TWI607293B - Method for transferring printed wiring board to be exposed and transfer device - Google Patents

Method for transferring printed wiring board to be exposed and transfer device Download PDF

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Publication number
TWI607293B
TWI607293B TW104132988A TW104132988A TWI607293B TW I607293 B TWI607293 B TW I607293B TW 104132988 A TW104132988 A TW 104132988A TW 104132988 A TW104132988 A TW 104132988A TW I607293 B TWI607293 B TW I607293B
Authority
TW
Taiwan
Prior art keywords
printed wiring
wiring board
exposure
machine
adsorption head
Prior art date
Application number
TW104132988A
Other languages
English (en)
Chinese (zh)
Other versions
TW201704899A (zh
Inventor
Koichi Ando
Original Assignee
Daiwa Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daiwa Co Ltd filed Critical Daiwa Co Ltd
Publication of TW201704899A publication Critical patent/TW201704899A/zh
Application granted granted Critical
Publication of TWI607293B publication Critical patent/TWI607293B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW104132988A 2015-07-23 2015-10-07 Method for transferring printed wiring board to be exposed and transfer device TWI607293B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/070994 WO2016006715A1 (ja) 2015-07-23 2015-07-23 露光すべきプリント配線板の移載方法及び移載装置

Publications (2)

Publication Number Publication Date
TW201704899A TW201704899A (zh) 2017-02-01
TWI607293B true TWI607293B (zh) 2017-12-01

Family

ID=55064337

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104132988A TWI607293B (zh) 2015-07-23 2015-10-07 Method for transferring printed wiring board to be exposed and transfer device

Country Status (5)

Country Link
JP (1) JP5906362B1 (ja)
KR (1) KR101801957B1 (ja)
CN (1) CN106550610B (ja)
TW (1) TWI607293B (ja)
WO (1) WO2016006715A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112822858B (zh) * 2021-02-09 2024-08-06 珠海微图科技有限公司 印刷线路板加工设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012203265A (ja) * 2011-03-25 2012-10-22 Hitachi Via Mechanics Ltd 反転装置及びそれを用いた露光装置並びに露光方法
JP2013257389A (ja) * 2012-06-11 2013-12-26 Adtec Engineeng Co Ltd 露光装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0281105B1 (en) * 1987-03-05 1993-05-19 Sharp Kabushiki Kaisha Color image copying device
EP0586841A1 (de) * 1992-07-30 1994-03-16 Reichle + De-Massari AG Elektro-Ingenieure Printplatte und Montagemodul für einen Anschluss abgeschirmter Leiter und Verteilersysteme im Schwachstrom-Anlagebau
JPH1191943A (ja) * 1997-09-25 1999-04-06 Zetekku Kk 基板搬送システム
JP2001166495A (ja) 1999-12-06 2001-06-22 Nsk Ltd 両面露光装置
JP2002175972A (ja) * 2000-12-08 2002-06-21 Orc Mfg Co Ltd 自動露光装置
JP3976531B2 (ja) * 2001-09-27 2007-09-19 Ｈｏｙａ株式会社 基板受渡機構、及びフォトマスクの製造方法
JP3371899B2 (ja) * 2001-10-15 2003-01-27 株式会社ニコン リソグラフィシステム、情報収集装置、設定装置、露光装置、及びデバイス製造方法
JP4365883B2 (ja) 2002-07-19 2009-11-18 富士機械製造株式会社 対基板作業システム
KR101388345B1 (ko) * 2005-09-09 2014-04-22 가부시키가이샤 니콘 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법
JP2007246179A (ja) * 2006-03-13 2007-09-27 Taiyo Manufacturing Co Ltd 基板の受取り積替機
JP2009256029A (ja) * 2008-04-15 2009-11-05 Toray Eng Co Ltd 板状部材の搬送装置および板状部材の搬送方法
JP5333063B2 (ja) * 2009-08-28 2013-11-06 ウシオ電機株式会社 両面露光装置
CN102736421B (zh) * 2011-03-31 2015-06-17 上海微电子装备有限公司 一种接近接触式扫描曝光装置与方法
CN102183880A (zh) * 2011-05-11 2011-09-14 武汉东羽光机电科技有限公司 Led自动曝光机基板快速预定位装置
CN202953546U (zh) * 2012-08-16 2013-05-29 迅得机械（东莞）有限公司 曝光机自动上下料装置
CN103984208B (zh) * 2013-02-07 2016-03-02 上海微电子装备有限公司 掩模版传输系统
CN104035286B (zh) * 2013-03-05 2015-12-23 中芯国际集成电路制造(上海)有限公司 圆筒形掩模板系统、曝光装置和曝光方法
CN104035284B (zh) * 2013-03-05 2016-08-03 中芯国际集成电路制造(上海)有限公司 圆筒形掩模板系统、曝光装置和曝光方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012203265A (ja) * 2011-03-25 2012-10-22 Hitachi Via Mechanics Ltd 反転装置及びそれを用いた露光装置並びに露光方法
JP2013257389A (ja) * 2012-06-11 2013-12-26 Adtec Engineeng Co Ltd 露光装置

Also Published As

Publication number Publication date
CN106550610A (zh) 2017-03-29
WO2016006715A1 (ja) 2016-01-14
KR20170012192A (ko) 2017-02-02
TW201704899A (zh) 2017-02-01
CN106550610B (zh) 2019-03-12
JPWO2016006715A1 (ja) 2017-04-27
KR101801957B1 (ko) 2017-11-27
JP5906362B1 (ja) 2016-04-20

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