TWI602324B - 晶圓等級之發光二極體陣列 - Google Patents
晶圓等級之發光二極體陣列 Download PDFInfo
- Publication number
- TWI602324B TWI602324B TW102128318A TW102128318A TWI602324B TW I602324 B TWI602324 B TW I602324B TW 102128318 A TW102128318 A TW 102128318A TW 102128318 A TW102128318 A TW 102128318A TW I602324 B TWI602324 B TW I602324B
- Authority
- TW
- Taiwan
- Prior art keywords
- emitting diode
- light emitting
- light
- interlayer insulating
- pad
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/835—Reflective materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/032—Manufacture or treatment of electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
Landscapes
- Led Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20120099263 | 2012-09-07 | ||
| KR20120101716 | 2012-09-13 | ||
| KR1020130088714A KR101893578B1 (ko) | 2012-09-13 | 2013-07-26 | 웨이퍼 레벨의 발광 다이오드 어레이 |
| KR1020130088712A KR101893579B1 (ko) | 2012-09-07 | 2013-07-26 | 웨이퍼 레벨의 발광 다이오드 어레이 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201414024A TW201414024A (zh) | 2014-04-01 |
| TWI602324B true TWI602324B (zh) | 2017-10-11 |
Family
ID=50237367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102128318A TWI602324B (zh) | 2012-09-07 | 2013-08-07 | 晶圓等級之發光二極體陣列 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9412922B2 (enExample) |
| CN (3) | CN109638032B (enExample) |
| DE (2) | DE112013003887T5 (enExample) |
| IN (1) | IN2015KN00387A (enExample) |
| TW (1) | TWI602324B (enExample) |
| WO (1) | WO2014038794A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI873097B (zh) * | 2018-06-20 | 2025-02-21 | 法商艾勒迪亞公司 | 包含二極體陣列之光電元件 |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10388690B2 (en) | 2012-08-07 | 2019-08-20 | Seoul Viosys Co., Ltd. | Wafer level light-emitting diode array |
| US9318529B2 (en) * | 2012-09-07 | 2016-04-19 | Seoul Viosys Co., Ltd. | Wafer level light-emitting diode array |
| US10804316B2 (en) * | 2012-08-07 | 2020-10-13 | Seoul Viosys Co., Ltd. | Wafer level light-emitting diode array |
| US9412911B2 (en) | 2013-07-09 | 2016-08-09 | The Silanna Group Pty Ltd | Optical tuning of light emitting semiconductor junctions |
| US9847457B2 (en) * | 2013-07-29 | 2017-12-19 | Seoul Viosys Co., Ltd. | Light emitting diode, method of fabricating the same and LED module having the same |
| JP6636459B2 (ja) | 2014-05-27 | 2020-01-29 | シランナ・ユー・ブイ・テクノロジーズ・プライベート・リミテッドSilanna Uv Technologies Pte Ltd | 半導体構造と超格子とを用いた高度電子デバイス |
| US11322643B2 (en) | 2014-05-27 | 2022-05-03 | Silanna UV Technologies Pte Ltd | Optoelectronic device |
| JP6817072B2 (ja) | 2014-05-27 | 2021-01-20 | シランナ・ユー・ブイ・テクノロジーズ・プライベート・リミテッドSilanna Uv Technologies Pte Ltd | 光電子デバイス |
| CN106415854B (zh) | 2014-05-27 | 2019-10-01 | 斯兰纳Uv科技有限公司 | 包括n型和p型超晶格的电子装置 |
| US9728698B2 (en) | 2014-06-03 | 2017-08-08 | Seoul Viosys Co., Ltd. | Light emitting device package having improved heat dissipation efficiency |
| US9577171B2 (en) | 2014-06-03 | 2017-02-21 | Seoul Viosys Co., Ltd. | Light emitting device package having improved heat dissipation efficiency |
| KR20150139194A (ko) * | 2014-06-03 | 2015-12-11 | 서울바이오시스 주식회사 | 발광 다이오드 및 그 제조 방법 |
| KR102197082B1 (ko) * | 2014-06-16 | 2020-12-31 | 엘지이노텍 주식회사 | 발광 소자 및 이를 포함하는 발광소자 패키지 |
