JP5705666B2 - 基板処理方法、基板処理システム及び基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体 - Google Patents

基板処理方法、基板処理システム及び基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体 Download PDF

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JP5705666B2
JP5705666B2 JP2011151123A JP2011151123A JP5705666B2 JP 5705666 B2 JP5705666 B2 JP 5705666B2 JP 2011151123 A JP2011151123 A JP 2011151123A JP 2011151123 A JP2011151123 A JP 2011151123A JP 5705666 B2 JP5705666 B2 JP 5705666B2
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substrate
processing
back surface
range
processing step
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Japanese (ja)
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JP2013021026A5 (ko
JP2013021026A (ja
Inventor
範臣 内田
範臣 内田
光則 中森
光則 中森
章一郎 日高
章一郎 日高
信彦 毛利
信彦 毛利
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2011151123A priority Critical patent/JP5705666B2/ja
Priority to KR1020120070058A priority patent/KR101600938B1/ko
Priority to TW105104685A priority patent/TWI593040B/zh
Priority to TW101123769A priority patent/TWI529836B/zh
Publication of JP2013021026A publication Critical patent/JP2013021026A/ja
Publication of JP2013021026A5 publication Critical patent/JP2013021026A5/ja
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Priority to KR1020160021071A priority patent/KR101688492B1/ko
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02082Cleaning product to be cleaned
    • H01L21/0209Cleaning of wafer backside
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
JP2011151123A 2011-07-07 2011-07-07 基板処理方法、基板処理システム及び基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体 Active JP5705666B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011151123A JP5705666B2 (ja) 2011-07-07 2011-07-07 基板処理方法、基板処理システム及び基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
KR1020120070058A KR101600938B1 (ko) 2011-07-07 2012-06-28 기판 처리 방법, 기판 처리 시스템 및 기판 처리 프로그램을 기억한 컴퓨터 판독 가능한 기억 매체
TW105104685A TWI593040B (zh) 2011-07-07 2012-07-02 基板處理方法、基板處理系統及記憶有基板處理程式之電腦可讀取記憶媒體
TW101123769A TWI529836B (zh) 2011-07-07 2012-07-02 基板處理方法、基板處理系統及記憶有基板處理程式之電腦可讀取記憶媒體
KR1020160021071A KR101688492B1 (ko) 2011-07-07 2016-02-23 기판 처리 방법, 기판 처리 시스템 및 기판 처리 프로그램을 기억한 컴퓨터 판독 가능한 기억 매체

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011151123A JP5705666B2 (ja) 2011-07-07 2011-07-07 基板処理方法、基板処理システム及び基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体

Related Child Applications (1)

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JP2015034976A Division JP6027640B2 (ja) 2015-02-25 2015-02-25 基板処理システム

Publications (3)

Publication Number Publication Date
JP2013021026A JP2013021026A (ja) 2013-01-31
JP2013021026A5 JP2013021026A5 (ko) 2013-08-29
JP5705666B2 true JP5705666B2 (ja) 2015-04-22

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JP2011151123A Active JP5705666B2 (ja) 2011-07-07 2011-07-07 基板処理方法、基板処理システム及び基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体

Country Status (3)

Country Link
JP (1) JP5705666B2 (ko)
KR (2) KR101600938B1 (ko)
TW (2) TWI593040B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5904169B2 (ja) 2013-07-23 2016-04-13 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法及び記憶媒体
KR102478317B1 (ko) 2015-04-08 2022-12-16 도쿄엘렉트론가부시키가이샤 기판 처리 시스템
US10155252B2 (en) * 2015-04-30 2018-12-18 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor apparatus and washing method
JP6552404B2 (ja) * 2015-12-17 2019-07-31 東京エレクトロン株式会社 基板処理方法、基板処理システム、基板処理装置、及び基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP7175119B2 (ja) * 2018-07-25 2022-11-18 東京エレクトロン株式会社 基板処理装置、および基板処理方法
US20240307925A1 (en) 2021-03-03 2024-09-19 Tokyo Electron Limited Substrate processing method and substrate processing system
JP2022152751A (ja) 2021-03-29 2022-10-12 東京エレクトロン株式会社 液滴吐出装置および液滴吐出方法
JP2022188854A (ja) 2021-06-10 2022-12-22 東京エレクトロン株式会社 基板処理装置及び基板処理装置の制御方法
TW202410144A (zh) 2022-05-18 2024-03-01 日商東京威力科創股份有限公司 基板處理裝置、基板處理方法及記錄媒體

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3892635B2 (ja) * 2000-02-04 2007-03-14 大日本スクリーン製造株式会社 洗浄装置
JP2004247582A (ja) * 2003-02-14 2004-09-02 Tokyo Electron Ltd 洗浄ブラシ及び基板洗浄装置
US8356376B2 (en) * 2008-06-18 2013-01-22 Tokyo Electron Limited Substrate cleaning apparatus, substrate cleaning method, and storage medium

Also Published As

Publication number Publication date
TW201624595A (zh) 2016-07-01
KR20130006309A (ko) 2013-01-16
TWI529836B (zh) 2016-04-11
TW201308492A (zh) 2013-02-16
KR20160026959A (ko) 2016-03-09
KR101688492B1 (ko) 2016-12-21
TWI593040B (zh) 2017-07-21
KR101600938B1 (ko) 2016-03-08
JP2013021026A (ja) 2013-01-31

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