TWI595811B - Printed circuit board and method for manufacturing the same - Google Patents

Description

Printed circuit board and method of manufacturing same

The present invention relates to a printed circuit board and a method of fabricating the same.

In recent years, with the thinning of the thickness of the portable device, it has been continuously thinned by a circuit board having a plurality of electronic components mounted thereon, and the electronic components mounted on the portable device are thinned. Try to reduce the thickness of all internal components.

In particular, when a circuit board having an electronic component mounted thereon is manufactured in a thin plate type, the circuit board is exposed to a high temperature environment during the manufacturing process of the circuit board or the reflow process when the electronic component is mounted, and the circuit The board is repeatedly subjected to high temperature processing or cooling, so that the board may be warped due to the nature of its material.

In order to prevent the warpage of the board, it is constantly trying to reduce the difference in coefficient of thermal expansion (CTE) between the original materials to improve the rigidity of the original material used in the manufacturing process of the board, and improve the back. Warpage caused by the difference in thermal expansion coefficients during the welding process. Therefore, the need for its technological development has increased.

In addition, as a circuit in the manufacturing process, by improving the circuit The physical structure of the board to avoid warping of the board, in order to increase the rigidity of the board core material, a method of further inserting a metal reinforcing material into the board has been examined; however, since the reinforcing material is a metal material, it is necessary A specific portion of the metal reinforcing material is removed in advance to form a via or the like.

However, in order to form a perforation or the like among a metal reinforcing material, a metal core material or the like, the metal reinforcing material must be removed by an etching treatment or a laser. In this case, it is necessary to perform a process of providing a separate carrier, forming an insulating layer on the metal reinforcing material on the carrier, and removing the carrier to perform processing of the metal reinforcing material. This may result in an increase in board manufacturing costs.

Further, in the prior art example using the metal reinforcing material, in order to prevent the through hole from contacting the metal reinforcing material, a part of the metal reinforcing material is removed in advance at a position where the through hole passes, and then in the through hole. An insulating layer is formed on the surface, but it may be difficult to form a fine pitch through hole when forming circuit wiring.

Related documents: Japanese Patent Application Publication No. 2004-193295

An object of the present invention is to provide a printed circuit board for preventing the occurrence of warpage.

Another object of the present invention is to provide a method of manufacturing a printed circuit board that minimizes the occurrence of warpage of the board during the manufacturing process of the printed circuit board.

According to an exemplary embodiment of the present invention, a printed circuit is proposed The board, the printed circuit board includes a core having an insulating layer and a core reinforcing material alternately laminated in the core.

The core may have a configuration in which a core reinforcing material is interposed between the insulating layers, and a pattern in which the core reinforcing material is laminated on both surfaces of the insulating layer.

The core reinforcing material can be made of a plate-shaped glass material and can be formed in a film form of a non-conductive polymer material.

The ratio of a part of the thickness of one of the core reinforcing materials to the total thickness of the core may range from 35% to 80%, and the core may satisfy the following equation of warpage characteristics, and the equation of the warping characteristic describes the core reinforcing The coefficient of thermal expansion between the material and the insulating layer is related to the modulus of elasticity.

Among them, α ₁ is the thermal expansion coefficient (1/k) of the core reinforcing material, α ₂ is the thermal expansion coefficient (1/k) of the insulating layer, and E ₁ is the elastic modulus (GPa) of the core reinforcing material, E ₂ It is the elastic modulus (GPa) of the insulating layer.

According to another exemplary embodiment of the present invention, a printed circuit board is provided, comprising a rigid core reinforcing material, an insulating layer, a consistent through hole, a circuit layer and a plating layer, and the insulating layer is formed on two surfaces of the core reinforcing material The through hole is formed through the insulating layer and the core reinforcing material, the circuit layer is formed on the insulating layer, and the plating layer is formed in the through hole to realize the interlayer connection of the circuit layer.

According to another exemplary embodiment of the present invention, a printed circuit is proposed The manufacturing method of the board comprises: preparing a core reinforcing material; forming an insulating layer on the two surfaces of the core reinforcing material; forming a uniform perforation, penetrating the core reinforcing material and the insulating layer; and forming a plating layer in the through hole, and forming a The circuit layer is on one surface of the insulating layer.

