TWI591347B - A probe unit, a substrate inspection apparatus, and a probe unit manufacturing method - Google Patents

A probe unit, a substrate inspection apparatus, and a probe unit manufacturing method Download PDF

Info

Publication number
TWI591347B
TWI591347B TW102126213A TW102126213A TWI591347B TW I591347 B TWI591347 B TW I591347B TW 102126213 A TW102126213 A TW 102126213A TW 102126213 A TW102126213 A TW 102126213A TW I591347 B TWI591347 B TW I591347B
Authority
TW
Taiwan
Prior art keywords
support
hole
support plate
probe
holes
Prior art date
Application number
TW102126213A
Other languages
Chinese (zh)
Other versions
TW201418720A (en
Inventor
Masashi Kobayashi
Original Assignee
Hioki Electric Works
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hioki Electric Works filed Critical Hioki Electric Works
Publication of TW201418720A publication Critical patent/TW201418720A/en
Application granted granted Critical
Publication of TWI591347B publication Critical patent/TWI591347B/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Description

探針單元、基板檢查裝置及探針單元製造方法 Probe unit, substrate inspection device, and probe unit manufacturing method

本發明係關於一種具有複數個探針與支撐各探針之支撐部之探針單元、具有該探針單元之基板檢查裝置及製造該探針單元之探針單元製造方法。 The present invention relates to a probe unit having a plurality of probes and a support portion for supporting the probes, a substrate inspection device having the probe unit, and a probe unit manufacturing method for manufacturing the probe unit.

此種探針單元眾所周知有開示於日本特開2009-8585號公報之檢查治具。此檢查治具係一種被搭載在進行檢查對象之電性檢查之檢查裝置上,被使用之檢查治具,其中,其具有:探針;尖端側支撐體,支撐探針的尖端側;後端側支撐體,支撐探針的後端側;以及支撐柱,連結尖端側支撐體與後端側支撐體。探針係由導電導線、及被形成於除了導電導線中之尖端側部分及後端側部分外之部分的外周面上之絕緣被覆所構成。尖端側支撐體係由層積三塊支撐板所構成。又,在各支撐板形成有穿孔,藉各穿孔構成貫穿有探針的尖端側部分之尖端側貫穿孔。又,尖端側貫穿孔係沿著相對於支撐板而言垂直的方向形成。在此情形下,各穿孔係各內徑比探針的尖端側部分的外徑還要大,而且,比絕緣被覆的形成部分的外徑還要小,如此一來,藉形成穿孔(尖端側貫穿孔),防止探針往檢查對象側掉出。 Such a probe unit is known as an inspection jig disclosed in Japanese Laid-Open Patent Publication No. 2009-8585. The inspection jig is an inspection jig that is mounted on an inspection device that performs an electrical inspection of an inspection object, and has a probe; a tip side support body that supports the tip end side of the probe; a side support body supporting a rear end side of the probe; and a support column connecting the tip side support body and the rear end side support body. The probe is composed of a conductive wire and an insulating coating formed on an outer peripheral surface of a portion other than the tip end side portion and the rear end side portion of the conductive wire. The tip side support system consists of three support plates stacked. Further, perforations are formed in each of the support plates, and the perforations constitute a tip end side through hole through which the tip end side portion of the probe is inserted. Further, the tip side through hole is formed in a direction perpendicular to the support plate. In this case, the inner diameter of each of the perforation systems is larger than the outer diameter of the tip side portion of the probe, and is smaller than the outer diameter of the formed portion of the insulating coating, so that the perforation is formed (the tip side) Through the hole), prevent the probe from falling out to the side of the inspection object.

後端側支撐體係由層積五塊支撐板所構成。又, 在各支撐板形成有穿孔,藉各穿孔構成貫穿有探針的後端側部分之後端側貫穿孔。在此情形下,後端側貫穿孔係在少許偏移各穿孔的中心之狀態下,被層積支撐板,藉此,被形成使得相對於支撐板(相對於尖端側貫穿孔的中心軸)而言傾斜。當組立此檢查治具時,首先,以支撐柱連結尖端側支撐體與後端側支撐體。接著,在卸下後端側支撐板後之狀態下,自後端側支撐體的後端側貫穿孔往尖端側支撐體的尖端側貫穿孔,插入探針,使絕緣被覆的形成部分中之尖端部,抵接在構成尖端側貫穿孔之穿孔的緣部上。接著,安裝後端側支撐板。藉此,探針藉尖端側支撐體與後端側支撐體而被支撐。在此情形下,後端側貫穿孔相對於尖端側貫穿孔而言傾斜,所以,被尖端側支撐體與後端側支撐體支撐之探針,係中間部份傾斜。因此,在檢查時,當探針的尖端部位抵接壓入檢查對象時,傾斜之探針的中間部份有可能很容易撓曲。 The rear side support system consists of five support plates stacked. also, Perforations are formed in each of the support plates, and the perforations constitute end-side through-holes through the rear end side portions through which the probes are inserted. In this case, the rear end side through hole is laminated in a state of being slightly offset from the center of each of the perforations, thereby being formed so as to be formed with respect to the support plate (with respect to the center axis of the tip side through hole) In terms of tilt. When the inspection jig is assembled, first, the tip side support body and the rear end side support body are joined by a support column. Then, in the state in which the rear end side support plate is removed, the rear end side through hole of the rear end side support body is inserted into the tip end side through hole of the tip end side support body, and the probe is inserted to form the insulating coating portion. The tip end portion abuts on the edge portion of the perforation constituting the tip end side through hole. Next, install the rear side support plate. Thereby, the probe is supported by the tip side support and the rear end side support. In this case, since the rear end side through hole is inclined with respect to the tip end side through hole, the probe supported by the tip side support and the rear end side support is inclined at the intermediate portion. Therefore, at the time of inspection, when the tip end portion of the probe abuts against the inspection object, the intermediate portion of the inclined probe may be easily deflected.

【先行技術文獻】 [First technical literature]

【專利文獻】 [Patent Literature]

【專利文獻1】日本特開2009-8585號公報(第4~6頁、第1~4圖) [Patent Document 1] JP-A-2009-8585 (pages 4-6, 1-4)

在先前的檢查治具,有以下的問題點。亦即,在此檢查治具中,在使分別形成於構成後端側支撐體之複數支撐板上之穿孔的中心,少許偏移之狀態下,層積各支撐板,藉此,形成有相對於尖端側貫穿孔而言傾斜之後端側貫穿孔。在此情 形下,在支撐板必須形成數量與探針數量相同之穿孔,當在數量很多之支撐板(在上述例中,係五塊支撐板)上,正確形成數量很多之穿孔,需要很長的加工時間。又,正確地少許偏移各穿孔的中心,使得後端側貫穿孔傾斜到事先被決定之傾斜方向,以層積各支撐板之作業,也需要很高難度之技術。而且,在此檢查治具中,後端側貫穿孔相對於支撐板而言傾斜,尖端側貫穿孔相對於支撐板而言成垂直,所以,當使自後端側貫穿孔插入之探針的尖端部貫穿尖端側貫穿孔時,需要在彈性變形探針的尖端部之狀態下壓入之繁雜作業。因此,在貫穿數量很多的探針時,需要很長的時間。因此,在此檢查治具中,存在有因為這些加工及作業所造成之製造成本增加之問題點。 In the previous inspection fixture, there are the following problems. In other words, in the inspection jig, the support plates are stacked in a state in which the centers of the perforations formed on the plurality of support plates constituting the rear end side support body are slightly offset, whereby the opposite sides are formed. The end side through hole is inclined after the tip end side through hole. In this situation In the shape, the number of perforations must be the same as the number of probes on the support plate. When a large number of support plates (in the above example, five support plates), a large number of perforations are correctly formed, which requires a long process. time. Further, it is also necessary to highly shift the center of each of the perforations so that the rear end side through hole is inclined to the previously determined inclined direction to laminate the operations of the support plates. Further, in the inspection jig, the rear end side through hole is inclined with respect to the support plate, and the tip end side through hole is perpendicular to the support plate, so when the probe inserted from the rear end side through hole is inserted When the tip end portion penetrates the tip end through hole, it is necessary to perform a complicated operation of being pressed in the state of the tip end portion of the elastic deformation probe. Therefore, it takes a long time to pass through a large number of probes. Therefore, in this inspection jig, there is a problem that the manufacturing cost due to these processes and operations increases.

本發明係鑑於上述問題點而研發出者,其主要目的在於提供一種可減少製造成本之探針單元、基板檢查裝置及探針單元製造方法。 The present invention has been made in view of the above problems, and its main object is to provide a probe unit, a substrate inspection apparatus, and a probe unit manufacturing method which can reduce manufacturing costs.

為達成上述目的之申請專利範圍第1項所述之探針單元,係一種探針單元,其具有:複數個探針,用於使尖端部接觸到基板的導體部,以進行電氣訊號之輸出入;以及支撐部,支撐前述探針,其特徵在於:前述支撐部之構成係具有:第l支撐板,具有第1支撐孔,以支撐貫穿該第1支撐孔之前述尖端部;第2支撐板,具有第2支撐孔,以支撐貫穿該第2支撐孔之前述探針的基端部;以及第3支撐板,具有第3支撐孔,以支撐貫穿該第3支撐孔之前述基端部;而被配置使得該各支撐板以此順序相向,同時構成為具有間隔物被配設於前述第1支撐板與前述第2支撐板間,前述各支撐部在前述第2支 撐板及前述第3支撐板在抵接或接近之狀態下,係以前述第1支撐板與該第2支撐板係分離,同時前述第1支撐孔、前述第2支撐孔及前述第3支撐孔的各開口面,沿著相對於該各支撐板的層積方向而言傾斜之傾斜方向,在假想直線上相向之姿勢固定於該間隔物,前述探針係維持前述尖端部沿著前述第1支撐孔延伸,同時除了該尖端部之部分係沿著前述傾斜方向延伸之狀態,在前述第1支撐板,形成有可被第1定位銷以及第2定位銷貫穿的第1貫穿孔,在前述第2支撐板以及前述第3支撐板,各自形成有可被前述第1定位銷貫穿的第2貫穿孔以及可被第3定位銷貫穿的第3貫穿孔,在前述間隔物,在相向前述第1支撐板的面形成有可被前述第2定位銷貫穿的第1貫入孔,同時在相向前述第2支撐板的面形成有可被前述第3定位銷貫穿的第2貫入孔,前述第1貫穿孔以及前述第2貫穿孔係各自形成於,當前述第1支撐孔、前述第2支撐孔及前述第3支撐孔的各開口面,沿著相對於該各支撐部而言垂直之垂直方向,在假想直線上相向地彼此抵接或接近之狀態下被重疊時,該各貫穿孔的中心軸成為同軸之位置,前述第1貫入孔係形成於,當前述各支撐板為前述姿勢時,該各第1貫入孔的中心軸與前述第1貫穿孔的中心軸成為同軸之位置,前述第3貫穿孔以及前述第2貫入孔係各自形成於,當前述各支撐板為前述姿勢時,該各第3貫穿孔的中心軸與該各第2貫入孔的中心軸成為同軸之位置,前述第1支撐板、前述第2支撐板以及前述第3支撐板係各自形成俯視為四邊形,前述第1貫穿孔,在前述第1支撐板中一對的對角位置各形成一個,前述第2貫穿孔, 在相向前述第1支撐板的前述各對角位置的前述第2支撐板中一對的對角位置各形成一個,同時在相向前述第1支撐板的前述各對角位置的前述第3支撐板中一對的對角位置各形成一個,前述第3貫穿孔,在與前述第2支撐板中前述一對的對角位置相異之另一對的對角位置各形成一個,同時在與前述第3支撐板中前述一對的對角位置相異之另一對對角位置各形成一個。 The probe unit according to claim 1 for achieving the above object is a probe unit having a plurality of probes for contacting a tip end portion of a conductor portion of a substrate for electrical signal output. And the support portion supporting the probe, wherein the support portion has a first support plate having a first support hole for supporting the tip end portion penetrating the first support hole; and a second support a plate having a second support hole for supporting a base end portion of the probe penetrating the second support hole; and a third support plate having a third support hole for supporting the base end portion penetrating the third support hole And arranged such that the support plates face each other in this order, and are configured such that a spacer is disposed between the first support plate and the second support plate, and each of the support portions is in the second branch The first support plate and the second support plate are separated from each other by the first support plate and the second support plate in a state in which the support plate and the third support plate are in contact with each other, and the first support hole, the second support hole, and the third support are Each of the opening faces of the hole is fixed to the spacer in a direction inclined with respect to a stacking direction of the support plates on a virtual straight line, and the probe maintains the tip end portion along the aforementioned a support hole is extended, and a first through hole that can be penetrated by the first positioning pin and the second positioning pin is formed in the first support plate except that a portion of the tip end portion extends in the oblique direction. Each of the second support plate and the third support plate is formed with a second through hole that can be penetrated by the first positioning pin and a third through hole that can be inserted by the third positioning pin, and the spacers are opposed to each other. a first penetration hole through which the second positioning pin is inserted is formed in a surface of the first support plate, and a second penetration hole through which the third positioning pin can pass is formed on a surface facing the second support plate. 1 through hole and the aforementioned second through hole Each of the opening faces of the first support hole, the second support hole, and the third support hole is formed to face each other on a virtual straight line along a vertical direction perpendicular to the support portions. When the contact or the approaching state is overlapped, the central axis of each of the through holes is a coaxial position, and the first penetration hole is formed in the center of each of the first penetration holes when each of the support plates is in the posture The shaft is coaxial with the central axis of the first through hole, and the third through hole and the second through hole are formed in each of the central axes of the third through holes when the support plates are in the posture The first support plate, the second support plate, and the third support plate are each formed in a quadrangular shape in plan view at a position coaxial with the central axis of each of the second penetration holes, and the first through hole is in the first support One of the diagonal positions of the pair of plates is formed one by one, and the second through hole is One of the pair of diagonal positions of the second support plate facing each of the diagonal positions facing the first support plate is formed, and the third support plate facing each of the diagonal positions of the first support plate One pair of diagonal positions are formed one by one, and the third through hole is formed in one diagonal position different from the diagonal position of the pair of the second support plates, and is formed in the same manner as described above. The other pair of diagonal positions of the pair of the third support plates differing from each other to form a diagonal position.