| CN110690249B (zh) * | 2015-02-13 | 2024-01-19 | 首尔伟傲世有限公司 | 发光元件 |
| CN106486490B (zh) * | 2015-08-31 | 2021-07-23 | 吴昭武 | 新型led面板组件、3d面板组件及3d显示屏 |
| DE102015114662A1 (de) | 2015-09-02 | 2017-03-02 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiter-Bauteils, optoelektronisches Halbleiter-Bauteil, Temporärer Träger |
| CN111987210A (zh) * | 2015-11-18 | 2020-11-24 | 晶元光电股份有限公司 | 发光元件 |
| JP6354799B2 (ja) * | 2015-12-25 | 2018-07-11 | 日亜化学工業株式会社 | 発光素子 |
| US10418517B2 (en) | 2016-02-23 | 2019-09-17 | Silanna UV Technologies Pte Ltd | Resonant optical cavity light emitting device |
| WO2017145026A1 (en) | 2016-02-23 | 2017-08-31 | Silanna UV Technologies Pte Ltd | Resonant optical cavity light emitting device |
| KR102530760B1 (ko) | 2016-07-18 | 2023-05-11 | 삼성전자주식회사 | 반도체 발광소자 |
| CN106206903B (zh) * | 2016-10-10 | 2018-11-27 | 江苏新广联半导体有限公司 | 一种具有高可靠性反射电极结构的led芯片的制作方法 |
| US10121932B1 (en) * | 2016-11-30 | 2018-11-06 | The United States Of America As Represented By The Secretary Of The Navy | Tunable graphene light-emitting device |
| KR102724660B1 (ko) | 2016-12-08 | 2024-10-31 | 삼성전자주식회사 | 발광 소자 |
| KR102549171B1 (ko) | 2017-07-12 | 2023-06-30 | 삼성전자주식회사 | 발광소자 패키지 및 이를 이용한 디스플레이 장치 |
| US10964851B2 (en) * | 2017-08-30 | 2021-03-30 | SemiLEDs Optoelectronics Co., Ltd. | Single light emitting diode (LED) structure |
| CN108428770B (zh) * | 2018-04-19 | 2021-03-23 | 北京大学 | 一种共面波导结构微米led的制备方法 |
| DE102018111227A1 (de) * | 2018-05-09 | 2019-11-14 | Osram Opto Semiconductors Gmbh | Verfahren zum Durchtrennen eines epitaktisch gewachsenen Halbleiterkörpers und Halbleiterchip |
| US10622514B1 (en) | 2018-10-15 | 2020-04-14 | Silanna UV Technologies Pte Ltd | Resonant optical cavity light emitting device |
| US11302248B2 (en) | 2019-01-29 | 2022-04-12 | Osram Opto Semiconductors Gmbh | U-led, u-led device, display and method for the same |
| KR20210118931A (ko) | 2019-01-29 | 2021-10-01 | 오스람 옵토 세미컨덕터스 게엠베하 | 비디오 벽, 드라이버 회로, 제어 시스템, 및 이를 위한 방법 |
| US11156759B2 (en) | 2019-01-29 | 2021-10-26 | Osram Opto Semiconductors Gmbh | μ-LED, μ-LED device, display and method for the same |
| US11271143B2 (en) | 2019-01-29 | 2022-03-08 | Osram Opto Semiconductors Gmbh | μ-LED, μ-LED device, display and method for the same |
| US11610868B2 (en) | 2019-01-29 | 2023-03-21 | Osram Opto Semiconductors Gmbh | μ-LED, μ-LED device, display and method for the same |
| JP7642549B2 (ja) | 2019-02-11 | 2025-03-10 | エイエムエス-オスラム インターナショナル ゲーエムベーハー | 光電子構造素子、光電子配置構造体および方法 |
| US11538852B2 (en) | 2019-04-23 | 2022-12-27 | Osram Opto Semiconductors Gmbh | μ-LED, μ-LED device, display and method for the same |
| KR20220002436A (ko) * | 2019-04-23 | 2022-01-06 | 오스람 옵토 세미컨덕터스 게엠베하 | Led 모듈, led 디스플레이 모듈 및 그 제조 방법 |
| US12266641B2 (en) | 2019-05-13 | 2025-04-01 | Osram Opto Semiconductors Gmbh | Multi-chip carrier structure |
| JP7494215B2 (ja) | 2019-05-23 | 2024-06-03 | エイエムエス-オスラム インターナショナル ゲーエムベーハー | 照明配置構造体、光誘導配置構造体およびそれらに関する方法 |
| US12294039B2 (en) | 2019-09-20 | 2025-05-06 | Osram Opto Semiconductors Gmbh | Optoelectronic component, semiconductor structure and method |
| KR102764501B1 (ko) * | 2019-11-12 | 2025-02-07 | 삼성전자주식회사 | 반도체 발광 소자 및 반도체 발광 소자 패키지 |
