CN109041441B - Batch management exposure method and exposure equipment for PCB - Google Patents
Batch management exposure method and exposure equipment for PCB Download PDFInfo
- Publication number
- CN109041441B CN109041441B CN201811072228.6A CN201811072228A CN109041441B CN 109041441 B CN109041441 B CN 109041441B CN 201811072228 A CN201811072228 A CN 201811072228A CN 109041441 B CN109041441 B CN 109041441B
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- pcb
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000011010 flushing procedure Methods 0.000 claims abstract description 7
- 238000004140 cleaning Methods 0.000 claims abstract description 4
- 238000009826 distribution Methods 0.000 claims description 38
- 230000003287 optical effect Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention relates to a batch management exposure method for a PCB, which comprises the following steps: ① . Preparing a PCB, namely flushing the PCB to be exposed with cleaning oil or pasting dry films on the upper surface and the lower surface, and then placing the PCB to be exposed into an exposure station of an exposure machine; ② . Starting an exposure lamp to perform image processing on the corresponding part of the PCB, and simultaneously performing code printing on the edge of the PCB by adopting a mode of hardening ink or a dry film by a code printing device in the exposure machine, wherein the light rays of the exposure lamp and the code printing device are not interfered with each other; ③ . The exposed PCB product is washed, the exposed and beam-hardened parts are not washed away, and then the exposure and coding marking of the PCB are synchronously completed, so that the batch management of the PCB is realized; the invention can realize the optical hardening treatment of the PCB board while exposing, and can realize the accurate completion of the integrated operation of exposing and coding by matching with the flushing after exposing, thereby realizing the good batch management of the PCB board.
Description
Technical Field
The invention relates to the field of PCB exposure processing, in particular to a PCB batch management exposure method and exposure equipment thereof.
Background
The batch management is an essential element for providing information service for tracing, for example, the batch is distinguished according to different prices when in warehouse entry, which is a necessary requirement; for the time sequence requirement, the first-in first-out and period are basic rules of material management, and the batch management is a non-second law gate for realizing first-in first-out; for the quality requirement, the production process has reworking and exception handling, so that batch confusion can not be tracked, and particularly, the circuit boards in the fields of national military industry, aviation, automobiles and the like are related, when one circuit board is found to be faulty, if the circuit board is controlled in an effective mode without batch management or the like, a large amount of manpower and material cost are increased to screen or defective products can not be found, and then the whole batch of products are scrapped directly, so that the cost loss is larger.
For the circuit board manufacturing industry, the internal batch management is also a very annoying item in the material circulation process, and currently, the batch number information tracking is mainly realized by adding a coding machine or a steel seal machine or drilling marks on the edges of the boards, but the additional cost is increased to complete the method, the effect is poor, the risk of batch number uncleanness or leakage easily exists, and the management of various processes and factories is seriously puzzled.
Disclosure of Invention
The invention aims to provide a PCB batch management exposure method and exposure equipment thereof, which can realize the optical hardening treatment of the PCB during exposure and realize the accurate completion of exposure and coding integrated operation in cooperation with flushing after exposure, thereby realizing good batch management of the PCB.
In order to achieve the above purpose, the invention adopts the following technical scheme: a PCB batch management exposure method comprises the following steps:
① . Preparing a PCB, namely flushing the PCB to be exposed with cleaning oil or pasting dry films on the upper surface and the lower surface, and then placing the PCB to be exposed into an exposure station of an exposure machine;
② . Starting an exposure lamp to perform image processing on the corresponding part of the PCB, and simultaneously performing code printing on the edge of the PCB by adopting a mode of hardening ink or a dry film by a code printing device in the exposure machine, wherein the light rays of the exposure lamp and the code printing device are not interfered with each other;
③ . The exposed PCB product is washed, the exposed and beam-hardened parts are not washed away, and then the exposure and coding marking of the PCB are synchronously completed, so that the batch management of the PCB is realized.
Preferably, the code in step ② is at least one-bit symbol code, and the controller controls the light beam change of the code printing device in synchronization with a counter inside the exposure machine.
The other technical scheme of the invention is as follows: the utility model provides a PCB board batch management exposure equipment, includes two distribution control boxes and the conveyor who sets up between them, the conveyor top be provided with the exposure lamp, the inboard of distribution control box be provided with the code printing device, the code printing device be located the product edge top on the conveyor exposure station, the code printing device be the light beam code printing device, and its and the light mutually noninterfere of exposure lamp, code printing device and exposure lamp be connected to the distribution control box.
Preferably, the code printing device comprises a code printing box which is arranged between two distribution control boxes and has no lower bottom plate hollow, wherein at least one code printing device is arranged on the inner side of an upper cover of the code printing box, and each code printing device is matched with a counter in the distribution control box for code printing.
Preferably, each code printing device comprises an 8-shaped structure formed by 7 code printing laser light bars, and each code printing laser light bar is connected to the power distribution control box.