又,申請專利範圍第2項所述之探針單元,係在申請專利範圍第1項所述之探針單元中,前述間隔物係圍繞前述各探針形成俯視為ㄈ字形。 Further, in the probe unit according to the first aspect of the invention, the probe unit according to the first aspect of the invention, wherein the spacer is formed in a U shape in a plan view around the probes.

又,申請專利範圍第3項所述之基板檢查裝置係具有:探針單元,如申請專利範圍第1或2項所述;以及檢查部,依據透過接觸到基板的導體部之前述探針單元的前述探針以輸入之電氣訊號,檢查前述基板。 Further, the substrate inspection apparatus according to the third aspect of the invention is characterized in that: the probe unit has the probe unit as described in claim 1 or 2; and the inspection portion is based on the probe unit that transmits the conductor portion that is in contact with the substrate. The aforementioned probe checks the aforementioned substrate with an input electrical signal.

又,申請專利範圍第4項所述之探針單元製造方法,係其製造探針單元,前述探針單元具有:複數個探針,用於使尖端部接觸到基板的導體部,以進行電氣訊號之輸出入;以及支撐部,支撐前述探針,其特徵在於:使用前述支撐部,前述支撐部之構成係具有:第1支撐板,具有第1支撐孔,以支撐貫穿該第1支撐孔之前述尖端部;第2支撐板,具有第2支撐孔,以支撐貫穿該第2支撐孔之前述探針的基端部;以及第3支撐板,具有第3支撐孔,以支撐貫穿該第3支撐孔之前述基端部;而被配置使得該各支撐板以此順序相向,同時構成為具有間隔物被配設於前述第1支撐板與前述第2支撐板間, 前述第1支撐板、前述第2支撐板以及前述第3支撐板係各自形成俯視為四邊形,以第1定位銷貫穿在前述第1支撐板中一對的對角位置各形成一個之第1貫穿孔,以及在相向前述第1支撐板的前述各對角位置的前述第2支撐板中一對的對角位置各形成一個同時在相向前述第1支撐板的前述各對角位置的前述第3支撐板中一對的對角位置各形成一個之第2貫穿孔,維持前述第1支撐孔、前述第2支撐孔及前述第3支撐孔的各開口面,沿著相對於前述各支撐部而言垂直之垂直方向,在假想直線上相向地,使前述各支撐板彼此抵接或接近以重疊之之狀態,在此狀態下貫穿前述探針到該各支撐孔,之後,在前述第2支撐板及前述第3支撐板抵接或接近之狀態下,分離前述第1支撐板與該第2支撐板,拔出前述第1定位銷,並在前述第1支撐板與前述第2支撐板之間配設前述間隔物,以第2定位銷貫穿前述第1貫穿孔以及在前述間隔物中相向前述第1支撐板的面形成之第1貫入孔,同時以第3定位銷貫穿在與前述第2支撐板中前述一對的對角位置相異之另一對的對角位置各形成一個且在與前述第3支撐板中前述一對的對角位置相異之另一對對角位置各形成一個之第3貫穿孔以及在前述間隔物中相向前述第1支撐板的面形成之第2貫入孔,使該各支撐板轉換成前述第1支撐孔、前述第2支撐孔及前述第3支撐孔的各開口面,沿著相對於該各支撐板的層積方向而言傾斜之傾斜方向,在假想直線上相向之姿勢,在此狀態下該各支撐板被固定於前述間隔物,前述尖端部沿著前述第1支撐孔延伸,同時除了該尖端部之部分係沿著前述傾斜方向延伸之狀態下,維持前 述探針以製造前述探針單元。 Further, in the probe unit manufacturing method according to the fourth aspect of the invention, the probe unit is manufactured, wherein the probe unit has a plurality of probes for bringing the tip end portion into contact with the conductor portion of the substrate to perform electrical And the support portion supporting the probe, wherein the support portion is configured to have a first support plate having a first support hole for supporting the first support hole The second support plate has a second support hole for supporting a base end portion of the probe penetrating the second support hole; and a third support plate having a third support hole for supporting the penetrating portion 3, the base end portion of the support hole; and the support plates are arranged in this order, and the spacer is disposed between the first support plate and the second support plate; Each of the first support plate, the second support plate, and the third support plate is formed in a quadrangular shape in a plan view, and the first positioning pin is inserted through a pair of diagonal positions of the first support plate to form a first through-hole. a hole and a pair of diagonal positions of the pair of second support plates facing the respective diagonal positions of the first support plate are formed at the same time as the third of the diagonal positions facing the first support plate a second through hole is formed in each of the pair of diagonal positions of the support plate, and the opening faces of the first support hole, the second support hole, and the third support hole are maintained, and are along the respective support portions. In the vertical direction of the vertical direction, the support plates are brought into contact with each other or close to each other on the imaginary straight line, and the probe is inserted into the support holes in this state, and then the second support is provided. The first support plate and the second support plate are separated from each other by the first support plate and the second support plate in a state in which the third support plate is in contact with or close to the first support plate, and the first support plate and the second support plate are Between the foregoing spacers, (2) the positioning pin penetrates the first through hole and the first penetration hole formed on the surface of the spacer facing the first support plate, and the third positioning pin penetrates the pair of the pair of the second support plate The other diagonal position of the other pair of angular positions is formed one by one and the third through hole is formed in the other diagonal position different from the diagonal position of the pair of the third support plates. a second penetration hole formed in a surface of the spacer facing the first support plate, wherein each of the support plates is converted into an opening surface of the first support hole, the second support hole, and the third support hole, along The inclined direction of the inclined direction of the support plates is opposite to each other on a virtual straight line. In this state, the support plates are fixed to the spacers, and the tip end portions are along the first support holes. Extending while maintaining the state in which the tip portion extends along the aforementioned oblique direction The probe is described to manufacture the aforementioned probe unit.

又,申請專利範圍第5項所述之探針單元製造方法,係在申請專利範圍第4項所述之探針單元製造方法中,形成俯視為ㄈ字形的前述間隔物係圍繞前述各探針地配設於前述第1支撐板與前述第2支撐板之間。 The probe unit manufacturing method according to claim 4, wherein the spacer unit having a U-shaped plan view surrounds each of the probes. The ground is disposed between the first support plate and the second support plate.

在申請專利範圍第1項所述之探針單元、申請專利範圍第3項所述之基板檢查裝置、及申請專利範圍第4項所述之探針單元製造方法中,在使各支撐板維持之狀態下,貫穿探針到各支撐孔,之後,使各支撐板轉移姿勢,以維持該狀態,藉各支撐板保持探針。因此,在探針單元、基板檢查裝置及探針單元製造方法中,在組立時,偏移各支撐板的位置,藉此,可使第1支撐孔、第2支撐孔及第3支撐孔的各開口面,沿著傾斜方向在假想直線上相向,結果,無須在偏移各穿孔的中心之狀態下,層積複數支撐板,以形成一塊基端部側支撐部之高難度技術,所以,藉此可充分降低探針單元及基板檢查裝置之製造成本。 In the probe unit according to the first aspect of the invention, the substrate inspection device according to the third aspect of the patent application, and the probe unit manufacturing method according to claim 4, wherein the support plates are maintained In this state, the probe is inserted into each of the support holes, and then the support plates are moved to maintain the state, and the probes are held by the support plates. Therefore, in the probe unit, the substrate inspection apparatus, and the probe unit manufacturing method, the positions of the respective support plates are shifted during assembly, whereby the first support hole, the second support hole, and the third support hole can be formed. Each of the opening faces faces on the imaginary straight line along the oblique direction. As a result, it is not necessary to slap the plurality of support plates in a state of offsetting the center of each of the perforations to form a base end side support portion. Thereby, the manufacturing cost of the probe unit and the substrate inspection device can be sufficiently reduced.

又,在探針單元、基板檢查裝置及探針單元製造方法中,僅以兩塊支撐板支撐探針的基端部。在此情形下,此種支撐板係形成很多個插入探針而支撐之支撐孔,所以,製造成本很高。因此,當依據此探針單元、基板檢查裝置及探針單元製造方法時,與使用數量很多之支撐板之構成及方法相比較下,支撐板減少之部分,可充分降低製造成本。又,在此探針單元、基板檢查裝置及探針單元製造方法中,在使各支撐板維 持之狀態下,貫穿探針到各支撐孔後,使各支撐板轉移姿勢,藉此,在尖端部側係沿著第1支撐孔延伸,除了尖端部側之部分係沿著傾斜方向延伸之狀態下,可使全部探針暫時維持(彈性變形),以組立探針單元。因此,與使自各開口面事先沿著傾斜方向相向地被形成之各支撐孔插入之探針持續彈性變形,插入各開口面沿著垂直方向相向之支撐孔之作業,係針對一支一支的探針進行,以組立探針單元之構成及方法相比較下,可充分縮短組立工序。因此,當依據此探針單元、基板檢查裝置及探針單元製造方法時,組立工序被縮短之部分,可充分減少製造成本。 Further, in the probe unit, the substrate inspection device, and the probe unit manufacturing method, the base end portion of the probe is supported by only two support plates. In this case, the support plate is formed with a plurality of support holes that are inserted into the probe and supported, so that the manufacturing cost is high. Therefore, when the probe unit, the substrate inspection device, and the probe unit manufacturing method are used, the manufacturing cost can be sufficiently reduced as compared with the configuration and method of using a large number of support plates. Further, in the probe unit, the substrate inspection device, and the probe unit manufacturing method, each support plate is made In the held state, after the probe is inserted into each of the support holes, the support plates are moved to the posture, whereby the tip end side extends along the first support hole, and the portion except the tip end side extends in the oblique direction. In this state, all probes can be temporarily maintained (elastically deformed) to assemble the probe unit. Therefore, the probe inserted into each of the support holes formed by the respective opening faces facing each other in the oblique direction is continuously elastically deformed, and the operation of inserting the support holes of the respective open faces facing each other in the vertical direction is for one set The probe is carried out, and the assembly process can be sufficiently shortened in comparison with the configuration and method of assembling the probe unit. Therefore, according to the probe unit, the substrate inspection apparatus, and the probe unit manufacturing method, the assembly process is shortened, and the manufacturing cost can be sufficiently reduced.

