KR20140016150A - A printed circuit board and a method for manufacturing - Google Patents

Abstract

The present invention relates to a printed circuit board and a manufacturing method thereof. The printed circuit board according to the present invention includes: a core reinforcing material with rigidity; an insulation layer which is formed on both sides of the core reinforcing material; a through hole which is formed by passing through the insulation layer and the core reinforcing material; and a plating layer which is formed in the through hole to connect circuit layers formed on the insulation layer.

Description

Printed circuit board and its manufacturing method {A PRINTED CIRCUIT BOARD AND A METHOD FOR MANUFACTURING}

The present invention relates to a printed circuit board and a manufacturing method thereof.

In recent years, as the thickness of portable devices becomes thinner and thinner, the electronic components mounted therein become thinner and the boards on which a plurality of electronic components are mounted are also made of thin plates, and efforts are being made to reduce the thickness of the entire internal components.

In particular, when the board on which a large number of electronic components are mounted is manufactured in a thin plate, the substrate is exposed to high temperature through a reflow process during the manufacturing process of the board or the mounting of the electronic component, and the characteristics of the material while repeating high temperature processing and cooling There is a problem that warpage occurs by.

Efforts have been made to increase the rigidity of the raw materials used during the manufacturing process of the substrate in order to prevent the warpage of the substrate, and to reduce the thermal expansion coefficient difference of the raw materials to improve the warpage caused by the difference in the thermal expansion coefficient (CTE) during the reflow process. More technical development is needed.

In addition, to improve the rigidity of the core material of the substrate as a way to prevent warpage by improving the physical structure during the manufacturing process of the substrate, a method of further inserting a metallic reinforcement inside the substrate is considered, but since the reinforcement is a metal material Certain portions of the metal reinforcement must be removed in advance to form vias or the like for electrically connecting the circuit pattern.

However, in order to form a via or the like in the metal reinforcement or the metal core material, the metal reinforcement is removed by using an etching process or a laser, and a separate carrier is provided for processing the metal reinforcement, and an insulating layer is formed on the metal reinforcement on the carrier. The problem of increasing the manufacturing cost of the substrate has been pointed out because it has to go through the process of removing the carrier after forming the

In the case of using a conventional metal reinforcing material, a part of the metal reinforcing material must be removed beforehand so that the through hole does not come into contact with the metal reinforcing material, and then an insulating layer must be applied to the surface including the through hole. There is a disadvantage in that it is difficult to form a fine pitch through hole at the time of formation.

Japanese Laid-Open Patent Publication No. 2004-193295

One object of the present invention is to provide a printed circuit board in which warpage is prevented.

An object of the present invention is to provide a method for manufacturing a printed circuit board which can minimize the occurrence of warpage of the substrate during the manufacturing process of the printed circuit board.

The above object of the present invention is achieved by providing a printed circuit board comprising a core in which an insulating layer and a core reinforcement are laminated alternately.

In this case, the core may have a configuration in which the core reinforcing material is interposed between the insulating layers, or the core reinforcing material is laminated on both surfaces of the insulating layer.

In addition, the core reinforcing material may be configured in the form of a film of glass or non-conductive polymer material on the plate.

The core stiffener has a ratio of the core stiffener thickness to the total thickness of the core in the range of 35% to 80%, the core is warped in the relationship between the coefficient of thermal expansion (CTE) and the thermal expansion coefficient of the core stiffener and the insulating layer The following equations may be satisfied with respect to the characteristics.

Equation

α ₁ : coefficient of thermal expansion of the core reinforcement (1 / k),

α _{2 is the} coefficient of thermal expansion of the insulating layer (1 / k),

E ₁ is the coefficient of thermal expansion (GPa) of the core reinforcing material,

E ₂ : Thermal expansion coefficient (GPa) of the insulating material.

On the other hand, another object of the present invention, the core reinforcing material provided with rigidity; Insulating layers formed on both surfaces of the core reinforcing material; A through hole formed through the insulating layer and the core reinforcement material; And a plating layer formed in the through hole for connecting the circuit layer formed on the insulating layer and the layer of the circuit layer.

And, the object of the present invention is to prepare a core reinforcement; Forming insulating layers on both sides of the core reinforcing material; Forming a through hole penetrating the core reinforcing material and the insulating layer; And forming a plating layer inside the through hole and forming a circuit layer on the surface of the insulating layer. It is achieved by providing a method for manufacturing a printed circuit board comprising a.

