KR102072451B1 - Probe Card Head Block - Google Patents

Abstract

Disclosed is a probe card head block. According to one embodiment, the probe card head block comprises: an upper probe guide; a lower probe guide formed spaced apart from a lower portion of the upper probe guide; and a probe having upper and lower portions coupled to the upper and lower probes. Each of the upper and lower probe guides is formed of a plurality of layers, wherein each of the plurality of layers is formed with a guide hole into which the probe is fitted. A probe can be bent by differently forming a shape and a position of the guide hole for each layer and an end portion of the probe is fitted into the guide hole so as to be fixed.

Description

Probe Card Head Block

Disclosed is a probe card head block, and more particularly, a plurality of contact points formed on a probe card for checking defects by applying an electrical signal and contacting semiconductor elements constituting the semiconductor wafer to check for defects. The present invention relates to a probe card head block capable of reading a presence and performing a defect inspection.

Unless otherwise indicated herein, the contents described in this section are not prior art to the claims of this application, and inclusion in this section is not admitted to be prior art.

After completion of wafer process, semiconductor devices undergo a product test to determine the final package, that is, process yield and abnormality of electrical signals. Probe cards are used.

However, with the recent development of semiconductor technology, as the integration and miniaturization of circuits is made, in order to reduce the overall size, several chips are mounted on a PCB and then packaged at a time, SIP (System In Package) and POP (Package On Package). Wafer Level Chip Scale Package (WLCSP) is used.

In order to reduce the thickness of semiconductor components, WLCSP, which stacks and packages several chips, and flip chips, POP, and MCP, which connect chips directly to PCBs using solder balls instead of wires, are mainly used.

In order to increase the degree of integration of semiconductor devices, MCP for wire bonding by stacking chips and POP for stacking packages are generally used, but recently, two or more chips are vertically stacked and an electrode penetrates silicon through a method for increasing processing speed. TSV technology, which connects circuits through wires, has begun to be applied.

In addition, Apple's recent adoption of FoWLP (Fan out wafer level package) technology, which is a form of placing package I / O terminals on the outside of the chip, has been in the spotlight.

This has the advantage that the standardized ball layout can be used as it is even if the chip size is small, and the packaging process is simple and the thickness can be realized.

In the transition period of the above-mentioned semiconductor packaging technology, new demand for wafer-level semiconductor inspection technology continues.

3D integrated system on chip (SOC) semiconductor is composed of a micro bump and a Cu pillar-type terminal formed in a lattice arrangement, and these terminals connect and stack a plurality of semiconductor devices or substrates.

The semiconductor inspection in the pre-package stage is connected to the test equipment by contacting the micro probe with the micro bump and the Cu pillar. The probe used in this case has to be vertical due to the lattice structure of the terminal, and also compared with the vertical horizontal structure. High probe power increases the likelihood of breakage of terminals and patterns.

Therefore, the probe pin must have low contact resistance for stable signal transmission while realizing low contact force to prevent circuit breakage in the terminal, and precise probe pin guide production is required to cope with the fine pitch of the terminal.

Fine probe pin guides are usually made of special ceramic materials from Ferrotec (Japan) and are manufactured by precision mechanical drilling.

However, the recent trend of applying new guide material and laser drilling together with MEMS probe pins to cope with ultra-fine pitches of less than 100㎛ has led the US and European companies to lead the technology. Are on stage.

On the other hand, as shown in Figure 4, the vertical probe card,

The upper reinforcement plate 110 ', the PCB 120' connected to the lower portion of the reinforcement plate 110 ', the interposer 130' connected to the lower portion of the PCB 120 ', and the interposer 130' It is composed of a probe head block (P ') connected to the bottom of the space transformer 140', and connected to the bottom of the space transformer 140 'and formed with a plurality of vertical probes 6'.

The head block P 'of the conventional probe card is, as shown in Figure 5 and 6,

A lower probe guide 2 'having a plurality of holes formed therein, a film 4' formed spaced apart from the upper probe guide 2 ', and an upper probe guide 8' formed on an upper surface of the film 4 '. ) And a plurality of probes 6 'coupled through the lower probe guide 2', the film 4 ', and the upper probe guide 8'.

