JP2002090410A - Checking fixture for board inspection and board inspection apparatus with checking fixture - Google Patents

Checking fixture for board inspection and board inspection apparatus with checking fixture

Info

Publication number
JP2002090410A
JP2002090410A JP2000277404A JP2000277404A JP2002090410A JP 2002090410 A JP2002090410 A JP 2002090410A JP 2000277404 A JP2000277404 A JP 2000277404A JP 2000277404 A JP2000277404 A JP 2000277404A JP 2002090410 A JP2002090410 A JP 2002090410A
Authority
JP
Japan
Prior art keywords
probe
plate
probes
inspection
inspection jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000277404A
Other languages
Japanese (ja)
Other versions
JP3505495B2 (en
Inventor
Hideo Nishikawa
秀雄 西川
Minoru Kato
穣 加藤
Shigeaki Koizumi
茂昭 小泉
Mitsuhiko Ito
光彦 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KOYO TECHNOS KK
Nidec Advance Technology Corp
Original Assignee
KOYO TECHNOS KK
Nidec Read Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KOYO TECHNOS KK, Nidec Read Corp filed Critical KOYO TECHNOS KK
Priority to JP2000277404A priority Critical patent/JP3505495B2/en
Priority to KR10-2001-0016405A priority patent/KR100455097B1/en
Priority to TW090109243A priority patent/TW505792B/en
Publication of JP2002090410A publication Critical patent/JP2002090410A/en
Application granted granted Critical
Publication of JP3505495B2 publication Critical patent/JP3505495B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733Geometry aspects
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Geometry (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Liquid Crystal (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a checking fixture, for board inspection, by which a board can be inspected with high accuracy and with high reliability and to provide a board inspection apparatus with the checking fixture. SOLUTION: The rear-end part 44 of a probe is fitted into the recess (the tip part) 211 of a connecting electrode 21 corresponding to the rear-end part. A flexure is given forcibly to the intermediate part in the axial direction of the probe 4. As a result, the rear-end part 44 of the probe and the tip part 211 of the connecting electrode 21 are brought into contact in a state that a load is applied along the axial direction of the probe 4. Also a load component along a direction nearly at right angles to the axial direction is applied to their contact part, i.e., their lock part. The load component in a plurality of directions acts on the contact part of the rear-end part of the probe with the connecting electrode. The probe and the connecting electrode are brought into contact surely and at a low resistance so as to contribute toward enhancing the inspection accuracy and the reliability of the checking fixture.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、プローブの先端
部を検査対象となる基板に接触させて当該基板を検査す
る基板検査用検査治具、および該検査治具を備えた基板
検査装置に関するものである。なお、この発明は、プリ
ント配線基板、フレキシブル基板、多層配線基板、液晶
ディスプレイやプラズマディスプレイ用のガラス基板、
ならびに半導体パッケージ用のフィルムキャリアなど種
々の基板上の電気的配線を検査する基板検査装置、なら
びに該基板検査装置において使用可能な基板検査用検査
治具に適用でき、この明細書では、それら種々の配線基
板を総称して「基板」と称する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection jig for inspecting a substrate by bringing the tip of a probe into contact with a substrate to be inspected and an inspection apparatus provided with the inspection jig. It is. The present invention is a printed wiring board, a flexible board, a multilayer wiring board, a glass substrate for a liquid crystal display or a plasma display,
In addition, the present invention can be applied to a board inspection apparatus for inspecting electrical wiring on various substrates such as a film carrier for a semiconductor package, and an inspection jig for board inspection that can be used in the board inspection apparatus. Wiring boards are collectively referred to as “boards”.

【0002】[0002]

【従来の技術】基板には複数の配線からなる配線パター
ンが形成されており、配線パターンが設計通りに仕上が
っているか否かを検査するために、従来より数多くの基
板検査装置が提供されている。例えば配線パターンを構
成する配線群のうち相互に隣接する配線が短絡している
か否かを検査するために、従来の基板検査装置では、複
数のプローブを基板に押し当てて、それら複数のプロー
ブに選択的に電気信号を与えて基板検査を行っている。
より具体的には、検査対象となる2本の配線を選択し、
それら選択端それぞれの一端に押し当てられたプローブ
間に電圧を印加したときに所定の電流が流れるか否かを
調べることで、選択配線間の短絡検査を行っている。
2. Description of the Related Art A wiring pattern composed of a plurality of wirings is formed on a substrate, and a large number of substrate inspection apparatuses have been provided in order to inspect whether or not the wiring pattern is finished as designed. . For example, in a conventional board inspection apparatus, a plurality of probes are pressed against a substrate to check whether or not adjacent wirings in a wiring group constituting a wiring pattern are short-circuited. The board inspection is performed by selectively giving an electric signal.
More specifically, two wirings to be inspected are selected,
By checking whether a predetermined current flows when a voltage is applied between the probes pressed against one end of each of the selected ends, a short-circuit test between the selected wires is performed.

【0003】このように複数のプローブを同時に基板に
押し当てるために、例えば実開昭61−129166号
公報に記載されたような基板検査用検査治具が用いられ
ている。この検査治具では、図8に示すように、プロー
ブ保持ボード101およびプローブガイドボード102
によって複数のプローブ103が支持されている。ま
た、このように支持されたプローブ103を基板検査部
104と電気的に接続するために、プローブ103の後
端部103aに対向して電極部105が配置されてい
る。この電極部105には、複数のプローブ103の後
端部103aと1対1で対応するように複数の接続用電
極106が設けられており、プローブ保持ボード101
とでプローブ103の後端部103aを挟持することに
よって接続用電極106をそれぞれ対応するプローブ1
03の後端部103aと電気的に接触させている。
In order to press a plurality of probes against a substrate at the same time, an inspection jig for inspecting a substrate as described in, for example, Japanese Utility Model Application Laid-Open No. 61-129166 is used. In this inspection jig, as shown in FIG. 8, the probe holding board 101 and the probe guide board 102
Supports a plurality of probes 103. Further, in order to electrically connect the probe 103 thus supported to the substrate inspection unit 104, an electrode unit 105 is disposed to face the rear end 103a of the probe 103. The electrode portion 105 is provided with a plurality of connection electrodes 106 so as to correspond one-to-one with the rear end portions 103 a of the plurality of probes 103.
, The rear end 103a of the probe 103 is interposed between the probe 103 and the connecting electrode 106, so that the corresponding probe 1
03 is in electrical contact with the rear end 103a.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、プロー
ブ103の後端部103aと接続用電極106とは軸方
向(同図の上下方向)に沿って荷重が印加された状態で
接触しているだけであり、接触抵抗が不安定である。特
に、近年、検査対象となる基板のファイン化に伴って基
板に押し当てるべきプローブ数も多くなっており、これ
ら多数のプローブ103と接続用電極106との接触抵
抗をすべて所定以下に抑えることは困難となり、検査精
度の低下要因の一つとなっている。
However, the rear end portion 103a of the probe 103 and the connection electrode 106 are only in contact with each other in a state where a load is applied along the axial direction (vertical direction in the figure). And the contact resistance is unstable. In particular, in recent years, the number of probes to be pressed against a substrate to be inspected has been increased along with the refinement of the substrate to be inspected, and it is difficult to suppress the contact resistance between these many probes 103 and the connection electrodes 106 to a predetermined value or less. This is one of the factors that makes the inspection difficult.

