JP2019152639A - Manufacturing inspection device for multiple electrical signal connecting device - Google Patents

Abstract

To provide a manufacturing inspection device for a multiple electrical signal connecting device capable of performing connection in a short time by enabling a tip shape manufacturing of connection terminals including narrow pitch terminal columns and reliability of the terminal contact.SOLUTION: This devices include a connection device fixing table 101 capable of fixing a multiple electrical signal connection device 1; a bending working unit of the connecting terminal that is movable with a die and a punch; an inspection jig substrate 111 provided with a connection terminal group or an extension wiring section; a terminal fixing unit 116 capable of pressing and fixing a spring deformation portion 14 on the inspection jig substrate connection terminal 112; a movable first probe 114 and a second probe 115; a measuring signal source 151 for providing a predetermined measuring signal to the multiple electrical signal connection device 1 or the inspection jig substrate 111; a signal detection determining unit 152 for detecting an electrical signal generated by the measuring signal and performing inspection determination; and a drive controller 153 for driving the connecting device fixing table 101, the bending working unit, and the first and second probes 114, 115.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a manufacturing inspection apparatus and method and inspection method for an electrical signal connection device used for connecting multiple interconnects having a narrow pitch arrangement in particular. The present invention relates to an electrical inspection of an electronic device or the like via a signal connection device or an electrical signal connection device.

  In recent years, there has been remarkable progress in electronic devices and electronic components, and the degree of integration per unit area has been improved with the increase in functionality, size, weight, and capacity. For this reason, the number of electrical signals exchanged between electronic devices or electronic components has increased, and both connection terminal portions and wiring patterns have to be installed in a minute space.

  The inventor of the present invention, in the wiring connection between electronic devices or electronic components tending to have a narrow pitch and a large number of pins, does not perform metal fusion connection such as soldering by a spring structure installed in the connection terminal portion, and is robust. In addition, detachable wiring connection is possible with a minimum mounting area, and furthermore, pitch conversion from a terminal arrangement having a minimum pitch (for example, 30 μm or less) that cannot be realized with a conventional connector can be realized with high accuracy. A multiple electric signal connecting device and a connecting method which are inexpensive and easy to connect are proposed.

  In FIG. 5, the structure of the multiple electrical signal connection device which is the object of the manufacturing and inspection device for the multiple electrical signal connection device of the present invention already proposed by the present inventor will be described.

  FIG. 5 is a perspective view showing a basic configuration of the multiple electrical signal connecting device. On the insulating substrate 10, a plurality of first connection terminals 11 on one side and a plurality of second connection terminals 12 on the other side are electrically connected between the first connection terminal 11 and the second connection terminal 12. A wiring pattern 13 to be connected to each other, and at least at the tip of each of the first connection terminal 11 or the second connection terminal 12 or all of the connection terminals, at least perpendicular to the substrate surface (XY plane) (Z And a spring deformation portion 14 that causes elastic deformation in the direction). In the range of the spring deformation portion 14-1 of the first connection terminal 11, a fixed plate 15-1 having a movable function at least in the Z direction is installed, and the spring deformation portion 14-2 of the second connection terminal 12 is In the range, a fixed plate 15-2 having a movable function at least in the Z direction was installed.

  21 is a connection terminal A of an electronic device or electronic component (not shown) to be connected to the first connection terminal 11, and 22 is an electronic device or electronic component (to be connected to the second connection terminal 12). A connection terminal B of (not shown) is shown. An example in which bumps 16 formed of copper or solder are provided on the connection terminal B22 is shown.

  The first connecting terminal 11 and the connecting terminal A21 are arranged such that each arrangement interval P1 in the XY plane of the first connecting terminal 11 including the spring deforming portion 14-1 is arranged in the XY plane of the connecting terminal A21. The distance Pa is set as much as possible in advance. Similarly, each arrangement interval P2 in the XY plane of the second connection terminal 12 including the spring deforming portion 14-2 is installed in advance to be the same as the arrangement interval Pb in the XY plane of the connection terminal B22. .

  The spring deformation portion 14-1 of the first connection terminal 11 is pressed downward in the Z direction by the fixing plate 15-1 on the connection terminal A21 to be connected. It is fixed by. Similarly, the spring deforming portion 14-2 of the second connection terminal 12 is pressed downward in the Z direction by the fixing plate 15-2 on the connection terminal B22 to be connected. It is fixed by the spring force. The first connecting terminal 11 and the connecting terminal A21, or the second connecting terminal 12 and the connecting terminal B22 are aligned with each other by aligning the reference holes 18 on the respective substrates. Can be implemented with high accuracy.

