KR20140016150A - 인쇄회로기판 및 그 제조방법 - Google Patents

인쇄회로기판 및 그 제조방법 Download PDF

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Publication number
KR20140016150A
KR20140016150A KR1020130061168A KR20130061168A KR20140016150A KR 20140016150 A KR20140016150 A KR 20140016150A KR 1020130061168 A KR1020130061168 A KR 1020130061168A KR 20130061168 A KR20130061168 A KR 20130061168A KR 20140016150 A KR20140016150 A KR 20140016150A
Authority
KR
South Korea
Prior art keywords
core
layer
circuit board
printed circuit
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020130061168A
Other languages
English (en)
Korean (ko)
Inventor
민태홍
조석현
김종립
이정한
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to TW102126939A priority Critical patent/TWI595811B/zh
Priority to US13/951,886 priority patent/US20140027163A1/en
Priority to JP2013157429A priority patent/JP2014027284A/ja
Publication of KR20140016150A publication Critical patent/KR20140016150A/ko
Priority to JP2015080094A priority patent/JP6342357B2/ja
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020130061168A 2012-07-30 2013-05-29 인쇄회로기판 및 그 제조방법 Ceased KR20140016150A (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW102126939A TWI595811B (zh) 2012-07-30 2013-07-26 印刷電路板及其製造方法
US13/951,886 US20140027163A1 (en) 2012-07-30 2013-07-26 Printed circuit board and method for manufacturing the same
JP2013157429A JP2014027284A (ja) 2012-07-30 2013-07-30 印刷回路基板及びその製造方法
JP2015080094A JP6342357B2 (ja) 2012-07-30 2015-04-09 印刷回路基板及びその製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020120083160 2012-07-30
KR20120083160 2012-07-30
KR1020120140480 2012-12-05
KR20120140480 2012-12-05

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020150040298A Division KR101903557B1 (ko) 2015-03-23 2015-03-23 인쇄회로기판 및 그 제조방법

Publications (1)

Publication Number Publication Date
KR20140016150A true KR20140016150A (ko) 2014-02-07

Family

ID=50265370

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130061168A Ceased KR20140016150A (ko) 2012-07-30 2013-05-29 인쇄회로기판 및 그 제조방법

Country Status (3)

Country Link
JP (1) JP6342357B2 (enrdf_load_stackoverflow)
KR (1) KR20140016150A (enrdf_load_stackoverflow)
TW (1) TWI595811B (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160020761A (ko) * 2014-08-14 2016-02-24 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판의 제조 방법
KR20160036247A (ko) * 2014-09-25 2016-04-04 코닝정밀소재 주식회사 집적회로 패키지용 기판
KR20170001310A (ko) 2015-06-26 2017-01-04 삼성전기주식회사 글라스 코어 기판, 그의 제조 방법 및 그를 이용한 회로기판

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI685288B (zh) * 2018-08-22 2020-02-11 健鼎科技股份有限公司 電路板及其製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4946165A (enrdf_load_stackoverflow) * 1972-09-11 1974-05-02
JP3756041B2 (ja) * 1999-05-27 2006-03-15 Ｈｏｙａ株式会社 多層プリント配線板の製造方法
EP1667509A4 (en) * 2003-09-09 2009-05-20 Hoya Corp METHOD FOR MANUFACTURING A GLASS PLATE PRINTED ON BOTH SIDES
JP2005159330A (ja) * 2003-11-05 2005-06-16 Hitachi Chem Co Ltd 多層回路基板の製造方法及びこれから得られる多層回路基板、半導体チップ搭載基板並びにこの基板を用いた半導体パッケージ
TWI236324B (en) * 2004-04-08 2005-07-11 Phoenix Prec Technology Corp Insulating structure of circuit board and method for fabricating the circuit board by using the insulating structure
JP2006049804A (ja) * 2004-07-07 2006-02-16 Shinko Electric Ind Co Ltd 配線基板の製造方法
JP4564342B2 (ja) * 2004-11-24 2010-10-20 大日本印刷株式会社 多層配線基板およびその製造方法
EP2461659A4 (en) * 2009-09-02 2014-08-20 Panasonic Corp FITTED PCB, MULTILAYER BUILT-UP PCB AND MANUFACTURING PROCESS THEREFOR

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160020761A (ko) * 2014-08-14 2016-02-24 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판의 제조 방법
KR20160036247A (ko) * 2014-09-25 2016-04-04 코닝정밀소재 주식회사 집적회로 패키지용 기판
KR20170001310A (ko) 2015-06-26 2017-01-04 삼성전기주식회사 글라스 코어 기판, 그의 제조 방법 및 그를 이용한 회로기판

Also Published As

Publication number Publication date
JP2015128195A (ja) 2015-07-09
JP6342357B2 (ja) 2018-06-13
TW201414367A (zh) 2014-04-01
TWI595811B (zh) 2017-08-11

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