【0005】また、上記のように構成された検査治具を
用いて基板検査を繰返して行っていると、千回に1回程
度の頻度で一部のプローブ103が接続用電極106に
接触しないことがあり、基板検査を正確に行うことがで
きないことがあった。そのため、基板検査装置の信頼性
が低下してしまうという問題もあった。
[0005] Further, when the board inspection is repeatedly performed using the inspection jig configured as described above, some probes 103 do not contact the connection electrode 106 about once in 1,000 times. In some cases, accurate board inspection cannot be performed. Therefore, there is also a problem that the reliability of the substrate inspection device is reduced.

【0006】この発明は上記課題に鑑みなされたもので
あり、基板検査を高精度、しかも高い信頼性で行うこと
ができる基板検査用検査治具および該検査治具を備えた
基板検査装置を提供することを目的とする。
SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides an inspection jig for inspecting a substrate capable of inspecting a substrate with high accuracy and high reliability, and a substrate inspection apparatus provided with the inspection jig. The purpose is to do.

【0007】[0007]

【課題を解決するための手段】この発明にかかる基板検
査用検査治具は、上記目的を達成するため、複数のプロ
ーブをその軸方向中間部を撓ませた状態で支持しなが
ら、各プローブの先端部を検査対象となる基板に接触さ
せる接触部と、前記複数のプローブの後端部と1対1で
対応するように複数の接続用電極を設け、これら複数の
接続用電極をそれぞれ対応するプローブ後端部に接触さ
せる電極部とを備えている。そして、各プローブの後端
部と、そのプローブ後端部に接触する接続用電極の先端
部とのうち一方端部が他方端部に係止されて両者が電気
的に接続されるように、前記複数のプローブおよび前記
複数の接続用電極が構成されている。
In order to achieve the above object, an inspection jig for inspecting a substrate according to the present invention supports a plurality of probes while supporting a plurality of probes in a state where an intermediate portion in an axial direction thereof is bent. A plurality of connection electrodes are provided so as to correspond one-to-one with a contact portion for bringing the front end portion into contact with the substrate to be inspected and the rear end portions of the plurality of probes, and the plurality of connection electrodes correspond respectively. And an electrode portion to be brought into contact with the rear end of the probe. Then, one end of the rear end of each probe and the front end of the connection electrode that contacts the rear end of the probe is locked to the other end so that both are electrically connected, The plurality of probes and the plurality of connection electrodes are configured.

【0008】このように構成された発明では、従来技術
と同様にプローブ後端部と接続用電極の先端部とはプロ
ーブの軸方向に沿って荷重が印加された状態で接触する
のに加えて、その接触部分、つまり係止部分では前記軸
方向とほぼ直交する方向に沿った荷重成分も印加される
ことになる。というのも、各プローブの軸方向中間部が
撓んでいるために、プローブには当該撓みに起因する荷
重が発生し、その荷重がそのまま接触部分に印加される
からである。このようにプローブ後端部と接続用電極と
の接触部分には複数方向の荷重成分が作用しており、プ
ローブと接続用電極とは確実に、しかも低抵抗で接触し
ており、検査精度および信頼性の向上に大きく寄与す
る。
[0008] In the invention thus constituted, the rear end of the probe and the front end of the connection electrode are brought into contact with each other in a state where a load is applied along the axial direction of the probe, as in the prior art. A load component along a direction substantially perpendicular to the axial direction is also applied to the contact portion, that is, the locking portion. This is because the probe is bent at the intermediate portion in the axial direction, so that a load is generated in the probe due to the bending, and the load is applied to the contact portion as it is. As described above, a load component in a plurality of directions acts on the contact portion between the rear end of the probe and the connection electrode, so that the probe and the connection electrode are surely and in low contact with each other, so that the inspection accuracy and It greatly contributes to the improvement of reliability.

【0009】また、上記のように構成された検査治具で
は、複数のプローブは接触部によって支持されているの
で、一部のプローブに損傷や破損などが生じた場合に
は、当該プローブのみを接触部から取外し、新しいプロ
ーブを装着することができ、メンテナンス性および組立
性においても優れている。
Further, in the inspection jig configured as described above, since a plurality of probes are supported by the contact portions, when some of the probes are damaged or broken, only the probes are used. The probe can be detached from the contact part and a new probe can be attached, and it is excellent in maintainability and assemblability.

【0010】ここで、前記複数のプローブの撓み方向を
一方向に揃えると、プローブ後端部と接続用電極との接
触部分に印加される荷重が均一化され、各接触部での接
触抵抗を均一化することができる。そのため、検査精度
および信頼性の向上にとって有利である。
Here, when the bending directions of the plurality of probes are aligned in one direction, the load applied to the contact portion between the rear end of the probe and the connection electrode is made uniform, and the contact resistance at each contact portion is reduced. It can be made uniform. Therefore, it is advantageous for improving the inspection accuracy and reliability.

【0011】また、各プローブの後端部と、接続用電極
の先端部とを相互に係止させるためには、例えば、これ
らのうち一方端部を凸状に形成する一方、他方端部を凹
状に形成し、一方端部の凸状部分を他方端部の凹状部分
の内壁面に係止するように構成すればよい。また、一方
端部を凸状に形成する一方、他方端部を凹状に形成し、
一方端部の凸状部分を他方端部の凹状部分に嵌入するよ
うに構成してもよい。このように構成することによって
各プローブの後端部と、接続用電極の先端部とが相互
に、しかも確実に係止される。
In order to interlock the rear end of each probe and the front end of the connection electrode with each other, for example, one end is formed in a convex shape while the other end is formed. What is necessary is just to form so that it may be formed in a concave shape, and the convex part of one end may be locked to the inner wall surface of the concave part of the other end. Also, while one end is formed in a convex shape, the other end is formed in a concave shape,
You may comprise so that the convex part of one end may be fitted in the concave part of the other end. With this configuration, the rear end of each probe and the front end of the connection electrode are mutually and reliably locked.