又,當依據申請專利範圍第2項所述之探針單元、及申請專利範圍第5項所述之探針單元製造方法時,在第1支撐板與第2支撐板之間配設圍繞各探針形成俯視為ㄈ字形間隔物,固定各支撐板在間隔物上,藉此,以簡易之構成及方法,就可以在短時間內確實且容易地使各支撐板維持姿勢,所以,能充分提高探針單元之製造效率,進而能充分提高基板檢查裝置之製造效率。 Further, in the probe unit according to the second aspect of the invention, and the probe unit manufacturing method according to claim 5, the first support plate and the second support plate are disposed around each other. The probe is formed in a U-shaped spacer in a plan view, and each of the support plates is fixed to the spacer. Therefore, the support plate can be reliably and easily held in a short time by a simple configuration and method. The manufacturing efficiency of the probe unit is improved, and the manufacturing efficiency of the substrate inspection device can be sufficiently improved.

1‧‧‧基板檢查裝置 1‧‧‧Substrate inspection device

2‧‧‧探針單元 2‧‧‧ probe unit

6‧‧‧檢查部 6‧‧‧ Inspection Department

11‧‧‧探針 11‧‧‧Probe

12‧‧‧本體部 12‧‧‧ Body Department

21‧‧‧尖端部 21‧‧‧ tip

22‧‧‧中間部 22‧‧‧Intermediate

23‧‧‧基端部 23‧‧‧ base end

31‧‧‧尖端部側支撐部 31‧‧‧ Tip side support

32‧‧‧基端部側支撐部 32‧‧‧ base end support

33‧‧‧間隔物 33‧‧‧ spacers

34a,34b,34c‧‧‧定位銷 34a, 34b, 34c‧‧‧ locating pins

41~44‧‧‧支撐板 41~44‧‧‧Support board

51~54‧‧‧支撐孔 51~54‧‧‧Support hole

61a,62a,63a,64a‧‧‧貫穿孔 61a, 62a, 63a, 64a‧‧‧through holes

65a,65b‧‧‧貫入孔 65a, 65b‧‧‧ penetration holes

65c‧‧‧螺孔 65c‧‧‧ screw hole

100‧‧‧基板 100‧‧‧Substrate

第1圖係表示基板檢查裝置1的構成之構成圖。 FIG. 1 is a configuration diagram showing the configuration of the substrate inspection apparatus 1.

第2圖係表示探針單元2的構成之構成圖。 Fig. 2 is a view showing the configuration of the probe unit 2.

第3圖係探針11之俯視圖。 Figure 3 is a plan view of the probe 11.

第4圖係使尖端部側支撐部31朝下之狀態之本體部12的分解立體圖。 Fig. 4 is an exploded perspective view of the main body portion 12 in a state where the tip end side support portion 31 faces downward.

第5圖係使基端部側支撐部32朝下之狀態之本體部12的分解立體圖。 Fig. 5 is an exploded perspective view of the main body portion 12 in a state where the proximal end side support portion 32 faces downward.

第6圖係本體部12的立體圖。 Fig. 6 is a perspective view of the body portion 12.

第7圖係說明探針單元2製造方法之第1說明圖。 Fig. 7 is a first explanatory diagram for explaining a method of manufacturing the probe unit 2.

第8圖係說明探針單元2製造方法之第2說明圖(第7圖中之Y面剖面圖)。 Fig. 8 is a second explanatory view (the Y-sectional cross-sectional view in Fig. 7) illustrating the method of manufacturing the probe unit 2.

第9圖係說明探針單元2製造方法之第3說明圖。 Fig. 9 is a third explanatory diagram for explaining the method of manufacturing the probe unit 2.

第10圖係說明探針單元2製造方法之第4說明圖(第6圖中之X面剖面圖)。 Fig. 10 is a fourth explanatory view (the X-sectional cross-sectional view in Fig. 6) illustrating the method of manufacturing the probe unit 2.

以下,針對本發明之探針單元、基板檢查裝置及探針單元製造方法之實施形態,參照圖面做說明。 Hereinafter, embodiments of the probe unit, the substrate inspection device, and the probe unit manufacturing method of the present invention will be described with reference to the drawings.

最初,針對基板檢查裝置1的構成做說明。第1圖所示之基板檢查裝置1之構成,如第1圖所示,其具有探針單元2、移動機構3、載置座4、測量部5、檢查部6、記憶部7及處理部8,可檢查基板100。 First, the configuration of the substrate inspection apparatus 1 will be described. As shown in Fig. 1, the substrate inspection device 1 shown in Fig. 1 includes a probe unit 2, a moving mechanism 3, a mount 4, a measuring unit 5, an inspection unit 6, a memory unit 7, and a processing unit. 8. The substrate 100 can be inspected.

如第2圖所示,探針單元2之構成係具有複數個探針11、本體部12及電極板13。 As shown in FIG. 2, the probe unit 2 has a plurality of probes 11, a main body portion 12, and an electrode plate 13.

探針11係用於在檢查時,接觸基板100中之導體圖案等之導體部,以進行電氣訊號之輸出入,茲做為一例,其係藉具有導電性之金屬材料(例如鈹銅合金、SKH(高速工具鋼)及鎢鋼等)形成可彈性變形之剖面形狀為圓形之棒狀。又,如第3圖所示,探針11的尖端部21及基端部23,係分別形成銳利狀態。又,在探針11的中間部22的周面,形成有以具有 絕緣性之被覆材料(茲做為一例,例如氟系樹脂、聚氨酯、聚酯及聚酰亞胺等)所形成之絕緣層。因此,中間部22的直徑L2係比尖端部21的直徑L1及基端部23的直徑L3還要大。亦即,探針11係尖端部21及基端部23的直徑比中間部22的直徑還要小。 The probe 11 is used to contact a conductor portion such as a conductor pattern in the substrate 100 during inspection to perform electrical signal input and output, and is exemplified by a conductive metal material (for example, beryllium copper alloy, SKH (high-speed tool steel) and tungsten steel, etc., form an elastically deformable cross-sectional shape of a circular rod. Further, as shown in Fig. 3, the tip end portion 21 and the base end portion 23 of the probe 11 are respectively formed in a sharp state. Further, the peripheral surface of the intermediate portion 22 of the probe 11 is formed to have An insulating coating formed of an insulating coating material (for example, a fluorine resin, a polyurethane, a polyester, a polyimide, or the like). Therefore, the diameter L2 of the intermediate portion 22 is larger than the diameter L1 of the tip end portion 21 and the diameter L3 of the base end portion 23. That is, the diameter of the tip end portion 21 and the base end portion 23 of the probe 11 is smaller than the diameter of the intermediate portion 22.

本體部12之構成係相當於支撐部,如第2圖、第4圖~第6圖所示,其具有尖端部側支撐部31、基端部側支撐部32及間隔物33,可支撐探針11。尖端部側支撐部31之構成係支撐探針11的尖端部21側之構件,其具有支撐板41及支撐板42。在此情形下,在此構成例中,係藉支撐板41,42構成第1支撐板。 The configuration of the main body portion 12 corresponds to a support portion, and as shown in Fig. 2 and Fig. 4 to Fig. 6, the tip end portion side support portion 31, the base end portion side support portion 32, and the spacer 33 are supported to support the probe portion. Needle 11. The tip end side support portion 31 is a member that supports the tip end portion 21 side of the probe 11 and has a support plate 41 and a support plate 42. In this case, in this configuration example, the first support plates are constituted by the support plates 41, 42.

支撐板41,茲做為一例,其係以具有非導電性之樹脂材料,被形成板狀。又,如第5圖及第8圖所示,在支撐板41形成有俯視為圓形之複數個(與探針11的數量相同)支撐孔51(第1支撐孔)。如第8圖所示,支撐孔51的直徑R1比探針11的尖端部21的直徑L1略大,而且,比探針11的中間部22的直徑L2略小,可不貫穿中間部22,而僅貫穿尖端部21。 The support plate 41 is exemplified as a resin material having a non-conductivity, and is formed into a plate shape. Further, as shown in FIGS. 5 and 8, the support plate 41 is formed with a plurality of support holes 51 (first support holes) having a circular shape in plan view (the same number as the probes 11). As shown in Fig. 8, the diameter R1 of the support hole 51 is slightly larger than the diameter L1 of the tip end portion 21 of the probe 11, and is slightly smaller than the diameter L2 of the intermediate portion 22 of the probe 11, and may not penetrate the intermediate portion 22, Only the tip end portion 21 is penetrated.

又,如第5圖、第8圖及第10圖所示,在支撐板41形成有複數個(例如兩個)貫穿孔61a,貫穿孔61a可插入在下述之探針單元2的組立工序中使用之定位銷34a,34c。又,如第5圖所示,在支撐板41形成有複數個(例如六個)固定孔61b,固定孔61b可插入固定支撐板41及支撐板42到間隔物33上時使用之螺栓35。 Further, as shown in FIGS. 5, 8 and 10, a plurality of (for example, two) through holes 61a are formed in the support plate 41, and the through holes 61a can be inserted into the assembly process of the probe unit 2 described below. Locating pins 34a, 34c are used. Further, as shown in Fig. 5, a plurality of (for example, six) fixing holes 61b are formed in the support plate 41, and the fixing holes 61b can be inserted into the bolts 35 used for fixing the support plate 41 and the support plate 42 to the spacers 33.

支撐板42以與支撐板41相同之材料(在此例中,係具有非導電性之樹脂材料)形成板狀。又,如第4圖及第8圖所示,在支撐板42形成有俯視為圓形之複數個(與探針11的數量相同)支撐孔52(第1支撐孔)。如第8圖所示,支撐孔52的直徑R2係與支撐板41的支撐孔51的直徑R1相同,可不貫穿中間部22,而僅貫穿尖端部21。 The support plate 42 is formed into a plate shape by the same material as the support plate 41 (in this example, a resin material having non-conductivity). Further, as shown in FIGS. 4 and 8, the support plate 42 is formed with a plurality of support holes 52 (first support holes) having a circular shape in plan view (the same number as the probes 11). As shown in Fig. 8, the diameter R2 of the support hole 52 is the same as the diameter R1 of the support hole 51 of the support plate 41, and does not penetrate the intermediate portion 22, but only penetrates the tip end portion 21.

又,如第4圖、第8圖及第10圖所示,在支撐板42形成有複數個(例如兩個)貫穿孔62a,貫穿孔62a可插入上述之定位銷34a,34c。又,如第4圖所示,在支撐板42形成有複數個(例如六個)固定孔62b,固定孔62b可插入上述之螺栓35。 Further, as shown in FIGS. 4, 8 and 10, a plurality of (for example, two) through holes 62a are formed in the support plate 42, and the above-mentioned positioning pins 34a, 34c can be inserted into the through holes 62a. Further, as shown in Fig. 4, a plurality of (for example, six) fixing holes 62b are formed in the support plate 42, and the fixing holes 62b can be inserted into the bolts 35 described above.

