JP6342357B2 - 印刷回路基板及びその製造方法 - Google Patents
印刷回路基板及びその製造方法 Download PDFInfo
- Publication number
- JP6342357B2 JP6342357B2 JP2015080094A JP2015080094A JP6342357B2 JP 6342357 B2 JP6342357 B2 JP 6342357B2 JP 2015080094 A JP2015080094 A JP 2015080094A JP 2015080094 A JP2015080094 A JP 2015080094A JP 6342357 B2 JP6342357 B2 JP 6342357B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- circuit board
- printed circuit
- core
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 43
- 239000010410 layer Substances 0.000 claims description 246
- 239000011521 glass Substances 0.000 claims description 39
- 238000007747 plating Methods 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 35
- 239000011247 coating layer Substances 0.000 claims description 11
- 239000004744 fabric Substances 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011162 core material Substances 0.000 description 147
- 239000012779 reinforcing material Substances 0.000 description 97
- 230000008569 process Effects 0.000 description 27
- 229910052751 metal Inorganic materials 0.000 description 17
- 239000002184 metal Substances 0.000 description 17
- 239000010949 copper Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000011810 insulating material Substances 0.000 description 10
- 230000003014 reinforcing effect Effects 0.000 description 10
- 239000002861 polymer material Substances 0.000 description 9
- 230000002787 reinforcement Effects 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010408 film Substances 0.000 description 8
- 229920001940 conductive polymer Polymers 0.000 description 7
- 239000010409 thin film Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000004088 simulation Methods 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000009832 plasma treatment Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2012-0083160 | 2012-07-30 | ||
| KR20120083160 | 2012-07-30 | ||
| KR10-2012-0140480 | 2012-12-05 | ||
| KR20120140480 | 2012-12-05 | ||
| KR10-2013-0061168 | 2013-05-29 | ||
| KR1020130061168A KR20140016150A (ko) | 2012-07-30 | 2013-05-29 | 인쇄회로기판 및 그 제조방법 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013157429A Division JP2014027284A (ja) | 2012-07-30 | 2013-07-30 | 印刷回路基板及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015128195A JP2015128195A (ja) | 2015-07-09 |
| JP2015128195A5 JP2015128195A5 (enrdf_load_stackoverflow) | 2016-02-12 |
| JP6342357B2 true JP6342357B2 (ja) | 2018-06-13 |
Family
ID=50265370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015080094A Active JP6342357B2 (ja) | 2012-07-30 | 2015-04-09 | 印刷回路基板及びその製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6342357B2 (enrdf_load_stackoverflow) |
| KR (1) | KR20140016150A (enrdf_load_stackoverflow) |
| TW (1) | TWI595811B (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102268385B1 (ko) * | 2014-08-14 | 2021-06-23 | 삼성전기주식회사 | 인쇄회로기판 및 인쇄회로기판의 제조 방법 |
| KR101650938B1 (ko) * | 2014-09-25 | 2016-08-24 | 코닝정밀소재 주식회사 | 집적회로 패키지용 기판 |
| KR20170001310A (ko) | 2015-06-26 | 2017-01-04 | 삼성전기주식회사 | 글라스 코어 기판, 그의 제조 방법 및 그를 이용한 회로기판 |
| TWI685288B (zh) * | 2018-08-22 | 2020-02-11 | 健鼎科技股份有限公司 | 電路板及其製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4946165A (enrdf_load_stackoverflow) * | 1972-09-11 | 1974-05-02 | ||
| JP3756041B2 (ja) * | 1999-05-27 | 2006-03-15 | Ｈｏｙａ株式会社 | 多層プリント配線板の製造方法 |
| EP1667509A4 (en) * | 2003-09-09 | 2009-05-20 | Hoya Corp | METHOD FOR MANUFACTURING A GLASS PLATE PRINTED ON BOTH SIDES |
| JP2005159330A (ja) * | 2003-11-05 | 2005-06-16 | Hitachi Chem Co Ltd | 多層回路基板の製造方法及びこれから得られる多層回路基板、半導体チップ搭載基板並びにこの基板を用いた半導体パッケージ |
| TWI236324B (en) * | 2004-04-08 | 2005-07-11 | Phoenix Prec Technology Corp | Insulating structure of circuit board and method for fabricating the circuit board by using the insulating structure |
| JP2006049804A (ja) * | 2004-07-07 | 2006-02-16 | Shinko Electric Ind Co Ltd | 配線基板の製造方法 |
| JP4564342B2 (ja) * | 2004-11-24 | 2010-10-20 | 大日本印刷株式会社 | 多層配線基板およびその製造方法 |
| EP2461659A4 (en) * | 2009-09-02 | 2014-08-20 | Panasonic Corp | FITTED PCB, MULTILAYER BUILT-UP PCB AND MANUFACTURING PROCESS THEREFOR |
-
2013
- 2013-05-29 KR KR1020130061168A patent/KR20140016150A/ko not_active Ceased
- 2013-07-26 TW TW102126939A patent/TWI595811B/zh active
-
2015
- 2015-04-09 JP JP2015080094A patent/JP6342357B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20140016150A (ko) | 2014-02-07 |
| JP2015128195A (ja) | 2015-07-09 |
| TW201414367A (zh) | 2014-04-01 |
| TWI595811B (zh) | 2017-08-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2014027284A (ja) | 印刷回路基板及びその製造方法 | |
| JP4199198B2 (ja) | 多層配線基板およびその製造方法 | |
| WO2015151512A1 (ja) | インターポーザ、半導体装置、インターポーザの製造方法、半導体装置の製造方法 | |
| TW200913098A (en) | Semiconductor plastic package and fabricating method thereof | |
| JP4395098B2 (ja) | Ｂｇａパッケージおよびその製造方法 | |
| JP6342357B2 (ja) | 印刷回路基板及びその製造方法 | |
| JP2012060112A (ja) | 単層印刷回路基板及びその製造方法 | |
| JP2014501448A (ja) | 印刷回路基板及びその製造方法 | |
| JP6214398B2 (ja) | 印刷回路基板 | |
| JP4689375B2 (ja) | 積層基板および該積層基板を有する電子機器 | |
| KR101903557B1 (ko) | 인쇄회로기판 및 그 제조방법 | |
| TW201347639A (zh) | 多層配線基板之製造方法 | |
| KR101177651B1 (ko) | 인쇄회로기판 및 그 제조방법 | |
| JP4907216B2 (ja) | プリント配線板及びプリント配線板の製造方法 | |
| JP4147298B2 (ja) | フレックスリジッドプリント配線板およびフレックスリジッドプリント配線板の製造方法 | |
| JP2018019076A (ja) | プリント回路基板 | |
| KR101167422B1 (ko) | 캐리어 부재 및 이를 이용한 인쇄회로기판의 제조방법 | |
| KR20090123032A (ko) | 반도체 칩 내장형 인쇄회로기판 제조 방법 | |
| KR100704920B1 (ko) | 범프기판을 이용한 인쇄회로기판 및 제조방법 | |
| KR20140123273A (ko) | 인쇄회로기판 및 그 제조방법 | |
| KR100796981B1 (ko) | 인쇄회로기판 제조방법 | |
| JP2007013048A (ja) | 多層配線基板の製造方法 | |
| KR101231343B1 (ko) | 인쇄회로기판 및 그의 제조 방법 | |
| KR101231525B1 (ko) | 인쇄회로기판 및 그의 제조 방법 | |
| JP6386252B2 (ja) | プリント配線板 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20151217 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160307 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20170126 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170131 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170314 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170926 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180508 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180516 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6342357 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |