JP5705666B2 - 基板処理方法、基板処理システム及び基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体 - Google Patents

基板処理方法、基板処理システム及び基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体 Download PDF

Info

Publication number
JP5705666B2
JP5705666B2 JP2011151123A JP2011151123A JP5705666B2 JP 5705666 B2 JP5705666 B2 JP 5705666B2 JP 2011151123 A JP2011151123 A JP 2011151123A JP 2011151123 A JP2011151123 A JP 2011151123A JP 5705666 B2 JP5705666 B2 JP 5705666B2
Authority
JP
Japan
Prior art keywords
substrate
processing
back surface
range
processing step
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011151123A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013021026A5 (ko
JP2013021026A (ja
Inventor
範臣 内田
範臣 内田
光則 中森
光則 中森
章一郎 日高
章一郎 日高
信彦 毛利
信彦 毛利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2011151123A priority Critical patent/JP5705666B2/ja
Priority to KR1020120070058A priority patent/KR101600938B1/ko
Priority to TW105104685A priority patent/TWI593040B/zh
Priority to TW101123769A priority patent/TWI529836B/zh
Publication of JP2013021026A publication Critical patent/JP2013021026A/ja
Publication of JP2013021026A5 publication Critical patent/JP2013021026A5/ja
Application granted granted Critical
Publication of JP5705666B2 publication Critical patent/JP5705666B2/ja
Priority to KR1020160021071A priority patent/KR101688492B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/0209—Cleaning of wafer backside
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
JP2011151123A 2011-07-07 2011-07-07 基板処理方法、基板処理システム及び基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体 Active JP5705666B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011151123A JP5705666B2 (ja) 2011-07-07 2011-07-07 基板処理方法、基板処理システム及び基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
KR1020120070058A KR101600938B1 (ko) 2011-07-07 2012-06-28 기판 처리 방법, 기판 처리 시스템 및 기판 처리 프로그램을 기억한 컴퓨터 판독 가능한 기억 매체
TW105104685A TWI593040B (zh) 2011-07-07 2012-07-02 基板處理方法、基板處理系統及記憶有基板處理程式之電腦可讀取記憶媒體
TW101123769A TWI529836B (zh) 2011-07-07 2012-07-02 基板處理方法、基板處理系統及記憶有基板處理程式之電腦可讀取記憶媒體
KR1020160021071A KR101688492B1 (ko) 2011-07-07 2016-02-23 기판 처리 방법, 기판 처리 시스템 및 기판 처리 프로그램을 기억한 컴퓨터 판독 가능한 기억 매체

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011151123A JP5705666B2 (ja) 2011-07-07 2011-07-07 基板処理方法、基板処理システム及び基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015034976A Division JP6027640B2 (ja) 2015-02-25 2015-02-25 基板処理システム

Publications (3)

Publication Number Publication Date
JP2013021026A JP2013021026A (ja) 2013-01-31
JP2013021026A5 JP2013021026A5 (ko) 2013-08-29
JP5705666B2 true JP5705666B2 (ja) 2015-04-22

Family

ID=47692204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011151123A Active JP5705666B2 (ja) 2011-07-07 2011-07-07 基板処理方法、基板処理システム及び基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体

Country Status (3)

Country Link
JP (1) JP5705666B2 (ko)
KR (2) KR101600938B1 (ko)
TW (2) TWI593040B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5904169B2 (ja) 2013-07-23 2016-04-13 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法及び記憶媒体
KR102478317B1 (ko) 2015-04-08 2022-12-16 도쿄엘렉트론가부시키가이샤 기판 처리 시스템
US10155252B2 (en) * 2015-04-30 2018-12-18 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor apparatus and washing method
JP6552404B2 (ja) * 2015-12-17 2019-07-31 東京エレクトロン株式会社 基板処理方法、基板処理システム、基板処理装置、及び基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP7175119B2 (ja) * 2018-07-25 2022-11-18 東京エレクトロン株式会社 基板処理装置、および基板処理方法
US20240307925A1 (en) 2021-03-03 2024-09-19 Tokyo Electron Limited Substrate processing method and substrate processing system
JP2022152751A (ja) 2021-03-29 2022-10-12 東京エレクトロン株式会社 液滴吐出装置および液滴吐出方法
JP2022188854A (ja) 2021-06-10 2022-12-22 東京エレクトロン株式会社 基板処理装置及び基板処理装置の制御方法
TW202410144A (zh) 2022-05-18 2024-03-01 日商東京威力科創股份有限公司 基板處理裝置、基板處理方法及記錄媒體