基端部側支撐部32之構成係支撐探針11的基端部23側之構件,如第2圖、第4圖及第5圖所示,其具有支撐板43(第2支撐板)及支撐板44(第3支撐板)。支撐板41,茲做為一例,其係以具有非導電性之樹脂材料,被形成板狀。又,如第5圖及第8圖所示,在支撐板43形成有俯視為圓形之複數個(與探針11的數量相同)支撐孔53(第2支撐孔)。如第8圖所示,支撐孔53的直徑R3比探針11的中間部22的直徑L2略大,可貫穿中間部22。 The base end side support portion 32 is a member that supports the base end portion 23 side of the probe 11, and has a support plate 43 (second support plate) as shown in FIGS. 2, 4, and 5; Support plate 44 (third support plate). The support plate 41 is exemplified as a resin material having a non-conductivity, and is formed into a plate shape. Further, as shown in FIGS. 5 and 8, the support plate 43 is formed with a plurality of support holes 53 (second support holes) having a circular shape in plan view (the same number as the probes 11). As shown in FIG. 8, the diameter R3 of the support hole 53 is slightly larger than the diameter L2 of the intermediate portion 22 of the probe 11, and can penetrate the intermediate portion 22.

又,如第5圖、第8圖及第10圖所示,在支撐板43形成有複數個(例如兩個)貫穿孔63a及複數個(例如兩個)貫穿孔63b,貫穿孔63a及貫穿孔63b可插入在探針單元2的組立工序中使用之定位銷34b,34c。又,如第5圖所示,在支撐板43形成有複數個(例如六個)固定孔63c,固定孔63c 可插入固定支撐板43及支撐板44到間隔物33上時使用之螺栓35。 Further, as shown in FIGS. 5, 8 and 10, a plurality of (for example, two) through holes 63a and a plurality of (for example, two) through holes 63b, through holes 63a and through are formed in the support plate 43. The hole 63b can be inserted into the positioning pins 34b, 34c used in the assembly process of the probe unit 2. Further, as shown in FIG. 5, a plurality of (for example, six) fixing holes 63c are formed in the support plate 43, and the fixing holes 63c are formed. A bolt 35 for fixing the support plate 43 and the support plate 44 to the spacer 33 can be inserted.

支撐板44以與支撐板43相同之材料(在此例中,係具有非導電性之樹脂材料)形成板狀。又,如第4圖及第8圖所示,在支撐板44形成有俯視為圓形之複數個(與探針11的數量相同)支撐孔54(第3支撐孔)。在此情形下,如第8圖所示,支撐孔54的直徑R4係與支撐板43的支撐孔53的直徑R1相同,可貫穿中間部22。 The support plate 44 is formed into a plate shape by the same material as the support plate 43 (in this example, a resin material having non-conductivity). Further, as shown in FIGS. 4 and 8, the support plate 44 is formed with a plurality of support holes 54 (third support holes) having a circular shape in plan view (the same number as the probes 11). In this case, as shown in FIG. 8, the diameter R4 of the support hole 54 is the same as the diameter R1 of the support hole 53 of the support plate 43, and can penetrate the intermediate portion 22.

又,如第4圖、第8圖及第10圖所示,在支撐板44形成有複數個(例如兩個)貫穿孔64a及複數個(例如兩個)貫穿孔64b,貫穿孔64a及貫穿孔64b可插入上述之定位銷34b,34c。又,如第4圖所示,在支撐板44形成有複數個(例如六個)固定孔64c,固定孔64c可插入上述之螺栓35。 Further, as shown in FIGS. 4, 8 and 10, a plurality of (for example, two) through holes 64a and a plurality of (for example, two) through holes 64b, through holes 64a and through are formed in the support plate 44. The hole 64b can be inserted into the above-described positioning pins 34b, 34c. Further, as shown in Fig. 4, a plurality of (for example, six) fixing holes 64c are formed in the support plate 44, and the fixing holes 64c can be inserted into the bolts 35 described above.

如第4圖及第5圖所示,間隔物33被形成俯視為ㄈ字形,如第6圖所示,其被配設於尖端部側支撐部31與基端部側支撐部32之間(支撐板42與支撐板43之間)。此間隔物33具有使以支撐板41及支撐板42構成之尖端部側支撐部31,與以支撐板43及支撐板44構成之基端部側支撐部32,維持隔開狀態之功能。 As shown in FIGS. 4 and 5, the spacer 33 is formed in a U-shape in a plan view, and as shown in FIG. 6, it is disposed between the tip end side support portion 31 and the base end side support portion 32 ( Between the support plate 42 and the support plate 43). The spacer 33 has a function of maintaining the state in which the tip end side support portion 31 including the support plate 41 and the support plate 42 and the base end side support portion 32 including the support plate 43 and the support plate 44 are separated from each other.

又,如第5圖所示,在間隔物33中之尖端部側(第5圖中之上部側)的端面上,形成有可插入上述定位銷34a之貫入孔65a。又,如第4圖所示,在間隔物33中之基端部側(第4圖中之上部側)的端面上,形成有可插入上述定位銷34b之貫入孔65b。而且,第4圖及第5圖所示,在間隔物33的尖端 部側端面及基端部側端面上,形成有可螺入上述螺栓35之複數個(在本例中,係分別各六個,合計十二個)螺孔65c。 Further, as shown in Fig. 5, a penetration hole 65a into which the positioning pin 34a can be inserted is formed on the end surface of the tip end portion side (the upper portion side in Fig. 5) of the spacer 33. Further, as shown in Fig. 4, a penetration hole 65b into which the positioning pin 34b can be inserted is formed on the end surface of the spacer 33 on the proximal end side (the upper portion side in Fig. 4). Moreover, as shown in Figs. 4 and 5, at the tip of the spacer 33 On the side end surface and the end surface side end surface, a plurality of screw holes 65c that can be screwed into the bolts 35 (in this example, six in total, twelve in total) are formed.

在此情形下,於探針單元2中,如第8圖所示,支撐板41的貫穿孔61a、支撐板42的貫穿孔62a、支撐板43的貫穿孔63a及支撐板44的貫穿孔64a中之各中心軸成為同軸狀態時,各貫穿孔61a,62a,63a,64a的形成位置被定義,使得支撐板41的各支撐孔51、支撐板42的各支撐孔52、支撐板43的各支撐孔53及支撐板44的各支撐孔54中之各中心軸成為同軸狀態,亦即,使得各支撐孔51~54的各開口面,沿著相對於各支撐板41~44而言垂直的方向(以下,單稱「垂直方向」),在假想直線A1(第8圖中,以虛線所示之部分)上相向(在假想直線A1上並列)。 In this case, in the probe unit 2, as shown in Fig. 8, the through hole 61a of the support plate 41, the through hole 62a of the support plate 42, the through hole 63a of the support plate 43, and the through hole 64a of the support plate 44 When each of the center axes is in the coaxial state, the positions at which the respective through holes 61a, 62a, 63a, 64a are formed are defined such that the support holes 51 of the support plate 41, the support holes 52 of the support plate 42, and the support plates 43 are each The central axes of the support holes 53 and the support holes 54 of the support plate 44 are in a coaxial state, that is, the respective open faces of the support holes 51 to 54 are perpendicular to the support plates 41 to 44. The direction (hereinafter, simply referred to as "vertical direction") is opposite to each other on the imaginary straight line A1 (portion indicated by a broken line in Fig. 8) (parallel on the imaginary straight line A1).

又,在此探針單元2中,如第10圖所示,當支撐板41的貫穿孔61a、支撐板42的貫穿孔62a及間隔物33的貫入孔65a中之各中心軸成為同軸狀態,而且,支撐板43的貫穿孔63b、支撐板44的貫穿孔64b及間隔物33的貫入孔65b中之各中心軸成為同軸狀態時,各貫穿孔61a,62a,65a,63b,64b與各貫入孔65a,65b的形成位置被定義,使得各支撐孔51,52的各開口面沿著垂直方向,在假想直線A2(第10圖中,以虛線所示之部分)上相向(在假想直線A2上並列),而且,支撐孔52,53,54的各開口面沿著相對於各支持板41~44的層積方向(厚度方向)而言傾斜之方向(以下,單稱「傾斜方向」),在假想直線A3(第10圖中,以中心線所示之部分)上相向(在假想直線A3上並列)。 Further, in the probe unit 2, as shown in Fig. 10, the central axes of the through holes 61a of the support plate 41, the through holes 62a of the support plate 42, and the penetration holes 65a of the spacers 33 are coaxial. Further, when the central axis of each of the through hole 63b of the support plate 43 and the through hole 64b of the support plate 44 and the penetration hole 65b of the spacer 33 is coaxial, each of the through holes 61a, 62a, 65a, 63b, 64b and each penetration The formation positions of the holes 65a, 65b are defined such that the respective opening faces of the respective support holes 51, 52 face each other in the vertical direction on the imaginary straight line A2 (the portion indicated by a broken line in Fig. 10) (in the imaginary straight line A2) Further, the opening faces of the support holes 52, 53, 54 are inclined in the direction of the stacking direction (thickness direction) of each of the support plates 41 to 44 (hereinafter, simply referred to as "inclination direction"). In the imaginary straight line A3 (the portion shown by the center line in Fig. 10), the opposite directions (parallel on the imaginary straight line A3).

又,在此探針單元2中,如第2圖所示,在構成尖端部側支撐部31之支撐板41,42的支撐孔51,52,貫穿有探針11的尖端部21,在構成基端部側支撐部32之支撐板43,44的支撐孔53,54,貫穿有探針11的基端部23之狀態下,探針11被本體部12支撐。又,如第2圖所示,探針11係被本體部12支撐,使得尖端部21側沿著垂直方向延伸,除了尖端部21側之部分沿著傾斜方向延伸。在此情形下,探針11係除了尖端部21側之部分傾斜,所以,當探針單元2全體往接近基板100之方向移動時,尖端部21接觸到基板100的導體部,此時,傾斜部分對應來自導體部之按壓力(反作用力)之施加而彎曲,藉此,自本體部12(尖端部側支撐部31)之突出量會變化(增減)。 Further, in the probe unit 2, as shown in Fig. 2, the support holes 51, 52 of the support plates 41, 42 constituting the tip end side support portion 31 penetrate the tip end portion 21 of the probe 11, and are configured. The probes 11 are supported by the main body portion 12 in a state in which the support holes 53, 54 of the support plates 43, 44 of the base end side support portion 32 penetrate the base end portion 23 of the probe 11. Further, as shown in Fig. 2, the probe 11 is supported by the main body portion 12 such that the tip end portion 21 side extends in the vertical direction, except that the portion on the tip end portion 21 side extends in the oblique direction. In this case, the probe 11 is inclined except for the portion on the side of the tip end portion 21, so that when the entire probe unit 2 moves toward the substrate 100, the tip end portion 21 comes into contact with the conductor portion of the substrate 100, at this time, the tilt The portion is bent in accordance with the application of the pressing force (reaction force) from the conductor portion, whereby the amount of protrusion from the main body portion 12 (the tip end side supporting portion 31) changes (increases or decreases).

電極板13係以具有非導電性之樹脂材料等,被形成板狀,如第2圖所示,被配設於本體部12中之基端部側支撐部32的上部。又,在電極板13中之與各探針11的各基端部23之接觸部位處,嵌入有具有導電性之端子,在此各端子處,分別連接有用於電性連接探針11與測量部5之電線。 The electrode plate 13 is formed into a plate shape by a non-conductive resin material or the like, and is disposed on the upper portion of the proximal end side support portion 32 of the main body portion 12 as shown in FIG. 2 . Further, at the contact portion of the electrode plate 13 with each of the base end portions 23 of the probes 11, a terminal having conductivity is embedded, and at each of the terminals, a probe 11 for electrical connection and measurement are respectively connected. Ministry 5 wire.

