JP2019135710A - Multiple electric signal connection device and connection method - Google Patents

Abstract

To provide a multiple electric signal connection device and connection method for reducing costs, and for simplifying a connection process by performing firm and detachable wiring connection with the minimum mounting area without performing metal molten connection such as soldering in narrow pitch multiple electric signal connection, and further highly accurately achieving pitch conversion from a terminal array having fine pitches.SOLUTION: The multiple electric signal connection device includes, on an insulating substrate, a plurality of first connection terminals on one side and a plurality of second connection terminals on the other side, and wiring patterns electrically connecting the first connection terminals to the second connection terminals, therein the top end parts of the first and second partial or whole connection terminals are respectively formed with a spring deformation part for generating elastic deformation in a vertical direction (Z direction) on at least a substrate surface (XY plane), and a movable function with respect to at least the Z direction is provided in a partial or whole range of the spring deformation part.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electrical signal connection device used for connecting multiple interconnects having a narrow pitch arrangement and its connection method, and more particularly to electrical signal connection in electronic devices such as narrow pitch connectors, liquid crystal devices, and probe cards.

  In recent years, there has been remarkable progress in electronic devices and electronic components, and the degree of integration per unit area has been improved with the increase in functionality, size, weight, and capacity. For this reason, the number of electrical signals exchanged between electronic devices or electronic components has increased, and both connection terminal portions and wiring patterns have to be installed in a minute space.

  For example, in the liquid crystal display device, the image quality is increasing year by year, and the number of pixels is increasing dramatically. Although the number of wirings with the drive circuit for driving these pixels has reached several thousand per unit, in order to electrically connect such a drive object and the drive circuit, In general, the connection terminals are fixed to each other by soldering or pressure welding with a flexible substrate or the like.

  Before the drive circuit is connected and fixed, a lighting inspection of each pixel of the liquid crystal screen is performed and a quality inspection of the liquid crystal screen is performed. Therefore, it is desirable that the connection terminal on the pixel side and the connection terminal such as a flexible substrate can be removed. In general, a connector having an insertion / extraction function is used to enable the removal, but the mounting occupation area is increased, which hinders downsizing.

  As another example in which narrow pitch multiple array connection is required, there is a probe card for performing an electrical inspection of an IC on a semiconductor wafer. The probe terminals arranged at the same number and the same pitch are brought into contact with the electric terminals of the miniaturized IC, and further, the terminals for connection from the probe to the tester are wired on the substrate. As a wiring method, wiring is generally performed using a multilayer board constituting the probe card. However, as the number of pins is increased and the pitch is reduced, the number of boards is increased to several tens of layers. is there.

  On the other hand, the progress of the electrical equipment function is remarkable, and the model of the IC is frequently changed to cope with the progress. Therefore, it is necessary to make a new multi-layer substrate each time. Is becoming a problem.

  In order to solve the problem of the probe card, the present inventors, as an efficient probe card assembling method, for example, as disclosed in Japanese Patent Application Laid-Open No. 2006-206160, a copper layer is formed on the surface layer of the probe card main board. A foil sheet is processed, and one or a plurality of wiring pattern sheets on which a wiring pattern for connecting the interface portion between the probe and the tester is formed are provided, and one end of any wiring pattern on the wiring pattern sheet is A configuration is proposed in which the wiring pattern is electrically connected to the probe, and the other end of the wiring pattern is electrically connected to a terminal of the interface unit or another terminal on the main board.

  A general example used as the probe card disclosed in JP-A-2006-206160 and a conventional multiple electric signal connection method is shown as a side view in FIG.

  In FIG. 4, on the insulating substrate 10, a plurality of first connection terminals 11 on one side, a plurality of second connection terminals 12 on the other side, and the first connection terminals 11 and the second connection terminals 12. A multiple electrical signal connection device 100 having a wiring pattern 13 for electrically connecting the two is configured. 21 is a connection terminal A of an electronic device or electronic component (not shown) to be connected to the first connection terminal 11, and 22 is an electronic device or electronic component (to be connected to the second connection terminal 12). A connection terminal B of (not shown) is shown. In order to connect between the connection terminal A21 and the connection terminal B22 using the multiple electrical signal connection device 100, the first connection terminal 11, the connection terminal A21, and the second connection terminal 12 are connected. And the connection terminal B22 are soldered with a solder 40.

