TWI613752B - 原位可移除式靜電吸盤 - Google Patents

原位可移除式靜電吸盤 Download PDF

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Publication number
TWI613752B
TWI613752B TW103125335A TW103125335A TWI613752B TW I613752 B TWI613752 B TW I613752B TW 103125335 A TW103125335 A TW 103125335A TW 103125335 A TW103125335 A TW 103125335A TW I613752 B TWI613752 B TW I613752B
Authority
TW
Taiwan
Prior art keywords
electrostatic chuck
top surface
electrode
dielectric layer
esc
Prior art date
Application number
TW103125335A
Other languages
English (en)
Chinese (zh)
Other versions
TW201513262A (zh
Inventor
寇克斯麥可Ｓ
華瑞恰克拉拉
珊索尼史蒂芬Ｖ
Original Assignee
應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW201513262A publication Critical patent/TW201513262A/zh
Application granted granted Critical
Publication of TWI613752B publication Critical patent/TWI613752B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW103125335A 2013-08-05 2014-07-24 原位可移除式靜電吸盤 TWI613752B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361862462P 2013-08-05 2013-08-05
US61/862,462 2013-08-05

Publications (2)

Publication Number Publication Date
TW201513262A TW201513262A (zh) 2015-04-01
TWI613752B true TWI613752B (zh) 2018-02-01

Family

ID=52427453

Family Applications (2)

Application Number Title Priority Date Filing Date
TW103125335A TWI613752B (zh) 2013-08-05 2014-07-24 原位可移除式靜電吸盤
TW106116396A TWI629747B (zh) 2013-08-05 2014-07-24 原位可移除式靜電吸盤

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW106116396A TWI629747B (zh) 2013-08-05 2014-07-24 原位可移除式靜電吸盤

Country Status (6)

Country Link
US (2) US9508584B2 (https=)
JP (1) JP6423880B2 (https=)
KR (2) KR20170124620A (https=)
CN (1) CN105359265B (https=)
TW (2) TWI613752B (https=)
WO (1) WO2015020791A1 (https=)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9264672B2 (en) 2010-12-22 2016-02-16 Magna Mirrors Of America, Inc. Vision display system for vehicle
CN110085546B (zh) * 2013-08-05 2023-05-16 应用材料公司 用于薄基板搬运的静电载体
CN105359265B (zh) * 2013-08-05 2018-12-14 应用材料公司 原位可移除式静电夹盘
US10008404B2 (en) 2014-10-17 2018-06-26 Applied Materials, Inc. Electrostatic chuck assembly for high temperature processes
US9999947B2 (en) * 2015-05-01 2018-06-19 Component Re-Engineering Company, Inc. Method for repairing heaters and chucks used in semiconductor processing
US10008399B2 (en) * 2015-05-19 2018-06-26 Applied Materials, Inc. Electrostatic puck assembly with metal bonded backing plate for high temperature processes
JP2017022343A (ja) * 2015-07-15 2017-01-26 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体製造装置、ウエハリフトピン穴清掃治具
EP3403325B1 (en) * 2016-01-12 2021-05-26 Grabit, Inc. Methods and systems for electroadhesion-based manipulation and mechanical release in manufacturing
US11011355B2 (en) * 2017-05-12 2021-05-18 Lam Research Corporation Temperature-tuned substrate support for substrate processing systems
KR102098129B1 (ko) * 2018-04-23 2020-04-07 주식회사 엠와이에스 정전기 척
GB201815258D0 (en) * 2018-09-19 2018-10-31 Spts Technologies Ltd A support
US10957520B2 (en) 2018-09-20 2021-03-23 Lam Research Corporation Long-life high-power terminals for substrate support with embedded heating elements
US11260679B2 (en) * 2018-12-21 2022-03-01 Kateeva, Inc. Gripping for print substrates
KR102651311B1 (ko) 2019-06-03 2024-03-27 삼성전자주식회사 마이크로폰들을 이용하여 사용자의 음성을 분석하는 전자 장치 및 모바일 장치
WO2020255319A1 (ja) * 2019-06-20 2020-12-24 株式会社日立ハイテク プラズマ処理装置およびプラズマ処理方法
US11887878B2 (en) * 2019-06-28 2024-01-30 Applied Materials, Inc. Detachable biasable electrostatic chuck for high temperature applications
KR102640172B1 (ko) 2019-07-03 2024-02-23 삼성전자주식회사 기판 처리 장치 및 이의 구동 방법
US12189310B2 (en) * 2019-12-31 2025-01-07 Asml Holding N.V. Systems and methods for manufacturing a double-sided electrostatic clamp
US12334315B2 (en) * 2020-04-30 2025-06-17 Applied Materials, Inc. Cooled substrate support assembly for radio frequency environments
US11380573B2 (en) * 2020-06-04 2022-07-05 Tokyo Electron Limited Structure for automatic in-situ replacement of a part of an electrostatic chuck
JP7683605B2 (ja) * 2020-06-29 2025-05-27 住友大阪セメント株式会社 静電チャック装置
US11749542B2 (en) * 2020-07-27 2023-09-05 Applied Materials, Inc. Apparatus, system, and method for non-contact temperature monitoring of substrate supports
US20220076978A1 (en) * 2020-09-09 2022-03-10 Applied Materials, Inc. Alignment of an electrostatic chuck with a substrate support
CN114695048A (zh) * 2020-12-30 2022-07-01 中微半导体设备(上海)股份有限公司 下电极组件和包含下电极组件的等离子体处理装置
JP2022165477A (ja) * 2021-04-20 2022-11-01 日新イオン機器株式会社 ウエハ支持装置
CN114220758B (zh) * 2021-11-29 2025-05-23 北京北方华创微电子装备有限公司 晶圆承载装置及工艺腔室
KR102757922B1 (ko) 2022-07-29 2025-01-21 세메스 주식회사 기판 지지 장치 및 이를 포함하는 기판 처리 장치
US20240249965A1 (en) * 2023-01-19 2024-07-25 Applied Materials, Inc. Substrate support carrier having multiple ceramic discs
TWI844352B (zh) * 2023-05-03 2024-06-01 劉華煒 半導體製程真空腔之靜電吸盤快速排氣結構
US12512358B2 (en) * 2023-10-06 2025-12-30 Applied Materials, Inc. Electrostatically secured substrate support assembly