【0012】また、接触部については、基板と対向配置
されて複数のプローブ先端部を貫通支持する第1プレー
トと、電極部と対向配置されて複数のプローブ後端部を
貫通支持する第2プレートと、第1プレートと第2プレ
ートとの間に配置されて複数のプローブの軸方向中間部
の撓み状態を制御する撓み制御手段とで構成してもよ
い。ここで、撓み制御手段として、少なくとも1枚以上
の間隔調整プレートを第1プレート近傍に配置すれば、
間隔調整プレートのうち第2プレートに最も近い間隔調
整プレートから第2プレートまでの間隔(以下「プレー
ト間隔」という)が調整されて複数のプローブの軸方向
中間部の撓み状態が制御される。
The contact portion is provided with a first plate which is disposed opposite to the substrate and penetrates and supports a plurality of probe tips, and a second plate which is disposed opposite to the electrode portion and which penetrates and supports a plurality of probe rear ends. And a bending control means disposed between the first plate and the second plate to control a bending state of an intermediate portion in the axial direction of the plurality of probes. Here, if at least one or more interval adjusting plates are arranged near the first plate as the deflection control means,
An interval between the interval adjusting plate closest to the second plate among the interval adjusting plates and the second plate (hereinafter, referred to as a “plate interval”) is adjusted, and the bending state of the intermediate portion in the axial direction of the plurality of probes is controlled.

【0013】特に、基板のファイン化に伴うプローブ数
の増大に対応すべくプローブ径は細くなる一方である
が、この場合、撓み制御手段を複数枚の間隔調整プレー
トで構成するのが望ましい。すなわち、このような技術
背景においては、プローブを貫通支持するための貫通孔
を微細加工によって撓み制御手段に形成する必要が生じ
るが、加工性を考慮すると、比較的薄いプレートを用い
るのが好ましい。というのも、プレート間隔を大きく変
更する場合、撓み制御手段を単一の間隔調整プレートで
構成するためには比較的厚みのある間隔調整プレートを
準備する必要があり、厚肉プレートに微細貫通孔を形成
するのが非常に難しくなるのに対し、比較的薄いプレー
トを複数枚用意してプレート間隔を調整する場合には各
プレートへの微細貫通孔の形成が容易となるためであ
る。
In particular, while the diameter of the probe is being reduced in order to cope with the increase in the number of probes accompanying finer substrates, in this case, it is desirable to configure the deflection control means with a plurality of interval adjusting plates. That is, in such a technical background, it is necessary to form a through hole for penetrating and supporting the probe in the deflection control means by micromachining. However, considering workability, it is preferable to use a relatively thin plate. This is because when the plate interval is largely changed, it is necessary to prepare a relatively thick interval adjusting plate in order to configure the deflection control means with a single interval adjusting plate, and it is necessary to prepare a fine through hole in the thick plate. This is because it is very difficult to form a small through-hole. On the other hand, when a plurality of relatively thin plates are prepared and the interval between the plates is adjusted, it is easy to form fine through holes in each plate.

【0014】また、上記のように構成された接触部にお
いては、第1プレートおよび第2プレートを一定間隔だ
け離間して平行配置するとともに、相対的に平行シフト
させると、複数のプローブの撓み方向を平行シフト方向
に揃えることができ、接触部分への荷重を均一化し、各
接触部での接触抵抗を均一化することができる。
In the contact portion configured as described above, when the first plate and the second plate are arranged in parallel at a predetermined distance from each other and are relatively shifted in parallel, the bending direction of the plurality of probes can be improved. Can be aligned in the parallel shift direction, the load on the contact portion can be made uniform, and the contact resistance at each contact portion can be made uniform.

【0015】また、複数のプローブの軸方向中間部を電
気絶縁外皮によって被覆すれば、プローブの軸方向中間
部同士が直接接触して電気的な短絡が発生するのを防止
することができる。
Further, if the axially intermediate portions of the plurality of probes are covered with the electrically insulating outer skin, it is possible to prevent the axially intermediate portions of the probes from coming into direct contact with each other, thereby preventing an electrical short circuit.

【0016】さらに、この発明にかかる基板検査装置
は、上記目的を達成するため、請求項1ないし7のいず
れかに記載の検査治具と、複数の接続用電極と電気的に
接続されて複数のプローブに選択的に電気信号を与えて
基板検査を行う基板検査部とを備えている。上記のよう
に構成された検査治具を用いることによって、電極部を
介してプローブと基板検査部とを確実に、しかも低抵抗
で接続することができ、高い精度で、しかも優れた信頼
性で基板検査を行うことができる。
In order to achieve the above object, a substrate inspection apparatus according to the present invention further comprises an inspection jig according to any one of claims 1 to 7, and a plurality of connection jigs electrically connected to the plurality of connection electrodes. And a board inspection unit for selectively performing an electrical signal to the probe to perform a board inspection. By using the inspection jig configured as described above, the probe and the substrate inspection unit can be reliably connected to the substrate inspection unit via the electrode unit with low resistance, and with high accuracy and excellent reliability. Substrate inspection can be performed.

【0017】[0017]

【発明の実施の形態】図1は、この発明にかかる基板検
査装置の一実施形態を示す斜視図である。また、図2は
図1の基板検査装置に用いられている基板検査用検査治
具の分解組立斜視図である。この基板検査装置は、複数
のプローブ4を支持しながら当該プローブ4の先端部4
3を検査対象たる基板(図4中の符号S)を接触させる
接触部1および電極部2を有する検査治具3と、検査治
具3と電気的に接続された基板検査部(図4中の符号
5)とを備え、基板検査部から複数のプローブ4に選択
的に電気信号を与えて基板検査を行う。
FIG. 1 is a perspective view showing one embodiment of a substrate inspection apparatus according to the present invention. FIG. 2 is an exploded perspective view of a board inspection jig used in the board inspection apparatus of FIG. The substrate inspection apparatus supports a plurality of probes 4 while supporting the tip 4 of the probes 4.
An inspection jig 3 having a contact portion 1 and an electrode portion 2 for bringing the substrate 3 into contact with a substrate to be inspected (reference numeral S in FIG. 4), and a substrate inspection portion electrically connected to the inspection jig 3 (FIG. 5), and a board inspection is performed by selectively supplying an electric signal to the plurality of probes 4 from the board inspection unit.

