TWI591347B - A probe unit, a substrate inspection apparatus, and a probe unit manufacturing method - Google Patents

A probe unit, a substrate inspection apparatus, and a probe unit manufacturing method Download PDF

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Publication number
TWI591347B
TWI591347B TW102126213A TW102126213A TWI591347B TW I591347 B TWI591347 B TW I591347B TW 102126213 A TW102126213 A TW 102126213A TW 102126213 A TW102126213 A TW 102126213A TW I591347 B TWI591347 B TW I591347B
Authority
TW
Taiwan
Prior art keywords
support
hole
support plate
probe
holes
Prior art date
Application number
TW102126213A
Other languages
English (en)
Chinese (zh)
Other versions
TW201418720A (zh
Inventor
Masashi Kobayashi
Original Assignee
Hioki Electric Works
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hioki Electric Works filed Critical Hioki Electric Works
Publication of TW201418720A publication Critical patent/TW201418720A/zh
Application granted granted Critical
Publication of TWI591347B publication Critical patent/TWI591347B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
TW102126213A 2012-07-26 2013-07-23 A probe unit, a substrate inspection apparatus, and a probe unit manufacturing method TWI591347B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012165301A JP6184667B2 (ja) 2012-07-26 2012-07-26 プローブユニット、基板検査装置およびプローブユニット製造方法

Publications (2)

Publication Number Publication Date
TW201418720A TW201418720A (zh) 2014-05-16
TWI591347B true TWI591347B (zh) 2017-07-11

Family

ID=49997238

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102126213A TWI591347B (zh) 2012-07-26 2013-07-23 A probe unit, a substrate inspection apparatus, and a probe unit manufacturing method

Country Status (5)

Country Link
JP (1) JP6184667B2 (ja)
KR (1) KR101979060B1 (ja)
CN (1) CN104508498B (ja)
TW (1) TWI591347B (ja)
WO (1) WO2014017426A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101656047B1 (ko) * 2016-03-23 2016-09-09 주식회사 나노시스 기판 검사용 지그
CN109564244B (zh) * 2016-07-28 2022-01-07 日本电产理德股份有限公司 检查辅助具、基板检查装置及检查辅助具的制造方法
KR101886536B1 (ko) * 2016-12-27 2018-08-07 주식회사 텝스 접촉력을 조절할 수 있는 스트레이트 니들 프로브 카드
CN110068711B (zh) * 2018-01-24 2022-04-26 台湾中华精测科技股份有限公司 探针卡装置及矩形探针
KR102072451B1 (ko) * 2018-07-27 2020-02-04 주식회사 에스디에이 프로브카드 헤드블록
CN108982933A (zh) * 2018-08-07 2018-12-11 深圳市芽庄电子有限公司 印制电路板测试治具
KR102170506B1 (ko) * 2020-03-04 2020-10-28 (주)뉴씨텍 기판 검사용 가동식 지그

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3505495B2 (ja) * 2000-09-13 2004-03-08 日本電産リード株式会社 基板検査用検査治具、該検査治具を備えた基板検査装置および基板検査用検査治具の組立方法
KR100773732B1 (ko) * 2006-05-09 2007-11-09 주식회사 파이컴 프로브 유닛 및 이를 포함하는 프로브 장치
KR100843224B1 (ko) * 2007-01-04 2008-07-02 삼성전자주식회사 웨이퍼 테스트용 프로브 카드
KR100975808B1 (ko) * 2007-04-17 2010-08-13 니혼덴산리드가부시키가이샤 기판검사용 치구
JP4965341B2 (ja) * 2007-05-31 2012-07-04 日置電機株式会社 プローブユニットおよび回路基板検査装置
JP2009008585A (ja) 2007-06-29 2009-01-15 Koyo Technos:Kk 検査冶具および検査装置
JP5179301B2 (ja) * 2008-09-09 2013-04-10 日置電機株式会社 プローブユニットおよび検査装置
JP5599150B2 (ja) * 2009-01-05 2014-10-01 東京特殊電線株式会社 プローブユニット構造
JP2012078297A (ja) * 2010-10-05 2012-04-19 Tokuso Riken:Kk ワイヤープローブ用治具並びにこれを用いた検査装置並びに検査方法

Also Published As

Publication number Publication date
TW201418720A (zh) 2014-05-16
CN104508498A (zh) 2015-04-08
KR101979060B1 (ko) 2019-05-15
JP6184667B2 (ja) 2017-08-23
KR20150037736A (ko) 2015-04-08
WO2014017426A1 (ja) 2014-01-30
CN104508498B (zh) 2018-04-10
JP2014025769A (ja) 2014-02-06

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