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050016685A1 (en) * 2003-06-30 2005-01-27 Canon Kabushiki Kaisha Substrate holding technique
TW200807552A (en) * 2006-03-22 2008-02-01 Tokyo Electron Ltd Plasma treatment device

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0828205B2 (ja) * 1989-10-27 1996-03-21 株式会社日立製作所 ウエハ搬送装置
JP3095790B2 (ja) 1991-01-22 2000-10-10 富士電機株式会社 静電チャック
JPH07257751A (ja) 1994-03-18 1995-10-09 Kanagawa Kagaku Gijutsu Akad 静電浮上搬送装置及びその静電浮上用電極
JP3596127B2 (ja) * 1995-12-04 2004-12-02 ソニー株式会社 静電チャック、薄板保持装置、半導体製造装置、搬送方法及び半導体の製造方法
US5740009A (en) * 1996-11-29 1998-04-14 Applied Materials, Inc. Apparatus for improving wafer and chuck edge protection
JP3296292B2 (ja) * 1998-06-26 2002-06-24 松下電器産業株式会社 エッチング方法、クリーニング方法、及びプラズマ処理装置
JP3805134B2 (ja) 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
JP2001035907A (ja) 1999-07-26 2001-02-09 Ulvac Japan Ltd 吸着装置
US6678143B2 (en) 2000-12-11 2004-01-13 General Electric Company Electrostatic chuck and method of manufacturing the same
JP2002357838A (ja) 2001-05-31 2002-12-13 Hitachi Industries Co Ltd 基板貼り合わせ方法及びその装置
JP2003179128A (ja) 2001-12-11 2003-06-27 Ngk Spark Plug Co Ltd 静電チャック
JP4124589B2 (ja) * 2001-12-21 2008-07-23 日本発条株式会社 ウエハー保持装置
JP2003243493A (ja) 2002-02-15 2003-08-29 Taiheiyo Cement Corp 双極型静電チャック
JP2003282692A (ja) * 2002-03-27 2003-10-03 Matsushita Electric Ind Co Ltd 基板搬送用トレーおよびこれを用いた基板処理装置
JP4346877B2 (ja) * 2002-08-29 2009-10-21 東京エレクトロン株式会社 静電吸着装置および処理装置
JP3962661B2 (ja) * 2002-08-30 2007-08-22 三菱重工業株式会社 静電チャック支持機構及び支持台装置及びプラズマ処理装置
JP2004103799A (ja) * 2002-09-09 2004-04-02 Canon Inc 基板保持装置、デバイス製造装置及びデバイス製造方法
KR100832684B1 (ko) 2003-07-08 2008-05-27 가부시끼가이샤 퓨처 비전 기판 스테이지 및 그에 이용하는 전극 및 그들을 구비한 처리 장치
JP3894562B2 (ja) * 2003-10-01 2007-03-22 キヤノン株式会社 基板吸着装置、露光装置およびデバイス製造方法
JP2005245106A (ja) * 2004-02-25 2005-09-08 Kyocera Corp 静電チャック
DE112005000621B4 (de) 2004-03-19 2019-01-31 Creative Technology Corporation Bipolare elektrostatische Haltevorrichtung
KR101265367B1 (ko) 2005-05-20 2013-05-20 쓰쿠바 세이코 가부시키가이샤 정전 유지 장치 및 그것을 이용한 정전 핀셋