  In the example of FIG. 5, the example in which the arrangement interval P1 of the first connection terminals is different from the arrangement interval P2 of the second connection terminals is shown. The connection terminal A21 to be connected to the first connection terminal 11 is an example of a terminal arrangement with a very narrow pitch (for example, several tens of μm) as seen in an IC electrode terminal, for example, and the second connection The connection terminal B22 to be connected to the terminal 12 is an example of a relatively large arrangement interval (for example, several hundred μm to several mm), for example, a connection terminal of a test apparatus that transmits and receives an inspection signal through an IC electrode terminal. The wiring pattern 13 has a pitch between the arrangement interval P1 of the first connection terminals 11 and the arrangement interval P2 of the second connection terminals 12 in order to connect the connection between the connection terminal A21 and the connection terminal B22. In order to perform conversion, a part or all of the shape of the wiring pattern 13 is constituted by a continuous curve 17 (for example, a spline curve).

  In the multiple electric signal connection device having the structure described above, the connection terminal of the electronic device or the like to be connected is fixed by a pressing force by a spring structure provided on the connection terminal on the electric signal connection device side without depending on soldering. . Therefore, a bending process for configuring the spring structure of all connection terminals is required. Further, in the shipping inspection, it is necessary to ensure not only the inspection of the wiring pattern of the electrical signal connection device, but also the certainty of contact by the connection terminal of the electrical signal connection device.

As a general thin metal bending method, a die for determining a bending shape provided with a V-groove or the like and a punch for abutting against a target position of the thin metal and pushing into the die are performed. In the mass production process, collective manufacturing is also performed by forming dies corresponding to some or all of the terminals.

  Also, in general, the inspection for checking the conduction / non-conduction of the wiring pattern on the substrate or the like is performed by providing multiple probe contacts on one surface of the substrate as disclosed in, for example, JP-A-2017-26407. Arrangement is made, and a movable probe is brought into contact with the measurement target pad on the other surface to inspect the conduction / non-conduction of the wiring pattern.

JP 2017-26407 A

  However, since there are many types of electronic devices or electronic parts to be connected, the terminal shape and terminal pitch are different, and the number of connection terminals tends to reach thousands or more, so it corresponds to each model. As a result, there arises a problem that assembly time such as alignment when the connecting terminals are individually bent and an increase in cost when the mold is produced are caused.

  Further, the inspection method disclosed in Japanese Patent Application Laid-Open No. 2017-26407 is effective when the connection terminal is fixed as a pad on the substrate, and when the connection terminal is bent and fixed by a spring force, It is impossible to perform an inspection including the certainty of contact with the connection terminal of the electrical signal connection device.

  Generally, as a problem in the manufacturing and inspection process in a connection device that requires a narrow pitch multi-array connection, the higher the pitch and the number of pins, the higher the cost of the inspection process such as the continuity inspection between the wiring pattern and the connection terminal. And the problem of longer delivery time arises.

  The present invention was made in order to solve the problems in the manufacturing method and inspection method of the terminal tip shape of the narrow pitch multiple electric signal connection, and the shape processing manufacture and contact of the connecting terminal tip including the narrow pitch terminal row Provided is a manufacturing and inspection device for a multiple electrical signal connection device that can be performed in a short time by making it possible to continuously perform electrical inspection including terminal reliability.