移動機構3係遵照處理部8的控制,使探針單元2往載置座4(被載置於載置座4上之基板100)移動及自載置座4離開。載置座4之構成係可載置基板100,同時可固定被載置之基板100。測量部5係依據透過探針11輸出入之電氣訊號,實施測量物理量(例如電阻值)之測量處理。 The moving mechanism 3 moves the probe unit 2 to the mount 4 (the substrate 100 placed on the mount 4) and away from the mount 4 in accordance with the control of the processing unit 8. The mounting base 4 is configured to mount the substrate 100 and to fix the substrate 100 placed thereon. The measuring unit 5 performs a measurement process of measuring a physical quantity (for example, a resistance value) based on an electrical signal transmitted through the probe 11.

檢查部6係遵照處理部8的控制,實施依據以測量部5測得之做為物理量之電阻值,檢查基板100良否(導體 部有無斷線或短路)之檢查處理。記憶部7係遵照處理部8的控制,暫時記憶以測量部5測得之電阻值或以檢查部6進行之檢查結果等。處理部8控制構成基板檢查裝置1之各部。 The inspection unit 6 performs the resistance value based on the physical quantity measured by the measurement unit 5 in accordance with the control of the processing unit 8, and checks whether the substrate 100 is good or not (conductor) Check whether there is any disconnection or short circuit in the department. The memory unit 7 temporarily stores the resistance value measured by the measurement unit 5 or the inspection result by the inspection unit 6 in accordance with the control of the processing unit 8. The processing unit 8 controls the respective units constituting the substrate inspection device 1.

接著,參照圖面說明探針單元2的製造方法。 Next, a method of manufacturing the probe unit 2 will be described with reference to the drawings.

首先,如第7圖及第8圖所示,使各支撐板41~44在彼此抵接之狀態下重疊。接著,對位使得各支撐板41~44中之各貫穿孔61a~64a的中心軸成為同軸。此時,如第8圖所示,支撐板41~44中之各支撐孔51~54的各開口面,係沿著垂直方向在假想直線A1上相向。接著,如相同圖面所示,貫穿定位銷34c到各貫穿孔61a~64a。藉此,各支撐板41~44被維持在此姿勢(彼此抵接,而各支撐孔51~54的各開口面,係沿著垂直方向在假想直線A1上相向之姿勢:第1姿勢)。 First, as shown in FIGS. 7 and 8, the support plates 41 to 44 are superposed on each other in a state of being in contact with each other. Next, the alignment is such that the central axes of the respective through holes 61a to 64a of the respective support plates 41 to 44 are coaxial. At this time, as shown in Fig. 8, the respective opening faces of the support holes 51 to 54 of the support plates 41 to 44 face each other on the imaginary straight line A1 in the vertical direction. Next, as shown in the same figure, the positioning pin 34c is inserted through the respective through holes 61a to 64a. Thereby, each of the support plates 41 to 44 is maintained in this posture (they are in contact with each other, and each of the opening faces of the support holes 51 to 54 is in a posture that faces the imaginary straight line A1 in the vertical direction: the first posture).

接著,如第8圖所示,自支撐板44的支撐孔54插入探針11的尖端部21,以貫穿探針11到支撐板43的支撐孔53、支撐板42的支撐孔52及支撐板41的支撐孔51。在此情形下,支撐孔51及支撐孔52的直徑R1,R2,係比探針11中之中間部22的直徑L2還要小,所以,僅探針11的尖端部21貫穿各支撐孔51,52。接著,同樣地貫穿探針11到各支撐孔51~54。 Next, as shown in FIG. 8, the support hole 54 of the self-supporting plate 44 is inserted into the tip end portion 21 of the probe 11, to penetrate the probe 11 to the support hole 53 of the support plate 43, the support hole 52 of the support plate 42, and the support plate. Support hole 51 of 41. In this case, the diameters R1, R2 of the support hole 51 and the support hole 52 are smaller than the diameter L2 of the intermediate portion 22 in the probe 11, so that only the tip end portion 21 of the probe 11 penetrates through the support holes 51. 52. Next, the probe 11 is inserted through the support holes 51 to 54 in the same manner.

接著,如第9圖所示,維持支撐板41與支撐板42抵接,而且,支撐板43與支撐板44抵接之狀態,分離支撐板42與支撐板43,接著,自各貫穿孔61a~64a拔出定位銷34c,接著,在支撐板42與支撐板43之間配設間隔物33。 Next, as shown in FIG. 9, the support plate 41 is held in contact with the support plate 42, and the support plate 43 is in contact with the support plate 44, and the support plate 42 and the support plate 43 are separated, and then, from the respective through holes 61a. The positioning pin 34c is pulled out by the 64a, and then the spacer 33 is disposed between the support plate 42 and the support plate 43.

接著,如第10圖所示,進行對位,使得支撐板41 的貫穿孔61a、支撐板42的貫穿孔62a及間隔物33的貫入孔65a中之各中心軸成為同軸,接著,貫穿定位銷34a到各貫穿孔61a,62a以及貫入孔65a。此時,維持支撐板41的支撐孔51及支撐板42的支撐孔52的各開口面,沿著垂直方向在假想直線A2上相向之狀態。 Next, as shown in FIG. 10, the alignment is performed such that the support plate 41 The through hole 61a, the through hole 62a of the support plate 42, and the center hole of the penetration hole 65a of the spacer 33 are coaxial, and then the positioning pin 34a is penetrated to each of the through holes 61a and 62a and the penetration hole 65a. At this time, the opening faces of the support holes 51 of the support plate 41 and the support holes 52 of the support plate 42 are maintained in a state of being opposed to each other on the imaginary straight line A2 in the vertical direction.

接著,貫穿螺栓35到支撐板41的固定孔61b及支撐板42的固定孔62b,螺入螺栓35的尖端部到被形成於間隔物33的尖端部側的端面上之螺孔65c。藉此,支撐板41及支撐板42被固定在間隔物33上。 Then, the through hole 35 is inserted into the fixing hole 61b of the support plate 41 and the fixing hole 62b of the support plate 42, and the tip end portion of the bolt 35 is screwed into the screw hole 65c formed in the end surface on the tip end side of the spacer 33. Thereby, the support plate 41 and the support plate 42 are fixed to the spacer 33.

接著,如第10圖所示,進行對位,使得支撐板44的貫穿孔64b、支撐板43的貫穿孔63b及間隔物33的貫入孔65b中之各中心軸成為同軸,接著,貫穿定位銷34b到各貫穿孔63b,64b以及貫入孔65b。此時,維持支撐板42的支撐孔52、支撐板43的支撐孔53及支撐板44的支撐孔54的各開口面,沿著傾斜方向在假想直線A3上相向之狀態。 Next, as shown in FIG. 10, the alignment is performed so that the central axes of the through holes 64b of the support plate 44, the through holes 63b of the support plate 43, and the penetration holes 65b of the spacers 33 are coaxial, and then the positioning pins are penetrated. 34b to each of the through holes 63b, 64b and the penetration hole 65b. At this time, the support holes 52 of the support plate 42, the support holes 53 of the support plate 43, and the opening faces of the support holes 54 of the support plate 44 are maintained in a state of being opposed to each other on the imaginary straight line A3 in the oblique direction.

接著,貫穿螺栓35到支撐板43的固定孔63c及支撐板44的固定孔64c,螺入螺栓35的尖端部到被形成於間隔物33的基端部側的端面上之螺孔65c。藉此,支撐板43及支撐板44被固定在間隔物33上。 Then, the through hole 35 is inserted into the fixing hole 63c of the support plate 43 and the fixing hole 64c of the support plate 44, and the tip end portion of the bolt 35 is screwed into the screw hole 65c formed on the end surface on the proximal end side of the spacer 33. Thereby, the support plate 43 and the support plate 44 are fixed to the spacer 33.

在此狀態下,如第10圖所示,維持支撐板41與支撐板42抵接,而且,支撐板43與支撐板44抵接之狀態,分離支撐板42與支撐板43,同時維持支撐孔51及支撐孔52的各開口面,沿著垂直方向在假想直線A2上相向,而且,支撐孔52、支撐孔53及支撐孔54的各開口面,沿著傾斜方向在 假想直線A3上相向之姿勢(第2姿勢)。接著,固定電極板13到基端部側支撐部32的外側。藉此,如第6圖所示,探針單元2的製造即告結束(在相同圖面中,省略電極板13的圖示)。 In this state, as shown in FIG. 10, the support plate 41 is maintained in contact with the support plate 42, and the support plate 43 is in contact with the support plate 44, and the support plate 42 and the support plate 43 are separated while maintaining the support hole. 51 and the opening faces of the support holes 52 face each other on the imaginary straight line A2 along the vertical direction, and the opening faces of the support holes 52, the support holes 53 and the support holes 54 are along the oblique direction. Imagine the posture on the straight line A3 (second posture). Next, the electrode plate 13 is fixed to the outside of the proximal end side support portion 32. Thereby, as shown in Fig. 6, the manufacture of the probe unit 2 is completed (in the same drawing, the illustration of the electrode plate 13 is omitted).

在此探針單元2及探針單元製造方法中,使用僅以兩塊支撐板41,42形成之尖端部側支撐部31、及僅以兩塊支撐板43,44形成之基端部側支撐部32,所以,與使用以數量較多之支撐板形成支撐部之構成及方法相比較下,可抑制探針單元2的製造成本。又,在此探針單元2及探針單元製造方法中,在組立時,偏移各支撐板41~44的位置,藉此,使支撐孔52、支撐孔53及支撐孔54的各開口面的相向方向(支撐孔52、53及54的並列方向),相對於各支撐板41~44的層積方向而言傾斜。因此,在此探針單元2及探針單元製造方法中,無須在少許偏移各穿孔的中心的狀態下,層積各支撐板以形成為一塊之高難度技術,所以,藉此可抑制探針單元2的製造成本。而且,在此探針單元2及探針單元製造方法中,在使各支撐板41~44,維持在各支撐孔51~54的各開口面,沿著相對於各支撐板41~44的層積方向而言垂直的方向,在假想直線A1上相向之第1姿勢之狀態下,貫穿探針11到各支撐孔51~54,之後,轉移各支撐板41~44到第2姿勢,藉此,可製造探針單元2,所以,與使自各開口面事先沿著傾斜方向相向地被形成之基端部側支撐部32的各支撐孔54,53插入之探針11持續彈性變形,插入各開口面沿著垂直方向相向之尖端部側支撐部31的支撐孔52,51之作業,係一支一支探針11 地進行以組立探針單元2之構成及方法相比較下,可充分縮短組立工序。 In the probe unit 2 and the probe unit manufacturing method, the tip end side support portion 31 formed of only two support plates 41, 42 and the base end side support formed by only two support plates 43, 44 are used. Since the portion 32 is used, the manufacturing cost of the probe unit 2 can be suppressed as compared with the configuration and method in which the support portion is formed by using a large number of support plates. Further, in the probe unit 2 and the probe unit manufacturing method, at the time of assembly, the positions of the support plates 41 to 44 are shifted, whereby the opening faces of the support hole 52, the support hole 53, and the support hole 54 are provided. The opposing directions (the parallel directions of the support holes 52, 53 and 54) are inclined with respect to the stacking direction of the respective support plates 41 to 44. Therefore, in the probe unit 2 and the probe unit manufacturing method, it is not necessary to laminate the support plates to form a difficult technique in a state where the center of each of the perforations is slightly shifted, so that the detection can be suppressed. The manufacturing cost of the needle unit 2. Further, in the probe unit 2 and the probe unit manufacturing method, each of the support plates 41 to 44 is maintained on each of the opening faces of the support holes 51 to 54 along the layer with respect to each of the support plates 41 to 44. In the vertical direction of the product direction, the probe 11 is inserted into each of the support holes 51 to 54 in a state in which the virtual line A1 faces the first posture, and then the support plates 41 to 44 are moved to the second posture. Since the probe unit 2 can be manufactured, the probes 11 inserted into the respective support holes 54, 53 of the proximal end side support portions 32 which are formed in advance in the oblique direction from the respective opening faces are continuously elastically deformed, and inserted into each The operation of the support holes 52, 51 of the tip end side support portion 31 facing the vertical direction in the vertical direction is a probe 11 In comparison with the configuration and method of assembling the probe unit 2, the assembly process can be sufficiently shortened.