【0018】この検査治具3を構成する接触部1は、図
1および図2に示すように、スペーサ11を介して第1
プレート12と第2プレート13とがほぼ平行に離間配
置されるとともに、それら2枚のプレート12,13の
間に、間隔調整スペーサ14a、間隔調整プレート14
b、間隔調整スペーサ14cおよび間隔調整プレート1
4dが上側より下側に向けて当該順序で積層配置されて
いる。これらの第1プレート12,14b,14dのそ
れぞれには、プローブ4を貫通支持するためのプローブ
孔121,141,141が複数個形成されるととも
に、位置決め孔122,142,142が複数個形成さ
れている。
As shown in FIGS. 1 and 2, the contact portion 1 of the inspection jig 3 is provided with a first
The plate 12 and the second plate 13 are spaced apart substantially in parallel, and a distance adjusting spacer 14 a and a distance adjusting plate 14 are provided between the two plates 12 and 13.
b, spacing adjustment spacer 14c and spacing adjustment plate 1
4d are stacked and arranged in this order from the upper side to the lower side. Each of these first plates 12, 14b, 14d has a plurality of probe holes 121, 141, 141 for penetrating and supporting the probe 4, and a plurality of positioning holes 122, 142, 142 formed therein. ing.

【0019】各プローブ4の軸方向中間部41は、図2
に示すように、トリフルオロエチレンなどの電気絶縁外
皮42によって被覆されており、後で詳述するようにプ
ローブ4の先端部43をプローブ孔121,141に挿
通した際に、電気絶縁外皮42はプローブ孔121,1
41の周縁部で係止されるように構成されている。つま
り、プローブ孔121,141の内径は電気絶縁外皮4
2の外径よりも小さく設定されている。
The axial intermediate portion 41 of each probe 4 is shown in FIG.
As shown in FIG. 5, the probe is covered with an electrically insulating sheath 42 such as trifluoroethylene. When the distal end 43 of the probe 4 is inserted into the probe holes 121 and 141 as described later in detail, the electrically insulating sheath 42 is Probe hole 121,1
It is configured to be locked at the peripheral portion of the reference numeral 41. That is, the inner diameter of the probe holes 121 and 141 is
2 is set smaller than the outer diameter.

【0020】一方、第2プレート13にもプローブ4を
挿通するための貫通孔131が形成されているが、この
貫通孔131は、プローブ孔121,141と異なり、
電気絶縁外皮42の外径よりも大きな内径を有してお
り、電気絶縁外皮42を被覆したままプローブ4を挿通
自在となっている。また、第2プレート13には、次に
詳述するようにして検査治具3を組み立てる際に用いら
れる組立用位置決め孔132およびセット用位置決め孔
133が設けられている。
On the other hand, a through hole 131 for inserting the probe 4 is also formed in the second plate 13, and this through hole 131 is different from the probe holes 121 and 141.
The probe 4 has an inner diameter that is larger than the outer diameter of the electrically insulated outer skin 42, and the probe 4 can be inserted with the outer insulated outer skin 42 covered. Further, the second plate 13 is provided with an assembly positioning hole 132 and a setting positioning hole 133 used when assembling the inspection jig 3 as described in detail below.

【0021】次に、検査治具3の組立手順を図3を参照
しつつ説明することによって、接触部1および電極部2
の構成を明確にする。図3は、図1の基板検査装置に用
いられている基板検査用検査治具の組立手順を示す図で
あり、図2のA−A線矢視断面を模式的に示している。
Next, the procedure for assembling the inspection jig 3 will be described with reference to FIG.
Clarify the structure of FIG. 3 is a view showing a procedure of assembling the inspection jig for board inspection used in the board inspection apparatus of FIG. 1, and schematically shows a cross section taken along line AA of FIG. 2.

【0022】まず最初に同図(a)に示すように、第1
プレート12と第2プレート13との間で、しかも第1
プレート12の近傍に間隔調整スペーサ14a、間隔調
整プレート14b、間隔調整スペーサ14cおよび間隔
調整プレート14dを積層配置する(なお、同図へのス
ペーサ14a,14cの図示は省略されている)。これ
によって第2プレート13と最も近い間隔調整プレート
14dから第2プレート13までの距離、つまりプレー
ト間隔ΔLを調整してプローブ4の撓み状態を制御し、
プローブ4の先端部43と基板との接触荷重を調整する
ことができる。この点に関しては、後で詳述する。
First, as shown in FIG.
Between the plate 12 and the second plate 13 and the first
The spacing adjusting spacers 14a, 14b, 14c, and 14d are stacked and arranged near the plate 12 (the spacers 14a and 14c are not shown in the drawing). Thereby, the distance from the interval adjustment plate 14d closest to the second plate 13 to the second plate 13, that is, the plate interval ΔL is adjusted to control the bending state of the probe 4,
The contact load between the tip 43 of the probe 4 and the substrate can be adjusted. This will be described in detail later.

【0023】また、このようにプレート12,14b,
14d,13を積層配置しながら、位置決め孔122,
142,142および組立用位置決め孔132にピン1
5を挿通する。これによってプローブ孔121,14
1,141および貫通孔131が一直線上に整列する。
そして、この状態で第2プレート13側から外皮付きの
プローブ4を挿入し、プローブ先端部43をプローブ孔
141,141,121の順序で挿通してプレート1
2,14b,14dによって貫通支持する。
Also, as described above, the plates 12, 14b,
Positioning holes 122, 14d and 13 are stacked and arranged.
142, 142 and the positioning hole 132 for assembly.
5 is inserted. As a result, the probe holes 121, 14
1, 141 and the through hole 131 are aligned on a straight line.
Then, in this state, the probe 4 having the outer skin is inserted from the second plate 13 side, and the probe tip 43 is inserted in the order of the probe holes 141, 141, and 121 so that the plate 1
They are penetrated and supported by 2, 14b and 14d.