According to another exemplary embodiment of the present invention, a printed circuit is proposed The plate comprises an insulating layer, a core reinforcing material, a consistent perforation and a circuit layer. The core reinforcing material is laminated on the two surfaces of the insulating layer, the through hole is formed through the insulating layer and the core reinforcing material, and the circuit layer is formed on the core reinforcing On the material.

According to another exemplary embodiment of the present invention, a printed circuit is proposed The manufacturing method of the board comprises: bonding a core reinforcing material to two surfaces of an insulating layer; forming a sub-layer on the core reinforcing material; forming a resist plating layer, the resist plating layer having an opening to form a circuit layer on the seed layer Forming a plating layer in the opening to form the circuit layer; and forming a circuit layer by removing the plating resist.

100‧‧‧Printed circuit board

110‧‧‧core reinforcing material

115‧‧‧ Coating

120‧‧‧Insulation

125‧‧‧Metal film

130‧‧‧ circuit layer

140‧‧‧Electroplating

150‧‧‧through holes

200‧‧‧Printed circuit board

210‧‧‧Insulation

220‧‧‧ core reinforcement

230‧‧‧ seed layer

230a‧‧‧first seed layer

230b‧‧‧Second seed layer

240‧‧‧resist plating

250‧‧‧through holes

260‧‧‧ plating

270‧‧‧ circuit layer

300‧‧‧Multilayer printed circuit boards

310‧‧‧Insulation

320‧‧‧ circuit layer

330‧‧‧through hole

340‧‧‧solder layer

C‧‧‧ core

Figure 1 is a cross-sectional view of a printed circuit board in accordance with a first exemplary embodiment of the present invention.

2 to 5 are cross-sectional views showing respective steps of a method of manufacturing a printed circuit board according to a first exemplary embodiment of the present invention.

Figure 2 is a cross-sectional view of a core reinforcing material.

Fig. 3A is a cross-sectional view showing a structure in which an insulating layer is laminated on a core reinforcing material.

Figure 3B is a structure in which one of the coatings is interposed between the core reinforcing material and the insulating layer Sectional view.

Fig. 3C is a cross-sectional view showing a structure in which a metal thin film is formed on an insulating layer.

Fig. 4 is a cross-sectional view showing a structure in which a uniform perforation is formed.

Fig. 5 is a cross-sectional view showing a structure in which a circuit layer is formed on an insulating layer and a plating layer is formed in the through hole.

Figure 6 is a cross-sectional view showing a printed circuit board in accordance with a second embodiment of the present invention.

7-12 are cross-sectional views showing respective steps of a method of manufacturing a printed circuit board according to a second exemplary embodiment of the present invention.

Figure 7 is a cross-sectional view showing a structure in which a core reinforcing material is laminated on an insulating layer.

Fig. 8 is a cross-sectional view showing a structure in which a uniform perforation is formed.

Fig. 9 is a cross-sectional view showing a structure in which a seed layer is formed on one surface of a core reinforcing material and an inner wall of one of the through holes.

Fig. 10 is a cross-sectional view showing a structure in which a plating resist is formed.

Figure 11 is a cross-sectional view showing a structure in which a plating layer is formed.

Figure 12 is a cross-sectional view showing a structure in which a circuit layer is formed.

Figure 13 is a cross-sectional view of a multilayer printed circuit board in which a plurality of insulating layers and a plurality of circuit layers are formed on a printed circuit board according to an exemplary embodiment of the present invention.

Figure 14 is a simulation diagram of warpage characteristics of a printed circuit board according to a first exemplary embodiment of the present invention and a printed circuit board according to the prior art.

Figure 15 is a perspective view showing the rigidity of a printed circuit board according to a first exemplary embodiment of the present invention and a second exemplary embodiment of the present invention.

Figure 16 is a printed circuit board and according to a first exemplary embodiment of the present invention A simulation diagram of the warpage characteristics of the printed circuit board of the second exemplary embodiment of the present invention.

The effects and technical configurations associated with aspects of a printed circuit board and method of fabricating the same according to the present invention will be apparent from the following description of the exemplary embodiments of the invention.

