TWI602703B - Substrate stripping apparatus and stripping method, and electronic device manufacturing method - Google Patents

Substrate stripping apparatus and stripping method, and electronic device manufacturing method Download PDF

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Publication number
TWI602703B
TWI602703B TW103102779A TW103102779A TWI602703B TW I602703 B TWI602703 B TW I602703B TW 103102779 A TW103102779 A TW 103102779A TW 103102779 A TW103102779 A TW 103102779A TW I602703 B TWI602703 B TW I602703B
Authority
TW
Taiwan
Prior art keywords
substrate
peeling
interface
reinforcing plate
traveling direction
Prior art date
Application number
TW103102779A
Other languages
English (en)
Chinese (zh)
Other versions
TW201434649A (zh
Inventor
伊藤泰則
宇津木洋
瀧內圭
Original Assignee
旭硝子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 旭硝子股份有限公司 filed Critical 旭硝子股份有限公司
Publication of TW201434649A publication Critical patent/TW201434649A/zh
Application granted granted Critical
Publication of TWI602703B publication Critical patent/TWI602703B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00—Machines for separating superposed webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
    • B65H29/54—Article strippers, e.g. for stripping from advancing elements
    • B65H29/56—Article strippers, e.g. for stripping from advancing elements for stripping from elements or machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H3/00—Separating articles from piles
    • B65H3/08—Separating articles from piles using pneumatic force
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H3/00—Separating articles from piles
    • B65H3/16—Separating articles from piles using magnetic force
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/50—Auxiliary process performed during handling process
    • B65H2301/51—Modifying a characteristic of handled material
    • B65H2301/511—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning
    • B65H2301/5112—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface
    • B65H2301/51122—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface peeling layer of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/17—Nature of material
    • B65H2701/175—Plastic
    • B65H2701/1752—Polymer film
TW103102779A 2013-01-25 2014-01-24 Substrate stripping apparatus and stripping method, and electronic device manufacturing method TWI602703B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013012416A JP6003675B2 (ja) 2013-01-25 2013-01-25 基板の剥離装置及び剥離方法並びに電子デバイスの製造方法

Publications (2)

Publication Number Publication Date
TW201434649A TW201434649A (zh) 2014-09-16
TWI602703B true TWI602703B (zh) 2017-10-21

Family

ID=51241494

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103102779A TWI602703B (zh) 2013-01-25 2014-01-24 Substrate stripping apparatus and stripping method, and electronic device manufacturing method

Country Status (4)

Country Link
JP (1) JP6003675B2 (ko)
KR (1) KR102099188B1 (ko)
CN (1) CN103972142B (ko)
TW (1) TWI602703B (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170086593A (ko) * 2014-11-19 2017-07-26 코닝 인코포레이티드 박리를 포함한 처리 방법
JP6468462B2 (ja) * 2015-02-23 2019-02-13 Ａｇｃ株式会社 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法
JP6471606B2 (ja) * 2015-02-23 2019-02-20 Ａｇｃ株式会社 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法
CN105904830B (zh) * 2015-02-23 2019-07-16 Ａｇｃ株式会社 层叠体的剥离装置和剥离方法及电子器件的制造方法
CN104900564B (zh) * 2015-05-12 2017-10-17 京东方科技集团股份有限公司 剥离设备
JPWO2017065155A1 (ja) 2015-10-16 2018-08-02 旭硝子株式会社 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法
KR102622227B1 (ko) 2015-10-30 2024-01-08 코닝 인코포레이티드 제2 기판에 결합된 제1 기판을 가공하는 방법
CN106739424B (zh) 2015-11-20 2020-02-14 财团法人工业技术研究院 取下贴合装置及应用此装置的取下方法与贴合方法
CN106793488B (zh) 2015-11-20 2019-04-30 财团法人工业技术研究院 软性电子装置与软性电子装置制作工艺方法
CN105842886B (zh) * 2016-03-22 2019-01-18 京东方科技集团股份有限公司 玻璃分离方法及其设备
JP6430439B2 (ja) * 2016-06-07 2018-11-28 株式会社岩崎製作所 フィルム剥離巻取り装置
CN110461606B (zh) 2016-11-15 2021-11-05 康宁公司 用于处理基板的方法
CN107454756B (zh) * 2017-07-12 2019-11-15 维沃移动通信有限公司 一种fpc器件贴片方法、fpc组件及终端
CN107567179B (zh) * 2017-08-25 2019-09-27 维沃移动通信有限公司 一种表面贴装方法、柔性电路板部件及移动终端
WO2019059057A1 (ja) * 2017-09-20 2019-03-28 日本電気硝子株式会社 ガラス基板の製造方法
JP7377656B2 (ja) * 2019-09-19 2023-11-10 株式会社ジャパンディスプレイ 素子移載装置、素子モジュールの作製方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200631887A (en) * 2005-02-28 2006-09-16 Lintec Corp Peeling apparatus and peeling method
TW201119864A (en) * 2009-08-31 2011-06-16 Asahi Glass Co Ltd Peeling device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11349215A (ja) * 1998-06-08 1999-12-21 Dainippon Printing Co Ltd シート状ワーク分離装置
JP5307970B2 (ja) * 2006-01-11 2013-10-02 旭硝子株式会社 大型ガラス基板の剥離方法及びその装置
JP4964070B2 (ja) * 2007-09-10 2012-06-27 日東電工株式会社 保護テープ剥離方法および保護テープ剥離装置
JP2010143737A (ja) * 2008-12-22 2010-07-01 Shinko Electric Ind Co Ltd 膜の剥離方法及び剥離装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200631887A (en) * 2005-02-28 2006-09-16 Lintec Corp Peeling apparatus and peeling method
TW201119864A (en) * 2009-08-31 2011-06-16 Asahi Glass Co Ltd Peeling device

Also Published As

Publication number Publication date
JP6003675B2 (ja) 2016-10-05
KR20140095996A (ko) 2014-08-04
TW201434649A (zh) 2014-09-16
JP2014141344A (ja) 2014-08-07
KR102099188B1 (ko) 2020-04-09
CN103972142A (zh) 2014-08-06
CN103972142B (zh) 2017-05-31

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