JP, 2006-206160, A

  However, according to the method disclosed in Japanese Patent Application Laid-Open No. 2006-206160, the number of terminals of the interface section has 1000 to 2000 pins, and all of them use connection fixing means such as soldering As a result, there arises a problem of high cost and long delivery time during assembly and maintenance.

  In general, as a problem with connection devices that require a narrow pitch multiple array connection, the narrower the pitch and the greater the number of pins, the higher the limit of the structure for narrowing the wiring connection, the higher the cost of the connection method, and the longer the delivery time. Problems arise.

  The present invention has been made in order to solve the problems in the above-described narrow pitch multiple electric signal connection. In the wiring connection between electronic devices or electronic components which tend to have a narrow pitch and multiple pins, the connection terminal portion With the spring structure installed in the cable, it is possible to achieve a robust and detachable wiring connection with a minimum mounting area without performing metal fusion connection such as soldering. For example, it is possible to provide a multiple electrical signal connection device and a connection method that are inexpensive and easy to connect by enabling pitch conversion from a terminal array having a size of 30 μm or less to be realized with high accuracy.

  The multiple electrical signal connection device of the present invention includes a plurality of first connection terminals on one side, a plurality of second connection terminals on the other side, the first connection terminal, and the second connection terminal on an insulating substrate. And a wiring pattern for electrically connecting between the first and second terminals or all of the connection terminals, elastic at least in the direction perpendicular to the substrate surface (XY plane) (Z direction) It has a spring deforming portion that causes deformation, and a fixed plate having a movable function in at least the Z direction is installed in a part or all of the spring deforming portion, and the first or second connection terminal Since the spring deformation portion is a means for fixing the spring deformation portion by the spring force of the spring deformation portion by pressing in the Z direction with the fixing plate on the connection terminal to be connected to the first or second connection terminal. No need for metal fusion connection Thereby enabling detachable mounting area of the connection.

  In addition, each arrangement interval in the XY plane of the spring deforming portion of the first or second connection terminal is equal to an arrangement interval in the XY plane of the connection terminal of the connection target device of the first or second connection terminal in advance. By means of the same arrangement as much as possible, the connection terminals can be connected with high accuracy.

  In addition, since the first connection terminal, the second connection terminal, and the wiring pattern are made of the same continuous metal, it can be easily manufactured, has excellent mass productivity, and can realize a highly accurate wiring pattern. is there.

  Further, at least the first connection terminal and the second connection terminal are made of a metal having a large elastic coefficient (for example, nickel alloy), and the wiring pattern is made of a metal having a large conductivity (for example, copper alloy). Or since it comprised with 3 or more types of metals, the coupling | bonding of a connection terminal part becomes firm, and the electrical signal connection apparatus with few electrical resistances is realizable.

  Further, since the first connection terminal pitch is different from the second connection terminal pitch, and the means includes a curve (for example, a spline curve) in which a part or all of the shape of the wiring pattern is continuous, a terminal arrangement with a minimum pitch is provided. It is possible to easily realize pitch conversion from a connection terminal having a connection terminal to a connection terminal having a relatively large pitch terminal arrangement.

  Also, the wiring pattern pitch or the wiring pattern width from the first or second connection terminal having a relatively small connection terminal pitch to the other connection end having a relatively large connection terminal pitch. Since there is a means for continuously increasing the size, a multiple electrical signal connection device with low electrical resistance even when converting from a connection terminal having a terminal arrangement with a very small pitch to a connection terminal having a terminal arrangement with a relatively large pitch Can be realized.

  Further, by means of collectively producing the first connection terminal, the second connection terminal, and the wiring pattern by an electroforming method, a connection with an extremely small pitch (for example, 30 μm pitch or less) impossible with a conventional flexible substrate or the like is possible. The terminal arrangement can be realized with high accuracy.

  According to the multiple electrical signal connecting device of the present invention, in the wiring connection between electronic devices or electronic components that tend to have a narrow pitch and multiple pins, metal fusion such as soldering is performed by a spring structure installed in the connection terminal portion. Pitch conversion from a terminal arrangement with a minimum pitch (for example, 30 μm or less) that cannot be realized with a conventional connector, and enables a robust and removable wiring connection with a minimum mounting area without connection. Can be realized with high accuracy, thereby providing a multiple electric signal connecting device and a connecting method which are inexpensive and easy to connect.

It is a perspective view which shows the basic composition of the multiple electric signal connection apparatus which concerns on embodiment of this invention. It is a side view which shows the structure of the multiple electrical signal connection apparatus which concerns on embodiment of this invention. It is a side view which shows the connection method and operation | movement of the multiple electrical signal connection apparatus which concern on embodiment of this invention. It is a side view which shows the connection method of the conventional multiple electric signal connection apparatus.