Further, when it is determined that the detailed description of the related art related to the present invention may obscure the gist of the present invention, the portions detailed therein will be omitted. In this specification, terms such as "first" and "second" are used to distinguish one element from another, and these elements are not limited by the above terms.

First exemplary embodiment: printed circuit board

First, Fig. 1 is a cross-sectional view of a printed circuit board according to a first exemplary embodiment of the present invention.

As shown in FIG. 1, a printed circuit board 100 according to a first exemplary embodiment of the present invention may include a core reinforcing member 110, a core C and a circuit layer 130, and the core C includes a surface formed on the surface of the core reinforcing member 110. The insulating layer 120 and the circuit layer 130 are formed on the insulating layer 120.

In this embodiment, a uniform through hole 150 is provided in the printed circuit board 100. The through hole 150 penetrates the core reinforcing material 110 and the insulating layer 120 at the same time, and the circuit layer 130 can be formed on the insulating layer 120. A plating layer 140 can be formed through the through hole. Hole 150.

A coating (not shown) may be further disposed on the core reinforcing material 110 Between the insulating layer 120 and the insulating layer 120, the adhesion between the surface of one of the reinforcing core members 110 and the insulating layer 120 is used. The coating may be subjected to a plasma treatment on the surface of the core reinforcing material 110 to add an ionization-OH group to improve the adhesion between the core reinforcing material 110 and the insulating layer 120. It is formed by coating a coupling agent and the like to ensure adhesion between the core reinforcing member 110 and the insulating layer 120.

In this case, the coating layer may preferably be formed to a thickness of about 2 microns or less.

Here, the core reinforcing material 110 may be a glass or a non-conductive polymer material. In the case of glass, a sheet of glass is used and formed to a thickness of about 25 to 200 microns relative to the total thickness of the printed circuit board.

The reason for limiting the thickness of the glass as the core reinforcing material 110 to 25 to 200 μm may occur during the manufacture of the printed circuit board due to a predetermined warpage, and when the radius of curvature of the core reinforcing material is 10 cm. Or lower, in the case where the thickness of the glass in the core reinforcing material is 25 to 200 μm, the core reinforcing material can surely avoid damage.

When glass is used as the core reinforcing member 110, a glass material having a thermal conductivity of about 0.6 W/mK can be preferably used, and more preferably, a glass material having a thermal conductivity of 1.0 W/mK or higher can be used. Avoid local thermal stresses.

Therefore, when a glass material is used as the core reinforcing member 110, since the glass material has a high elastic modulus of 50 GPa or more, warpage can be prevented from occurring in the process of manufacturing a printed circuit board.

In addition, the core reinforcing material 110 can also be a non-conductive polymer material. The film is formed to replace the glass.

The insulating layer 120 formed on the surfaces of the core reinforcing members 110 may include a plurality of glass fiber structures to maintain the elastic modulus and to limit the warpage of the core reinforcing members 110, respectively.

Therefore, the insulating layer 120 may be formed in a film type or an insulating sheet containing a glass fiber structure.

When the insulating layer 120 is formed of an insulating sheet, the insulating sheet is laminated on both surfaces of the core reinforcing member 110, and the insulating sheet can be bonded to the core reinforcing member by heating and pressing the upper surface of the insulating sheet to press the insulating sheet. The surface of the material 110.

The exemplary embodiment of the present invention describes that the insulating layer 120 is formed on both surfaces of the core reinforcing member 110, but is not limited thereto. Therefore, the insulating layer 120 may be formed only on one surface of the core reinforcing material 110.

In addition, the through hole 150 is provided to the core reinforcing material 110 formed with the insulating layer 120. The through hole 150 penetrates through the insulating layer 120 and the core reinforcing material 110, and the plating layer 140 may be formed in the through hole 150, and the circuit layer 130 may be formed on On the insulating layer 120. The circuit layer 130 and the plating layer 140 may be formed by electrolytic copper plating, and the circuit layer 130 formed on the insulating layer 120 may form a circuit pattern, and the plating layer 140 formed in the through hole 150 may be formed as An interlayer connection layer electrically connects the circuit layer 130 formed on the insulating layer 120.