【0024】次に、同図(b)に示すように、プローブ
4の後端部44を電極部2の接続用電極21に嵌入させ
る。この電極部2は、電極ガイドプレート22に複数の
接続用電極21がプローブ4の後端部44と1対1で対
応して設けられている。また、各接続用電極21の先端
部211は凹状形状となっており、プローブ後端部44
をその凹部(先端部)211に嵌入可能となっている。
そのため、接触部1と電極部2とを相対的に接近移動さ
せると、すべてのプローブ4について、各プローブ後端
部44がそれに対応する接続用電極21の先端部211
に嵌入されて電気的に接続される。
Next, as shown in FIG. 2B, the rear end 44 of the probe 4 is fitted into the connection electrode 21 of the electrode section 2. In the electrode section 2, a plurality of connection electrodes 21 are provided on the electrode guide plate 22 in one-to-one correspondence with the rear end 44 of the probe 4. In addition, the tip 211 of each connection electrode 21 has a concave shape, and the probe rear end 44
Can be fitted into the concave portion (tip portion) 211.
Therefore, when the contact portion 1 and the electrode portion 2 are moved relatively close to each other, the rear end portions 44 of all the probes 4 become the front end portions 211 of the connection electrodes 21 corresponding thereto.
And are electrically connected.

【0025】それに続いて、同図(c)に示すように、
組立用位置決め孔132からピン15を抜き、第2プレ
ート13と電極ガイドプレート22とを一体的に第1プ
レート12および間隔調整プレート14b,14dに対
して相対的に矢印方向に平行シフトさせた後、ピン15
をセット用位置決め孔133に挿入する。すると、プロ
ーブ先端部43とプローブ後端部44とが相対的に平行
シフトしてプローブ4の軸方向中間部41が撓む。その
結果、例えば図4に示すように、プローブ先端部側で
は、プローブ先端部43が丸印箇所P1,P2で第1プレ
ート12および間隔調整プレート14dとそれぞれ物理
的に接触する。
Subsequently, as shown in FIG.
After removing the pin 15 from the positioning hole 132 for assembly, after the second plate 13 and the electrode guide plate 22 are integrally shifted in parallel with the first plate 12 and the gap adjusting plates 14b and 14d in the direction of the arrow. , Pin 15
Into the positioning hole 133 for setting. Then, the probe front end portion 43 and the probe rear end portion 44 relatively shift in parallel, and the axially intermediate portion 41 of the probe 4 bends. As a result, for example, as shown in FIG. 4, on the probe tip side, the probe tip 43 physically contacts the first plate 12 and the interval adjusting plate 14d at the circled points P1 and P2, respectively.

【0026】一方、プローブ後端側では、プローブ後端
部44が接続用電極21に嵌入された状態で従来技術と
同様にプローブ後端部44と接続用電極21の先端部2
11とはプローブ4の軸方向(同図の上下方向)に沿っ
て荷重が印加されるとともに、丸印箇所(係止部分)P
3,P4では軸方向とほぼ直交する方向、つまり略水平方
向に沿った荷重成分も印加されることになる。というの
も、各プローブ4の軸方向中間部41が撓んでいるため
に、プローブ4には当該撓みに起因する荷重が発生し、
その荷重がそのまま丸印箇所P3,P4の各部に印加され
るからである。このようにプローブ後端部44と接続用
電極21との接触部分には複数方向の荷重成分が作用し
ており、プローブ4と接続用電極21とは確実に、しか
も低抵抗で接触している。
On the other hand, on the probe rear end side, the probe rear end portion 44 and the front end portion 2 of the connection electrode 21 are inserted in a state in which the probe rear end portion 44 is fitted into the connection electrode 21 as in the prior art.
11, a load is applied along the axial direction of the probe 4 (vertical direction in the figure), and a circled portion (locking portion) P
At 3, P4, a load component along a direction substantially perpendicular to the axial direction, that is, a substantially horizontal direction is also applied. This is because the axial intermediate portion 41 of each probe 4 is bent, so that a load is generated on the probe 4 due to the bending,
This is because the load is applied as it is to each part of the circles P3 and P4. As described above, a load component in a plurality of directions acts on the contact portion between the probe rear end portion 44 and the connection electrode 21, and the probe 4 and the connection electrode 21 are surely and in low contact with each other. .

【0027】また、各プローブ4の撓み方向については
任意であるが、この実施形態によれば、プレートの平行
シフトによってプローブ先端部43とプローブ後端部4
4とを相対的に平行シフトしてプローブ4の軸方向中間
部41を撓ませているため、プローブ4の撓み方向を平
行シフト方向に揃えることができる。そして、このよう
に撓み方向を揃えることによって、プローブ後端部44
と接続用電極21との接触部分への荷重が均一化され、
各接触部分での接触抵抗を均一化することができる。し
たがって、検査精度および信頼性を向上させる上で撓み
方向を揃えることは有利であるといえる。
The bending direction of each probe 4 is arbitrary, but according to this embodiment, the probe front end 43 and the probe rear end 4 are moved by the parallel shift of the plate.
4 is relatively parallel-shifted to bend the axial intermediate portion 41 of the probe 4, so that the bending direction of the probe 4 can be aligned with the parallel shift direction. By aligning the bending directions in this manner, the probe rear end 44
The load on the contact portion between the electrode and the connection electrode 21 is made uniform,
The contact resistance at each contact portion can be made uniform. Therefore, it can be said that it is advantageous to make the bending directions uniform in order to improve the inspection accuracy and reliability.

【0028】また、この実施形態によれば、プローブ4
の軸方向中間部41を電気絶縁外皮42によって被覆し
ているので、プローブ4の軸方向中間部41同士が近接
移動したとしても電気的な短絡が防止されて正確な基板
検査を行うことができる。
According to this embodiment, the probe 4
Of the probe 4 is covered with the electrically insulating outer cover 42, so that even if the axial middle portions 41 of the probe 4 move close to each other, an electrical short circuit is prevented and accurate board inspection can be performed. .

【0029】また、上記のように構成された検査治具3
では、複数のプローブ4は接触部1によって支持されて
いるので、一部のプローブ4に損傷や破損などが生じた
場合には、当該プローブ4のみを接触部1から取外し、
新しいプローブ4を装着することができ、メンテナンス
性および組立性においても優れている。
The inspection jig 3 constructed as described above
In this case, since the plurality of probes 4 are supported by the contact portion 1, when some of the probes 4 are damaged or broken, only the probe 4 is detached from the contact portion 1, and
A new probe 4 can be mounted, and maintenance and assemblability are excellent.

