TWI611012B - 散熱部件、使用該散熱部件的電子零件、馬達、電池、照明器具與工作機械 - Google Patents

散熱部件、使用該散熱部件的電子零件、馬達、電池、照明器具與工作機械 Download PDF

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Publication number
TWI611012B
TWI611012B TW101137496A TW101137496A TWI611012B TW I611012 B TWI611012 B TW I611012B TW 101137496 A TW101137496 A TW 101137496A TW 101137496 A TW101137496 A TW 101137496A TW I611012 B TWI611012 B TW I611012B
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TW
Taiwan
Prior art keywords
heat
heat dissipating
metal plate
dissipating member
meth
Prior art date
Application number
TW101137496A
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English (en)
Chinese (zh)
Other versions
TW201339293A (zh
Inventor
矢田行人
日夏雅子
藤原武
Original Assignee
捷恩智股份有限公司
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Application filed by 捷恩智股份有限公司 filed Critical 捷恩智股份有限公司
Publication of TW201339293A publication Critical patent/TW201339293A/zh
Application granted granted Critical
Publication of TWI611012B publication Critical patent/TWI611012B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Polymerisation Methods In General (AREA)
TW101137496A 2011-10-14 2012-10-11 散熱部件、使用該散熱部件的電子零件、馬達、電池、照明器具與工作機械 TWI611012B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-227199 2011-10-14
JP2011227199 2011-10-14

Publications (2)

Publication Number Publication Date
TW201339293A TW201339293A (zh) 2013-10-01
TWI611012B true TWI611012B (zh) 2018-01-11

Family

ID=48440447

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101137496A TWI611012B (zh) 2011-10-14 2012-10-11 散熱部件、使用該散熱部件的電子零件、馬達、電池、照明器具與工作機械

Country Status (3)

Country Link
JP (2) JP6024265B2 (ja)
KR (1) KR20130040710A (ja)
TW (1) TWI611012B (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
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JP6024265B2 (ja) * 2011-10-14 2016-11-16 Jnc株式会社 放熱塗料組成物とそれを用いた放熱部材
JP6364614B2 (ja) * 2014-05-09 2018-08-01 パナソニックＩｐマネジメント株式会社 高熱放射性樹脂組成物
JP6428032B2 (ja) * 2014-08-06 2018-11-28 Jnc株式会社 樹脂組成物、それを用いた放熱塗料および電子部品
WO2016186316A1 (ko) * 2015-05-15 2016-11-24 주식회사 대화알로이테크 공기 청정기
KR101711438B1 (ko) * 2015-05-19 2017-03-13 주식회사 대화알로이테크 발열 페이스트 조성물을 구비한 발열체 원단 및 이를 이용한 발열 스티어링 휠
KR101745440B1 (ko) * 2015-05-19 2017-06-12 주식회사 대화알로이테크 세탁기용 스팀발생장치 및 세탁기
KR101698841B1 (ko) * 2015-05-19 2017-01-23 주식회사 대화알로이테크 건조 장치
KR20180048841A (ko) * 2015-09-02 2018-05-10 제이엔씨 주식회사 방열 도료 조성물, 방열 부재 및 물품
JP2017087673A (ja) * 2015-11-16 2017-05-25 住友精化株式会社 放熱シート、熱放射層用分散液、及び、熱放射性塗膜
JP6669890B2 (ja) * 2016-03-30 2020-03-18 アモセンス・カンパニー・リミテッドＡｍｏｓｅｎｓｅ Ｃｏ．， Ｌｔｄ． 車両ヒーター用ｐｔｃユニット、これを具備するｐｔｃヒーターおよび車両用空調装置
WO2018110929A1 (ko) * 2016-12-12 2018-06-21 주식회사 아모그린텍 투명 절연성 방열 코팅조성물, 이를 통해 형성된 방열유닛 및 방열 회로기판
KR101984216B1 (ko) * 2017-03-28 2019-05-30 주식회사 엠오피 광경화 방식 3d프린터용 기능성 원료 조성물
KR102008227B1 (ko) * 2017-08-03 2019-10-21 주식회사 알파머티리얼즈 멀티 히트 스프레더
WO2019146391A1 (ja) * 2018-01-25 2019-08-01 日立オートモティブシステムズ株式会社 電子制御装置
KR102047891B1 (ko) * 2019-03-26 2019-11-22 동의대학교 산학협력단 방열분체도료 제조기술 및 led 조명 응용기술
KR102047889B1 (ko) * 2019-03-26 2019-11-22 동의대학교 산학협력단 알루미늄실리케이트를 포함하는 방열분체도료 제조기술
JP7228707B2 (ja) * 2019-09-26 2023-02-24 富士フイルム株式会社 導熱層の製造方法、積層体の製造方法および半導体デバイスの製造方法
JPWO2021182295A1 (ja) * 2020-03-10 2021-09-16
WO2023021891A1 (ja) * 2021-08-19 2023-02-23 三井化学株式会社 紫外線硬化性組成物

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TW200527619A (en) * 2004-01-07 2005-08-16 Jisouken Co Ltd Heat sink
CN101003690A (zh) * 2006-01-17 2007-07-25 太阳油墨制造株式会社 散热绝缘性树脂组合物及使用其的印刷电路板

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JP2002228085A (ja) * 2001-01-31 2002-08-14 Sumitomo Metal Ind Ltd 熱放射性表面処理材
JP2004002813A (ja) * 2002-04-16 2004-01-08 Ceramission Kk 水性組成物及び非水系組成物
JP4276407B2 (ja) * 2002-05-08 2009-06-10 ヘンケル コーポレイション 光カチオン硬化型エポキシ樹脂組成物
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JP2006131713A (ja) * 2004-11-04 2006-05-25 Fuji Photo Film Co Ltd ハードコート用塗布組成物、ハードコートフィルム、反射防止フィルム及び画像表示装置
JP2007031216A (ja) * 2005-07-27 2007-02-08 Nippon Shokubai Co Ltd 金属酸化物粒子およびその用途
JP2009070812A (ja) * 2007-08-17 2009-04-02 Sosuke Naito 放熱膜を用いた熱放射加熱調理器
WO2009142036A1 (ja) * 2008-05-21 2009-11-26 ニホンハンダ株式会社 放熱性硬化塗膜、塗料組成物、放熱性硬化塗膜の製造方法及び放熱性硬化塗膜を有する電子機器
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JP6024265B2 (ja) * 2011-10-14 2016-11-16 Jnc株式会社 放熱塗料組成物とそれを用いた放熱部材

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200527619A (en) * 2004-01-07 2005-08-16 Jisouken Co Ltd Heat sink
CN101003690A (zh) * 2006-01-17 2007-07-25 太阳油墨制造株式会社 散热绝缘性树脂组合物及使用其的印刷电路板

Also Published As

Publication number Publication date
TW201339293A (zh) 2013-10-01
KR20130040710A (ko) 2013-04-24
JP2013100454A (ja) 2013-05-23
JP6024265B2 (ja) 2016-11-16
JP2013100477A (ja) 2013-05-23

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