Further, a thin metal film (not shown) having a thickness of 2 μm or less may be further formed on the insulating layer 120. The metal thin film may be formed mainly of a copper foil, and may be formed while coating the insulating layer 120 on the core reinforcing material 110.

The metal film is used for electrolytic copper plating to form the circuit layer 130. As a seed layer, and the metal thin film must be formed with a thickness of 2 μm or less, laser processing can be performed to form the through hole 150 penetrating the insulating layer 120 and the core reinforcing material 110. Further, the metal film can be made of a conductive carbon material.

First Exemplary Embodiment: Method of Manufacturing Printed Circuit Board

Meanwhile, a method of manufacturing a printed circuit board according to an exemplary embodiment of the present invention will be described below with reference to FIGS. 2-5.

First, as shown in Fig. 2, a core reinforcing material 110 is prepared. The core reinforcing material 110 may be a plate glass or a non-conductive polymer material. In the example of the non-conductive polymer material, the core reinforcing material can be formed in a film form.

Here, in the example of the glass, the core reinforcing material 110 preferably has an elastic modulus of 50 GPa or more, and the core reinforcing material 110 is formed with a thickness of one of 25 to 200 μm when the thickness of the reinforcing core reinforcing material 110 is fixed. At the time of manufacture of the printed circuit board, the core reinforcing material can be deformed by a predetermined radius of curvature, and then can be returned to the original state without being damaged.

Next, as shown in FIG. 3A, the core C can be fabricated by forming the insulating layer 120 on both surfaces of the core reinforcing member 110. The insulating layer 120 is formed by coating an insulating material on the core reinforcing member 110. For example, an insulating material added to the fiberglass structure material may also be applied to the core reinforcing member 110.

In this case, as shown in FIG. 3B, before the step of forming the insulating layer 120, the coating layer 115 is further formed on one surface or both surfaces of the core reinforcing member 110. The coating 115 is a thin insulating layer for reinforcing the core reinforcing material 110 and the insulating layer The adhesion between the 120 and the coating 115 is mainly coated with a polymer material to improve the adhesion of the insulating layer 120. The coating 115 is preferably formed to a thickness of about 2 microns or less, and the coating 115 can be increased in viscosity by plasma treatment on the surface of the core reinforcing member 110 to enhance adhesion.

Further, the coating layer 115 can be formed by coating a coupling agent and the like in addition to the plasma treatment on the surface of the core reinforcing member 110.

Next, as shown in FIG. 4, a through hole 150 penetrating the core reinforcing material 110 and the insulating layer 120 can be formed. The through holes 150 can be formed primarily by laser processing and processed using a CO ₂ laser. When the core reinforcing member 110 and the insulating layer 120 made of an insulating material are formed by laser irradiation, as in the prior art, it is not necessary to form a separate insulating substrate for preventing interlayer conduction on the inner wall surface of the through hole 150. And since the through holes are formed only by laser processing, the through holes 150 having a fine pitch can be processed.

Meanwhile, as shown in FIG. 3C, a thin metal thin film 125 having a thickness of about 2 μm may be further formed on the insulating layer 120 before the step of forming the through holes in the core reinforcing material 110 and the insulating layer 120. The metal film 125 may be mainly formed of a copper foil, and since the metal film 125 is formed thick enough to perform laser processing (CO ₂ laser processing at a thickness of 5 μm or less), the through hole 150 may be CO ₂ laser irradiation is applied.

In this case, when the circuit layer is formed by copper plating in the subsequent process, the metal thin film 125 formed on the insulating layer 120 may serve as a sub-layer in addition to the portion forming the through hole 150.

Next, as shown in FIG. 5, the plating layer 140 may be formed in the through hole In 150, the circuit layer 130 may be formed on the insulating layer 120. In the plating layer 140 and the circuit layer 130, the circuit layer 130 formed on the insulating layer 120 may form a circuit pattern, and the plating layer 140 formed in the through hole 150 may be formed as an interlayer connection layer, and the electrical connection is formed on A circuit layer 130 of a circuit pattern is formed on the insulating layer 120.

The circuit layer 130 and the plating layer 140 may be formed by electrolytic copper plating, and It can be simultaneously formed on the insulating layer 120 and in the through hole 150.