【0030】さらに、上記実施形態によれば、第1プレ
ート12と第2プレート13との間に、間隔調整スペー
サ14a、間隔調整プレート14b、間隔調整スペーサ
14cおよび間隔調整プレート14dを配置して間隔調
整プレート14dから第2プレート13までの距離、つ
まりプレート間隔ΔLを調整可能に構成されている。そ
して、プレート間隔ΔLを調整することによってプロー
ブ4の軸方向中間部41の撓み状態を制御することがで
き、基板に対してプローブ先端部43が与えるプローブ
荷重を設定することができる。
Further, according to the above-described embodiment, the spacing adjusting spacers 14a, 14b, 14c and 14d are arranged between the first plate 12 and the second plate 13. The distance from the adjustment plate 14d to the second plate 13, that is, the plate interval ΔL is adjustable. By adjusting the plate interval ΔL, the bending state of the axial intermediate portion 41 of the probe 4 can be controlled, and the probe load applied by the probe distal end portion 43 to the substrate can be set.

【0031】ここで、互いに径の異なる4種類(プロー
ブ径φ1,φ2,φ3,φ4)のプローブ4を用意し、プレ
ート間隔ΔLに対するプローブ荷重の変化を調べると、
例えば図5に示すような関係が得られる。同図から明ら
かなように、プレート間隔ΔLを調整することにプロー
ブ荷重を制御することができ、この実施形態によればプ
ローブ荷重を正確に調整して高精度な基板検査が可能と
なることがわかる。なお、この実施形態では、間隔調整
スペーサ14a、間隔調整プレート14b、間隔調整ス
ペーサ14cおよび間隔調整プレート14dによってプ
レート間隔ΔLを調整する撓み制御手段が構成されてい
るが、間隔調整スペーサ14a、14cを設けることは
必須構成要件ではなく、例えば複数の間隔調整プレート
を積層配置したり、単一の間隔調整プレートで撓み制御
手段を構成してもよい。また、間隔調整スペーサおよび
間隔調整プレートの形状や数などについても任意であ
る。
Here, four types of probes 4 having different diameters (probe diameters φ1, φ2, φ3, φ4) are prepared, and changes in the probe load with respect to the plate interval ΔL are examined.
For example, the relationship shown in FIG. 5 is obtained. As can be seen from the figure, the probe load can be controlled by adjusting the plate interval ΔL, and according to this embodiment, it is possible to precisely adjust the probe load and to perform high-precision board inspection. Understand. In this embodiment, the deflection control means for adjusting the plate interval ΔL is constituted by the interval adjusting spacer 14a, the interval adjusting plate 14b, the interval adjusting spacer 14c, and the interval adjusting plate 14d. It is not an indispensable component to provide them. For example, a plurality of interval adjusting plates may be stacked and arranged, or the bending control means may be constituted by a single interval adjusting plate. The shape and number of the spacing adjusting spacers and spacing adjusting plates are also arbitrary.

【0032】ただし、プレートに貫通孔を形成する際の
加工性や加工精度などを考慮すると、この実施形態の如
く撓み制御手段を複数枚の間隔調整プレートで構成する
ことが有利となる。というのも、基板のファイン化に伴
うプローブ数の増大に対応すべくプローブ径は細くなる
一方であり、このようなプローブを貫通支持するための
貫通孔を微細加工によって撓み制御手段に形成する必要
が生じるからである。より詳しく説明すると、プレート
間隔ΔLを大きく変更する場合、撓み制御手段を単一の
間隔調整プレートで構成するためには比較的厚みのある
間隔調整プレートを準備する必要があり、微細貫通孔を
形成するのが非常に難しくなるのに対し、比較的薄いプ
レートを複数枚用意してプレート間隔を調整する場合に
は各プレートへの微細貫通孔の形成が容易となるためで
ある。
However, considering the workability and the processing accuracy when forming the through holes in the plate, it is advantageous to configure the deflection control means with a plurality of interval adjusting plates as in this embodiment. This is because the diameter of the probe is becoming thinner in order to cope with the increase in the number of probes accompanying finer substrates, and it is necessary to form through holes for supporting such probes in the deflection control means by fine processing. Is caused. More specifically, when the plate interval ΔL is largely changed, it is necessary to prepare a relatively thick interval adjusting plate in order to configure the deflection control means with a single interval adjusting plate, and to form a fine through hole. On the other hand, it is very difficult to form a fine through hole in each plate when preparing a plurality of relatively thin plates and adjusting the interval between the plates.

【0033】ところで、上記実施形態にかかる検査治具
では、プローブ後端部44を接続用電極21の凹部(先
端部)211に嵌入するように構成しているが、次に説
明すようにプローブ後端部44が接続用電極21の凹部
(先端部)211に嵌入されないまでも凹部211の一
部で係止されるように構成しても上記実施形態と同じ作
用効果が得られる。以下、図6および図7を参照しつつ
本発明にかかる基板検査用検査治具の他の実施形態につ
いて説明する。
In the inspection jig according to the above-described embodiment, the rear end portion 44 of the probe is configured to fit into the concave portion (front end portion) 211 of the connection electrode 21. Even if the rear end portion 44 is locked at a part of the concave portion 211 even if it is not fitted into the concave portion (front end portion) 211 of the connection electrode 21, the same operation and effect as the above embodiment can be obtained. Hereinafter, another embodiment of the inspection jig for inspecting a substrate according to the present invention will be described with reference to FIGS. 6 and 7.

【0034】図6は、本発明にかかる基板検査用検査治
具の他の実施形態における検査治具の組立手順を示す図
である。また図7は、図6に示す検査治具のプローブ先
端部の基板への接触状態、およびプローブ後端部の接続
用電極への接触状態を示す拡大断面図である。この実施
形態では、図6(a)に示すように、先の実施形態と同
様にして、所定のプローブ荷重に対応するプレート間隔
ΔLが確保されるように、プレート12,14b,14
d,13をこの順序で積層配置しながら、位置決め孔1
22,142,142および組立用位置決め孔132に
ピン15を挿通する。これによってプローブ孔121,
141,141および貫通孔131が一直線上に整列す
る。そして、この状態で第2プレート13側から外皮付
きのプローブ4を挿入し、プローブ先端部43をプロー
ブ孔141,141,121の順序で挿通してプレート
12,14b,14dによって貫通支持する。
FIG. 6 is a view showing a procedure for assembling an inspection jig in another embodiment of the inspection jig for substrate inspection according to the present invention. FIG. 7 is an enlarged cross-sectional view showing the contact state of the probe tip of the inspection jig shown in FIG. 6 with the substrate and the contact state of the probe rear end with the connection electrode. In this embodiment, as shown in FIG. 6A, the plates 12, 14b, and 14 are arranged so that the plate interval ΔL corresponding to a predetermined probe load is secured, as in the previous embodiment.
d, 13 while arranging them in this order,
The pins 15 are inserted through the holes 22, 142, 142 and the positioning holes 132 for assembly. Thereby, the probe hole 121,
141, 141 and the through-hole 131 are aligned on a straight line. Then, in this state, the probe 4 with an outer skin is inserted from the second plate 13 side, and the probe tip 43 is inserted in the order of the probe holes 141, 141, 121 and is supported by the plates 12, 14b, 14d.