The lower part of the probe 6 'is assembled to the lower probe guide 2' through the film 4 ', and the upper probe guide 8' is assembled by aligning holes on the upper part of the plurality of probes 6 '.

The probe 6 'is formed to be inclined so that the upper and lower portions are fixed to the upper probe guide 8' and the lower probe guide 2 ', respectively.

In addition, the process of bending the probe to reduce the stress of the probe, the contact reaction force and the driving direction control required a lot of work maneuver, there was a disadvantage that the accuracy of the probe is lowered.

When the ends of the plurality of probes 6 'are worn to become almost the same length as the lower probe guide 2', the contact performance is lowered, and thus the probes need to be replaced.

Conventionally, the guide holes H 'formed in the lower probe guides 8' and 2 'depended on machining, so that only circular structures were possible by machine drilling, and corresponded to pitches of 100 mu m or more.

In recent years, it is necessary to form a rectangular guide hole by laser drilling.

When laser drilling in this way, it is possible to perform ultra-precision processing with a pitch of 100 μm or less.

In addition, the probe is a metal wire having a rectangular cross section and is formed with a smaller cross-sectional area than the guide hole.

Therefore, as shown in FIG. 6, after the probes 6 'are inserted into the guide holes H', each of the probes 6 'is coupled in an unaligned state so that the guide holes may be uniformly aligned. A process of uniformly aligning a plurality of probes 6 'in close contact with one direction of H') was required.

In the prior art, since the tolerance of the guide hole is large and there is a lot of play between the probe and the guide, the precision and driving stability are low, and there is a difficulty in coping with a fine pitch.

In the prior art, in the processing of a guide hole, when a rectangular laser processing is performed, a certain rounding phenomenon occurs at the corners according to the spot size and various conditions of the laser, which may cause uneven alignment and driving instability of the probe. .

Korea Patent Registration No. 10-1416477

In order to reduce the stress of the probe and to implement proper contact reaction force, the degree of bending of the probe may be adjusted by the lower probe guide, and the probe may be inserted into the guide holes of the upper and lower probe guides to maintain an appropriate tension. Provide a card headblock.

On the other hand, the disclosure is a probe card head block that laser-drills the guide hole into a rectangle, but cuts only one part of the corner and aligns the two when assembling the probe to secure driving stability and fine pitch of the probe. to provide.

On the other hand, the disclosure is to provide a probe card head block that can be extended by the life of the probe by removing the part of the upper and lower probe guide, and by re-working the tip when the tip of the probe is worn.

An object of the embodiment includes an upper probe guide, a lower probe guide formed spaced below the upper probe guide, and the upper and lower probes coupled to the upper and lower probe guides, each of the upper and lower probe guides A plurality of layers are stacked to form a multilayer, and guide holes into which probes are inserted are formed, respectively, and holes are drilled individually to control the driving of the probe safely, and to adjust the direction of refraction and pad contact of the tip. Can be achieved by one probe card headblock.

According to the disclosed embodiments, it is possible to simplify the process by excluding the film, thereby improving work efficiency and reducing assembly costs, precisely fine pitch response, and improving safety and lifespan. have.

1 is a cross-sectional view showing a probe head block according to an embodiment;
2 is a view showing the operation of the probe head block according to the embodiment,
3 is a partially enlarged view illustrating a process of coupling the probe and the upper and lower probe guides in the probe head block according to the embodiment;
4 is a view showing a vertical probe card;
5 is a cross-sectional view showing a conventional probe head block,
Figure 6 is an enlarged plan view showing one form of a guide hole in a conventional probe head block.

Hereinafter, a preferred embodiment will be described in detail with reference to the accompanying drawings.

The embodiments to be described below are intended to be described in detail so that those skilled in the art to which the present invention pertains can easily practice the invention, and thus the technical spirit and scope of the present invention are limited. It does not mean.