  The present invention provides a wiring pattern for electrically connecting a plurality of first connection terminals on one side, a plurality of second connection terminals on the other side, and the first and second connection terminals on an insulating substrate. The multiple electrical signal connection device with respect to the multiple electrical signal connection device having a spring deforming portion that elastically deforms at least in the direction perpendicular to the substrate surface at the tip of the first or second connection terminal. A connecting device fixing base that is fixed and movable in the X, Y, Z direction or rotational direction, and the tip of the first or second connecting terminal is inserted, and a die and a punch for bending, X, A connection terminal group and / or an extension wiring in which the arrangement interval in the XY plane of the spring deforming portion of the first or second connection terminal in the XY plane is the same as the bending unit movable in the Y, Z direction or the rotation direction Inspection jig substrate with a portion and the spring deformed portion with the inspection A terminal fixing unit that can be pressed and fixed on the connection terminal or extension wiring portion of the tool substrate, one connection terminal of the first or second connection terminal, or one connection terminal group of the inspection jig substrate, and / or A first probe arranged in the extension wiring portion and movable in the X, Y, and Z directions; the other connection terminal of the first or second connection terminal; or the other connection terminal group of the inspection jig substrate; And / or a second probe that can be moved in the X, Y, and Z directions disposed in the extended wiring portion, and a predetermined electrical connection to the multiple electrical signal connection device or the inspection jig substrate via the first or second probe. A measurement signal supply source for providing a measurement signal, and a signal detection determination for detecting an electrical signal generated in the multiple electrical signal connection device or the inspection jig substrate by the measurement signal and performing an inspection determination of the multiple electrical signal connection device And the connection device Since it has means including a base, the bending unit, and a drive control unit for driving the first and second probes, the same equipment is used for manufacturing the tip shape of the connection terminal and the electrical inspection including the reliability of the contact terminal. This makes it possible to manufacture the terminal tip shape and to perform electrical inspection in a short time.

  Further, the connecting device fixing base or the bending unit is moved in the X, Y, Z direction or the rotation direction, and one or more distal ends of the first or second connection terminals are moved to the die of the bending unit. A first step of inserting the connecting terminal into a predetermined position between the punch and the punch and continuously bending the connecting terminal to complete the bending of the multiple electrical signal connecting device; and The measurement signal supply source is brought into contact with one connection terminal of the first or second connection terminal and the other connection terminal of the first or second connection terminal is brought into contact with a die or a punch of the bending unit. A predetermined measurement signal is given to the multiple electrical signal connecting device through the first probe, and an electrical signal generated in the die or punch of the bending unit is detected through the multiple electrical signal connecting device, A second step of performing an inspection determination of the wiring pattern of the multiple electrical signal connection device by the signal detection determination unit; and attaching the inspection jig substrate and the terminal fixing unit, and a spring of the first or second connection terminal A third step of relatively pressing and fixing the deformable portion and the connection terminal or extension wiring portion of the inspection jig substrate; and the first probe is attached to one connection terminal group or extension wiring portion of the inspection jig substrate. The second probe is brought into contact with the other connection terminal group or extension wiring portion of the inspection jig substrate, and the measurement signal supply source is connected to the inspection jig substrate via the first or second probe. A predetermined measurement signal is given, and an electric signal generated on the other inspection jig substrate is detected by the measurement signal via the multiple electric signal connecting device, and the signal detection determination unit Since it has the means of the 4th step which carries out the inspection judgment of an electric signal connection device, it is possible to carry out the electric inspection including the tip shape processing manufacture of the connection terminal and the reliability of the contact terminal in the same equipment and in the same process. It is possible to manufacture the terminal tip shape and to perform electrical inspection in a short time.

  Furthermore, since the tip of the first connection terminal can be used as an inspection apparatus such as a probe cart by means of a position conversion fixing unit that aligns and fixes the tip of the first connection terminal in a direction facing the terminal group of the semiconductor to be inspected, Thus, it becomes possible to manufacture a multiple electric signal connecting device and to electrically inspect a semiconductor to be inspected.

  According to the manufacturing inspection device for the multiple electric signal connecting device of the present invention, the electrical inspection including the tip shape processing and manufacturing of the connection terminal and the reliability of the contact terminal can be continuously performed, In addition to being able to inspect, it can also be used as an inspection device such as a probe card, so that multiple electrical signal connection devices can be manufactured and electrical inspection of the device to be inspected in a short time.

It is a figure explaining the first half process in the manufacturing inspection apparatus of the multiple electrical signal connection apparatus which concerns on the 1st Embodiment of this invention. It is a figure explaining the latter half process in the manufacture test | inspection apparatus of the multiple electrical signal connection apparatus which concerns on the 1st Embodiment of this invention. It is a figure explaining the manufacture inspection procedure of the manufacture inspection apparatus of the multiple electrical signal connection apparatus which concerns on the 1st Embodiment of this invention. It is a figure explaining the semiconductor test process in the manufacture test | inspection apparatus of the multiple electrical signal connection apparatus which concerns on the 2nd Embodiment of this invention. It is a figure explaining the manufacture inspection procedure of the manufacture inspection apparatus of the multiple electrical signal connection apparatus which concerns on the 2nd Embodiment of this invention. It is a perspective view which shows the structure of the multiple electrical signal connection apparatus used as the object of the manufacture inspection apparatus of the multiple electrical signal connection apparatus which concerns on embodiment of this invention.