In addition, another object of the present invention, the insulating layer; A core reinforcing material laminated on both sides of the insulating layer; A through hole formed through the insulating layer and the core reinforcement material; And a circuit layer formed on the core reinforcing material.

And, the object of the present invention is the step of bonding the core reinforcing material on both sides of the insulating layer; Forming a seed layer on the core stiffener; Forming a plating resist layer having an opening for forming a circuit on the seed layer; Forming a plating layer in the opening for forming the circuit; And removing the plating resist layer to form a circuit layer, which is achieved by providing a method of manufacturing a printed circuit board.

As described above, the printed circuit board and the method of manufacturing the same according to the present invention are made of glass or non-conductive polymer material having rigidity, and the rigidity of the printed circuit board is maintained at a high temperature by interposing a film reinforcement material. Therefore, there is an advantage that can be prevented during the manufacturing process.

In addition, the present invention can improve the deflection because the rigidity of the core reinforcing material is maintained even if a thin printed circuit board is manufactured, there is an advantage that can improve the heat radiation characteristics in the vertical direction.

1 is a cross-sectional view of a first embodiment of a printed circuit board according to the present invention;
2 to 5 are cross-sectional views illustrating a method of manufacturing a printed circuit board according to the first embodiment.
2 is a cross-sectional view of the core reinforcement,
3A is a cross-sectional view of an insulation layer laminated on a core reinforcement material;
3B is a cross-sectional view with a coating interposed between the core reinforcing material and the insulating layer,
3C is a cross-sectional view of a metal thin film formed on an insulating layer;
4 is a cross-sectional view of the through-hole is formed,
5 is a cross-sectional view in which a circuit layer is formed in an insulating layer and a plating layer is formed in a through hole.
6 is a sectional view of a second embodiment of a printed circuit board according to the present invention;
7 to 12 are cross-sectional views illustrating a method of manufacturing a printed circuit board according to the second embodiment.
7 is a cross-sectional view of the core reinforcing material laminated on the insulating layer,
8 is a cross-sectional view of the through-hole is formed,
9 is a sectional view in which a seed layer is formed on the surface of the core reinforcement and the inner wall of the through hole,
10 is a sectional view in which a plating resist layer is formed,
11 is a cross-sectional view of the plating layer is formed,
12 is a cross-sectional view in which a circuit layer is formed.
13 is a cross-sectional view of a multilayer printed circuit board having a plurality of insulating layers and circuit layers built up on the printed circuit board according to an embodiment of the present invention.
14 is a simulation graph of the bending characteristics of a printed circuit board according to the first embodiment of the present invention and a conventional printed circuit board.
15 is a stiffness characteristic simulation graph for the printed circuit board of the first embodiment and the second embodiment according to the present invention;
16 is a bending characteristic simulation graph of the printed circuit board of the first embodiment and the second embodiment according to the present invention.

Matters relating to the operational effects including the technical configuration of the printed circuit board and the manufacturing method according to the present invention will be clearly understood by the following detailed description with reference to the drawings showing preferred embodiments of the present invention.

In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. As used herein, the terms "first", "second", and the like are used to distinguish one component from another component, and a component is not limited by the terms.

1st Example  Printed circuit board

First, Figure 1 is a cross-sectional view of a first embodiment of a printed circuit board according to the present invention.

As shown in FIG. 1, the printed circuit board 100 according to the present exemplary embodiment includes a core reinforcement 110 and a core C including an insulation layer 120 formed on both surfaces of the core reinforcement 110. It may be composed of a circuit layer 130 formed on the insulating layer 120.

In this case, the printed circuit board 100 includes a through hole 150 that passes through the core reinforcement 110 and the insulating layer 120 at the same time, and has an upper surface of the insulating layer 120 and the through hole 150. Inside the circuit layer 130 and the plating layer 140 may be formed.

A coating layer (not shown) may be further formed between the core reinforcement 110 and the insulating layer 120 to reinforce the adhesion of the insulating layer 120 on the surface of the core reinforcement 110. The coating layer may increase the adhesion between the core reinforcing material 110 and the insulating layer 120 by increasing the ionization -OH group by plasma treatment on the surface of the core reinforcing material 110, formed by the application of a coupling agent, etc. This can be ensured.