KR20070016227A (ko) * 2005-08-02 2007-02-08 삼성전자주식회사 반도체 제조설비
CN101326627B (zh) 2005-12-06 2010-06-09 创意科技股份有限公司 静电卡盘用电极片以及静电卡盘
JP4802018B2 (ja) 2006-03-09 2011-10-26 筑波精工株式会社 静電保持装置及びそれを用いた真空環境装置並びにアライメント装置又は貼り合わせ装置
US20080062609A1 (en) 2006-08-10 2008-03-13 Shinji Himori Electrostatic chuck device
US7989022B2 (en) 2007-07-20 2011-08-02 Micron Technology, Inc. Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto
JP5112808B2 (ja) 2007-10-15 2013-01-09 筑波精工株式会社 静電型補強装置
CN102089875B (zh) 2008-07-08 2012-08-08 创意科技股份有限公司 双极型静电吸盘
KR101001454B1 (ko) 2009-01-23 2010-12-14 삼성모바일디스플레이주식회사 정전척 및 이를 구비한 유기전계발광 소자의 제조장치
CN102067303B (zh) * 2009-02-18 2012-11-28 株式会社爱发科 晶片搬送用托盘以及在该托盘上固定晶片的方法
US20120227886A1 (en) 2011-03-10 2012-09-13 Taipei Semiconductor Manufacturing Company, Ltd. Substrate Assembly Carrier Using Electrostatic Force
JP6003011B2 (ja) * 2011-03-31 2016-10-05 東京エレクトロン株式会社 基板処理装置
KR102047001B1 (ko) 2012-10-16 2019-12-03 삼성디스플레이 주식회사 정전 척
CN105359265B (zh) * 2013-08-05 2018-12-14 应用材料公司 原位可移除式静电夹盘
US9740111B2 (en) 2014-05-16 2017-08-22 Applied Materials, Inc. Electrostatic carrier for handling substrates for processing
US10978334B2 (en) 2014-09-02 2021-04-13 Applied Materials, Inc. Sealing structure for workpiece to substrate bonding in a processing chamber

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050016685A1 (en) * 2003-06-30 2005-01-27 Canon Kabushiki Kaisha Substrate holding technique
TW200807552A (en) * 2006-03-22 2008-02-01 Tokyo Electron Ltd Plasma treatment device

Also Published As

Publication number Publication date
CN105359265B (zh) 2018-12-14
KR101876501B1 (ko) 2018-07-10
WO2015020791A1 (en) 2015-02-12
KR20160041982A (ko) 2016-04-18
US9773692B2 (en) 2017-09-26
CN105359265A (zh) 2016-02-24
US20170062260A1 (en) 2017-03-02
TWI629747B (zh) 2018-07-11
JP6423880B2 (ja) 2018-11-14
TW201729337A (zh) 2017-08-16
JP2016531438A (ja) 2016-10-06
KR20170124620A (ko) 2017-11-10
US20150036259A1 (en) 2015-02-05
US9508584B2 (en) 2016-11-29
TW201513262A (zh) 2015-04-01

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