JP2015128195A5 - - Google Patents

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Publication number
JP2015128195A5
JP2015128195A5 JP2015080094A JP2015080094A JP2015128195A5 JP 2015128195 A5 JP2015128195 A5 JP 2015128195A5 JP 2015080094 A JP2015080094 A JP 2015080094A JP 2015080094 A JP2015080094 A JP 2015080094A JP 2015128195 A5 JP2015128195 A5 JP 2015128195A5
Authority
JP
Japan
Prior art keywords
layer
circuit board
printed circuit
board according
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015080094A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015128195A (ja
JP6342357B2 (ja
Filing date
Publication date
Priority claimed from KR1020130061168A external-priority patent/KR20140016150A/ko
Application filed filed Critical
Publication of JP2015128195A publication Critical patent/JP2015128195A/ja
Publication of JP2015128195A5 publication Critical patent/JP2015128195A5/ja
Application granted granted Critical
Publication of JP6342357B2 publication Critical patent/JP6342357B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015080094A 2012-07-30 2015-04-09 印刷回路基板及びその製造方法 Active JP6342357B2 (ja)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR10-2012-0083160 2012-07-30
KR20120083160 2012-07-30
KR10-2012-0140480 2012-12-05
KR20120140480 2012-12-05
KR10-2013-0061168 2013-05-29
KR1020130061168A KR20140016150A (ko) 2012-07-30 2013-05-29 인쇄회로기판 및 그 제조방법

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2013157429A Division JP2014027284A (ja) 2012-07-30 2013-07-30 印刷回路基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2015128195A JP2015128195A (ja) 2015-07-09
JP2015128195A5 true JP2015128195A5 (enrdf_load_stackoverflow) 2016-02-12
JP6342357B2 JP6342357B2 (ja) 2018-06-13

Family

ID=50265370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015080094A Active JP6342357B2 (ja) 2012-07-30 2015-04-09 印刷回路基板及びその製造方法

Country Status (3)

Country Link
JP (1) JP6342357B2 (enrdf_load_stackoverflow)
KR (1) KR20140016150A (enrdf_load_stackoverflow)
TW (1) TWI595811B (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102268385B1 (ko) * 2014-08-14 2021-06-23 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판의 제조 방법
KR101650938B1 (ko) * 2014-09-25 2016-08-24 코닝정밀소재 주식회사 집적회로 패키지용 기판
KR20170001310A (ko) 2015-06-26 2017-01-04 삼성전기주식회사 글라스 코어 기판, 그의 제조 방법 및 그를 이용한 회로기판
TWI685288B (zh) * 2018-08-22 2020-02-11 健鼎科技股份有限公司 電路板及其製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4946165A (enrdf_load_stackoverflow) * 1972-09-11 1974-05-02
JP3756041B2 (ja) * 1999-05-27 2006-03-15 Hoya株式会社 多層プリント配線板の製造方法
EP1667509A4 (en) * 2003-09-09 2009-05-20 Hoya Corp METHOD FOR MANUFACTURING A GLASS PLATE PRINTED ON BOTH SIDES
JP2005159330A (ja) * 2003-11-05 2005-06-16 Hitachi Chem Co Ltd 多層回路基板の製造方法及びこれから得られる多層回路基板、半導体チップ搭載基板並びにこの基板を用いた半導体パッケージ
TWI236324B (en) * 2004-04-08 2005-07-11 Phoenix Prec Technology Corp Insulating structure of circuit board and method for fabricating the circuit board by using the insulating structure
JP2006049804A (ja) * 2004-07-07 2006-02-16 Shinko Electric Ind Co Ltd 配線基板の製造方法
JP4564342B2 (ja) * 2004-11-24 2010-10-20 大日本印刷株式会社 多層配線基板およびその製造方法
EP2461659A4 (en) * 2009-09-02 2014-08-20 Panasonic Corp FITTED PCB, MULTILAYER BUILT-UP PCB AND MANUFACTURING PROCESS THEREFOR

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