Second exemplary embodiment: printed circuit board

Meanwhile, FIG. 6 is a printing according to a second exemplary embodiment of the present invention. A cross-sectional view of the board.

As shown in FIG. 6, the printing according to the second exemplary embodiment of the present invention The circuit board 200 can include an insulating layer 210, a core C, and a circuit layer 270. The core C includes a core reinforcing material 220 formed on the insulating layer 210, and the circuit layer 270 is formed on the core C.

In this case, as described above, coated in accordance with the present invention first In the insulating layer on the printed circuit board of the exemplary embodiment, the insulating layer 210 may be made of an insulating material including a plurality of glass fiber structures, and may be formed of a film type or an insulating sheet in which a glass fiber structure is mixed.

As shown in FIG. 6, the core reinforcing material 220 may be bonded to the insulating layer 210 On the second surface, which is only one of the exemplary embodiments, the core reinforcing material 220 may also be bonded only to one surface of the insulating layer 210.

A glass having an elastic modulus of about 50 GPa or more can be used as the glass The core reinforcing material 220 and the thin plate glass may be laminated on the upper and lower surfaces of the insulating layer 210, respectively. Further, the core reinforcing material 220 may be formed in a film form of a non-conductive polymer material instead of glass.

As described above, when the core material 220 of the sheet glass is formed When the surface of the edge layer 210 is on the surface with the insulating layer 210 therebetween, the insulating layer 210 between the core reinforcing members 220 serves to absorb the impact, thereby preventing the core reinforcing material 220 from being damaged during the manufacturing process of the printed circuit board.

Here, FIG. 6 illustrates the insulation laminated between the core reinforcing members 220. Layer 210 is a single layer structure that is only used to describe an exemplary embodiment. Therefore, the insulating layer can be formed in a multilayer structure of at least two layers.

The circuit layer 270 may be formed on the core reinforcing material 220 in a predetermined pattern. And similar to the first exemplary embodiment of the present invention, the circuit layer 270 formed on the core reinforcing material 220 can achieve interlayer connection by the plating layer 260 filled in the through hole 250, wherein the through hole 250 is It is formed through the core reinforcing material 220 and the insulating layer 210.

The circuit layer 270 may be formed on the core reinforcing material 220 by a plating layer, and when the plating layer is formed to form the circuit layer 270, the seed layer 230 is formed first, and then a plating layer may be formed, and the circuit layer 270 may be formed by plating The pattern to form. In this case, the seed layer 230 may be formed of a first seed layer 230a and a second seed layer 230b.

The seed layer 230 includes a first seed layer 230a and a second seed layer 230b, and the seed layer 230 may be selected from titanium (Ti), copper (Cu), molybdenum (Mo), nickel (Ni), Any of a group consisting of silver (Ag), zinc (Zn), and carbon (C), and the like, or an alloy thereof.

In addition, taking into account the advantages of cost, process, etc., seed layer 230 The circuit layer 270 can be made of copper.

Printed circuit board formed in accordance with an exemplary embodiment of the present invention 200, since the core reinforcing material 220 on the insulating layer 210 is made of plate glass, the circuit layer 270 formed on the core reinforcing material 220 is formed on a smooth surface so that the core reinforcing material 220 and the circuit layer 270 are located. The surface between them has no roughness, so that the circuit layer 270 with less signal noise and ultra-fine pitch is easily realized.

Since the circuit layer 270 has a smooth surface, that is, With a small surface roughness, the amount of etching required to form the circuit layer is reduced, and the amount of loss in forming the circuit layer is reduced, thereby forming an ultra-fine pitch and significantly reducing signal noise.

Second Exemplary Embodiment: Method of Manufacturing Printed Circuit Board

Next, Fig. 7-12 are cross-sectional views showing respective steps of a method of manufacturing a printed circuit board according to a second exemplary embodiment of the present invention.

First, as shown in Fig. 7, the core C can be made by bonding the core reinforcing material to the upper and lower surfaces of the insulating layer 210. In this case, the insulating layer 210 may be made of an insulating material in which one of the glass fiber structures is impregnated, as a polymer material having heat resistance, and may be formed of a film type or an insulating sheet in which a glass fiber structure is mixed. In addition, the insulating layer 210 laminated between the core reinforcing materials absorbs the impact generated during the process to prevent the core reinforcing material 220 from being damaged due to impact or warpage. Bad.