Preferably, the hole which is sleeved and matched with the code printing box is formed in the inner side plate of the power distribution control box at the rear side, and the code printing pushing cylinder which is connected with the code printing box and runs forwards and backwards is arranged in the power distribution control box, and the code printing pushing cylinder is communicated with the control element in the power distribution control box.
Preferably, a positioning opening matched with the coding box (7) is formed in the inner side of the other power distribution control box (1), a pressure sensor (9) is embedded in the positioning opening, and the pressure sensor (9) is communicated with a control element in the power distribution control box (1).
The invention can realize the optical hardening treatment of the PCB board while exposing, and can realize the accurate completion of the integrated operation of exposing and coding by matching with the flushing after exposing, thereby realizing the good batch management of the PCB board.
Drawings
Fig. 1 is a schematic structural diagram of a batch management exposure apparatus for PCB boards.
Fig. 2 is a schematic structural view of a portion of the coding device.
Fig. 3 is a bottom view of the coding box and the coding device thereof.
The text labels shown in the figures are expressed as: 1. a power distribution control box; 2. a conveying device; 3. a product; 4. an exposure lamp; 5. a coding device; 6. coding to push the cylinder; 7. coding a code box; 8. a code printer; 9. a pressure sensor; 10. coding laser lamp bars.
Detailed Description
In order that those skilled in the art may better understand the technical solutions of the present invention, the following detailed description of the present invention with reference to the accompanying drawings is provided for exemplary and explanatory purposes only and should not be construed as limiting the scope of the present invention.
As shown in fig. 1-3, the specific structure of the invention is as follows: the utility model provides a PCB board batch management exposure equipment, includes two distribution control boxes 1 and conveyor 2 that set up between them, conveyor 2 top be provided with exposure lamp 4, its characterized in that, the inboard of distribution control box 1 be provided with the coding device 5, coding device 5 be located the product edge top on the conveyor 2 exposure station, coding device 5 be the light beam and beat the coding device, and its and the light mutual noninterference of exposure lamp 4, coding device 5 and exposure lamp 4 be connected to distribution control box 1.
The coding device 5 comprises a coding box 7 which is arranged between two distribution control boxes 1 and has no lower bottom plate hollow, the inner side of an upper cover of the coding box 7 is provided with at least one coding device 8, and each coding device 8 is matched with a counter in the distribution control box 1 for coding.
Each code printing device 8 is composed of 7 code printing laser light bars 10 to form an 8-shaped structure, and each code printing laser light bar 10 is connected to the power distribution control box 1.
The inner side plate of the power distribution control box 1 at the rear side is provided with a hole which is sleeved and matched with the code printing box 7, and the power distribution control box 1 is internally provided with a code printing pushing cylinder 6 which is connected with the code printing box 7 and runs forwards and backwards, and the code printing pushing cylinder 6 is communicated with a control element in the power distribution control box 1.
The inside of the other distribution control box 1 is provided with a positioning opening matched with the coding box 7, a pressure sensor 9 is embedded in the positioning opening, and the pressure sensor 9 is communicated with a control element in the distribution control box 1.
The batch management exposure method for the PCB by adopting the equipment is characterized by comprising the following steps of:
① . Preparing a PCB, namely flushing the PCB to be exposed with cleaning oil or pasting dry films on the upper surface and the lower surface, and then placing the PCB to be exposed into an exposure station of an exposure machine;
② . The exposure lamp is started to process images of the corresponding parts of the PCB through the power distribution control box, meanwhile, the printing device in the exposure machine is used for printing codes on the edge of the PCB in a mode of hardening ink or a dry film through light beams, and the light rays of the exposure lamp and the light rays of the printing device are not interfered with each other; in this process, the code printer matches the counter in the distribution control box with the beam hardened number.
③ . The exposed PCB product is washed, the exposed and beam-hardened parts are not washed away, and then the exposure and coding marking of the PCB are synchronously completed, so that the batch management of the PCB is realized.
In the exposure coding process, the coding device is also required to perform preparation work, namely the coding box 7 is pushed between the two power distribution control boxes 1 by the coding pushing cylinder 6, the coding box is inserted into the positioning opening of the other power distribution control box 1, and the pressure sensor in the coding box generates a sensing signal, so that the position accuracy of the coding box can be ensured.
The code printing device is realized by an 8-shaped structure formed by 7 laser code printing lamp bars, and further digital change between 0 and 9 can be realized by controlling the on-off condition of the lamp bars, in actual operation, most of the code printing devices can be selected by 4 code printing devices, the codes of 9999 PCB boards can be carried out, and accurate batch management can be realized by matching with a calculator inside an exposure machine.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The principles and embodiments of the present invention have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present invention and its core ideas. The foregoing is merely illustrative of the preferred embodiments of this invention, and it is noted that there is objectively no limit to the specific structure disclosed herein, since numerous modifications, adaptations and variations can be made by those skilled in the art without departing from the principles of the invention, and the above-described features can be combined in any suitable manner; such modifications, variations and combinations, or the direct application of the inventive concepts and aspects to other applications without modification, are contemplated as falling within the scope of the present invention.
