CN106132629B - 助焊剂及焊膏 - Google Patents
助焊剂及焊膏 Download PDFInfo
- Publication number
- CN106132629B CN106132629B CN201580016031.9A CN201580016031A CN106132629B CN 106132629 B CN106132629 B CN 106132629B CN 201580016031 A CN201580016031 A CN 201580016031A CN 106132629 B CN106132629 B CN 106132629B
- Authority
- CN
- China
- Prior art keywords
- long
- flux
- mass
- chain
- acid mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-062417 | 2014-03-25 | ||
| JP2014062417A JP5952849B2 (ja) | 2014-03-25 | 2014-03-25 | フラックス及びソルダペースト |
| PCT/JP2015/055781 WO2015146473A1 (ja) | 2014-03-25 | 2015-02-27 | フラックス及びソルダペースト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106132629A CN106132629A (zh) | 2016-11-16 |
| CN106132629B true CN106132629B (zh) | 2017-10-13 |
Family
ID=54195004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580016031.9A Active CN106132629B (zh) | 2014-03-25 | 2015-02-27 | 助焊剂及焊膏 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9902022B2 (enExample) |
| EP (1) | EP3124167B1 (enExample) |
| JP (1) | JP5952849B2 (enExample) |
| KR (1) | KR101712787B1 (enExample) |
| CN (1) | CN106132629B (enExample) |
| TW (1) | TWI596154B (enExample) |
| WO (1) | WO2015146473A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5962832B1 (ja) * | 2015-09-18 | 2016-08-03 | 千住金属工業株式会社 | フラックス |
| JP2017130623A (ja) * | 2016-01-22 | 2017-07-27 | 株式会社村田製作所 | 充填用ペースト材料、それを用いたビアホール導体の製造方法および多層基板の製造方法 |
| JP2017183571A (ja) * | 2016-03-31 | 2017-10-05 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP6536503B2 (ja) * | 2016-07-12 | 2019-07-03 | 千住金属工業株式会社 | フラックス |
| JP6399242B1 (ja) * | 2018-01-17 | 2018-10-03 | 千住金属工業株式会社 | フラックス及びソルダペースト |
| CN111836695B (zh) | 2018-03-09 | 2022-06-24 | 株式会社欧利生 | 助焊剂、焊膏、焊接制程、焊接制品的制造方法、bga封装件的制造方法 |
| CN112469531A (zh) * | 2018-08-10 | 2021-03-09 | 株式会社弘辉 | 助焊剂和焊膏 |
| US12240061B2 (en) | 2020-03-17 | 2025-03-04 | Panasonic Intellectual Property Management Co., Ltd. | Flux resin composition, electronic component, method for manufacturing the electronic component, mounting structure, and method for manufacturing the mounting structure |
| JP7620916B2 (ja) | 2020-12-17 | 2025-01-24 | パナソニックIpマネジメント株式会社 | フラックス用樹脂組成物、電子部品、電子部品の製造方法、実装構造体及び実装構造体の製造方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1374168A (zh) * | 2000-12-04 | 2002-10-16 | 富士电机株式会社 | 钎焊用焊剂和钎料组合物 |
| CN1433351A (zh) * | 1999-12-27 | 2003-07-30 | 住友电木株式会社 | 可固化助焊剂、阻焊剂、可固化助焊剂增强的半导体封装和半导体器件以及制造半导体封装和半导体器件的方法 |
| CN1543385A (zh) * | 2001-06-29 | 2004-11-03 | 富士电机株式会社 | 焊料组合物 |
| CN101232967A (zh) * | 2005-08-11 | 2008-07-30 | 千住金属工业株式会社 | 无铅焊膏及其应用 |
| JP2012115871A (ja) * | 2010-11-30 | 2012-06-21 | Panasonic Corp | はんだペースト |
| CN102554512A (zh) * | 2010-12-02 | 2012-07-11 | 罗门哈斯电子材料有限公司 | 一种可固化助焊剂组合物和焊接方法 |
| CN103042320A (zh) * | 2011-09-30 | 2013-04-17 | 罗门哈斯电子材料有限公司 | 可固化助焊剂组合物和焊接方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6971163B1 (en) | 1998-04-22 | 2005-12-06 | Dow Corning Corporation | Adhesive and encapsulating material with fluxing properties |
| GB9808587D0 (en) * | 1998-04-22 | 1998-06-24 | Craig Hugh P | Adhesive and encapsulating material with fluxing properties |
| JP4504481B2 (ja) * | 1998-11-26 | 2010-07-14 | 岡村製油株式会社 | 長鎖二塩基酸組成物及びこれを用いる電解液 |