In addition, the size or shape of the components shown in the drawings may be exaggerated for clarity and convenience of description, terms specifically defined in consideration of the configuration and operation of the present invention will vary depending on the intention or custom of the user or operator It should be understood that definitions of these terms should be made based on the contents throughout the specification.

1 is a cross-sectional view illustrating a probe head block according to an embodiment, FIG. 2 is a view illustrating an operation of a probe head block according to an embodiment, and FIG. 3 is a probe and an upper and lower probe guides in a probe head block according to an embodiment. A partial enlarged view showing the joining process in order.

As shown in Figure 1, the probe card head block according to the embodiment,

The upper probe guide 100, the lower probe guide 200 spaced apart from the lower portion of the upper probe guide 100, and the upper and lower probe guide 100, 200 coupled to the upper and lower probe guides (100) Include.

Each of the upper and lower probe guides 100 and 200 has a plate shape made of a nonmetal insulating material such as ceramic.

In addition, each of the upper and lower probe guides 100 and 200 is formed of a multilayer by stacking a plurality of layers.

Each of the upper and lower probe guides 100 and 200 is formed with a guide hole 6 into which the probe 300 is fitted, for each of a plurality of layers.

Referring to one embodiment, as shown in the enlarged view of FIG. 2, the lower probe guide 200 is formed of a plurality of layers, and positions and shapes of the guide holes 6 are different for each layer. As a result, the guide holes are gradually smaller in diameter as the lower layers are arranged to have a step.

Therefore, the probe 300 inserted into the guide hole of each layer may be bent obliquely, and the end of the probe 6 may be kept inserted.

Meanwhile, referring to another embodiment, as illustrated in FIG. 2, when each of the plurality of layers constituting the lower probe guide 200 is individually moved by a different distance, the guide holes of each layer are alternately arranged to be stepped on each other. The probes 300 inserted into the guide holes naturally bend, and the lower portion of the probe 300 is inserted into the guide holes 61 of the outermost layer 210.

Due to the stepped shape of each guide hole 6, the probe 300 has an appropriate bending state and an end of the probe 300 is inserted into the guide hole 6, and the upper, lower, upper and lower tips Proper tension is exerted so that the shape of the probe 300 may be deformed when the object (for example, the board of the space converter, etc.) touches.

For example, a plurality of layers forming the lower probe guide 200 may be

A first layer 210 disposed below and having a first guide hole 61 formed therein;

A second layer 220 stacked on an upper surface of the first layer 210 and having a second guide hole 62 formed therein;

A third layer 230 stacked on an upper surface of the second layer 220 and having a third guide hole 63 formed therein;

And a fourth layer 240 stacked on an upper surface of the third layer 230 and having a plurality of fourth guide holes 64 formed therein.

 Portions of the first to fourth guide holes 61, 62, 63, and 64 are overlapped with each other, and are gradually shifted so that the tips of the probes 300 can be inserted.

Therefore, referring to the enlarged view of FIG. 2, the first through fourth guide holes 61, respectively formed in the first layer 210, the second layer 220, the third layer 230, and the fourth layer 240, respectively, may be used. Since the first and fourth guide holes 61, 62, 63, and 64 are shifted to be inclined gradually by overlapping the formation positions of the 62, 63, and 64 parts by a predetermined portion, some of the diameters thereof become narrower. Are combined while having an appropriate inclination.

Meanwhile, the layers constituting the upper and lower probe guides 100 and 200 may be separated from each other.

That is, the first layer 210 to the fourth layer 240 may be separated from each other.

Therefore, when the tip of the probe 300 is worn out, it is possible to secure the exposure length of the tip of the probe 300 by sequentially removing the lower layer from the first layer 210, so that the upper and lower probe guides 100 and 200 need to be replaced. You can continue to use without.

As shown in FIG. 3, the guide hole 6 is formed by drilling a portion of the upper and lower probe guides 100 and 200 by laser processing.

According to an example, as shown in FIG. 3, 2 × 2 guide holes 6 are formed.

The guide hole 6 is formed of a polygon in which two sides meet to form a predetermined angle.

As an example, as shown in FIG. 3, the guide hole 6 is formed in a square shape, and four corners having an angle of 90 degrees are formed inside.

