TWI593040B - 基板處理方法、基板處理系統及記憶有基板處理程式之電腦可讀取記憶媒體 - Google Patents

基板處理方法、基板處理系統及記憶有基板處理程式之電腦可讀取記憶媒體 Download PDF

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Publication number
TWI593040B
TWI593040B TW105104685A TW105104685A TWI593040B TW I593040 B TWI593040 B TW I593040B TW 105104685 A TW105104685 A TW 105104685A TW 105104685 A TW105104685 A TW 105104685A TW I593040 B TWI593040 B TW I593040B
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TW
Taiwan
Prior art keywords
substrate
back surface
processing
peripheral portion
substrate processing
Prior art date
Application number
TW105104685A
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English (en)
Chinese (zh)
Other versions
TW201624595A (zh
Inventor
內田範臣
中森光則
日高章一郎
毛利信彥
Original Assignee
東京威力科創股份有限公司
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Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW201624595A publication Critical patent/TW201624595A/zh
Application granted granted Critical
Publication of TWI593040B publication Critical patent/TWI593040B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/0209—Cleaning of wafer backside
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
TW105104685A 2011-07-07 2012-07-02 基板處理方法、基板處理系統及記憶有基板處理程式之電腦可讀取記憶媒體 TWI593040B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011151123A JP5705666B2 (ja) 2011-07-07 2011-07-07 基板処理方法、基板処理システム及び基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体

Publications (2)

Publication Number Publication Date
TW201624595A TW201624595A (zh) 2016-07-01
TWI593040B true TWI593040B (zh) 2017-07-21

Family

ID=47692204

Family Applications (2)

Application Number Title Priority Date Filing Date
TW105104685A TWI593040B (zh) 2011-07-07 2012-07-02 基板處理方法、基板處理系統及記憶有基板處理程式之電腦可讀取記憶媒體
TW101123769A TWI529836B (zh) 2011-07-07 2012-07-02 基板處理方法、基板處理系統及記憶有基板處理程式之電腦可讀取記憶媒體

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TW101123769A TWI529836B (zh) 2011-07-07 2012-07-02 基板處理方法、基板處理系統及記憶有基板處理程式之電腦可讀取記憶媒體

Country Status (3)

Country Link
JP (1) JP5705666B2 (ko)
KR (2) KR101600938B1 (ko)
TW (2) TWI593040B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5904169B2 (ja) 2013-07-23 2016-04-13 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法及び記憶媒体
KR102478317B1 (ko) 2015-04-08 2022-12-16 도쿄엘렉트론가부시키가이샤 기판 처리 시스템
US10155252B2 (en) * 2015-04-30 2018-12-18 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor apparatus and washing method
JP6552404B2 (ja) * 2015-12-17 2019-07-31 東京エレクトロン株式会社 基板処理方法、基板処理システム、基板処理装置、及び基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP7175119B2 (ja) * 2018-07-25 2022-11-18 東京エレクトロン株式会社 基板処理装置、および基板処理方法
US20240307925A1 (en) 2021-03-03 2024-09-19 Tokyo Electron Limited Substrate processing method and substrate processing system
JP2022152751A (ja) 2021-03-29 2022-10-12 東京エレクトロン株式会社 液滴吐出装置および液滴吐出方法
JP2022188854A (ja) 2021-06-10 2022-12-22 東京エレクトロン株式会社 基板処理装置及び基板処理装置の制御方法
TW202410144A (zh) 2022-05-18 2024-03-01 日商東京威力科創股份有限公司 基板處理裝置、基板處理方法及記錄媒體

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3892635B2 (ja) * 2000-02-04 2007-03-14 大日本スクリーン製造株式会社 洗浄装置
JP2004247582A (ja) * 2003-02-14 2004-09-02 Tokyo Electron Ltd 洗浄ブラシ及び基板洗浄装置
US8356376B2 (en) * 2008-06-18 2013-01-22 Tokyo Electron Limited Substrate cleaning apparatus, substrate cleaning method, and storage medium

Also Published As

Publication number Publication date
TW201624595A (zh) 2016-07-01
KR20130006309A (ko) 2013-01-16
JP5705666B2 (ja) 2015-04-22
TWI529836B (zh) 2016-04-11
TW201308492A (zh) 2013-02-16
KR20160026959A (ko) 2016-03-09
KR101688492B1 (ko) 2016-12-21
KR101600938B1 (ko) 2016-03-08
JP2013021026A (ja) 2013-01-31

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