  Next, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a diagram for explaining a multiple electrical signal connection device manufacturing and inspection device according to a first embodiment of the present invention. FIG. 1A illustrates a bending process for forming a spring shape of a tip portion of the first connection terminal 11 or the second connection terminal 12 in the multiple electrical signal connection device manufacturing and inspection device 100. The configuration is shown. In FIG. 1A, reference numeral 101 denotes a connecting device fixing base that fixes the multiple electrical signal connecting device 1 and is movable in the XYZ direction or the rotation direction, and 102 is a die 103 and a punch 104 for bending. The connecting device fixing base 101 and the bending unit 102 are controlled by the drive control device 153 with high accuracy, and can be moved in the X, Y, Z direction or rotational direction. Or the front-end | tip part of the said some 1st connection terminal 11 or the said 2nd connection terminal 12 is inserted between the said die | dye 103 and the said punch 104, and a bending process is implemented. (First step)

  FIG. 1 (b) shows that the wiring pattern 13 of the multiple electrical signal connecting device 1 is conductive / non-conductive after the bending of the tips of the first connecting terminal 11 and the second connecting terminal 12 is completed. A method of performing inspection determination such as continuity will be described.

  In FIG. 1B, reference numeral 114 denotes a first probe that is arranged in the first connection terminal 11 or the second connection terminal 12 and is movable in the X, Y, and Z directions. The first connection terminal 11 or the second connection terminal 12 is brought into contact with the other connection terminal, and the first or second connection terminal is connected to the die 103 or the punch 103 having conductivity of the bending unit 102. A predetermined measurement signal is given to the multiple electrical signal connection device 1 from the measurement signal supply device 151 via the first probe 114 and the bending unit 102 is connected via the multiple electrical signal connection device 1. The signal detection determination device 152 performs an inspection determination on the wiring pattern 13 of the multiple electric signal connection device 1. By this step, the pass / fail judgment of the wiring pattern 13 of the multiple electrical signal connecting device 1 can be performed at the same time as the bending of the tips of the connection terminals 11 and 12 is completed. (Second step)

  FIG. 2 shows a configuration for performing an electrical test including contact of the connection terminals 11 and 12 of the multiple electrical signal connection device 1 in the multiple electrical signal connection device manufacturing inspection device 100. .

  In FIG. 2, reference numeral 111 denotes an arrangement interval of the first or second connection terminal in the XY plane of the spring deformable portion 14 that is the same as an arrangement interval of connection terminals of an electronic device (not shown) to be connected. The inspection jig substrate 116 including the connection terminal group 112 and the extended wiring portion 113 is a terminal fixing unit capable of pressing and fixing the spring deformation portion 14 on the connection terminal 112 of the inspection jig substrate 111. .

  By attaching the terminal fixing unit 116 and relatively pressing and fixing the spring deformation portion 14 of the first or second connection terminal and the connection terminal 112 of the inspection jig substrate 111, the multiple electric signal The connection between the connecting device 1 and the inspection jig substrate 111 is reliably ensured. (Third step)

  On the other hand, along with the first probe 114 that can be moved in the X, Y, and Z directions arranged on one connection terminal group 112 of the inspection jig substrate 111 or the extension wiring portion 113, 115 is the inspection jig substrate 111. The 2nd probe which can be moved to the X, Y, Z direction arrange | positioned at the other connection terminal group 112 or the said extension wiring part 113 is shown. The first probe 114 is brought into contact with one extended wiring portion 113a of the inspection jig substrate 111, and the second probe 115 is brought into contact with the other extended wiring portion 113b of the inspection jig substrate 111, so that the measurement signal A predetermined measurement signal is given from the supply device 151 to the inspection jig substrate 111 via the first probe 114, and the inspection jig is connected by the signal detection determination device 152 via the multiple electrical signal connection device 1. A comprehensive inspection of the multiple electrical signal connection device 1 is performed by detecting an electrical signal generated on the substrate 111 and performing an inspection determination on the multiple electrical signal connection device 1. (4th step)

  FIG. 3 is a diagram for explaining a manufacturing / inspection procedure of the manufacturing / inspection apparatus for the multiple electrical signal connecting apparatus according to the first embodiment of the present invention described above. As described above, according to the multiple electrical signal connecting device manufacturing and inspection apparatus of the first embodiment of the present invention, the shape processing and manufacturing of the connecting terminal spring deforming portion 14 and the electrical inspection including the terminal contact portion are continuously performed. Can be implemented.