The manufacturing of the core C may further include laminating the core reinforcing material 220 on the insulating layer On the surface of the 210 second, the core reinforcing material 220 and the insulating layer 210 are sequentially laminated, and the core reinforcing material 220 and the insulating layer 210 are heated and pressed to bond the core reinforcing material 220 to the two surfaces of the insulating layer 210.

Next, as shown in FIG. 8, a through hole 250 penetrating the core C may be formed, in which the insulating layer 210 and the core reinforcing material 220 are laminated in the core C. The through holes 250 may be formed by laser drilling, such as CO ₂ lasers, YAG lasers, pulse UV excimer lasers, and the like.

Meanwhile, after the step of forming the through hole 250 in the core C, the surface of the core C forming the through hole 250 and an inner wall of the through hole 250 may be further cleaned. In this case, it is not limited to a special process for cleaning the surface of the core C and the inner wall of the through hole 250, so dry etching or wet etching may be used, and a desmear process may also be used. In particular, as the dry etching treatment, plasma etching, sputtering etching, ion etching, or the like can be used.

Next, as shown in FIG. 9, the seed layer 230 may be formed on the surface of the core C including the inner wall of the through hole 250. In a subsequent process, when a plating layer is formed to form the circuit layer 270, the seed layer 230 is used to promote the growth of the plating layer, and the seed layer 230 can be formed mainly by a sputtering method. In addition, the seed layer 230 may be formed by dividing the first seed layer 230a and the second seed layer 230b, if necessary, and may be selected from the group consisting of titanium (Ti), copper (Cu), molybdenum (Mo), and nickel (Ni). Any of a group consisting of silver (Ag), zinc (Zn), and carbon (C), and the like, or alloys thereof.

Next, as shown in FIG. 10, a plating layer can be formed (plating) Resistor layer 240, the plating resist 240 has an opening 241 to form a circuit on the seed layer 230. The plating resist 240 may be formed using a photoresist of a photosensitive polymer, and the opening 241 for forming a circuit may be formed by a mask after the step of applying the photoresist. In this case, the opening 241 of the circuit for forming the plating resist 240 may be formed in accordance with the design specifications of the circuit pattern.

Thereafter, as shown in FIGS. 11-12, the formation of the plating layer 260 is formed. On the core reinforcing material 220 having the plating resist 240, the plating resist 240 may be removed to form the circuit layer 270.

Here, the plating layer 260 is formed on the plating place on the core reinforcing material 220. The electroplating can be performed, preferably made of copper. Further, the removal of the plating resist 240 may be performed by a mechanical delamination process and a chemical delaminating process using a chemical solution.

According to the first and second exemplary embodiments of the present invention The printed circuit boards 100 and 200, as shown in FIG. 13, the core reinforcing material 220 is formed on the insulating layer 210, or the second insulating layer 310 and the circuit layer 270 may be successively laminated in sequence to be laminated with the core reinforcing material 220. A process is established on the upper and lower surfaces of the core C of the type on the surface of the insulating layer 210.

Figure 13 is where a plurality of insulating layers are formed with a plurality of circuit layers A cross-sectional view of a multilayer printed circuit board on a printed circuit board in accordance with an exemplary embodiment of the present invention.

Steps in manufacturing a printed circuit board as shown in Figures 1 and 6 Thereafter, the multilayer printed circuit board 300 shown in FIG. 13 can be laminated on the upper and lower surfaces of the core C by a second insulating layer 310 made of a prepreg (PPG), respectively, wherein the insulating layer 210 The core reinforcing material 220 is laminated on the core C, and then the circuit layer 320 is formed on the second insulating layer 310. A via hole 330 is provided to the second insulating layer 310 laminated on the core C to turn on the circuit layer 270 formed on the core C and the circuit layer 320 formed on the second insulating layer 310, thereby implementing the circuit layer An interlayer connection, a solder resist layer 340 is formed on the second insulating layer 310 to protect and expose the second insulating layer 310 and the circuit layer 320.