  Next, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a perspective view showing a basic configuration of a multiple electrical signal connection device 1 according to an embodiment of the present invention. On the insulating substrate 10, a plurality of first connection terminals 11 on one side and a plurality of second connection terminals 12 on the other side are electrically connected between the first connection terminal 11 and the second connection terminal 12. A wiring pattern 13 to be connected to the first connection terminal 11, the second connection terminal 12, or a part or all of the connection terminals, respectively, at least perpendicular to the substrate surface (XY plane) (Z direction) It has the spring deformation | transformation part 14 which produces elastic deformation. In the range of the spring deformation portion 14-1 of the first connection terminal 11, a fixed plate 15-1 having a movable function at least in the Z direction is installed, and the spring deformation portion 14-2 of the second connection terminal 12 is In the range, a fixed plate 15-2 having a movable function at least in the Z direction was installed.

  21 is a connection terminal A of an electronic device or electronic component (not shown) to be connected to the first connection terminal 11, and 22 is an electronic device or electronic component (to be connected to the second connection terminal 12). A connection terminal B of (not shown) is shown. An example in which bumps 16 formed of copper or solder are provided on the connection terminal B22 is shown.

  The first connecting terminal 11 and the connecting terminal A21 are arranged such that each arrangement interval P1 in the XY plane of the first connecting terminal 11 including the spring deforming portion 14-1 is arranged in the XY plane of the connecting terminal A21. The distance Pa is set as much as possible in advance. Similarly, each arrangement interval P2 in the XY plane of the second connection terminal 12 including the spring deforming portion 14-2 is installed in advance to be the same as the arrangement interval Pb in the XY plane of the connection terminal B22. .

  The spring deformation portion 14-1 of the first connection terminal 11 is pressed downward in the Z direction by the fixing plate 15-1 on the connection terminal A21 to be connected. It is fixed by. Similarly, the spring deforming portion 14-2 of the second connection terminal 12 is pressed downward in the Z direction by the fixing plate 15-2 on the connection terminal B22 to be connected. It is fixed by the spring force.

  The first connecting terminal 11 and the connecting terminal A21 or the second connecting terminal 12 and the connecting terminal B22 are aligned with each other by a reference hole 18 provided on each substrate. Can be implemented with accuracy.

  In the example of FIG. 1, an example in which the arrangement interval P1 of the first connection terminals is different from the arrangement interval P2 of the second connection terminals is shown. The connection terminal A21 to be connected to the first connection terminal 11 is an example of a terminal arrangement with a very narrow pitch (for example, several tens of μm) as seen in an IC electrode terminal, for example, and the second connection The connection terminal B22 to be connected to the terminal 12 is an example of a relatively large arrangement interval (for example, several hundred μm to several mm), for example, a connection terminal of a test apparatus that transmits and receives an inspection signal through an IC electrode terminal. The wiring pattern 13 has a pitch between the arrangement interval P1 of the first connection terminals 11 and the arrangement interval P2 of the second connection terminals 12 in order to connect the connection between the connection terminal A21 and the connection terminal B22. In order to perform conversion, a part or all of the shape of the wiring pattern 13 is constituted by a continuous curve 17 (for example, a spline curve).

  Further, the wiring pattern pitch Pw or the wiring pattern width Wp extends from the first connection terminal 11 having a relatively small connection terminal interval to the second connection terminal 12 having a relatively large connection terminal interval. It is also possible to install it so that it continuously increases.

  FIG. 2 is a side view showing the structure of the multiple electrical signal connecting device according to the embodiment of the present invention. FIG. 2A shows the case where the first connection terminal 11, the second connection terminal 12, and the wiring pattern 13 are made of the same metal. On the other hand, FIG. 2B shows that at least the first connection terminal 11 and the second connection terminal 12 are made of a first metal 31 (for example, nickel alloy) having a large elastic coefficient, and the wiring pattern 13 is conductive. It shows that it consists of the 2nd metal 32 (for example, copper alloy etc.) with big property. As a method for producing such a wiring pattern made of two or more kinds of metals, an electroforming method or the like is effective.

  FIG. 3 is an explanatory diagram illustrating a connection method and operation of the multiple electrical signal connection device according to the embodiment of the present invention. By pressing the spring deformation portion 14-2 of the second connection terminal 12 on the bump 16 of the connection terminal B22 to be connected with the fixing plate 15-2 by the force F downward in the Z direction, It shows the operation when the spring deforming portion 14-2 is fixed by the spring reaction force.