At this time, the coating layer is preferably formed to a thickness of about 2㎛ or less.

Here, the core reinforcement 110 may be made of glass or non-conductive polymer material. Glass in the form of plate may be used, and may be formed to a thickness of about 25 to 200㎛ in proportion to the overall thickness of the printed circuit board.

The reason for limiting the thickness of the glass used as the core reinforcement 110 to a thickness of 25 to 200 μm is that a predetermined warpage may be applied during the manufacturing process of the printed circuit board, and the glass has a thickness of 25 to 200 μm. This is because the radius of curvature can withstand up to 10 cm without being damaged.

When the glass is used as the core reinforcement 110, the glass is preferably applied to a glass material having a thermal conductivity of about 0.6 W / mK, more preferably 1.0 to prevent local thermal stress Glass materials having a thermal conductivity of W / mK or more may be used.

As such, when the glass material is used as the core reinforcing material 110, since the glass material has a high rigidity (Elastic Module) of 50 GPa or more, it is possible to prevent the warpage generated during the manufacturing process of the printed circuit board.

In addition, the core reinforcement 110 may be made of a non-conductive polymer material in the form of a film instead of glass.

The insulating layer 120 formed on both sides of the core reinforcement 110 may include a glass fabric of several strands to maintain the rigidity that can correspond to the bending separately from the core reinforcement (110).

In addition, the insulating layer 120 may be formed of an insulating sheet including a film type or glass fabric.

When the insulating layer 120 is formed of an insulating sheet, the insulating sheet is laminated on both surfaces of the core reinforcing material 110, and the insulating sheet is formed on the surface of the core reinforcing material 110 by compressing the upper surface of the insulating sheet by applying heat and pressure. Can be bonded.

The insulating layer 120 is illustrated as being formed on both sides of the core reinforcement 110 and described in detail, but is not limited thereto and may be formed only on one surface of the core reinforcement 110.

In addition, the core reinforcement 110 having the insulation layer 120 formed therein is formed with a through hole 150 penetrating through the insulation layer 120 and the core reinforcement 110. The plating layer is formed inside the through hole 150. 140 may be formed, and a circuit layer 130 may be formed on the insulating layer 120. The circuit layer 130 and the plating layer 140 may be formed by electric copper plating, and the circuit layer 130 formed on the insulating layer 120 constitutes a circuit pattern and is formed in the through hole 150. The plating layer 140 may be configured as an interlayer connection layer that electrically connects the circuit layer 130 formed on the insulating layer 120.

In addition, a thin metal thin film (not shown) of 2 μm or less may be further formed on the insulating layer 120. The metal thin film may be mainly composed of copper foil, and may be simultaneously formed when the insulating layer 120 is applied to the core reinforcement 110.

The metal thin film is used as a seed layer during the electroplating process for forming the circuit layer 130. The insulating layer 120 and the core reinforcement layer 110 may be laser processed to form the through hole 150. It should be formed to a thickness of 탆 or less. In addition, the metal thin film may be made of a material of carbon that is electrically conductive.

1st Example  Manufacturing method of printed circuit board

Meanwhile, the manufacturing method of the printed circuit board according to the present embodiment will be described with reference to FIGS. 2 to 5 as follows.

First, as shown in FIG. 2, the core reinforcement 110 is prepared. The core reinforcement 110 may be formed of a plate-shaped glass or a non-conductive polymer material, and in the case of a non-conductive polymer material, may be formed in a film form.

In this case, the core reinforcement 110 is preferably formed of a glass having a stiffness of 50 GPa or more and a thickness of 25 to 200 μm. When the thickness is maintained, the core reinforcement 110 is deformed with a predetermined radius of curvature during the manufacturing process of the printed circuit board. Can be returned to its original state without damage.

Next, as illustrated in FIG. 3A, the core C may be manufactured by forming the insulating layers 120 on both surfaces of the core reinforcement 110. The insulating layer 120 is formed by applying an insulating material on the core reinforcement 110, and an insulating material to which a glass fabric material is added may be applied.

In this case, as shown in FIG. 3B, the coating layer 115 may be further formed on one or both surfaces of the core reinforcement 110 before the insulating layer 120 is formed. The coating layer 115 is a thin insulating layer for enhancing adhesion between the core reinforcing material 110 and the insulating layer 120, and a polymer material may be mainly applied to improve the adhesion performance of the insulating layer 120. The coating layer 115 is preferably formed in about 2㎛, it is possible to increase the adhesion by increasing the -OH group by the plasma treatment on the surface of the core reinforcing material (110).