  In this embodiment, the inspection jig substrate 111 includes a connection terminal group having the same arrangement interval of circuit board connection terminals of an electronic device (not shown) to be connected to the multiple electrical signal connection device 1. Although the inspection jig substrate 111 has been described, an actual circuit board used for the electronic device to be connected may be used.

  FIG. 4 is a diagram for explaining a multiple electric signal connection device manufacturing / inspection apparatus 100 according to the second embodiment of the present invention, and a configuration of the multiple electric signal connection device manufacturing / inspection apparatus capable of inspecting a semiconductor to be inspected. Is shown. In FIG. 4, the steps described in FIGS. 1A and 1B, that is, the bending process of the connection terminal portion in the first step and the wiring pattern inspection determination of the electric signal connection device in the second step are the same and are omitted. The following third and fourth steps will be described.

  In FIG. 4, reference numeral 121 denotes an inspection jig substrate including a connection terminal group 122 and an extended wiring portion 123 having the same arrangement interval in the XY plane of the spring deformation portion 14 of the second connection terminal 12, 133. Is a semiconductor fixing base that can move in the X, Y, Z direction or the rotation direction for fixing the semiconductor 131 to be inspected having the terminal group 132 having the same arrangement interval in the XY plane of the first connection terminal 11 ′. A position conversion fixing unit for aligning and fixing the spring deformable portion 14 ′ of the first connection terminal 11 ′ in a direction facing the terminal group 132 of the semiconductor to be inspected is shown.

  The position converting / fixing unit 134 is mounted on the inspection jig substrate 121, and the spring deforming portion 14 'of the first connection terminal 11' is aligned and fixed in a direction facing the terminal group 132 of the semiconductor to be inspected. The terminal fixing unit 116 is attached to the inspection jig substrate 121, and the spring deforming portion 14 of the second connection terminal 12 and the connection terminal 122 of the inspection jig substrate 121 are relatively pressed and fixed. (Third step)

  The spring deformed portion 14 ′ of the first connection terminal 11 ′ is brought into contact with a predetermined opposed terminal group 132 of the semiconductor to be inspected, and the first probe 114 and the second probe 115 are connected to the inspection jig substrate. A predetermined measurement signal is given to the inspection jig substrate 121 from the measurement signal supply device 151 via the first probe 114, and the inspection treatment is performed by the measurement signal. An electrical signal generated in the inspected semiconductor 131 is detected via the tool substrate 121 and the multiple electrical signal connecting device 1 ′, and the inspection of the inspected semiconductor 131 is determined based on the detected signal. (4th step)

  FIG. 5 is a diagram for explaining the manufacturing / inspection procedure of the manufacturing / inspection apparatus for the multiple electrical signal connecting apparatus according to the second embodiment of the present invention described above. As described above, according to the multiple electrical signal connection device manufacturing and inspection apparatus of the second embodiment of the present invention, the shape of the connection terminal spring deforming portion 14 is processed and the semiconductor to be inspected such as a probe card is manufactured. It becomes possible to carry out electrical inspection continuously.

  As described above, according to the first embodiment, it is possible to continuously carry out the electrical inspection including the tip shape processing manufacture of the connection terminal and the reliability of the contact terminal, and it is possible to manufacture and inspect for a short time. Become. Furthermore, according to the second embodiment, it can be used as an inspection device such as a probe cart, and it is possible to manufacture a multiple electric signal connecting device and inspect an inspected device in a short time.

  In particular, electrical signal connection devices used for connecting multiple interconnects having a narrow pitch arrangement, and manufacturing and processing of terminal tips of multiple electrical signal connection devices in electronic devices such as narrow pitch connectors, liquid crystal devices, probe cards, etc. It can be used for electrical inspection.