接著,針對使用基板檢查裝置1以進行基板100檢查之基板檢查方法,參照圖面做說明。 Next, a substrate inspection method for performing substrate inspection using the substrate inspection apparatus 1 will be described with reference to the drawings.

首先,使尖端部側支撐部31為朝下狀態之探針單元2,固定在移動機構3(參照第1圖)。接著,載置基板100在載置座4的載置面,接著,藉圖面外之固定件,固定基板100在載置座4上。接著,作動基板檢查裝置1。此時,處理部8係控制移動機構3,以移動(下降)探針單元2往接近基板100(載置座4的載置面)之方向(第1圖中之朝下方向)。 First, the probe unit 2 having the tip end side support portion 31 facing downward is fixed to the moving mechanism 3 (see FIG. 1). Next, the mounting substrate 100 is placed on the mounting surface of the mount 4, and then the substrate 100 is fixed to the mount 4 by means of a fixing member outside the drawing. Next, the substrate inspection device 1 is actuated. At this time, the processing unit 8 controls the moving mechanism 3 to move (lower) the probe unit 2 toward the substrate 100 (the mounting surface of the mount 4) (the downward direction in FIG. 1).

接著,處理部8係控制移動機構3,在使探針單元2僅移動事先決定之移動量之時點上,停止其移動。接著,處理部8係控制測量部5以執行測量處理。在此測量處理中,測量部5係依據透過各探針11輸出入之電氣訊號,測量做為物理量之電阻值。 Next, the processing unit 8 controls the moving mechanism 3 to stop the movement of the probe unit 2 when it moves only the amount of movement determined in advance. Next, the processing unit 8 controls the measurement unit 5 to perform measurement processing. In this measurement process, the measuring unit 5 measures the resistance value as a physical quantity based on the electrical signal input and output through each probe 11.

接著處理部8係控制檢查部6以執行檢查處理。在此檢查處理中,檢查部6係依據藉測量部5所測得之電阻值,檢查導體部有無斷線或短路。接著,處理部8係使檢查結果顯示在圖面外之顯示部。藉此,基板100的檢查即告結束。接著,當檢查新的基板100時,載置固定新的基板100到載置座4,接著,作動基板檢查裝置1。此時,處理部8執行上述各處理。 Next, the processing unit 8 controls the inspection unit 6 to execute the inspection process. In this inspection process, the inspection unit 6 checks whether or not the conductor portion is broken or short-circuited based on the resistance value measured by the measurement unit 5. Next, the processing unit 8 displays the inspection result on the display unit outside the drawing. Thereby, the inspection of the substrate 100 is completed. Next, when the new substrate 100 is inspected, the new substrate 100 is placed and fixed to the mount 4, and then the substrate inspection device 1 is actuated. At this time, the processing unit 8 executes the above respective processes.

另外,當被配設於探針單元2上之探針11的局部破損時,以下述之順序更換探針11。首先,自移動機構3卸下 探針單元2。接著,自本體部12(基端部側支撐部32)卸下電極板13。接著,壓入破損之探針11的尖端部21到支撐板44側。此時,探針11的基端部23係自支撐板44少許突出。接著,捏著突出之基端部23,以自本體部12拔出。 Further, when the portion of the probe 11 disposed on the probe unit 2 is partially broken, the probe 11 is replaced in the following order. First, it is removed from the moving mechanism 3 Probe unit 2. Next, the electrode plate 13 is removed from the main body portion 12 (base end portion side support portion 32). Next, the tip end portion 21 of the damaged probe 11 is pressed into the support plate 44 side. At this time, the base end portion 23 of the probe 11 slightly protrudes from the support plate 44. Next, the protruding base end portion 23 is pinched to be pulled out from the body portion 12.

接著,自支撐板44的支撐孔54插入新的探針11,以貫穿到支撐板43的支撐孔53,接著,插入尖端部21到支撐板42的支撐孔52。在此情形下,支撐孔54,53,52的各開口面沿著傾斜方向在假想直線A3上相向,所以,探針11被支撐孔54及支撐孔53導引,而尖端部21正確到達支撐孔52,被插入到支撐孔52。接著,藉更加壓入探針11,使尖端部21插入到支撐板41的支撐孔51。 Next, a new probe 11 is inserted from the support hole 54 of the support plate 44 to penetrate the support hole 53 of the support plate 43, and then, the tip end portion 21 is inserted into the support hole 52 of the support plate 42. In this case, the opening faces of the support holes 54, 53, 52 face each other on the imaginary straight line A3 along the oblique direction, so that the probe 11 is guided by the support hole 54 and the support hole 53, and the tip end portion 21 correctly reaches the support The hole 52 is inserted into the support hole 52. Next, the tip end portion 21 is inserted into the support hole 51 of the support plate 41 by further pressing the probe 11.

在此情形下,支撐孔51,52的開口面沿著垂直方向在假想直線A2上相向,所以,尖端部21與中間部22的邊界部分彈性變形,而尖端部21沿著垂直方向延伸,除了尖端部21之部分(中間部22及基端部23)沿著傾斜方向延伸。接著,藉更加壓入探針11,使尖端部21自支撐板41突出,結束探針11的更換。如此一來,在此探針單元2中,可在使各支撐板41~44的姿勢維持在第2姿勢之狀態下(不使各支撐板41~44的姿勢轉移到第1姿勢),進行探針11的更換。接著,安裝電極板13到本體部12,接著,安裝探針單元2到移動機構3。 In this case, the opening faces of the support holes 51, 52 face each other on the imaginary straight line A2 in the vertical direction, so that the boundary portion of the tip end portion 21 and the intermediate portion 22 is elastically deformed, and the tip end portion 21 extends in the vertical direction except Portions of the tip end portion 21 (the intermediate portion 22 and the base end portion 23) extend in the oblique direction. Next, by further pressing the probe 11, the tip end portion 21 is protruded from the support plate 41, and the replacement of the probe 11 is completed. In this manner, in the probe unit 2, the posture of each of the support plates 41 to 44 can be maintained in the second posture (the posture of each of the support plates 41 to 44 is not shifted to the first posture). Replacement of the probe 11. Next, the electrode plate 13 is mounted to the body portion 12, and then the probe unit 2 is mounted to the moving mechanism 3.

如此一來,在此探針單元2、基板檢查裝置1及探針單元製造方法中,在維持各支撐孔51~54的各開口面沿著垂直方向,在假想直線A1上相向地彼此抵接,以使各支撐板 41~44重疊之第1姿勢之狀態下,貫穿探針11到各支撐孔51~54,轉移到在使支撐板41,42彼此抵接,且使支撐板43,44彼此抵接之狀態下,分離支撐板42,43,同時支撐孔52~54的各開口面沿著傾斜方向,在假想直線A3上相向之第2姿勢,而維持該狀態,以藉各支撐板41~44保持探針11。因此,在此探針單元2、基板檢查裝置1及探針單元製造方法中,在組立時,偏移各支撐板41~44的位置,藉此,可使支撐孔52~54的各開口面,沿著傾斜方向在假想直線A3上相向,結果,無須在偏移各穿孔的中心之狀態下,層積複數支撐板,以形成一塊基端部側支撐部之高難度技術,所以,藉此可充分降低探針單元2及基板檢查裝置1之製造成本。 In this manner, in the probe unit 2, the substrate inspection apparatus 1 and the probe unit manufacturing method, the respective opening faces of the support holes 51 to 54 are maintained in the vertical direction, and are abutted against each other on the virtual straight line A1. To make each support plate In the state of the first posture in which 41 to 44 are overlapped, the probe 11 is passed through the support holes 51 to 54, and the support plates 41 and 42 are brought into contact with each other, and the support plates 43 and 44 are brought into contact with each other. The support plates 42 and 43 are separated, and the opening faces of the support holes 52 to 54 are inclined to the second posture on the imaginary straight line A3, and the state is maintained to hold the probes by the support plates 41 to 44. 11. Therefore, in the probe unit 2, the substrate inspection apparatus 1 and the probe unit manufacturing method, the positions of the support plates 41 to 44 are shifted at the time of assembly, whereby the opening faces of the support holes 52 to 54 can be made. And facing each other on the imaginary straight line A3 along the oblique direction, and as a result, it is not necessary to slap the plurality of support plates in a state of shifting the center of each of the perforations to form a base end side support portion, so that The manufacturing cost of the probe unit 2 and the substrate inspection apparatus 1 can be sufficiently reduced.

又,在此探針單元2、基板檢查裝置1及探針單元製造方法中,係使用僅以兩塊支撐板43,44形成之基端部側支撐部32。在此情形下,此種支撐板係形成很多個插入探針11而支撐之支撐孔,所以,製造成本很高。因此,當依據此探針單元2、基板檢查裝置1及探針單元製造方法時,與使用以數量很多之支撐板形成之尖端部側支撐部或基端部側支撐部之構成及方法相比較下,支撐板減少之部分,可充分降低製造成本。又,在此探針單元2、基板檢查裝置1及探針單元製造方法中,在使各支撐板41~44維持於第1姿勢之狀態下,貫穿探針11到各支撐孔51~54後,使各支撐板41~44轉移到第2姿勢,藉此,在尖端部21側係沿著支撐孔51,52延伸,除了尖端部21側之部分係沿著傾斜方向延伸之狀態下,可使全部探針11暫時維持(彈性變形),以組立探針單元2。因此, 與使自各開口面事先沿著傾斜方向相向地被形成之基端部側支撐部32的各支撐孔54,53插入之探針11持續彈性變形,插入尖端部側支撐部31的支撐孔52,51之作業,係針對一支一支的探針11進行,以組立探針單元2之構成及方法相比較下,可充分縮短組立工序。因此,當依據此探針單元2、基板檢查裝置1及探針單元製造方法時,組立工序被縮短之部分,可充分減少製造成本。 Further, in the probe unit 2, the substrate inspection device 1, and the probe unit manufacturing method, the base end side support portion 32 formed of only two support plates 43, 44 is used. In this case, such a support plate is formed with a plurality of support holes that are inserted into the probe 11 and supported, so that the manufacturing cost is high. Therefore, when the probe unit 2, the substrate inspection device 1, and the probe unit manufacturing method are used, compared with the configuration and method of using the tip end side support portion or the base end side support portion formed by a large number of support plates Under the reduced part of the support plate, the manufacturing cost can be fully reduced. Further, in the probe unit 2, the substrate inspection device 1, and the probe unit manufacturing method, after the support plates 41 to 44 are maintained in the first posture, the probe 11 is inserted through the support holes 51 to 54. The support plates 41 to 44 are moved to the second posture, whereby the side of the tip end portion 21 extends along the support holes 51, 52, and the portion on the side of the tip end portion 21 extends in the oblique direction. All of the probes 11 are temporarily maintained (elastically deformed) to assemble the probe unit 2. therefore, The probe 11 inserted into each of the support holes 54, 53 from the proximal end side support portion 32, which is formed in advance in the oblique direction from the respective opening faces, is continuously elastically deformed, and is inserted into the support hole 52 of the tip end side support portion 31, The operation of 51 is performed for one probe 11 at a time, and the assembly process can be sufficiently shortened in comparison with the configuration and method of assembling the probe unit 2. Therefore, according to the probe unit 2, the substrate inspection apparatus 1, and the probe unit manufacturing method, the assembly process is shortened, and the manufacturing cost can be sufficiently reduced.