In addition, the coating layer 115 may be formed by applying a coupling agent or the like to the surface of the core reinforcing material 110 in addition to the surface plasma treatment of the core reinforcing material 110.

Next, as illustrated in FIG. 4, a through hole 150 penetrating the core reinforcement 110 and the insulating layer 120 may be formed. The through hole 150 may be mainly formed by laser processing, and the through hole 150 may be processed using a CO ₂ laser. As the through-hole 150 is formed of a core reinforcing material 110 and the insulating layer 120 of the insulating material by the laser irradiation to the inner wall surface of the through-hole 150 has a separate insulating substrate that prevents interlayer conduction as in the prior art There is no need to form, and as the through hole is formed only by laser processing, fine hole through hole processing may be possible.

Meanwhile, before forming the through hole in the core reinforcing material 110 and the insulating layer 120, a thin metal thin film 125 of about 2 μm or more is formed on the insulating layer 120 as shown in FIG. 3C. Can be. The metal thin film 125 is mainly can consist of a copper foil, a CO ₂ laser at a predetermined position are formed in the thickness of the thickness of the laser processing possible level (CO ₂ laser processing at a thickness of less than 5㎛ acceptable) Irradiation may be possible through the through hole 150 processing.

In this case, the metal thin film 125 formed on the insulating layer 120 other than the portion where the through hole 150 is formed may be used as a seed layer during copper plating for forming a circuit layer in a subsequent process.

Next, as shown in FIG. 5, the plating layer 140 and the circuit layer 130 may be formed on the inside of the through hole 150 and the upper surface of the insulating layer 120, respectively. The circuit layer 130 formed on the insulating layer 120 among the plating layer 140 and the circuit layer 130 may be configured as a circuit pattern, and the plating layer 140 formed in the through hole 150 may form a circuit pattern. It may be used as an interlayer connection layer for electrically connecting the circuit layer 130 on the insulating layer 120 to constitute.

The circuit layer 130 and the plating layer 140 may be formed by electroplating, and may be simultaneously formed on the top surface of the insulating layer 120 and the inside of the through hole 150.

Second Example  Printed circuit board

6 is a cross-sectional view of a second embodiment of a printed circuit board according to the present invention.

As shown, the printed circuit board 200 according to the present embodiment includes an insulating layer 210 and a core C and a core reinforcing material 220 formed on the insulating layer 210. It may be configured to include a circuit layer 270 formed on.

At this time, the insulating layer 210 may be composed of an insulating material including a glass fabric of several strands, such as the insulating layer applied to the printed circuit board of the first embodiment described above, and composed of an insulating sheet mixed with a film type or glass fabric May be

As shown in the figure, the insulating layer 210 may be attached to both sides of the core reinforcing material 220, but this is only one embodiment, the core reinforcing material 220 is attached only to one surface of the insulating layer 210 May be

The core reinforcing material 220 may be a glass having a rigidity of about 50 Gpa or more, and a thin plate-like glass may be laminated on the upper and lower surfaces of the insulating layer 210, respectively. In this case, the core reinforcement 220 may be made of a non-conductive polymer material instead of glass.

As such, when plate-shaped glass is employed as the core reinforcement 220 on both surfaces of the insulation layer 210 with the insulating layer 210 therebetween, the insulating layer 210 between the core reinforcement 220 serves as a shock absorber. By doing so, it is possible to prevent the core reinforcing material 220 from being damaged during the manufacturing process of the printed circuit board.

Here, although the insulating layer 210 stacked between the core reinforcing materials 220 is illustrated as being made of one layer, this is for explaining an embodiment, and it may be possible to form the insulating layer with two or more multilayers. have.

The circuit layer 270 may be formed in a predetermined pattern on the core reinforcing material 220, and the circuit layer 270 passes through the core reinforcing material 220 and the insulating layer 210 as in the first embodiment. The interlayer connection of the circuit layer 270 formed on the core reinforcement 220 may be made by the plating layer 260 filled in the formed through hole 250.

The circuit layer 270 may be formed by a plating layer on the core reinforcing material 220. When forming a plating layer for forming the circuit layer 270, the seed layer 230 is first formed, and then a plating layer is formed, and the plating layer is patterned. The circuit layer 270 can be formed by this. In this case, the seed layer 230 may be formed of the first seed layer 230a and the second seed layer 230b.