Expansion grooves 63 are formed at any one of the corners of the guide hole 6.

The expansion groove 63 is formed into an arc by cutting inward from the corner.

Expansion grooves 63 of each guide hole 6 should be formed in the same position.

Thus, by forming the expansion grooves 63 for each of the guide holes 6, when the probe 300 is assembled, the edge portions of the probes 300 may be inserted into the expansion grooves so that the coupling positions of the probes 300 may be constantly aligned. .

As shown in (a) of FIG. 3, the probe 300 is initially inserted into the guide hole 6 to show a non-uniform arrangement.

Then, as shown in (b) of Figure 3, by moving the upper probe guide 100 or the lower probe guide 200 to primary alignment so that each probe 300 is located at the lower edge of the expansion groove (63).

Then, as shown in (c) of Figure 3, by moving the upper probe guide 100 or the lower probe guide 200 to the secondary groove so that one side edge of the probe 300 is inserted into the expansion groove 63 a plurality of The probes 300 are inserted into the same expansion grooves 63, respectively, so that they can be evenly aligned.

Alternatively, as shown in the enlarged view of FIG. 2, a plurality of first layers 210, second layers 220, third layers 230, and fourth layers 240 constituting the lower probe guide 200. The lower end of the probe 300 is fitted into the lowermost guide hole 61 by different hole processing positions, and the first to fourth guide holes 61, 62, 63, and 64 of each layer are inclined. The probe can be controlled to bend.

That is, the formation positions of the first to fourth guide holes 61, 62, 63, and 64 formed in the first layer 210, the second layer 220, the third layer 230, and the fourth layer 240, respectively. Since the first to fourth guide holes (61, 62, 63, 64) are shifted so that the first to fourth guide holes (61, 62, 63, 64) are partially inclined while being overlapped by a predetermined portion, the probe 300 may be fitted.

Although described in connection with the preferred embodiment, it will be readily apparent to those skilled in the art that various modifications and variations can be made without departing from the spirit and scope of the invention, all such modifications and variations are within the scope of the appended claims. Is self-explanatory.

6: guide hole 7: expansion hole
100: upper probe guide 200: lower probe guide
210: first layer 220; 2nd layer
230: 3rd layer 240: 4th layer
300; Probe

Claims (6)

An upper probe guide, a lower probe guide spaced apart from the lower portion of the upper probe guide, and a probe connecting the upper and lower probe guides,
Each of the upper and lower probe guides is formed of a plurality of layers,
Each of the plurality of layers is formed with a guide hole in which the probe is fitted,
The shape and position of the guide hole for each layer are differently formed so that the probe can be bent and the end of the probe can be fitted into the guide hole.
Guide holes formed for each layer are
As the diameter goes down to the lower layer, it is arranged to have a step,
Each of the guide hole formed in each floor is formed to be gradually inclined while overlapping a predetermined portion, so that some of the guide holes formed in each floor are shifted and the diameter thereof becomes narrower.
The guide hole formed for each layer is formed in a square,
4 curved corners are formed inside,
An expansion groove is formed in one of the corners of the guide hole,
The expansion groove is formed into an arc by cutting inward from the corner,
Expansion grooves of each guide hole are formed in the same position,
Probe card head block, characterized in that the coupling position of the probe to be constantly aligned by inserting the edge portion of the probe into the expansion groove when assembling the probe. delete delete delete The method of claim 1,
The plurality of layers are separated so that each can be moved separately,
Probe card head block, characterized in that each of the plurality of layers are moved so that the guide holes are arranged to be offset from each other. The method of claim 5,
The plurality of layers,
A first layer disposed below and having a first guide hole;
A second layer stacked on an upper surface of the first layer and having a second guide hole formed therein;
A third layer stacked on an upper surface of the second layer and having a third guide hole formed therein;
And a fourth layer stacked on an upper surface of the third layer and having a fourth guide hole formed therein.
Probe card head block, characterized in that the first to fourth guide holes are arranged to be partially overlapping each other but gradually shifted.

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