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3892635B2 (ja) * 2000-02-04 2007-03-14 大日本スクリーン製造株式会社 洗浄装置
JP2004247582A (ja) * 2003-02-14 2004-09-02 Tokyo Electron Ltd 洗浄ブラシ及び基板洗浄装置
US8356376B2 (en) * 2008-06-18 2013-01-22 Tokyo Electron Limited Substrate cleaning apparatus, substrate cleaning method, and storage medium

Also Published As

Publication number Publication date
TW201624595A (zh) 2016-07-01
KR20130006309A (ko) 2013-01-16
TWI529836B (zh) 2016-04-11
TW201308492A (zh) 2013-02-16
KR20160026959A (ko) 2016-03-09
KR101688492B1 (ko) 2016-12-21
TWI593040B (zh) 2017-07-21
KR101600938B1 (ko) 2016-03-08
JP2013021026A (ja) 2013-01-31

Similar Documents

Publication Publication Date Title
JP5705666B2 (ja) 基板処理方法、基板処理システム及び基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP6740066B2 (ja) 基板洗浄装置、基板処理装置および基板洗浄方法
JP5478586B2 (ja) 洗浄装置、剥離システム、洗浄方法、プログラム及びコンピュータ記憶媒体
KR20160143705A (ko) 기판 처리 장치 및 기판 처리 방법 그리고 기판 처리 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체
JP5726686B2 (ja) 液処理装置、及び液処理装置の制御方法
TW201624532A (zh) 基板液體處理方法、基板液體處理裝置及記錄媒體
JP6584532B2 (ja) 研削装置および研削方法
TWI681449B (zh) 研磨方法及研磨裝置
JP2019021859A (ja) 基板処理システム
JP6027523B2 (ja) 基板処理装置及び基板処理方法並びに基板処理プログラムを記録した記録媒体
JP2015050213A (ja) 基板処理システム及び基板処理方法並びに基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP6027640B2 (ja) 基板処理システム
JP6395673B2 (ja) 基板処理装置
JP6254054B2 (ja) 塗布装置、接合システム、塗布方法、接合方法、プログラム、および情報記憶媒体
JP2018129476A (ja) 基板処理装置
JP6513492B2 (ja) 基板処理方法、基板処理装置及び記憶媒体
JP5634381B2 (ja) 基板洗浄方法、基板洗浄装置、及びコンピュータ可読記憶媒体
JP2017059784A (ja) カップ洗浄用治具及び同治具を用いてカップを洗浄する基板液処理装置並びにカップ洗浄方法
JP2024044924A (ja) 基板洗浄装置および基板洗浄方法
JP2024044905A (ja) 基板洗浄装置および基板洗浄方法
JP6552404B2 (ja) 基板処理方法、基板処理システム、基板処理装置、及び基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP5970102B2 (ja) 液処理装置
KR20230012426A (ko) 기판 세정 장치, 기판 세정 시스템, 기판 처리 시스템, 기판 세정 방법 및 기판 처리 방법
JP2012216624A (ja) 基板処理装置および基板処理装置の清掃装置
JP2006041445A (ja) 基板処理装置および基板処理方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130712

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130712

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20140522

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140527

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140711

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150127

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150225

R150 Certificate of patent or registration of utility model

Ref document number: 5705666

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250