【0035】次に、同図(b)に示すように、組立用位
置決め孔132からピン15を抜き、第2プレート13
を第1プレート12および間隔調整プレート14b,1
4dに対して相対的に矢印方向に平行シフトさせた後、
ピン15をセット用位置決め孔133に挿入する。する
と、プローブ先端部43とプローブ後端部44とが相対
的に平行シフトしてプローブ4の軸方向中間部41が撓
む。その結果、例えば図7に示すように、プローブ先端
部側では、プローブ先端部43が丸印箇所P1,P2で第
1プレート12および間隔調整プレート14dとそれぞ
れ物理的に接触する。
Next, as shown in FIG. 4B, the pin 15 is pulled out from the positioning hole 132 for assembly, and the second plate 13 is removed.
To the first plate 12 and the interval adjusting plates 14b, 1
After a parallel shift in the direction of the arrow relative to 4d,
The pin 15 is inserted into the positioning hole 133 for setting. Then, the probe front end portion 43 and the probe rear end portion 44 relatively shift in parallel, and the axially intermediate portion 41 of the probe 4 bends. As a result, for example, as shown in FIG. 7, on the probe distal end side, the probe distal end 43 physically contacts the first plate 12 and the interval adjusting plate 14d at the circles P1 and P2, respectively.

【0036】次に、図6(c)に示すように、接触部1
を電極部2に対して相対的に移動させる。すると、図7
に示すように、各プローブ後端部44がそれに対応する
接続用電極21の凹部(先端部)211の内壁面に係止
されて接続用電極21と電気的に接続される。また、こ
の実施形態では、上記のようにしてプローブ4の軸方向
中間部41が撓んでいるため、プローブ後端側では、先
の実施形態と同様に、プローブ後端部44と接続用電極
21の先端部211とはプローブ4の軸方向(同図の上
下方向)に沿って荷重が印加されるとともに、丸印箇所
(係止部分)P3では軸方向とほぼ直交する方向、つま
り略水平方向に沿った荷重成分も印加されることにな
る。その結果、プローブ4と接続用電極21とを確実
に、しかも低抵抗で接触させることができるため、基板
検査を高精度、しかも高い信頼性で行うことができる。
また、本実施形態によれば、先の実施形態における作用
効果と同一の作用効果が得られる。
Next, as shown in FIG.
Is moved relatively to the electrode unit 2. Then, FIG.
As shown in (2), the rear end portion 44 of each probe is locked to the inner wall surface of the corresponding concave portion (tip portion) 211 of the connection electrode 21 and is electrically connected to the connection electrode 21. Further, in this embodiment, since the axial intermediate portion 41 of the probe 4 is bent as described above, the probe rear end portion 44 and the connection electrode 21 are disposed on the probe rear end side in the same manner as in the previous embodiment. A load is applied along the axial direction (vertical direction in the figure) of the probe 4 and a direction substantially perpendicular to the axial direction at a circle mark point (locking portion) P3, that is, a substantially horizontal direction. A load component along the line is also applied. As a result, the probe 4 and the connection electrode 21 can be reliably contacted with low resistance, so that the board inspection can be performed with high accuracy and high reliability.
Further, according to the present embodiment, the same operation and effect as those in the previous embodiment can be obtained.

【0037】また、上記実施形態では、プローブ4の軸
方向中間部41を撓ませた後でプローブ後端部44を接
続用電極21と係止させているが、先の実施形態と同様
に、プローブ後端部44を接続用電極21と係止させた
後でプローブ4の軸方向中間部41を撓まるようにして
もよい。
Further, in the above embodiment, the probe rear end portion 44 is locked with the connection electrode 21 after the axial intermediate portion 41 of the probe 4 is bent, but as in the previous embodiment, After locking the probe rear end portion 44 with the connection electrode 21, the axial intermediate portion 41 of the probe 4 may be bent.

【0038】なお、本発明は上記した実施形態に限定さ
れるものではなく、その趣旨を逸脱しない限りにおいて
上述したもの以外に種々の変更を行うことが可能であ
る。例えば、上記実施形態では、プローブ後端部44を
凸状に形成する一方、接続用電極21の先端部211を
凹状に形成し、プローブ後端部44を接続用電極21の
先端部211に嵌入したり、先端部211の内壁面によ
って係止したりしているが、形状を入れ替えてもよい。
すなわち、プローブ後端部44を凹状に形成する一方、
接続用電極21の先端部211を凸状に形成し、接続用
電極21の先端部211をプローブ後端部44に嵌入し
たり、プローブ後端部44の内壁面によって係止するよ
うに構成してもよい。
The present invention is not limited to the above-described embodiment, and various changes other than those described above can be made without departing from the gist of the present invention. For example, in the above embodiment, the probe rear end portion 44 is formed in a convex shape, while the distal end portion 211 of the connection electrode 21 is formed in a concave shape, and the probe rear end portion 44 is fitted into the front end portion 211 of the connection electrode 21. Or it is locked by the inner wall surface of the tip portion 211, but the shape may be interchanged.
That is, while forming the probe rear end portion 44 in a concave shape,
The distal end portion 211 of the connection electrode 21 is formed in a convex shape, and the distal end portion 211 of the connection electrode 21 is fitted into the probe rear end portion 44 or locked by the inner wall surface of the probe rear end portion 44. You may.