The seed layer 230 including the first seed layer 230a and the second seed layer 230b includes titanium (Ti), copper (Cu), molybdenum (Mo), nickel (Ni), silver (Ag), and zinc. It may be made of any one selected from the group consisting of conductive metal materials such as (Zn), carbon (C) or alloys thereof.

In addition, the seed layer 230 and the circuit layer 270 is preferably composed of copper (Cu) in consideration of cost and process advantages.

The printed circuit board 200 according to the present embodiment configured as described above has a smooth circuit layer 270 formed on the core reinforcement 220 because the core reinforcement 220 centered on the insulating layer 210 is formed of plate glass. By being formed on the surface, there is no roughness at the interface between the core reinforcing material 220 and the circuit layer 270, thereby reducing noise of the signal and facilitating the implementation of the circuit layer 270 having an ultra fine pitch.

Since the circuit layer 270 has a smooth surface, that is, the surface roughness is small, the etching amount for forming the circuit layer is reduced, and the amount of loss in the circuit formation is reduced, so that the ultra fine pitch can be formed, and the signal noise can be significantly reduced.

Second Example  Manufacturing method of printed circuit board

Next, FIGS. 7 to 12 are process cross-sectional views sequentially illustrating a method of manufacturing a printed circuit board according to a second embodiment of the present invention.

First, as shown in FIG. 7, the core C may be manufactured by attaching the core reinforcement 220 to the upper and lower surfaces of the insulating layer 210. In this case, the insulating layer 210 may be made of an insulating material impregnated with a glass fabric made of a polymer material having heat resistance, and may be made of an insulating sheet having a film type or a mixed glass fabric. In addition, it is possible to prevent the core reinforcing material 220 from being damaged by impact or warp by absorbing the impact generated during the process of the insulating layer 210 stacked between the core reinforcing materials 220.

The manufacturing of the core C may include stacking the core reinforcement 220 on both sides of the insulation layer 210, and sequentially stacking the core reinforcement 220 and the insulation layer 210, heating, and pressing the insulation. Bonding the core reinforcement 220 to both sides of the layer 210 may be further included.

Next, as shown in FIG. 8, a through hole 250 penetrating the core C in which the insulating layer 210 and the core reinforcing material 220 are stacked may be formed. The through hole 250 may be formed by laser drilling, and typically, a CO ₂ laser, a YAG laser, or a pulsed UV excimer laser may be applied.

Meanwhile, after the forming of the through hole 250 in the core C, the method may further include cleaning the surface of the core C on which the through hole 250 is formed and the inner wall of the through hole 250. In this case, the cleaning of the core C surface and the inner wall of the through hole 250 is not limited to any one process, but dry etching or wet etching may be applied, and may be performed by a desmear process. Among the dry etching process, plasma etching, sputter etching or ion etching may be used.

Next, as illustrated in FIG. 9, the seed layer 230 may be formed on the surface of the core C including the inner wall of the through hole 250. The seed layer 230 is intended to facilitate plating layer growth when forming a plating layer for forming the circuit layer 270 in a subsequent process, and may be mainly formed through a sputtering method. The seed layer 230 may be formed by dividing the first seed layer 230a and the second seed layer 230b in some cases, and may include titanium (Ti), aluminum (Al), copper (Cu), and molybdenum. (Mo), nickel (Ni), silver (Ag), zinc (Zn), carbon (C) or an alloy thereof may be made of any one selected from the group consisting of.

Thereafter, as shown in FIG. 10, the plating resist layer 240 having the opening 241 for forming a circuit may be formed on the seed layer 230. The plating resist layer 240 may be formed using a photoresist using a photosensitive polymer, and the opening 241 for forming a circuit may be formed using a mask after application of the photoresist. In this case, the opening 241 for forming a circuit of the plating resist layer 240 may be formed according to a circuit pattern design specification.

Next, as shown in FIGS. 11 and 12, the plating layer 260 is formed on the core reinforcing material 220 having the plating resist layer 240 formed thereon, and the plating resist layer 240 is removed to form the circuit layer 270. Can be formed.

Here, the plating process of forming the plating layer 260 on the core reinforcing material 220 may be made by electrolytic plating, and the plating layer 260 is preferably composed of copper (Cu). In addition, the removing of the plating resist layer 240 may be performed through a mechanical peeling process using a mechanical peeling or a chemical solution.

