JP6558646B2 - 基板の吸着装置及び基板の貼合装置及び貼合方法並びに電子デバイスの製造方法 - Google Patents
基板の吸着装置及び基板の貼合装置及び貼合方法並びに電子デバイスの製造方法 Download PDFInfo
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Description
電子デバイスは、ガラス製、樹脂製、金属製等の基板の表面に電子デバイス用の機能層(LCDであれば、薄膜トランジスタ(TFT)、カラーフィルタ(CF))を形成することにより製造される。
図1は、積層体1の一例を示した要部拡大側面図である。
基板2は、その表面2aに機能層が形成される。基板2としては、ガラス基板、セラミックス基板、樹脂基板、金属基板、半導体基板を例示できる。これらの基板のなかでも、ガラス基板は、耐薬品性、耐透湿性に優れ、かつ、線膨張係数が小さいので、電子デバイス用の基板2として好適である。また、線膨張係数が小さくなるに従い、高温下で形成される機能層のパターンが冷却時に、ずれ難くなる利点もある。
補強板3としては、ガラス基板、セラミックス基板、樹脂基板、金属基板、半導体基板を例示できる。
樹脂層4は、樹脂層4と補強板3との間で剥離するのを防止するため、補強板3との間の結合力が、基板2との間の結合力よりも高く設定される。これにより、剥離工程では、樹脂層4と基板2との界面が剥離される。
機能層形成工程を経ることにより積層体1の基板2の表面2aには、機能層が形成される。機能層の形成方法としては、CVD(Chemical Vapor Deposition)法、PVD(Physical Vapor Deposition)法等の蒸着法、スパッタ法が用いられる。機能層は、フォトリソグラフィ法、エッチング法によって所定のパターンに形成される。
図3(A)〜(D)は、積層体製造工程に含まれる吸着工程及び貼合工程にて使用される貼合装置10の要部構成を示した側面図であって、貼付工程の動作を時系列的に示した説明図である。また、前記吸着工程にて使用される実施形態の基板の吸着装置が、貼合装置10に組み込まれている。前記吸着装置については後述する。
図3(A)〜(D)に示した貼合装置10は、ローラ16によって補強板3を、自重により撓み変形させた状態で基板2に押し付けるとともに、ローラ16を転動させながらローラ16から付与される押圧力によって補強板3の全面を基板2に貼合する装置である。
図3(B)の如くローラ16は、基板2と補強板3とを貼合する際に、シリンダ装置22によって上昇され、下テーブル14に載置された補強板3を撓み変形させて、上テーブル12に吸着されている基板2に下方から押し付ける。このとき、補強板3は、撓み変形された状態で基板2に貼合されるので、基板2と補強板3との間に気泡が噛み込み難くなる。
図4は、本発明の基板の吸着装置を、図3(A)〜(D)の上テーブル12に適用した上テーブル12の平面図であり、その吸着面13の略全面に複数の吸引孔(吸引部)30が碁盤目状に配置されていることが示されている。図5は、吸引孔30に連結されたバキューム(吸引)系及びエアーブロー系を示した上テーブル12の構造図である。
図4の如く、複数の吸引孔30は、吸引孔群30A、30B、30Cに3分割されている。
図5の如く、バキューム系は、吸引ポンプ42を有している。吸引ポンプ42には、配管44が連結され、この配管44は配管44A、44B、44Cに分岐される。配管44Aは、三方弁等の切換弁46Aを介して通気路36に連通され、配管44Bは、切換弁46Bを介して通気路38に連通され、配管44Cは、切換弁46Cを介して通気路40に連通される。また、配管44Aには、配管44Aの内圧を検出する圧力計48Aが設けられ、配管44Bには、配管44Bの内圧を検出する圧力計48Bが設けられ、配管44Cには、配管44Cの内圧を検出する圧力計48Cが設けられている。
図5の如く、エアーブロー系は、圧縮エアー供給ポンプ(以下、供給ポンプと言う。)50を有している。供給ポンプ50には、配管52が連結され、この配管52は大気開放切換弁(以下、切換弁と言う。)54を介して配管52A、52B、52Cに分岐される。配管52Aは、切換弁46Aを介して通気路36に連通され、配管52Bは、切換弁46Bを介して通気路38に連通され、配管52Cは、切換弁46Cを介して通気路40に連通される。
