveying path of the molded article by the product storage unit Moving means movable in substantially the same direction as the molded product while being synchronized with
It has a molded article imaging means attached to the moving means and imaging the molded article
Resin sealing device . Identification information capable of identifying the substrate is given to the substrate,
The imaging information generated by imaging the base material or the molded article is associated with the identification information, and when there is a plurality of the imaging information, the imaging information associated with the common identification information is integrated The imaging information processing recording unit for recording
The resin sealing device according to claim 7 or 8 . An imaging that records a reference information serving as a reference and compares the imaging information generated by imaging the substrate or the molded article with the reference information to determine a difference in the appearance of the substrate or the molded article It has an information discrimination unit
The resin sealing device according to claim 7, claim 8 or claim 9 . The resin-sealed unit has a resin-sealable mold for resin-sealing by sandwiching the base material on a mold mating surface,
The unloader has a cleaner portion that cleans the mold mating surface after resin-sealing the base, and a mold imaging unit that captures an image of the same mold mating surface after the cleaner portion cleans.
The resin sealing device according to claim 7, claim 8, claim 9 or claim 10 .

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