| KR102730959B1 (ko) | 2020-04-24 | 2024-11-20 | 삼성디스플레이 주식회사 | 화소, 이를 구비한 표시 장치, 및 그의 제조 방법 |
| CN115172556A (zh) * | 2021-06-17 | 2022-10-11 | 厦门三安光电有限公司 | 一种发光二极管芯片、发光装置及显示装置 |
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| US5260586A (en) * | 1991-11-18 | 1993-11-09 | Ricoh Company, Ltd. | Optical exclusive-or element |
| US20050225973A1 (en) * | 2004-04-02 | 2005-10-13 | Gelcore, Llc | LED with series-connected monolithically integrated mesas |
| US20090242910A1 (en) * | 2008-03-28 | 2009-10-01 | Sanken Electric Co., Ltd. | Light emitting device |
| US20110084294A1 (en) * | 2007-11-14 | 2011-04-14 | Cree, Inc. | High voltage wire bond free leds |
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|---|---|---|---|---|
| JP2000323750A (ja) * | 1999-05-10 | 2000-11-24 | Hitachi Cable Ltd | 発光ダイオードアレイ |
| JP3659098B2 (ja) * | 1999-11-30 | 2005-06-15 | 日亜化学工業株式会社 | 窒化物半導体発光素子 |
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| JP2002009331A (ja) * | 2000-06-20 | 2002-01-11 | Hitachi Cable Ltd | 発光ダイオードアレイ |
| US6547249B2 (en) * | 2001-03-29 | 2003-04-15 | Lumileds Lighting U.S., Llc | Monolithic series/parallel led arrays formed on highly resistive substrates |
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| CN102479913A (zh) * | 2010-11-29 | 2012-05-30 | 上海蓝宝光电材料有限公司 | 一种高效高压垂直通孔键合式led芯片及其制作方法 |
-
2013
- 2013-08-06 US US14/426,723 patent/US9412922B2/en active Active
- 2013-08-06 WO PCT/KR2013/007105 patent/WO2014038794A1/ko not_active Ceased
- 2013-08-06 DE DE201311003887 patent/DE112013003887T5/de active Pending
- 2013-08-06 DE DE202013012470.9U patent/DE202013012470U1/de not_active Expired - Lifetime
- 2013-08-06 IN IN387KON2015 patent/IN2015KN00387A/en unknown
- 2013-08-06 CN CN201811346014.3A patent/CN109638032B/zh active Active
- 2013-08-06 CN CN202010064109.7A patent/CN111223973B/zh active Active
- 2013-08-06 CN CN201380046853.2A patent/CN104620399B/zh active Active
- 2013-08-07 TW TW102128318A patent/TWI602324B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5260586A (en) * | 1991-11-18 | 1993-11-09 | Ricoh Company, Ltd. | Optical exclusive-or element |
| US20050225973A1 (en) * | 2004-04-02 | 2005-10-13 | Gelcore, Llc | LED with series-connected monolithically integrated mesas |
| US20110084294A1 (en) * | 2007-11-14 | 2011-04-14 | Cree, Inc. | High voltage wire bond free leds |
| US20090242910A1 (en) * | 2008-03-28 | 2009-10-01 | Sanken Electric Co., Ltd. | Light emitting device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI873097B (zh) * | 2018-06-20 | 2025-02-21 | 法商艾勒迪亞公司 | 包含二極體陣列之光電元件 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE202013012470U1 (de) | 2017-01-12 |
| CN109638032B (zh) | 2023-10-27 |
| CN104620399B (zh) | 2020-02-21 |
| US9412922B2 (en) | 2016-08-09 |
| US20150280086A1 (en) | 2015-10-01 |
| WO2014038794A1 (ko) | 2014-03-13 |
| CN111223973B (zh) | 2023-08-22 |
| CN109638032A (zh) | 2019-04-16 |
| CN104620399A (zh) | 2015-05-13 |
| DE112013003887T5 (de) | 2015-05-07 |
| IN2015KN00387A (enExample) | 2015-07-10 |
| CN111223973A (zh) | 2020-06-02 |
| TW201414024A (zh) | 2014-04-01 |
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