As illustrated in FIG. 13, the printed circuit boards 100 and 200 of the first and second embodiments configured as described above have an insulating layer 210 formed on both surfaces of the core reinforcing material 220 or the insulating layer 210. The build-up process may be followed by successive stacking of the second insulating layer 210 and the circuit layer 270 on the upper and lower surfaces of the core C having the core reinforcing material 220 laminated on both surfaces thereof. have.

13 is a cross-sectional view of a multilayer printed circuit board having a plurality of insulating layers and circuit layers built up on the printed circuit board according to an embodiment of the present invention.

The multilayer printed circuit board 300 shown in FIG. 13 is formed on the upper and lower surfaces of the core C on which the insulating layer 210 and the core reinforcement 220 are stacked after fabrication of the printed circuit boards shown in FIGS. 1 and 6. Each of the second insulating layer 310 made of a material such as prepreg (PPG) may be stacked, and a circuit layer 320 may be formed on the second insulating layer 310. Via holes 330 are formed in the second insulating layer 310 stacked on the core C to form the circuit layer 270 formed on the core C and the circuit layer 270 formed on the second insulating layer 310. The conductive layer may be connected to each other so that the interlayer connection may be made. The solder resist layer 340 may be formed on the second insulating layer 310 to protect and expose the second insulating layer 310 and the circuit layer 270. Can be.

Printed circuit board Example  Stiffness and Flexural Characteristics

The printed circuit board according to the present invention constructed as described above is manufactured through the above-mentioned manufacturing process, and a conventional printed circuit board, that is, a printed circuit board manufactured by using an insulation layer formed only of an insulating material without using a core reinforcement material, and the present invention. Applying a predetermined heat to the printed circuit board according to the invention and looking at the coefficient of thermal expansion is simulated as shown in Figure 14 shown below.

FIG. 14 is a graph illustrating a bending characteristic simulation of a printed circuit board according to a first embodiment of the present invention and a conventional printed circuit board. As illustrated, a conventional printed circuit board having a prepreg material interposed between insulating layers is used. While the thermal expansion coefficient, which is a force that causes warpage, increases rapidly, the warpage is greatly generated during the manufacturing process of the substrate, while the printed circuit board according to the present invention does not significantly change the thermal expansion rate at low or high temperatures. It can be seen that the warpage is minimized during the manufacturing process of the printed circuit board because it is maintained at a low level. That is, the printed circuit board according to the present invention has excellent rigidity as the glass core reinforcing material is inserted between the insulating layer surface or the insulating layer constituting the core, the degree of application during the manufacturing process of the printed circuit board changes in temperature and humidity It is possible to minimize the warpage due to.

On the other hand, the printed circuit board of the present invention having the technical features of the above-mentioned embodiments has a core compared to the total thickness of the core consisting of an insulating layer and a core reinforcement in order to implement the improved rigidity and bending characteristics of the core compared to the conventional printed circuit board It is desirable for the reinforcement to have a proportion in the range of 35% to 80%. This can be applied to both the core configuration employed in the printed circuit board (FIG. 1) of the first embodiment and the printed circuit board (FIG. 6) of the second embodiment described above.

Further, in each embodiment, when the following Equation 1 is satisfied in the relationship between the coefficient of thermal expansion (CTE) and the coefficient of thermal expansion of the core reinforcing material constituting the core and the insulating layer, it is possible to implement improved bending characteristics of the core compared to the conventional printed circuit board. have.

Where α ₁ : coefficient of thermal expansion of the core reinforcing material (1 / k),

α _{2 is the} coefficient of thermal expansion of the insulating layer (1 / k),

E ₁ is the coefficient of thermal expansion (GPa) of the core reinforcing material,

E ₂ : Thermal expansion coefficient (GPa) of the insulating material.

Here, the reason for limiting the ratio of the core reinforcement to the lowest 35% of the total thickness of the core is that the bending property of the core can be improved when the composition ratio of the core reinforcement is 35% or more than the core structure in the conventional substrate, up to 80 The reason for limiting to the% or less is that the thickness of the insulating layer except for the core reinforcement in the core can be manufactured up to 10 μm. When the thickness of the insulating layer is formed thinner, cracks may occur in the core, Breakage of the core may occur.