DESCRIPTION OF SYMBOLS 1 Multiple electrical signal connection apparatus 11 1st connection terminal 12 2nd connection terminal 13 Wiring pattern 14 Spring deformation | transformation part 15 Fixing plate 21 Connection terminal A
22 Connection terminal B
P1 First connection terminal arrangement interval P2 Second connection terminal arrangement interval Pa Connection terminal A arrangement interval Pb Connection terminal B arrangement interval 100 Multiple electric signal connection device manufacturing inspection device 101 Connection device fixing base 102 Bending Unit 103 Die 104 Punch 111, 121 Inspection jig substrate 112, 122 Inspection jig substrate connection terminal 113, 123 Extension wiring part 114 First probe 115 Second probe 116 Terminal fixing unit 131 Semiconductor to be inspected 132 Terminal group of semiconductor to be inspected 133 Semiconductor fixing base 134 Position conversion fixing unit 151 Measurement signal supply unit 152 Signal detection determination unit 153 Drive control unit

Claims (5)

On the insulating substrate, a plurality of first connection terminals on one side, a plurality of second connection terminals on the other side, and a wiring pattern for electrically connecting the first connection terminal and the second connection terminal A multiple electric signal having a spring deforming part that elastically deforms at least in the direction perpendicular to the substrate surface (XY plane) (Z direction) at the tip of the first or second part or all of the connection terminals A manufacturing inspection device for a connecting device,
A connection device fixing base that fixes the multiple electrical signal connection device and is movable in the X, Y, Z direction or the rotation direction;
One or a plurality of the first or second connection terminal tip portions are inserted, and the bending is movable in the X, Y, Z direction or the rotation direction provided with a conductive die and punch for bending. Processing unit,
An inspection jig substrate having a connection terminal group and / or an extended wiring portion in which the arrangement intervals in the XY plane of the spring deformation portion of the first or second connection terminal are the same;
A terminal fixing unit capable of pressing and fixing the spring deformation portion on the connection terminal or the extended wiring portion of the inspection jig substrate;
A first probe that can be moved in the X, Y, and Z directions disposed on one of the first or second connection terminals, or one of the connection terminal groups and / or the extended wiring portion of the inspection jig substrate. When,
A second probe that is movable in the X, Y, and Z directions disposed on the other connection terminal of the first or second connection terminal or the other connection terminal group and / or the extended wiring portion of the inspection jig substrate. When,
A measurement signal supply source for supplying a predetermined measurement signal to the multiple electrical signal connection device or the inspection jig substrate via the first or second probe;
A signal detection determination unit that detects an electrical signal generated in the multiple electrical signal connection device or the inspection jig substrate by the measurement signal, and performs inspection determination of the multiple electrical signal connection device based on the detected signal;
A device for inspecting and manufacturing a multiple electrical signal connection device, comprising: the connection device fixing base; the bending unit; and a drive control unit for driving the first and second probes. The connecting device fixing base or the bending unit is moved in the X, Y, Z direction or the rotational direction, and the tip of one or a plurality of the first or second connecting terminals is formed on the die and punch of the bending unit. A first step of continuously performing the bending of the connection terminal by inserting it at a predetermined position between the first and the second, and completing the bending of the multiple electrical signal connecting device;
The first probe is brought into contact with one connection terminal of the first or second connection terminal, and the other connection terminal of the first or second connection terminal is brought into contact with a die or a punch of the bending unit. A predetermined measurement signal is supplied from the measurement signal supply source to the multiple electrical signal connecting device via the first probe, and is generated in the die or punch of the bending unit via the multiple electrical signal connecting device. A second step of detecting an electrical signal and performing an inspection determination of a wiring pattern of the multiple electrical signal connection device by the signal detection determination unit;
The inspection jig substrate and the terminal fixing unit are attached, and the spring deformed portion of the first or second connection terminal and the connection terminal or extension wiring portion of the inspection jig substrate are relatively pressed and fixed. Steps,
The first probe is brought into contact with one connection terminal group or extension wiring portion of the inspection jig substrate, and the second probe is brought into contact with the other connection terminal group or extension wiring portion of the inspection jig substrate, A predetermined measurement signal is supplied from the measurement signal supply source to the inspection jig substrate via the first or second probe, and the other inspection jig substrate is connected to the inspection jig substrate via the multiple electrical signal connection device according to the measurement signal. In the fourth step of detecting the electrical signal generated in the signal, and performing the inspection determination of the multiple electrical signal connection device by the signal detection determination unit,
