TWI593046B - Bonding device and bonding method - Google Patents
Bonding device and bonding method Download PDFInfo
- Publication number
- TWI593046B TWI593046B TW104140754A TW104140754A TWI593046B TW I593046 B TWI593046 B TW I593046B TW 104140754 A TW104140754 A TW 104140754A TW 104140754 A TW104140754 A TW 104140754A TW I593046 B TWI593046 B TW I593046B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- chuck
- substrate
- bonding
- head
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/832—Applying energy for connecting
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015048168A JP6510837B2 (ja) | 2015-03-11 | 2015-03-11 | ボンディング装置及びボンディング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201633441A TW201633441A (zh) | 2016-09-16 |
TWI593046B true TWI593046B (zh) | 2017-07-21 |
Family
ID=56984111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104140754A TWI593046B (zh) | 2015-03-11 | 2015-12-04 | Bonding device and bonding method |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6510837B2 (ko) |
KR (2) | KR101807369B1 (ko) |
CN (1) | CN105977183B (ko) |
TW (1) | TWI593046B (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6643197B2 (ja) * | 2016-07-13 | 2020-02-12 | ファスフォードテクノロジ株式会社 | 半導体製造装置および半導体装置の製造方法 |
CN108511364B (zh) | 2017-02-28 | 2020-01-24 | 上海微电子装备(集团)股份有限公司 | 一种芯片键合装置 |
JP7164314B2 (ja) | 2017-04-28 | 2022-11-01 | ベシ スウィッツァーランド エージー | 部品を基板上に搭載する装置及び方法 |
CN107093651B (zh) * | 2017-05-18 | 2023-08-04 | 江西比太科技有限公司 | 太阳能硅片二合一自动上下料设备 |
JP7018341B2 (ja) * | 2018-03-26 | 2022-02-10 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
US10861819B1 (en) * | 2019-07-05 | 2020-12-08 | Asm Technology Singapore Pte Ltd | High-precision bond head positioning method and apparatus |
JP7352159B2 (ja) * | 2019-09-30 | 2023-09-28 | 日本電気硝子株式会社 | デバイスの製造方法 |
CN112802793A (zh) * | 2021-02-09 | 2021-05-14 | 深圳市卓兴半导体科技有限公司 | 运行机构和晶片吸附装置 |
CN117080127B (zh) * | 2023-10-11 | 2024-01-05 | 江苏快克芯装备科技有限公司 | 芯片吸取异常检测装置及检测方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6140040A (ja) * | 1984-07-31 | 1986-02-26 | Oki Electric Ind Co Ltd | 発光素子のダイスボンデイング位置決め方法 |
JP2696617B2 (ja) * | 1991-06-04 | 1998-01-14 | ローム株式会社 | ダイボンディング装置 |
JPH05337865A (ja) * | 1992-06-10 | 1993-12-21 | Sony Corp | 半導体実装装置とこれを用いた実装方法 |
KR100214586B1 (ko) * | 1995-12-29 | 1999-08-02 | 구자홍 | 홀로그램 모듈 조립장치 |
JPH11274180A (ja) * | 1998-03-24 | 1999-10-08 | Sony Corp | ダイボンド装置及びそれを用いた半導体装置の製造方法 |
JP2000244195A (ja) | 1999-02-17 | 2000-09-08 | Rohm Co Ltd | フリップチップ装着装置のチップ位置認識装置 |
JP2000269240A (ja) * | 1999-03-16 | 2000-09-29 | Hitachi Cable Ltd | 光モジュールの製造方法及び光素子搭載装置 |
JP3851468B2 (ja) * | 1999-07-09 | 2006-11-29 | 富士写真フイルム株式会社 | 発光部品のボンディング方法および装置 |
JP4425609B2 (ja) * | 2003-02-19 | 2010-03-03 | キヤノンマシナリー株式会社 | チップマウント方法および装置 |
JP4156460B2 (ja) * | 2003-07-09 | 2008-09-24 | Tdk株式会社 | ワークのピックアップ方法及びその装置、実装機 |
JP3808465B2 (ja) * | 2003-12-24 | 2006-08-09 | エルピーダメモリ株式会社 | マウント方法及び装置 |
JP2006261209A (ja) * | 2005-03-15 | 2006-09-28 | Seiko Epson Corp | 部品の吸着治具 |
JP2006032987A (ja) * | 2005-09-27 | 2006-02-02 | Renesas Technology Corp | ボンディング装置および半導体集積回路装置の製造方法 |
JP4593429B2 (ja) | 2005-10-04 | 2010-12-08 | キヤノンマシナリー株式会社 | ダイボンダ |
JP2009212456A (ja) * | 2008-03-06 | 2009-09-17 | Sharp Corp | ボンディング装置 |
JP4992953B2 (ja) * | 2009-11-09 | 2012-08-08 | 株式会社竹屋 | 電子部品の取付構造 |
JP5989313B2 (ja) * | 2011-09-15 | 2016-09-07 | ファスフォードテクノロジ株式会社 | ダイボンダ及びボンディング方法 |
US8967452B2 (en) * | 2012-04-17 | 2015-03-03 | Asm Technology Singapore Pte Ltd | Thermal compression bonding of semiconductor chips |
-
2015
- 2015-03-11 JP JP2015048168A patent/JP6510837B2/ja active Active
- 2015-12-04 TW TW104140754A patent/TWI593046B/zh active
- 2015-12-11 KR KR1020150176798A patent/KR101807369B1/ko active IP Right Grant
- 2015-12-14 CN CN201510929210.3A patent/CN105977183B/zh active Active
-
2017
- 2017-10-25 KR KR1020170139319A patent/KR101874756B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20170121133A (ko) | 2017-11-01 |
CN105977183B (zh) | 2019-10-25 |
KR101874756B1 (ko) | 2018-07-04 |
KR101807369B1 (ko) | 2017-12-08 |
TW201633441A (zh) | 2016-09-16 |
JP2016171106A (ja) | 2016-09-23 |
KR20160110058A (ko) | 2016-09-21 |
JP6510837B2 (ja) | 2019-05-08 |
CN105977183A (zh) | 2016-09-28 |
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