| TW527253B (en) | 1999-10-05 | 2003-04-11 | Tdk Corp | Soldering flux, soldering paste and soldering process |
| JP3849842B2 (ja) * | 1999-10-05 | 2006-11-22 | Tdk株式会社 | はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール、電子回路装置、及び、はんだ付け方法 |
| JP2001219294A (ja) * | 1999-12-03 | 2001-08-14 | Tdk Corp | 熱硬化性はんだ付け用フラックスおよびはんだ付け方法 |
| JP3702418B2 (ja) * | 2002-03-07 | 2005-10-05 | 株式会社 東京第一商興 | ソルダペースト用フラックス及びソルダペースト |
| TW200634127A (en) * | 2004-12-15 | 2006-10-01 | Tamurakaken Corp | An electrically conductive adhesive, electrical part and electrical part module were made of it |
| WO2013125087A1 (ja) | 2012-02-24 | 2013-08-29 | 日立化成株式会社 | 半導体用接着剤、フラックス剤、半導体装置の製造方法及び半導体装置 |
-
2014
- 2014-03-25 JP JP2014062417A patent/JP5952849B2/ja active Active
-
2015
- 2015-02-27 CN CN201580016031.9A patent/CN106132629B/zh active Active
- 2015-02-27 WO PCT/JP2015/055781 patent/WO2015146473A1/ja not_active Ceased
- 2015-02-27 US US15/128,231 patent/US9902022B2/en active Active
- 2015-02-27 EP EP15770209.3A patent/EP3124167B1/en active Active
- 2015-02-27 KR KR1020167029054A patent/KR101712787B1/ko active Active
- 2015-03-04 TW TW104106780A patent/TWI596154B/zh active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1433351A (zh) * | 1999-12-27 | 2003-07-30 | 住友电木株式会社 | 可固化助焊剂、阻焊剂、可固化助焊剂增强的半导体封装和半导体器件以及制造半导体封装和半导体器件的方法 |
| CN1374168A (zh) * | 2000-12-04 | 2002-10-16 | 富士电机株式会社 | 钎焊用焊剂和钎料组合物 |
| CN1543385A (zh) * | 2001-06-29 | 2004-11-03 | 富士电机株式会社 | 焊料组合物 |
| CN101232967A (zh) * | 2005-08-11 | 2008-07-30 | 千住金属工业株式会社 | 无铅焊膏及其应用 |
| JP2012115871A (ja) * | 2010-11-30 | 2012-06-21 | Panasonic Corp | はんだペースト |
| CN102554512A (zh) * | 2010-12-02 | 2012-07-11 | 罗门哈斯电子材料有限公司 | 一种可固化助焊剂组合物和焊接方法 |
| CN103042320A (zh) * | 2011-09-30 | 2013-04-17 | 罗门哈斯电子材料有限公司 | 可固化助焊剂组合物和焊接方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201602219A (zh) | 2016-01-16 |
| JP5952849B2 (ja) | 2016-07-13 |
| EP3124167B1 (en) | 2019-05-08 |
| US20170190005A1 (en) | 2017-07-06 |
| KR20160133558A (ko) | 2016-11-22 |
| EP3124167A4 (en) | 2017-09-20 |
| US9902022B2 (en) | 2018-02-27 |
| TWI596154B (zh) | 2017-08-21 |
| EP3124167A1 (en) | 2017-02-01 |
| CN106132629A (zh) | 2016-11-16 |
| JP2015182125A (ja) | 2015-10-22 |
| WO2015146473A1 (ja) | 2015-10-01 |
| KR101712787B1 (ko) | 2017-03-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106132629B (zh) | 助焊剂及焊膏 | |
| EP1914035B1 (en) | Lead free solder paste and application thereof | |
| KR102095083B1 (ko) | 도전성 접착제, 접합체 및 조인트 | |
| JP5093766B2 (ja) | 導電性ボール等搭載半導体パッケージ基板の製造方法 | |
| JP5964597B2 (ja) | 異方性導電性ペーストおよびそれを用いた電子部品の接続方法 | |
| JP2006199937A (ja) | 導電性接着剤、これを用いた導電部及び電子部品モジュール | |
| JP2008510620A (ja) | 半田組成物および半田接合方法ならびに半田接合構造 | |
| JP2008510621A (ja) | 半田組成物及び半田接合方法並びに半田接合構造 | |
| JPWO2013168352A1 (ja) | 実装構造体とその製造方法 | |
| JP5140038B2 (ja) | 熱硬化性樹脂組成物及び回路基板 | |
| TWI659990B (zh) | Flux | |
| US20150027589A1 (en) | Solder Paste | |
| JP5560032B2 (ja) | はんだ接合補強剤組成物、及びこれを用いた実装基板の製造方法 | |
| JP4897697B2 (ja) | 導電性接着剤 | |
| KR20150111403A (ko) | 전자부품을 접합하기 위한 무연납땜용 플럭스 및 페이스트, 이를 이용하여 납땜하는 방법 | |
| JP2010232388A (ja) | 半導体パッケージ及び半導体部品の実装構造 | |
| JP5310664B2 (ja) | 電子部品実装方法 | |
| JP6048562B1 (ja) | フラックス残渣の接着強度測定方法 | |
| CN102848095B (zh) | 接合材料、接合部及电路基板 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |