KR20170124620A - 인-시츄 제거 가능한 정전 척 - Google Patents

인-시츄 제거 가능한 정전 척 Download PDF

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Publication number
KR20170124620A
KR20170124620A KR1020177031250A KR20177031250A KR20170124620A KR 20170124620 A KR20170124620 A KR 20170124620A KR 1020177031250 A KR1020177031250 A KR 1020177031250A KR 20177031250 A KR20177031250 A KR 20177031250A KR 20170124620 A KR20170124620 A KR 20170124620A
Authority
KR
South Korea
Prior art keywords
electrostatic chuck
top surface
electrode
esc
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020177031250A
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English (en)
Korean (ko)
Inventor
마이클 에스. 콕스
라라 하우릴책
스티븐 브이. 샌소니
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20170124620A publication Critical patent/KR20170124620A/ko
Ceased legal-status Critical Current

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Classifications

    • H01L21/6833—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H01L21/68728—
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H01L2224/75723—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020177031250A 2013-08-05 2014-07-22 인-시츄 제거 가능한 정전 척 Ceased KR20170124620A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361862462P 2013-08-05 2013-08-05
US61/862,462 2013-08-05
PCT/US2014/047656 WO2015020791A1 (en) 2013-08-05 2014-07-22 In-situ removable electrostatic chuck

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020167005800A Division KR101876501B1 (ko) 2013-08-05 2014-07-22 인-시츄 제거 가능한 정전 척

Publications (1)

Publication Number Publication Date
KR20170124620A true KR20170124620A (ko) 2017-11-10

Family

ID=52427453

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020177031250A Ceased KR20170124620A (ko) 2013-08-05 2014-07-22 인-시츄 제거 가능한 정전 척
KR1020167005800A Active KR101876501B1 (ko) 2013-08-05 2014-07-22 인-시츄 제거 가능한 정전 척

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020167005800A Active KR101876501B1 (ko) 2013-08-05 2014-07-22 인-시츄 제거 가능한 정전 척

Country Status (6)

Country Link
US (2) US9508584B2 (https=)
JP (1) JP6423880B2 (https=)
KR (2) KR20170124620A (https=)
CN (1) CN105359265B (https=)
TW (2) TWI613752B (https=)
WO (1) WO2015020791A1 (https=)

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KR20190123108A (ko) * 2018-04-23 2019-10-31 주식회사 엠와이에스 정전기 척

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US9999947B2 (en) * 2015-05-01 2018-06-19 Component Re-Engineering Company, Inc. Method for repairing heaters and chucks used in semiconductor processing
US10008399B2 (en) * 2015-05-19 2018-06-26 Applied Materials, Inc. Electrostatic puck assembly with metal bonded backing plate for high temperature processes
JP2017022343A (ja) * 2015-07-15 2017-01-26 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体製造装置、ウエハリフトピン穴清掃治具
EP3403325B1 (en) * 2016-01-12 2021-05-26 Grabit, Inc. Methods and systems for electroadhesion-based manipulation and mechanical release in manufacturing
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US11749542B2 (en) * 2020-07-27 2023-09-05 Applied Materials, Inc. Apparatus, system, and method for non-contact temperature monitoring of substrate supports
US20220076978A1 (en) * 2020-09-09 2022-03-10 Applied Materials, Inc. Alignment of an electrostatic chuck with a substrate support
CN114695048A (zh) * 2020-12-30 2022-07-01 中微半导体设备(上海)股份有限公司 下电极组件和包含下电极组件的等离子体处理装置
JP2022165477A (ja) * 2021-04-20 2022-11-01 日新イオン機器株式会社 ウエハ支持装置
CN114220758B (zh) * 2021-11-29 2025-05-23 北京北方华创微电子装备有限公司 晶圆承载装置及工艺腔室
KR102757922B1 (ko) 2022-07-29 2025-01-21 세메스 주식회사 기판 지지 장치 및 이를 포함하는 기판 처리 장치
US20240249965A1 (en) * 2023-01-19 2024-07-25 Applied Materials, Inc. Substrate support carrier having multiple ceramic discs
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US12512358B2 (en) * 2023-10-06 2025-12-30 Applied Materials, Inc. Electrostatically secured substrate support assembly

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Publication number Priority date Publication date Assignee Title
KR20190123108A (ko) * 2018-04-23 2019-10-31 주식회사 엠와이에스 정전기 척

Also Published As

Publication number Publication date
CN105359265B (zh) 2018-12-14
KR101876501B1 (ko) 2018-07-10
WO2015020791A1 (en) 2015-02-12
KR20160041982A (ko) 2016-04-18
US9773692B2 (en) 2017-09-26
CN105359265A (zh) 2016-02-24
US20170062260A1 (en) 2017-03-02
TWI629747B (zh) 2018-07-11
JP6423880B2 (ja) 2018-11-14
TW201729337A (zh) 2017-08-16
TWI613752B (zh) 2018-02-01
JP2016531438A (ja) 2016-10-06
US20150036259A1 (en) 2015-02-05
US9508584B2 (en) 2016-11-29
TW201513262A (zh) 2015-04-01

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