  FIG. 3A shows a state in which the fixed plate 15-2 moves downward in the Z direction and starts to contact the spring deforming portion 14-2. FIG. 3B shows that the fixing plate 15-2 further moves downward in the Z direction, and the spring deformation portion 14-2 of the second connection terminal 12 is connected to the bump of the connection terminal B22 to be connected. 16 is fixed by the spring reaction force of the spring deforming portion 14-2 by being pressed by the fixing plate 15-2 with the force F downward in the Z direction. As shown in the figure, the shape of the spring deforming portion 14-2 is obtained by bending the distal end portion of the second connection terminal 12 approximately 30 degrees in the + Z direction, but is not limited to this shape.

  According to the embodiment described above, according to the multiple electric signal connecting device of the present invention, in the wiring connection between electronic devices or electronic components which tend to have a narrow pitch and multiple pins, the spring structure installed in the connection terminal portion This makes it possible to achieve a robust and detachable wiring connection with a minimum mounting area without performing a metal fusion connection such as soldering, and a minimum pitch (for example, 30 μm or less) that cannot be realized with a conventional connector. By making it possible to realize pitch conversion from the terminal arrangement having high accuracy, it is possible to provide a multiple electric signal connecting device and a connecting method that are inexpensive and easy to connect.

  In particular, it is an electrical signal connection device used for connecting multiple interconnects having a narrow pitch arrangement, and can be used for electrical signal connection in electronic devices such as narrow pitch connectors, liquid crystal devices, and probe cards.

DESCRIPTION OF SYMBOLS 1,100 Multiple electric signal connection apparatus 11 1st connection terminal 12 2nd connection terminal 13 Wiring pattern 14 Spring deformation | transformation part 15 Fixing board 16 Bump 17 Curve 18 Reference hole 21 Connection terminal A
22 Connection terminal B
31 First Metal 32 Second Metal P1 First Connection Terminal Arrangement P2 Second Connection Terminal Arrangement Pa Connection Terminal A Arrangement Pb Connection Terminal B Arrangement Pw Wiring Pattern Pitch Wp Wiring Pattern width

Claims (8)

  On the insulating substrate, a plurality of first connection terminals on one side, a plurality of second connection terminals on the other side, and a wiring pattern for electrically connecting the first connection terminal and the second connection terminal A spring deforming portion that elastically deforms at least in the direction perpendicular to the substrate surface (XY plane) (Z direction) at the tip of the first or second part or all of the connection terminals, and the spring A multiple electric signal connecting device characterized in that a fixed plate having a movable function at least in the Z direction is installed in a part or all of the deformed portion.   Each arrangement interval in the XY plane of the spring deformation part of the first or second connection terminal is previously the same as the arrangement interval in the XY plane of the connection terminal of the connection target device of the first or second connection terminal. 2. The multiple electrical signal connecting device according to claim 1, wherein the device is installed as much as possible.   2. The multiple electrical signal connection device according to claim 1, wherein the first connection terminal, the second connection terminal, and the wiring pattern are made of the same continuous metal.   At least the first connection terminal and the second connection terminal are made of a first metal (for example, nickel alloy) having a large elastic coefficient, and the wiring pattern is a second metal (for example, copper alloy) having a high conductivity. 2. The multiple electric signal connecting device according to claim 1, wherein the multiple electric signal connecting device is composed of two or more kinds of metals.   The multiplicity according to claim 1, wherein the first connection terminal pitch is different from the second connection terminal pitch, and a part or all of the shape of the wiring pattern includes a continuous curve (for example, a spline curve). Continuous electrical signal connection device   The multiple electrical signal connection device according to claim 5, wherein the connection terminal pitch reaches from the first or second connection terminal having a relatively small connection terminal pitch to the other connection terminal having a relatively large connection terminal pitch. The multiple electric signal connecting device, wherein the pitch between the wiring patterns or the wiring pattern width is continuously increased   The multiple electrical signal connection device according to claim 1, wherein the first connection terminal, the second connection terminal, and the wiring pattern are collectively produced by an electroforming method.   The multiple electrical signal connection device according to claim 1, wherein the spring deformation portion of the first or second connection terminal is connected to the connection target of the first or second connection terminal. A multiple electric signal connecting method characterized by being fixed by a spring force of the spring deforming portion by being pressed in the Z direction by the fixing plate.

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