The rigidity and warpage characteristics of the printed circuit boards of the exemplary embodiments

A printed circuit board formed in accordance with an exemplary embodiment of the present invention is The above-mentioned manufacturing method is manufactured, and a general printed circuit board manufactured according to the prior art, that is, a printed circuit board manufactured using an insulating layer made of an insulating material and a coreless reinforcing material, With a printed circuit board according to an exemplary embodiment of the present invention, a predetermined heat is applied thereto, and then, the elastic modulus thereof is simulated as shown in Fig. 14.

Figure 14 is a printed circuit in accordance with a first exemplary embodiment of the present invention The board is simulated with the warpage characteristics of the printed circuit board according to the prior art. As shown in Fig. 14, for a printed circuit board according to the prior art in which a prepreg material is interposed between insulating layers, a modulus (which is a force causing warpage) is a function of temperature. Raising and suddenly increasing, but for a printed circuit board according to an exemplary embodiment of the present invention, since the modulus of elasticity changes little at low or high temperatures, and is maintained at one At a lower level, it is understood that the occurrence of warpage is minimized during the manufacture of such a board. That is, the printed circuit board according to an exemplary embodiment of the present invention has a core reinforcing material made of a glass material formed on a surface of the insulating layer to form a core, or a core reinforcing material interposed between the insulating layers to form The core enables such a printed circuit board to have excellent rigidity and minimize warpage due to changes in applied temperature and humidity during the manufacture of the printed circuit board.

At the same time, in order to make the core compared to the printed circuit board according to the prior art With a more improved rigidity and warping characteristics, the printed circuit board according to the exemplary embodiment of the present invention and having the technical features mentioned in the above exemplary embodiments preferably has a portion of the core reinforcing material occupied by the insulating layer The total thickness of the core composed of the core reinforcing material ranges from 35% to 80%. This can be applied to the composition of the printed circuit board (Fig. 1) according to the first exemplary embodiment of the present invention and the printed circuit board (Fig. 6) according to the second exemplary embodiment of the present invention as described above. Morphologically.

In addition, when in each of the exemplary embodiments, the core reinforcing material and the core are formed When the thermal expansion coefficient and the elastic modulus of the edge layer satisfy the following Equation 1, the warpage characteristics of the core are further improved as compared with the printed circuit board according to the prior art.

Among them, α ₁ is the thermal expansion coefficient (1/k) of the core reinforcing material, α ₂ is the thermal expansion coefficient (1/k) of the insulating layer, and E ₁ is the elastic modulus (GPa) of the core reinforcing material, E ₂ It is the elastic modulus (GPa) of the insulating layer, and V ₁ is the volume of the core reinforcing material.

Here, limiting the portion of the core reinforcing material relative to the total thickness of the core The reason why the proportion is at least 35% is that the core warpage can be improved when the proportion of the core reinforcing material is 35% or more as compared with the core structure on the circuit board according to the prior art. Characteristics, limiting the proportion of a portion of the core reinforcing material to the total thickness of the core to 80% or less, because the thickness of the insulating layer other than the core reinforcing material can be made up to 10 micrometers in the core . In this case, when the thickness of the insulating layer is formed thinner, cracks may be generated in the core, and the crack may be caused due to the generation of cracks.

Therefore, based on the above equation, the ratio of the thickness of the core reinforcing material to the total thickness ranges from 35% to 80%, and when the insulating layer is made of any insulating material of many different materials, An insulating layer made of PPG, ABF, polyimine (PI) and primer, or PPG, ABF, PI and primer in which a glass fiber cloth, a filler material and the like are impregnated The insulating layer of any insulating material, the different variables of these insulating layers are substituted into the above equation, and the core reinforcing material and the insulating layer surrounding the core reinforcing material satisfy 6.492×10 ^-8 to 4.463×10 ^-6 /GPa. When the range of k is used, the warpage of the core can be improved.

When the core reinforcing material occupies a portion relative to the total thickness of the core and the above When the conditions of the equation are satisfied, as shown in Fig. 15 or Fig. 16, the rigidity and warpage characteristics of the core can be satisfied.

Figure 15 is a diagram showing a first exemplary embodiment according to the present invention A rigid simulation diagram of a printed circuit board of a second exemplary embodiment, and Fig. 16 is a simulation diagram of warpage characteristics of a printed circuit board according to a first exemplary embodiment of the present invention and a second exemplary embodiment of the present invention.