Claims (5)
1. The PCB batch management exposure method is characterized by comprising the following steps:
① . Preparing a PCB, namely flushing the PCB to be exposed with cleaning oil or pasting dry films on the upper surface and the lower surface, and then placing the PCB to be exposed into an exposure station of an exposure machine;
② . Starting an exposure lamp to perform image processing on the corresponding part of the PCB, and simultaneously performing code printing on the edge of the PCB by adopting a mode of hardening ink or a dry film by a code printing device in the exposure machine, wherein the light rays of the exposure lamp and the code printing device are not interfered with each other;
③ . The PCB product after exposure is washed, the part of exposure and beam hardening can not be washed away, and then the exposure and the code marking of PCB board have been accomplished in step ②, the code marking in step ② is at least one bit sign code marking, and in step with the counter of exposure built-in, the light beam change of the code marking device is controlled through the controller, the exposure equipment that its adopted, including two distribution control box (1) and conveyor (2) that set up between them, conveyor (2) top be provided with exposure lamp (4), the inboard of distribution control box (1) be provided with code marking device (5), code marking device (5) be located the product edge top on conveyor (2) exposure station, code marking device (5) be the light beam code marking device, and its light mutually noninterfere with exposure lamp (4), code marking device (5) and exposure lamp (4) be connected to distribution control box (1).
2. The method for batch management exposure of the PCB according to claim 1, wherein the code printing device (5) comprises a code printing box (7) which is arranged between two distribution control boxes (1) and has no lower bottom plate hollow, at least one code printing device (8) is arranged on the inner side of an upper cover of the code printing box (7), and each code printing device (8) is matched with a counter in the distribution control box (1).
3. The method for batch management exposure of the PCB according to claim 2, wherein each code printer (8) is composed of 7 code printing laser light bars (10) to form an 8-shaped structure, and each code printing laser light bar (10) is connected to the power distribution control box (1).
4. The PCB batch management exposure method according to claim 2, wherein a hole which is sleeved and matched with a code printing box (7) is formed in the inner side plate of the distribution control box (1) at the rear side, a code printing pushing cylinder (6) which is connected with the code printing box (7) and runs forwards and backwards is arranged in the distribution control box (1), and the code printing pushing cylinder (6) is communicated with a control element in the distribution control box (1).
5. The method for batch management and exposure of the PCB according to claim 4, wherein a positioning opening matched with the code printing box (7) is formed in the inner side of the other power distribution control box (1), a pressure sensor (9) is embedded in the positioning opening, and the pressure sensor (9) is communicated with a control element in the power distribution control box (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811072228.6A CN109041441B (en) | 2018-09-14 | 2018-09-14 | Batch management exposure method and exposure equipment for PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811072228.6A CN109041441B (en) | 2018-09-14 | 2018-09-14 | Batch management exposure method and exposure equipment for PCB |
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| Publication Number | Publication Date |
|---|---|
| CN109041441A CN109041441A (en) | 2018-12-18 |
| CN109041441B true CN109041441B (en) | 2024-07-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811072228.6A Active CN109041441B (en) | 2018-09-14 | 2018-09-14 | Batch management exposure method and exposure equipment for PCB |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209608971U (en) * | 2018-09-14 | 2019-11-08 | 东莞市多普光电设备有限公司 | A kind of pcb board batch pipe exposure sources |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002043197A (en) * | 2000-07-28 | 2002-02-08 | Daido Steel Co Ltd | Thin-film laminated element and manufacturing method thereof |
| JP2009302400A (en) * | 2008-06-16 | 2009-12-24 | Canon Inc | Exposure apparatus and method of manufacturing device |
| CN103324037B (en) * | 2013-07-04 | 2015-01-07 | 北京京东方光电科技有限公司 | Exposure device and method |
| CN105446083B (en) * | 2014-08-28 | 2018-05-04 | 上海微电子装备（集团）股份有限公司 | It is a kind of that there is the exposure machine of stamp |
| CN105629679B (en) * | 2016-03-22 | 2017-11-10 | 武汉华星光电技术有限公司 | Edge exposure machine and edge exposure region code printing method |
| CN107598382B (en) * | 2017-07-26 | 2019-02-12 | 苏州市长峰激光技术有限公司 | Full-automatic PCB laser marker with sorting function, method and system |
| CN107708288A (en) * | 2017-09-08 | 2018-02-16 | 江西景旺精密电路有限公司 | A kind of pcb board and its processing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209608971U (en) * | 2018-09-14 | 2019-11-08 | 东莞市多普光电设备有限公司 | A kind of pcb board batch pipe exposure sources |
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| CN109041441A (en) | 2018-12-18 |
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