Therefore, the core reinforcement in the overall thickness of the core through the above equation to have a range of 35% to 80%, while the insulation layer surrounding the core reinforcement and the core reinforcement is a variety of materials, that is, PPG, ABF, PI or primer (primer) ) Into an insulating layer composed of any one of PPG, ABF, PI, or primer, and an insulating layer impregnated with a glass cloth or filler in the insulating material of 6.492 × If the range of 10 to 4.463 × 10 / GPa · k is satisfied, it means that the core is effective in improving warpage.

As such, when the ratio of the core reinforcing material to the thickness of the entire core and the condition of the above equation are satisfied, as shown in FIG. 15 or FIG. 16, the rigidity and the bending property of the core may be satisfied.

15 is a stiffness characteristic simulation graph of the printed circuit board of the first embodiment and the second embodiment according to the present invention, Figure 16 is a bending characteristic of the printed circuit board of the first embodiment and the second embodiment according to the present invention Simulation graph.

As shown in the graph, referring to FIGS. 15 and 16, the first and second embodiments of the above-described printed circuit board are compared to the total thickness of the core compared to the core of the conventional printed circuit board (mainly CCL). When the ratio of the reinforcing material occupies 35% or more, both the stiffness and the bending property are improved, and when the ratio of the core reinforcing material to the total thickness of the core is 35% or more in each embodiment, the ratio of the second embodiment to the printed circuit board of the first embodiment It can be seen that the printed circuit board may have about 2.5 times stronger rigidity, and the printed circuit board of the second embodiment exhibits a finer bending effect than the printed circuit board of the first embodiment.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It will be understood that the invention may be varied and varied without departing from the scope of the invention.

100, 200, 300. Printed Circuit Board
110, 220. Core reinforcement
120, 210. Insulation layer
130, 270. Circuit layer
150, 250.Through Hole

Claims (38)

A core in which an insulating layer and a core reinforcement are laminated alternately;
And a printed circuit board.
The method of claim 1,
The core is a printed circuit board, the core reinforcing material is interposed between the insulating layer.
The method of claim 1,
The core is a printed circuit board in which the core reinforcing material is laminated on both sides of the insulating layer.
The method of claim 1,
The core reinforcing material is a printed circuit board made of a plate-like glass material.
The method of claim 1,
The core reinforcing material is a printed circuit board composed of a film form of a non-conductive polymer material.
The method according to claim 2 or 3,
The core reinforcing material is a printed circuit board formed to a thickness of 25 to 200㎛.
The method of claim 3,
The insulating layer is a printed circuit board composed of a plurality of insulating layers.
The method of claim 1,
The core reinforcing member, the ratio of the thickness of the core reinforcing material to the total thickness of the core has a range of 35% to 80%.
The method of claim 1,
And the core satisfies the following equation for the bending property in the relationship between the coefficient of thermal expansion (CTE) and the coefficient of thermal expansion of the core reinforcing material, the insulating layer.
Equation

