TWI596154B - Flux and solder paste - Google Patents

Flux and solder paste Download PDF

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Publication number
TWI596154B
TWI596154B TW104106780A TW104106780A TWI596154B TW I596154 B TWI596154 B TW I596154B TW 104106780 A TW104106780 A TW 104106780A TW 104106780 A TW104106780 A TW 104106780A TW I596154 B TWI596154 B TW I596154B
Authority
TW
Taiwan
Prior art keywords
long
flux
chain dibasic
mass
dibasic acid
Prior art date
Application number
TW104106780A
Other languages
English (en)
Chinese (zh)
Other versions
TW201602219A (zh
Inventor
Masashi Uehata
Yasuyuki Yamagawa
Kazuya Kitazawa
Yoshinori Takagi
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of TW201602219A publication Critical patent/TW201602219A/zh
Application granted granted Critical
Publication of TWI596154B publication Critical patent/TWI596154B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW104106780A 2014-03-25 2015-03-04 Flux and solder paste TWI596154B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014062417A JP5952849B2 (ja) 2014-03-25 2014-03-25 フラックス及びソルダペースト

Publications (2)

Publication Number Publication Date
TW201602219A TW201602219A (zh) 2016-01-16
TWI596154B true TWI596154B (zh) 2017-08-21

Family

ID=54195004

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104106780A TWI596154B (zh) 2014-03-25 2015-03-04 Flux and solder paste

Country Status (7)

Country Link
US (1) US9902022B2 (enExample)
EP (1) EP3124167B1 (enExample)
JP (1) JP5952849B2 (enExample)
KR (1) KR101712787B1 (enExample)
CN (1) CN106132629B (enExample)
TW (1) TWI596154B (enExample)
WO (1) WO2015146473A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5962832B1 (ja) * 2015-09-18 2016-08-03 千住金属工業株式会社 フラックス
JP2017130623A (ja) * 2016-01-22 2017-07-27 株式会社村田製作所 充填用ペースト材料、それを用いたビアホール導体の製造方法および多層基板の製造方法
JP2017183571A (ja) * 2016-03-31 2017-10-05 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6536503B2 (ja) * 2016-07-12 2019-07-03 千住金属工業株式会社 フラックス
JP6399242B1 (ja) * 2018-01-17 2018-10-03 千住金属工業株式会社 フラックス及びソルダペースト
WO2019172410A1 (ja) 2018-03-09 2019-09-12 株式会社オリジン フラックス、ソルダペースト、はんだ付けプロセス、はんだ付け製品の製造方法、ｂｇａパッケージの製造方法
EP3834982A4 (en) 2018-08-10 2021-12-22 Koki Company Limited SOLDERING FLUX AND PULP
US12240061B2 (en) 2020-03-17 2025-03-04 Panasonic Intellectual Property Management Co., Ltd. Flux resin composition, electronic component, method for manufacturing the electronic component, mounting structure, and method for manufacturing the mounting structure
JP7620916B2 (ja) 2020-12-17 2025-01-24 パナソニックＩｐマネジメント株式会社 フラックス用樹脂組成物、電子部品、電子部品の製造方法、実装構造体及び実装構造体の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200730288A (en) * 2005-08-11 2007-08-16 Senju Metal Industry Co Lead free solder paste and application thereof
JP2012115871A (ja) * 2010-11-30 2012-06-21 Panasonic Corp はんだペースト
TW201335302A (zh) * 2012-02-24 2013-09-01 日立化成股份有限公司 半導體用黏著劑、助焊劑、半導體裝置的製造方法及半導體裝置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6971163B1 (en) 1998-04-22 2005-12-06 Dow Corning Corporation Adhesive and encapsulating material with fluxing properties
GB9808587D0 (en) * 1998-04-22 1998-06-24 Craig Hugh P Adhesive and encapsulating material with fluxing properties
JP4504481B2 (ja) * 1998-11-26 2010-07-14 岡村製油株式会社 長鎖二塩基酸組成物及びこれを用いる電解液
TW527253B (en) 1999-10-05 2003-04-11 Tdk Corp Soldering flux, soldering paste and soldering process
JP3849842B2 (ja) * 1999-10-05 2006-11-22 Ｔｄｋ株式会社 はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール、電子回路装置、及び、はんだ付け方法
JP2001219294A (ja) * 1999-12-03 2001-08-14 Tdk Corp 熱硬化性はんだ付け用フラックスおよびはんだ付け方法
EP1252966B1 (en) 1999-12-27 2006-08-30 Sumitomo Bakelite Co., Ltd. Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device
JP3791403B2 (ja) * 2000-12-04 2006-06-28 富士電機ホールディングス株式会社 鉛フリーハンダ対応無洗浄用フラックスおよびこれを含有するハンダ組成物
JP3888573B2 (ja) 2001-06-29 2007-03-07 富士電機ホールディングス株式会社 ハンダ組成物
JP3702418B2 (ja) 2002-03-07 2005-10-05 株式会社 東京第一商興 ソルダペースト用フラックス及びソルダペースト
TW200634127A (en) 2004-12-15 2006-10-01 Tamurakaken Corp An electrically conductive adhesive, electrical part and electrical part module were made of it
US8070043B1 (en) 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering
US8430295B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200730288A (en) * 2005-08-11 2007-08-16 Senju Metal Industry Co Lead free solder paste and application thereof
JP2012115871A (ja) * 2010-11-30 2012-06-21 Panasonic Corp はんだペースト
TW201335302A (zh) * 2012-02-24 2013-09-01 日立化成股份有限公司 半導體用黏著劑、助焊劑、半導體裝置的製造方法及半導體裝置

Also Published As

Publication number Publication date
TW201602219A (zh) 2016-01-16
EP3124167B1 (en) 2019-05-08
EP3124167A1 (en) 2017-02-01
EP3124167A4 (en) 2017-09-20
KR20160133558A (ko) 2016-11-22
WO2015146473A1 (ja) 2015-10-01
US20170190005A1 (en) 2017-07-06
JP2015182125A (ja) 2015-10-22
JP5952849B2 (ja) 2016-07-13
US9902022B2 (en) 2018-02-27
CN106132629B (zh) 2017-10-13
CN106132629A (zh) 2016-11-16
KR101712787B1 (ko) 2017-03-06

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