Review the 15th and 16th figures, as shown in the figure, when the core reinforcement material When the ratio of the portion to the total thickness of the core is 35% or more, compared with the core of the printed circuit board according to the related art (mainly a copper foil substrate), as described above, according to the first exemplary embodiment of the present invention The printed circuit board according to the second exemplary embodiment of the present invention can further improve the rigidity and warpage characteristics of the printed circuit board, and can be understood by the respective exemplary embodiments, when the ratio of the portion occupied by the core reinforcing material to the total thickness of the core is 35% or more, the printed circuit board according to the second exemplary embodiment of the present invention has a rigidity of about 2.5 times that of the printed circuit board according to the first exemplary embodiment of the present invention, and is compared with the first according to the present invention The printed circuit board of the exemplary embodiment has slightly superior warpage characteristics.

As described above, a printed circuit board according to an exemplary embodiment of the present invention And a manufacturing method thereof, which can manufacture a printed circuit board by inserting a core-type reinforcing material of a film type having a rigid glass or a film type of a non-conductive polymer material in a printed circuit board to maintain the printed circuit board in Rigidity at high temperatures to prevent warpage of the board during manufacturing.

Further, according to an exemplary embodiment of the present invention, even a thin plate is manufactured The type of printed circuit board can improve the deflection of the printed circuit board and the heat dissipation characteristics in the vertical direction because the core reinforcing material can maintain rigidity.

In summary, although the present invention has been disclosed above by way of exemplary embodiments, It is not intended to limit the invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100‧‧‧Printed circuit board

110‧‧‧core reinforcing material

120‧‧‧Insulation

130‧‧‧ circuit layer

140‧‧‧Electroplating

150‧‧‧through holes

Claims (18)

A printed circuit board comprising: a core having a glass layer and a plurality of insulating layers laminated on two surfaces of the glass layer; a continuous perforation extending through the core; and a sub-layer formed in the through hole The inner wall is continuously formed on at least a portion of the core; wherein the insulating layers are made of a resin in which one of the glass fiber structures is impregnated. The printed circuit board of claim 1, further comprising a plating layer formed in the through hole. The printed circuit board of claim 1 or 2, wherein the glass layer is formed to a thickness of 25 to 200 microns. The printed circuit board of claim 1 or 2, wherein the thickness of the glass layer ranges from 35% to 80% with respect to the total thickness of the core. The printed circuit board of claim 1, further comprising a circuit layer formed on the insulating layers. The printed circuit board of claim 5, wherein the seed layer is further formed between the insulating layer and the circuit layer so as to correspond to the circuit layer. The printed circuit board of claim 1 or 2, wherein the seed layer is composed of a plurality of layers. The printed circuit board of claim 1, further comprising a coating between the glass layer and the insulating layers. The printed circuit board of claim 8, wherein the coating is formed to a thickness of 2 microns or less. A method of manufacturing a printed circuit board, comprising: laminating a plurality of insulating layers on two surfaces of a glass layer to form a core; forming a uniform perforation in the core; and forming a sublayer in the through hole And being continuously formed on at least a portion of the core; wherein the insulating layers are made of a resin in which one of the glass fiber structures is impregnated. The manufacturing method of claim 10, further comprising: forming a plating layer in the through hole. The manufacturing method of claim 10 or 11, further comprising: forming a circuit layer on the insulating layers. The manufacturing method according to claim 12, wherein in the step of forming the seed layer, the seed layer is further formed on the insulating layers corresponding to the circuit layer. The manufacturing method of claim 10, wherein the seed layer is composed of a plurality of layers. The manufacturing method according to claim 10 or 11, wherein the forming the core comprises: forming a coating on one or both surfaces of the glass layer before the step of forming the insulating layers . The manufacturing method of claim 10, further comprising: after the step of forming the through hole, cleaning the surface of the glass layer and the inner wall of the through hole. The manufacturing method of claim 16, wherein the cleaning step is performed by etching. The manufacturing method according to claim 10, wherein in the step of forming the core, the insulating layers are disposed, heated and pressurized on both surfaces of the glass layer.