2. The manufacturing and inspection apparatus for a multiple electrical signal connection device according to claim 1, wherein the multiple electrical signal connection device is continuously manufactured and inspected. On the insulating substrate, a plurality of first connection terminals on one side, a plurality of second connection terminals on the other side, and a wiring pattern for electrically connecting the first connection terminal and the second connection terminal A multiple electric signal having a spring deforming part that elastically deforms at least in the direction perpendicular to the substrate surface (XY plane) (Z direction) at the tip of the first or second part or all of the connection terminals A manufacturing inspection device for a connecting device,
A connection device fixing base that fixes the multiple electrical signal connection device and is movable in the X, Y, Z direction or the rotation direction;
One or a plurality of the first or second connection terminal tip portions are inserted, and the bending is movable in the X, Y, Z direction or the rotation direction provided with a conductive die and punch for bending. Processing unit,
A semiconductor fixing base that is movable in the X, Y, Z direction or the rotation direction for fixing a semiconductor to be inspected having a terminal group having the same arrangement interval in the XY plane of the spring deformation portion of the first connection terminal;
An inspection jig substrate provided with a connection terminal group and / or an extended wiring portion having the same arrangement interval in the XY plane of the spring deformation portion of the second connection terminal;
A position conversion fixing unit that aligns and fixes the tip of the first connection terminal in a direction opposite to the terminal group of the semiconductor to be inspected;
A terminal fixing unit capable of pressing and fixing the spring deformation portion of the second connection terminal on the connection terminal or the extension wiring portion of the inspection jig substrate;
A first probe that can be moved in the X, Y, and Z directions disposed on one of the first or second connection terminals, or one of the connection terminal groups and / or the extended wiring portion of the inspection jig substrate. When,
A second probe that is movable in the X, Y, and Z directions disposed on the other connection terminal of the first or second connection terminal or the other connection terminal group and / or the extended wiring portion of the inspection jig substrate. When,
A measurement signal supply source for supplying a predetermined measurement signal to the multiple electrical signal connection device or the inspection jig substrate via the first or second probe;
The measurement signal detects an electrical signal generated in the multiple electrical signal connection device or the semiconductor to be inspected via the inspection jig substrate and / or the multiple electrical signal connection device, and based on the detected signal, the A multiple electrical signal connection device or a signal detection determination unit for performing inspection determination of the semiconductor to be inspected;
A manufacturing and inspection apparatus for a multiple electrical signal connection device, comprising: the semiconductor fixing base, the connection device fixing base, the bending unit, and a drive control unit that drives the first and second probes. The connecting device fixing base or the bending unit is moved in the X, Y, Z direction or the rotational direction, and the tip of one or a plurality of the first or second connecting terminals is formed on the die and punch of the bending unit. A first step of continuously performing the bending of the connection terminal by inserting it at a predetermined position between the first and the second, and completing the bending of the multiple electrical signal connecting device;
The first probe is brought into contact with one connection terminal of the first or second connection terminal, and the other connection terminal of the first or second connection terminal is brought into contact with a die or a punch of the bending unit. A predetermined measurement signal is supplied from the measurement signal supply source to the multiple electrical signal connecting device via the first probe, and is generated in the die or punch of the bending unit via the multiple electrical signal connecting device. A second step of detecting an electrical signal and performing an inspection determination of a wiring pattern of the multiple electrical signal connection device by the signal detection determination unit;
The position conversion fixing unit is attached, the spring deformation portion of the first connection terminal is aligned and fixed in a direction facing the terminal group of the semiconductor to be inspected, the inspection jig substrate and the terminal fixing unit are attached, A third step of relatively pressing and fixing the spring deformation portion of the connection terminal of 2 and the connection terminal of the inspection jig substrate or the extension wiring portion;
The first connection terminal and a predetermined terminal group of the semiconductor to be inspected are brought into contact with each other, and the first and second probes are brought into contact with the connection terminal group or the extension wiring portion of the inspection jig substrate, A predetermined measurement signal is supplied from the measurement signal supply source to the inspection jig substrate via the first or second probe, and the measurement signal is supplied via the inspection jig substrate and the multiple electric signal connection device. According to a fourth step of detecting an electrical signal generated in the inspection semiconductor, and performing an inspection determination of the semiconductor to be inspected by the signal detection determination unit,
4. A manufacturing and inspection apparatus for a multiple electrical signal connection device according to claim 3, wherein the manufacture of the multiple electrical signal connection device and the inspection of a semiconductor to be inspected are continuously performed.   5. The manufacturing inspection apparatus for a multiple electrical signal connection device according to claim 1, wherein the inspection jig substrate has substantially the same shape as a circuit board to be connected to the multiple electrical signal connection device.

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