Where α ₁ : coefficient of thermal expansion of the core reinforcing material (1 / k),
α ₂ : coefficient of thermal expansion of the insulating layer (1 / k),
E ₁ : coefficient of thermal expansion (GPa) of the core reinforcement,
E ₂ : Thermal expansion coefficient (GPa) of an insulating material.
Core reinforcement provided with rigidity;
Insulating layers formed on both surfaces of the core reinforcing material;
A through hole formed through the insulating layer and the core reinforcement material; And
A plating layer formed in the through hole for connecting the circuit layer formed on the insulating layer and the layer between the circuit layer;
And a printed circuit board.
11. The method of claim 10,
The printed circuit board further comprising a coating layer on the surface of the core reinforcing material between the core reinforcing material and the insulating layer.
12. The method of claim 11,
The coating layer is a printed circuit board formed to a thickness of 2㎛ or less.
11. The method of claim 10,
The core reinforcing material is a printed circuit board consisting of a film on the plate glass or non-conductive polymer material.
11. The method of claim 10,
The insulating layer is a printed circuit board composed of an insulating material impregnated with a glass fabric.
11. The method of claim 10,
The core reinforcing material is a printed circuit board formed to a thickness of 25 to 200㎛.
11. The method of claim 10,
And a ratio of the thickness of the core reinforcement to the thickness of the core reinforcement and the insulation layer is in a range of 35% to 80%.
Preparing a core reinforcement;
Forming insulating layers on both sides of the core reinforcing material;
Forming a through hole penetrating the core reinforcing material and the insulating layer; And
Forming a plating layer on the inside of the through hole and forming a circuit layer on the surface of the insulating layer; And a step of forming the printed circuit board.
18. The method of claim 17,
The core reinforcing material is a manufacturing method of a printed circuit board consisting of a film of glass or non-conductive polymer material on the plate provided with rigidity.
18. The method of claim 17,
Prior to forming the insulating layer,
And forming a coating layer on one or both surfaces of the core reinforcing material.
20. The method of claim 19,
The coating layer is a manufacturing method of a printed circuit board having a thickness of 2㎛ or less.
18. The method of claim 17,
Before forming the through hole,
Forming a metal thin film on the insulating layer; manufacturing method of a printed circuit board further comprising.
22. The method of claim 21,
The metal thin film is a method of manufacturing a printed circuit board is formed at the same time as the insulating layer is formed on the surface of the core reinforcing material.
18. The method of claim 17,
The plating layer is formed by electroplating, and is formed simultaneously with the plating layer for forming the circuit layer formed on the insulating layer upper surface printed circuit board manufacturing method.
Insulating layer;
A core reinforcing material laminated on both sides of the insulating layer;
A through hole formed through the insulating layer and the core reinforcement material; And
Printed circuit board comprising a; circuit layer formed on the core reinforcing material.
25. The method of claim 24,
The insulating layer is a printed circuit board formed of a plurality of insulating layers.
25. The method of claim 24,
And a ratio of the thickness of the core reinforcement to the thickness of the insulation layer and the core reinforcement in a range of 35% to 80%.
25. The method of claim 24,
The core reinforcing material is a printed circuit board consisting of a film on the plate glass or non-conductive polymer material.
25. The method of claim 24,
The insulating layer is a printed circuit board composed of an insulating material impregnated with a glass fabric.
25. The method of claim 24,
The circuit layer, the seed layer formed on the core reinforcing material; And
A plating layer formed on the seed layer; And a printed circuit board.
30. The method of claim 29,
The seed layer is made of a conductive metal material such as titanium (Ti), copper (Cu), molybdenum (Mo), nickel (Ni), silver (Ag), zinc (Zn), carbon (C), or an alloy thereof. The printed circuit board is any one selected from.
Bonding the core reinforcement to both sides of the insulating layer;
Forming a seed layer on the core stiffener;
Forming a plating resist layer having an opening for forming a circuit on the seed layer;
Forming a plating layer in the opening for forming the circuit; And
Removing the plating resist layer to form a circuit layer.
32. The method of claim 31,
Bonding the core reinforcement to the insulating layer,
Disposing a core reinforcement on both sides of the insulating layer; And
Bonding the insulation layer and the core reinforcement on the core reinforcement through a heating process and a pressing process.
32. The method of claim 31,
Prior to forming the seed layer,
And processing a through hole penetrating through the insulating layer and the core reinforcement.
34. The method of claim 33,
After the step of processing the through hole,
And cleaning the surface of the core reinforcing material and the inner wall of the through hole.
32. The method of claim 31,
The core reinforcing material is a manufacturing method of a printed circuit board consisting of a film of glass or non-conductive polymer material on the plate provided with rigidity.
35. The method of claim 34,
The cleaning step,
A method of manufacturing a printed circuit board carried out by dry etching or wet etching.
The method of claim 10 or 24,
The printed circuit board satisfies the following equation for the bending property in the relationship between the coefficient of thermal expansion (CTE) and the coefficient of thermal expansion of the core reinforcing material, the insulating layer.
Equation

Where α ₁ : coefficient of thermal expansion of the core reinforcing material (1 / k),
α ₂ : coefficient of thermal expansion of the insulating layer (1 / k),
E ₁ : coefficient of thermal expansion (GPa) of the core reinforcement,
E ₂ : Thermal expansion coefficient (GPa) of an insulating material.
The method according to claim 1 or 10 or 24,
A second insulating layer is laminated on the upper and lower surfaces of the core in which the insulating layer and the core reinforcing material are alternately stacked, and a circuit layer is formed on the second insulating layer to build up the via hole formed in the second insulating layer. The conductive circuit of the circuit layer is made through, the printed circuit board formed with a solder resist layer on the second insulating layer.

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