又,當依據此探針單元2、基板檢查裝置1及探針單元製造方法時,插入定位銷34c到各支撐板41~44的各貫穿孔61a~64a,以使各支撐板41~44維持在第1姿勢,藉此,以簡易之構成及方法,就可確實且容易地使各支撐板41~44維持在第1姿勢,所以,能充分提高探針單元2之製造效率,進而能充分提高基板檢查裝置1之製造效率。 Further, in accordance with the probe unit 2, the substrate inspection apparatus 1, and the probe unit manufacturing method, the positioning pins 34c are inserted into the respective through holes 61a to 64a of the respective support plates 41 to 44 to maintain the respective support plates 41 to 44. In the first posture, the support plates 41 to 44 can be reliably and easily maintained in the first posture by a simple configuration and method. Therefore, the manufacturing efficiency of the probe unit 2 can be sufficiently increased, and the full efficiency can be sufficiently achieved. The manufacturing efficiency of the substrate inspection apparatus 1 is improved.

又,當依據此探針單元2、基板檢查裝置1及探針單元製造方法時,在第2姿勢之支撐板42,43之間配設間隔物33,固定各支撐板41~44在間隔物33上,藉此,以簡易之構成及方法,就可以在短時間內確實且容易地使各支撐板41~44維持在第2姿勢,所以,能充分提高探針單元2之製造效率,進而能充分提高基板檢查裝置1之製造效率。 Further, according to the probe unit 2, the substrate inspection device 1, and the probe unit manufacturing method, spacers 33 are disposed between the support plates 42 and 43 in the second posture, and the support plates 41 to 44 are fixed to the spacers. According to the configuration and method of the present invention, the support plates 41 to 44 can be reliably and easily maintained in the second posture in a short time, so that the manufacturing efficiency of the probe unit 2 can be sufficiently improved. The manufacturing efficiency of the substrate inspection apparatus 1 can be sufficiently improved.

而且,基板檢查裝置及基板檢查方法,並不侷限於上述構成及方法。例如在第1姿勢中,雖然上述記載有使各支撐板41~44維持在彼此抵接之狀態之構成及方法,但是,也可以採用維持在第1姿勢中,各支撐板41~44彼此接近之狀態之構成及方法。又,雖然上述記載有維持在第2姿勢中, 使支撐板41,42彼此抵接,支撐板43,44彼此抵接,而且,分離支撐板43,44之狀態之構成及方法,但是,也可以採用維持使支撐板41,42彼此接近之狀態,或者,維持使支撐板43,44彼此接近之狀態之構成及方法。 Further, the substrate inspection device and the substrate inspection method are not limited to the above configuration and method. For example, in the first posture, although the configuration and method for maintaining the support plates 41 to 44 in contact with each other are described above, the support plates 41 to 44 may be maintained close to each other in the first posture. The composition and method of the state. Moreover, although the above description is maintained in the second posture, The support plates 41, 42 are abutted against each other, the support plates 43, 44 are abutted against each other, and the configuration and method of separating the support plates 43, 44, but the state in which the support plates 41, 42 are maintained close to each other may be employed. Or, the configuration and method of maintaining the state in which the support plates 43, 44 are close to each other.

又,雖然上述記載有在第2姿勢中,支撐孔51及支撐孔52的各開口面沿著垂直方向,在假想直線A2上相向之構成及方法,但是,也可以採用在第2姿勢中,各開口面沿著傾斜方向,在假想直線上相向之構成及方法。在此情形下,此傾斜方向可與上述假想直線A3的傾斜方向相同,也可以不同。 Further, in the second posture, the opening faces of the support hole 51 and the support hole 52 are formed to face each other on the virtual straight line A2 along the vertical direction. However, in the second posture, the second posture may be employed. Each of the opening faces is configured to face each other on an imaginary straight line along the oblique direction. In this case, the inclination direction may be the same as or different from the inclination direction of the imaginary straight line A3.

而且,雖然上述記載有使第1支撐板以兩塊支撐板41,42構成之例,但是,也可以使用以一塊板體構成之第1支撐板。在此情形下,此第1支撐板的支撐孔,可以形成使得沿著上述垂直方向延伸,也可以形成使得沿著上述傾斜方向延伸。 Further, although the first support plate is configured by the two support plates 41 and 42 as described above, the first support plate formed of one plate may be used. In this case, the support hole of the first support plate may be formed to extend in the vertical direction or may be formed to extend in the oblique direction.

又,在上述兩塊支撐板43,44(第2支撐板及第3支撐板)之外,也可以採用以再加上一塊或兩塊以上之支撐板(亦即,三塊以上之支撐板),支撐探針11的基端部23之構成及方法。在此情形下,使追加之支撐板中之支撐孔的開口面,與其他支撐板中之支撐孔的開口面同樣地,在第1姿勢中,沿著垂直方向在假想直線A1上相向,在第2姿勢中,沿著傾斜方向在假想直線A3上相向,藉此,可實現與上述構成及方法相同之效果。 Further, in addition to the two support plates 43, 44 (the second support plate and the third support plate), one or more support plates may be added (that is, three or more support plates) The configuration and method of supporting the proximal end portion 23 of the probe 11. In this case, the opening surface of the support hole in the additional support plate is oriented on the virtual straight line A1 in the vertical direction in the first posture similarly to the opening surface of the support hole in the other support plate. In the second posture, the opposite directions are formed on the virtual straight line A3 along the oblique direction, whereby the same effects as the above-described configuration and method can be achieved.

又,雖然上述記載有在支撐板42,43之間配設俯視為ㄈ字形之間隔物33,以使各支撐板41~44維持在第2姿 勢之構成及方法,但是,也可以採用取代間隔物33,而使用立方體或圓柱狀等任意形狀之間隔物之構成及方法。 Further, although it is described above that spacers 33 having a U-shape in plan view are disposed between the support plates 42 and 43, so that the support plates 41 to 44 are maintained in the second posture. Although the configuration and method of the potential are used, it is also possible to use a configuration and a method of a spacer having an arbitrary shape such as a cube or a column instead of the spacer 33.

2‧‧‧探針單元 2‧‧‧ probe unit

11‧‧‧探針 11‧‧‧Probe

31‧‧‧尖端部側支撐部 31‧‧‧ Tip side support

32‧‧‧基端部側支撐部 32‧‧‧ base end support

33‧‧‧間隔物 33‧‧‧ spacers

34a,34b‧‧‧定位銷 34a, 34b‧‧‧ Locating pins

41~44‧‧‧支撐板 41~44‧‧‧Support board

51~54‧‧‧支撐孔 51~54‧‧‧Support hole

61a,62a,63b,64b‧‧‧貫穿孔 61a, 62a, 63b, 64b‧‧‧through holes

65a,65b‧‧‧貫入孔 65a, 65b‧‧‧ penetration holes

Claims (5)

