TWI595811B - 印刷電路板及其製造方法 - Google Patents
印刷電路板及其製造方法 Download PDFInfo
- Publication number
- TWI595811B TWI595811B TW102126939A TW102126939A TWI595811B TW I595811 B TWI595811 B TW I595811B TW 102126939 A TW102126939 A TW 102126939A TW 102126939 A TW102126939 A TW 102126939A TW I595811 B TWI595811 B TW I595811B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- core
- printed circuit
- circuit board
- reinforcing material
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 38
- 238000000034 method Methods 0.000 title description 15
- 238000007747 plating Methods 0.000 claims description 44
- 239000011521 glass Substances 0.000 claims description 27
- 238000000576 coating method Methods 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 14
- 239000003365 glass fiber Substances 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 238000009751 slip forming Methods 0.000 claims 2
- 239000010410 layer Substances 0.000 description 218
- 239000011162 core material Substances 0.000 description 164
- 239000012779 reinforcing material Substances 0.000 description 106
- 230000003014 reinforcing effect Effects 0.000 description 24
- 229910052751 metal Inorganic materials 0.000 description 21
- 239000002184 metal Substances 0.000 description 21
- 239000000463 material Substances 0.000 description 17
- 239000010408 film Substances 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000010949 copper Substances 0.000 description 10
- 239000002861 polymer material Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000011810 insulating material Substances 0.000 description 8
- 229920001940 conductive polymer Polymers 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 239000005357 flat glass Substances 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- 238000004088 simulation Methods 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 239000011247 coating layer Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000009832 plasma treatment Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20120083160 | 2012-07-30 | ||
| KR20120140480 | 2012-12-05 | ||
| KR1020130061168A KR20140016150A (ko) | 2012-07-30 | 2013-05-29 | 인쇄회로기판 및 그 제조방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201414367A TW201414367A (zh) | 2014-04-01 |
| TWI595811B true TWI595811B (zh) | 2017-08-11 |
Family
ID=50265370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102126939A TWI595811B (zh) | 2012-07-30 | 2013-07-26 | 印刷電路板及其製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6342357B2 (enrdf_load_stackoverflow) |
| KR (1) | KR20140016150A (enrdf_load_stackoverflow) |
| TW (1) | TWI595811B (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102268385B1 (ko) * | 2014-08-14 | 2021-06-23 | 삼성전기주식회사 | 인쇄회로기판 및 인쇄회로기판의 제조 방법 |
| KR101650938B1 (ko) * | 2014-09-25 | 2016-08-24 | 코닝정밀소재 주식회사 | 집적회로 패키지용 기판 |
| KR20170001310A (ko) | 2015-06-26 | 2017-01-04 | 삼성전기주식회사 | 글라스 코어 기판, 그의 제조 방법 및 그를 이용한 회로기판 |
| TWI685288B (zh) * | 2018-08-22 | 2020-02-11 | 健鼎科技股份有限公司 | 電路板及其製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI236324B (en) * | 2004-04-08 | 2005-07-11 | Phoenix Prec Technology Corp | Insulating structure of circuit board and method for fabricating the circuit board by using the insulating structure |
| TWI247567B (en) * | 2003-09-09 | 2006-01-11 | Hoya Corp | Method for fabricating a double-sided wiring glass substrate |
| TW201121372A (en) * | 2009-09-02 | 2011-06-16 | Panasonic Corp | Printed wiring board, build-up multi-layer board, and production method therefor |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4946165A (enrdf_load_stackoverflow) * | 1972-09-11 | 1974-05-02 | ||
| JP3756041B2 (ja) * | 1999-05-27 | 2006-03-15 | Ｈｏｙａ株式会社 | 多層プリント配線板の製造方法 |
| JP2005159330A (ja) * | 2003-11-05 | 2005-06-16 | Hitachi Chem Co Ltd | 多層回路基板の製造方法及びこれから得られる多層回路基板、半導体チップ搭載基板並びにこの基板を用いた半導体パッケージ |
| JP2006049804A (ja) * | 2004-07-07 | 2006-02-16 | Shinko Electric Ind Co Ltd | 配線基板の製造方法 |
| JP4564342B2 (ja) * | 2004-11-24 | 2010-10-20 | 大日本印刷株式会社 | 多層配線基板およびその製造方法 |
-
2013
- 2013-05-29 KR KR1020130061168A patent/KR20140016150A/ko not_active Ceased
- 2013-07-26 TW TW102126939A patent/TWI595811B/zh active
-
2015
- 2015-04-09 JP JP2015080094A patent/JP6342357B2/ja active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI247567B (en) * | 2003-09-09 | 2006-01-11 | Hoya Corp | Method for fabricating a double-sided wiring glass substrate |
| TWI236324B (en) * | 2004-04-08 | 2005-07-11 | Phoenix Prec Technology Corp | Insulating structure of circuit board and method for fabricating the circuit board by using the insulating structure |
| TW201121372A (en) * | 2009-09-02 | 2011-06-16 | Panasonic Corp | Printed wiring board, build-up multi-layer board, and production method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015128195A (ja) | 2015-07-09 |
| JP6342357B2 (ja) | 2018-06-13 |
| TW201414367A (zh) | 2014-04-01 |
| KR20140016150A (ko) | 2014-02-07 |
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