制御部34には、基板2が吸着面13に確実に吸着されたことを示す圧力値が記憶されており、圧力計48A、48B、48Cから出力される配管44A、44B、44Cの内圧(圧力)値に基づいて、切換弁46A、46B、46Cの動作を制御する。
図7(A)、(B)、(C)、(D)は、吸引孔群30A、30B、30Cが順次減圧されて、上テーブル12の吸着面13に基板2が順次吸着されていくことを時系列的に示した説明図である。
上テーブル12を備えた図3(A)〜(D)の貼合装置10によれば、上テーブル12に対する基板2の吸着方式を改善することができるので、吸着工程に起因する積層体1の反りを低減することができる。また、貼合工程においても、補強板3を自重で撓み変形させるローラ16の作用によって、貼合工程に起因する積層体1の反りを低減することができる。
電子デバイスの製造方法の積層体製造工程に、貼合装置10の吸着工程と貼合工程とを備えたので、貼合後の積層体1の反りを低減することができる電子デバイスの製造方法を提供できる。積層体製造工程にて製造された積層体1は、反りが低減されているので、機能層形成工程において、品質のよい機能層を基板2の表面2aに形成することができる。
2…基板
2A…基板
2B…基板
6…積層体
7…機能層
10…貼合装置
12…上テーブル
13…吸着面
14…下テーブル
16…ローラ
22…シリンダ装置
30…吸引孔
30A、30B、30C、30D、30E、30F、30G、30H、30N、30P、30Q、30R…吸引孔群
34…制御部
42…吸引ポンプ
46A、46B、46C…切換弁
50…供給ポンプ
54…切換弁
Claims (6)
- 基板を吸着する吸着面を備えたテーブルと、前記テーブルの前記吸着面に設けられた複数の吸引部と、を有する基板の吸着装置において、
前記複数の吸引部のうち一部の吸引部を起点とし、起点とした前記一部の吸引部から離れる方向に配置された残りの複数の吸引部を、前記離れる方向に沿って順次減圧させる制御部を有し、
前記複数の吸引部は、エアー噴射部として兼用され、
前記制御部は、前記吸引部から噴射されるエアーによって、前記基板をエアーブローしながら、バキュームに切り換えられた前記吸引部に前記基板を順次吸着させる、基板の吸着装置。 - 前記制御部は、矩形状の前記テーブルの中央部に配置された前記一部の吸引部を起点とし、起点とした前記一部の吸引部から離れる方向に配置された残りの複数の吸引部を、前記離れる方向に沿って順次減圧させる請求項1に記載の基板の吸着装置。
- 前記制御部は、矩形状の前記テーブルの一辺部に沿って配置された前記一部の吸引部を起点とし、起点とした前記一部の吸引部から離れる方向に配置された残りの複数の吸引部を、前記離れる方向に沿って順次減圧させる請求項1に記載の基板の吸着装置。
- 第1の基板と第2の基板とを貼合する基板の貼合装置において、
請求項1から3のいずれか1項に記載された基板の吸着装置であって、前記吸着装置のテーブルによって前記第1の基板を吸着する吸着装置と、
前記第2の基板を自重により撓み変形させた状態で前記第1の基板に押し付けるとともに、転動しながら前記第2の基板の全面を前記第1の基板に貼り付けるローラと、
を備えたことを特徴とする基板の貼合装置。 - 第1の基板と第2の基板とを貼合する基板の貼合方法において、
請求項1から3のいずれか1項に記載された基板の吸着装置のテーブルに前記第1の基板を吸着保持する吸着工程と、
ローラによって前記第2の基板を、自重により撓み変形させた状態で前記第1の基板に押し付けるとともに、前記ローラを転動させながら前記第2の基板の全面を前記第1の基板に貼合する貼合工程と、
を備えることを特徴とする基板の貼合方法。 - 第1の基板と第2の基板とを貼合することにより積層体を製造する積層体製造工程と、前記積層体の前記第1の基板の露出面に機能層を形成する機能層形成工程と、前記機能層が形成された前記第1の基板から前記第2の基板を分離する分離工程と、を有し、
前記積層体製造工程は、
請求項1から3のいずれか1項に記載された基板の吸着装置のテーブルに前記第1の基板を吸着保持する吸着工程と、
ローラによって前記第2の基板を、自重により撓み変形させた状態で前記第1の基板に押し付けるとともに、前記ローラを転動させながら前記第2の基板の全面を前記第1の基板に貼合する貼合工程と、
を備えることを特徴とする電子デバイスの製造方法。
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