一種探針單元,具有:複數個探針,用於使尖端部接觸到基板的導體部,以進行電氣訊號之輸出入;以及支撐部,支撐前述探針,其特徵在於:前述支撐部之構成係具有:第1支撐板,具有第1支撐孔,以支撐貫穿該第1支撐孔之前述尖端部;第2支撐板,具有第2支撐孔,以支撐貫穿該第2支撐孔之前述探針的基端部;以及第3支撐板,具有第3支撐孔,以支撐貫穿該第3支撐孔之前述基端部;而被配置使得該各支撐板以此順序相向,同時構成為具有間隔物被配設於前述第1支撐板與前述第2支撐板間,前述各支撐部在前述第2支撐板及前述第3支撐板在抵接或接近之狀態下,係以前述第1支撐板與該第2支撐板係分離,同時前述第1支撐孔、前述第2支撐孔及前述第3支撐孔的各開口面,沿著相對於該各支撐板的層積方向而言傾斜之傾斜方向,在假想直線上相向之姿勢固定於該間隔物,前述探針係維持前述尖端部沿著前述第1支撐孔延伸,同時除了該尖端部之部分係沿著前述傾斜方向延伸之狀態,在前述第1支撐板,形成有可被第1定位銷以及第2定位銷貫穿的第1貫穿孔,在前述第2支撐板以及前述第3支撐板,各自形成有可被前述第1定位銷貫穿的第2貫穿孔以及可被第3定位銷貫 穿的第3貫穿孔,在前述間隔物,在相向前述第1支撐板的面形成有可被前述第2定位銷貫穿的第1貫入孔,同時在相向前述第2支撐板的面形成有可被前述第3定位銷貫穿的第2貫入孔,前述第1貫穿孔以及前述第2貫穿孔係各自形成於,當前述第1支撐孔、前述第2支撐孔及前述第3支撐孔的各開口面,沿著相對於該各支撐部而言垂直之垂直方向,在假想直線上相向地彼此抵接或接近之狀態下被重疊時,該各貫穿孔的中心軸成為同軸之位置,前述第1貫入孔係形成於,當前述各支撐板為前述姿勢時,該各第1貫入孔的中心軸與前述第1貫穿孔的中心軸成為同軸之位置,前述第3貫穿孔以及前述第2貫入孔係各自形成於,當前述各支撐板為前述姿勢時,該各第3貫穿孔的中心軸與該各第2貫入孔的中心軸成為同軸之位置,前述第1支撐板、前述第2支撐板以及前述第3支撐板係各自形成俯視為四邊形,前述第1貫穿孔,在前述第1支撐板中一對的對角位置各形成一個,前述第2貫穿孔,在相向前述第1支撐板的前述各對角位置的前述第2支撐板中一對的對角位置各形成一個,同時在相向前述第1支撐板的前述各對角位置的前述第3支撐板中一對的對角位置各形成一個,前述第3貫穿孔,在與前述第2支撐板中前述一對的對角 位置相異之另一對的對角位置各形成一個,同時在與前述第3支撐板中前述一對的對角位置相異之另一對對角位置各形成一個。 A probe unit having: a plurality of probes for contacting a tip end portion to a conductor portion of a substrate for electrical signal input and output; and a support portion for supporting the probe, wherein: the support portion is configured The first support plate has a first support hole for supporting the tip end portion penetrating the first support hole, and the second support plate has a second support hole for supporting the probe penetrating the second support hole a base end portion; and a third support plate having a third support hole for supporting the base end portion penetrating the third support hole; and being configured such that the support plates face each other in this order, and are configured to have a spacer And being disposed between the first support plate and the second support plate, wherein each of the support portions is in contact with or close to the second support plate and the third support plate, and the first support plate and the first support plate are The second support plate is separated, and the opening faces of the first support hole, the second support hole, and the third support hole are inclined in an oblique direction with respect to a stacking direction of the support plates. Opposite posture on an imaginary line In the spacer, the probe is configured to extend the tip end portion along the first support hole, and the first support plate is formed in a state in which the tip end portion extends in the oblique direction. The first through hole through which the first positioning pin and the second positioning pin are inserted is formed in the second support plate and the third support plate, and the second through hole that can be penetrated by the first positioning pin is formed 3 positioning pin The third through hole that is formed in the spacer is formed with a first penetration hole that can be penetrated by the second positioning pin on a surface facing the first support plate, and is formed on a surface facing the second support plate. The second penetration hole penetrated by the third positioning pin, the first through hole and the second through hole are formed in each of the first support hole, the second support hole, and the third support hole When the surfaces are overlapped in a state in which they are perpendicular to each other in the vertical direction with respect to the respective support portions, the central axes of the respective through holes are coaxial, and the first The through hole is formed in a position where the center axis of each of the first penetration holes is coaxial with a central axis of the first through hole, and the third through hole and the second penetration hole are formed when the support plates are in the posture Each of the first support plates and the second support plate is formed at a position where the central axis of each of the third through holes and the central axis of each of the second penetration holes are coaxial with each other when the support plates are in the posture. And the aforementioned third support plate system Each of the first through holes is formed in a pair of diagonal positions in the first support plate, and the second through holes are formed in the respective diagonal positions facing the first support plate. One pair of diagonal positions of the pair of second support plates are formed one by one, and one pair of diagonal positions of the pair of third support plates facing the respective diagonal positions of the first support plate are formed, and the third through-hole is formed. a hole opposite to the aforementioned pair in the second support plate The other diagonal positions of the other pair are formed one by one, and the other diagonal position different from the diagonal position of the pair of the third support plates is formed one at a time. 如申請專利範圍第1項所述之探針單元,其中,前述間隔物係圍繞前述各探針形成俯視為ㄈ字形。 The probe unit according to claim 1, wherein the spacers are formed in a U shape in a plan view around the probes. 一種基板檢查裝置,具有:探針單元,如申請專利範圍第1或2項所述;以及檢查部,依據透過接觸到基板的導體部之前述探針單元的前述探針以輸入之電氣訊號,檢查前述基板。 A substrate inspection device having: a probe unit as described in claim 1 or 2; and an inspection portion for inputting an electrical signal according to the probe passing through the probe unit contacting the conductor portion of the substrate, Check the aforementioned substrate. 一種探針單元製造方法,製造探針單元,前述探針單元具有:複數個探針,用於使尖端部接觸到基板的導體部,以進行電氣訊號之輸出入;以及支撐部,支撐前述探針,其中,使用前述支撐部,前述支撐部之構成係具有:第1支撐板,具有第1支撐孔,以支撐貫穿該第1支撐孔之前述尖端部;第2支撐板,具有第2支撐孔,以支撐貫穿該第2支撐孔之前述探針的基端部;以及第3支撐板,具有第3支撐孔,以支撐貫穿該第3支撐孔之前述基端部;而被配置使得該各支撐板以此順序相向,同時構成為具有間隔物被配設於前述第1支撐板與前述第2支撐板間,前述第1支撐板、前述第2支撐板以及前述第3支撐板係各自形成俯視為四邊形,以第1定位銷貫穿在前述第1支撐板中一對的對角位置各形成一個之第1貫穿孔,以及在相向前述第1支撐板的前述各對角位置的前述第2支撐板中一對的對角位置各形成 一個同時在相向前述第1支撐板的前述各對角位置的前述第3支撐板中一對的對角位置各形成一個之第2貫穿孔,維持前述第1支撐孔、前述第2支撐孔及前述第3支撐孔的各開口面,沿著相對於前述各支撐部而言垂直之垂直方向,在假想直線上相向地,使前述各支撐板彼此抵接或接近以重疊之狀態,在此狀態下貫穿前述探針到前述各支撐孔,之後,在前述第2支撐板及前述第3支撐板抵接或接近之狀態下,分離前述第1支撐板與該第2支撐板,拔出前述第1定位銷,並在前述第1支撐板與前述第2支撐板之間配設前述間隔物,以第2定位銷貫穿前述第1貫穿孔以及在前述間隔物中相向前述第1支撐板的面形成之第1貫入孔,同時以第3定位銷貫穿在與前述第2支撐板中前述一對的對角位置相異之另一對的對角位置各形成一個且在與前述第3支撐板中前述一對的對角位置相異之另一對對角位置各形成一個之第3貫穿孔以及在前述間隔物中相向前述第2支撐板的面形成之第2貫入孔,使該各支撐板轉換成前述第1支撐孔、前述第2支撐孔及前述第3支撐孔的各開口面,沿著相對於該各支撐板的層積方向而言傾斜之傾斜方向,在假想直線上相向之姿勢,在此狀態下該各支撐板被固定於前述間隔物,前述尖端部沿著前述第1支撐孔延伸,同時除了該尖端部之部分係沿著前述傾斜方向延伸之狀態下,維持前述探針以製造前述探針單元。 A probe unit manufacturing method for manufacturing a probe unit, the probe unit having: a plurality of probes for contacting a tip end portion to a conductor portion of a substrate for electrical signal input and output; and a support portion for supporting the probe In the needle, the support portion is configured to have a first support plate having a first support hole for supporting the tip end portion penetrating the first support hole, and a second support plate having a second support a hole for supporting a base end portion of the probe penetrating the second support hole; and a third support plate having a third support hole for supporting the base end portion penetrating the third support hole; Each of the support plates is opposed to each other in this order, and is configured such that a spacer is disposed between the first support plate and the second support plate, and each of the first support plate, the second support plate, and the third support plate is configured Forming a first through hole in which a first positioning pin penetrates a pair of diagonal positions in a pair of the first support plates in a plan view, and a first through hole facing the respective diagonal positions of the first support plate 2 support The diagonal positions of a pair of plates are formed a second through hole is formed in each of the pair of diagonal support positions of the third support plate at each of the diagonal positions facing the first support plate, and the first support hole and the second support hole are maintained. Each of the opening faces of the third support hole is in a state in which the support plates are in contact with each other or are close to each other on a virtual straight line in a direction perpendicular to the vertical direction of each of the support portions. And inserting the probe into the support holes, and then separating the first support plate and the second support plate in a state in which the second support plate and the third support plate abut or close, and extract the first a positioning pin, wherein the spacer is disposed between the first support plate and the second support plate, and the second positioning pin penetrates the first through hole and the surface of the spacer facing the first support plate a first penetration hole is formed, and the third positioning pin is inserted through one of the diagonal positions of the other pair of diagonal positions of the pair of the second support plates, and is formed in the third support plate. The diagonal position of the aforementioned pair is different a third through hole formed in each of the diagonal positions and a second penetration hole formed in a surface of the spacer facing the second support plate, wherein the support plates are converted into the first support holes and the first (2) the support holes of the support holes and the third support holes are inclined in an oblique direction with respect to the stacking direction of the support plates, and the support plates are in this state. The probe is fixed to the spacer, and the tip end portion extends along the first support hole, and the probe is held to manufacture the probe unit except that a portion of the tip end portion extends in the oblique direction. 如申請專利範圍第4項所述之探針單元製造方法,其中,形成俯視為ㄈ字形的前述間隔物係圍繞前述各探針地配設於前述第1支撐板與前述第2支撐板之間。 The probe unit manufacturing method according to claim 4, wherein the spacer formed in a U-shape in a plan view is disposed between the first support plate and the second support plate around the probes. .
TW102126213A 2012-07-26 2013-07-23 A probe unit, a substrate inspection apparatus, and a probe unit manufacturing method TWI591347B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012165301A JP6184667B2 (en) 2012-07-26 2012-07-26 Probe unit, substrate inspection apparatus, and probe unit manufacturing method

Publications (2)

Publication Number Publication Date
TW201418720A TW201418720A (en) 2014-05-16
TWI591347B true TWI591347B (en) 2017-07-11

Family

ID=49997238

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102126213A TWI591347B (en) 2012-07-26 2013-07-23 A probe unit, a substrate inspection apparatus, and a probe unit manufacturing method

Country Status (5)

Country Link
JP (1) JP6184667B2 (en)
KR (1) KR101979060B1 (en)
CN (1) CN104508498B (en)
TW (1) TWI591347B (en)
WO (1) WO2014017426A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101656047B1 (en) * 2016-03-23 2016-09-09 주식회사 나노시스 Jig for Circuit Board Inspection
JP6812018B2 (en) * 2016-07-28 2021-01-13 日本電産リード株式会社 Inspection jig, substrate inspection device equipped with this, and manufacturing method of inspection jig
KR101886536B1 (en) * 2016-12-27 2018-08-07 주식회사 텝스 Straight needle probe card with adjustable probe force
CN110068711B (en) * 2018-01-24 2022-04-26 台湾中华精测科技股份有限公司 Probe card device and rectangular probe
KR102072451B1 (en) * 2018-07-27 2020-02-04 주식회사 에스디에이 Probe Card Head Block
CN108982933A (en) * 2018-08-07 2018-12-11 深圳市芽庄电子有限公司 Printed circuit board test fixture
KR102170506B1 (en) * 2020-03-04 2020-10-28 (주)뉴씨텍 Movable jig for PCB test

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3505495B2 (en) * 2000-09-13 2004-03-08 日本電産リード株式会社 Inspection jig for substrate inspection, substrate inspection device provided with the inspection jig, and method of assembling inspection jig for substrate inspection
KR100773732B1 (en) * 2006-05-09 2007-11-09 주식회사 파이컴 Probe unit and probe apparatus having the same
KR100843224B1 (en) * 2007-01-04 2008-07-02 삼성전자주식회사 Probe card for testing wafer
KR100975808B1 (en) * 2007-04-17 2010-08-13 니혼덴산리드가부시키가이샤 The fixture for circuit board inspection
JP4965341B2 (en) * 2007-05-31 2012-07-04 日置電機株式会社 Probe unit and circuit board inspection device
JP2009008585A (en) 2007-06-29 2009-01-15 Koyo Technos:Kk Inspection jig and inspection device
JP5179301B2 (en) * 2008-09-09 2013-04-10 日置電機株式会社 Probe unit and inspection device
JP5599150B2 (en) * 2009-01-05 2014-10-01 東京特殊電線株式会社 Probe unit structure
JP2012078297A (en) * 2010-10-05 2012-04-19 Tokuso Riken:Kk Jig for wire probe, and inspection device and inspection method using the same

Also Published As

Publication number Publication date
JP6184667B2 (en) 2017-08-23
WO2014017426A1 (en) 2014-01-30
TW201418720A (en) 2014-05-16
CN104508498A (en) 2015-04-08
KR20150037736A (en) 2015-04-08
CN104508498B (en) 2018-04-10
JP2014025769A (en) 2014-02-06
KR101979060B1 (en) 2019-05-15

Similar Documents

Publication Publication Date Title
TWI591347B (en) A probe unit, a substrate inspection apparatus, and a probe unit manufacturing method
JP6112890B2 (en) Probe unit, board inspection apparatus, and probe unit assembling method
JP3505495B2 (en) Inspection jig for substrate inspection, substrate inspection device provided with the inspection jig, and method of assembling inspection jig for substrate inspection
JP2008145238A (en) Electrical connection apparatus and electric connection device using it
JP2021028603A (en) Electric contact and electrical connection device
CN110573890A (en) Probe card for testing device of electronic device
JP2007304008A (en) Contact and tool for board inspection, and board inspection apparatus
JP2018048919A (en) Probe pin and inspection unit
JP6283929B2 (en) Inspection jig and method for manufacturing inspection jig
JP2010122057A (en) Probe unit
JP5179301B2 (en) Probe unit and inspection device
JP2014240788A (en) Probe unit, substrate inspection device, and probe unit manufacturing method
JP2007071753A (en) Connector for measuring electric resistance, and instrument and method for measuring electric resistance of circuit board
JP2011133354A (en) Contact probe and probe unit
JP4209696B2 (en) Electrical connection device
JP2007232558A (en) Electronic component inspection probe
JP5528532B2 (en) Board inspection equipment
JP2008197009A (en) Electronic component inspection probe
TWM545907U (en) Improved structure of probe seat
JP6176466B1 (en) PCB inspection jig
JP2014032111A (en) Inspection jig
CN103837715B (en) Fixture
JP2010066003A (en) Electric-resistance measuring electrode sheet and method of manufacturing the same, electric-resistance measuring connector, and device of measuring electric resistance of circuit board
JP2014044104A (en) Probe unit, substrate inspection device, and method of manufacturing probe unit
JP2019152639A (en) Manufacturing inspection device for multiple electrical signal connecting device