【0039】[0039]

【発明の効果】以上のように、この発明によれば、各プ
ローブの後端部と、そのプローブ後端部に接触する接続
用電極の先端部とのうち一方端部が他方端部に係止され
て両者が電気的に接続されるように、複数のプローブお
よび複数の接続用電極を構成しているので、プローブ後
端部と接続用電極との接触部分に対して複数方向の荷重
成分が作用し、プローブと接続用電極とを確実に、しか
も低抵抗で接触させることができ、検査精度および信頼
性を大きく向上させることができる。また、複数のプロ
ーブを接触部によって支持するように構成しているの
で、プローブ交換が容易となり、優れたメンテナンス性
および組立性が得られる。
As described above, according to the present invention, one end of the rear end of each probe and the front end of the connection electrode in contact with the rear end of the probe is related to the other end. Since a plurality of probes and a plurality of connection electrodes are configured so as to be stopped and electrically connected to each other, a load component in a plurality of directions is applied to a contact portion between the probe rear end and the connection electrode. Acts, and the probe and the connection electrode can be surely brought into contact with each other with low resistance, and the inspection accuracy and reliability can be greatly improved. Further, since the plurality of probes are configured to be supported by the contact portions, the probes can be easily replaced, and excellent maintenance and assembling properties can be obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】この発明にかかる基板検査装置の一実施形態を
示す斜視図である。
FIG. 1 is a perspective view showing one embodiment of a substrate inspection apparatus according to the present invention.

【図2】図1の基板検査装置に用いられている基板検査
用検査治具の分解組立斜視図である。
FIG. 2 is an exploded perspective view of an inspection jig for substrate inspection used in the substrate inspection apparatus of FIG.

【図3】図1の基板検査装置に用いられている基板検査
用検査治具の組立手順を示す図である。
FIG. 3 is a view showing a procedure for assembling an inspection jig for board inspection used in the board inspection apparatus of FIG. 1;

【図4】プローブ先端部の基板への接触状態、およびプ
ローブ後端部の接続用電極への接触状態を示す拡大断面
図である。
FIG. 4 is an enlarged cross-sectional view showing a contact state of a probe tip portion with a substrate and a contact state of a probe rear end portion with a connection electrode.

【図5】プローブ間隔に対するプローブ荷重の変化を示
すグラフである。
FIG. 5 is a graph showing a change in a probe load with respect to a probe interval.

【図6】この発明にかかる基板検査用検査治具の他の実
施形態における検査治具の組立手順を示す図である。
FIG. 6 is a view showing a procedure for assembling the inspection jig in another embodiment of the inspection jig for substrate inspection according to the present invention.

【図7】図6に示す検査治具のプローブ先端部の基板へ
の接触状態、およびプローブ後端部の接続用電極への接
触状態を示す拡大断面図である。
FIG. 7 is an enlarged cross-sectional view showing a contact state of a probe tip of the inspection jig shown in FIG. 6 with a substrate and a contact state of a probe rear end with a connection electrode.

【図8】従来の基板検査用検査治具を示す図である。FIG. 8 is a view showing a conventional inspection jig for substrate inspection.

【符号の説明】[Explanation of symbols]

1…接触部 2…電極部 3…検査治具 4…プローブ 5…基板検査部 12…第1プレート 13…第2プレート 14a,14c…間隔調整スペーサ(撓み制御手段) 14b,14d…間隔調整プレート(撓み制御手段) 21…接続用電極 41…(プローブの)軸方向中間部 42…電気絶縁外皮 43…プローブ先端部 44…プローブ後端部 121,141…プローブ孔 211…(接続用電極の)先端部 P3,P4…丸印箇所 ΔL…プレート間隔 DESCRIPTION OF SYMBOLS 1 ... Contact part 2 ... Electrode part 3 ... Inspection jig 4 ... Probe 5 ... Substrate inspection part 12 ... First plate 13 ... Second plate 14a, 14c ... Space adjustment spacer (bending control means) 14b, 14d ... Space adjustment plate (Deflection control means) 21 ... Connection electrode 41 ... Axial middle part (of probe) 42 ... Electrical insulation sheath 43 ... Probe tip 44 ... Probe rear end 121,141 ... Probe hole 211 ... (of connection electrode) Tip part P3, P4: Circled part ΔL: Plate interval

─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成13年1月17日(2001.1.1
7)
[Submission date] January 17, 2001 (2001.1.1)
7)

【手続補正1】[Procedure amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】図5[Correction target item name] Fig. 5

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【図5】プレート間隔に対するプローブ荷重の変化を示
すグラフである。
FIG. 5 is a graph showing a change in a probe load with respect to a plate interval.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H05K 3/00 G01R 31/28 K (72)発明者 加藤 穣 京都府宇治市槙島町目川126番地 日本電 産リード株式会社内 (72)発明者 小泉 茂昭 長野県茅野市豊平373番地 株式会社コー ヨーテクノス内 (72)発明者 伊藤 光彦 長野県茅野市豊平373番地 株式会社コー ヨーテクノス内 Fターム(参考) 2G003 AA00 AA07 AG03 AG12 AG20 AH05 AH07 2G011 AB06 AB07 AC06 AC14 AE01 AF00 AF07 2G014 AA02 AA03 AB59 AC06 AC10 2G032 AA00 AD08 AE00 AF02 AF03 AL03 2H088 FA13 FA30 HA01 MA20 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H05K 3/00 G01R 31/28 K (72) Inventor Minoru Kato 126 Makishima-cho Megawa, Uji City, Kyoto, Japan (72) Inventor Shigeaki Koizumi 373 Toyohira, Chino-shi, Nagano Prefecture Inside Koyo Technos Co., Ltd. (72) Inventor Mitsuhiko Ito 373, Toyohira, Chino-shi, Nagano Prefecture F-term in Koyo Technos Corporation (reference) 2G003 AA00 AA07 AG03 AG12 AG20 AH05 AH07 2G011 AB06 AB07 AC06 AC14 AE01 AF00 AF07 2G014 AA02 AA03 AB59 AC06 AC10 2G032 AA00 AD08 AE00 AF02 AF03 AL03 2H088 FA13 FA30 HA01 MA20

Claims (9)

【特許請求の範囲】[Claims] 【請求項1】 複数のプローブをその軸方向中間部を撓
ませた状態で支持しながら、各プローブの先端部を検査
対象となる基板に接触させる接触部と、 前記複数のプローブの後端部と1対1で対応するように
複数の接続用電極を設け、これら複数の接続用電極をそ
れぞれ対応するプローブ後端部に接触させる電極部とを
備え、 各プローブの後端部と、そのプローブ後端部に接触する
接続用電極の先端部とのうち一方端部が他方端部に係止
されて両者が電気的に接続されるように、前記複数のプ
ローブおよび前記複数の接続用電極が構成されているこ
とを特徴とする基板検査用検査治具。
A contact portion for contacting a tip portion of each probe with a substrate to be inspected while supporting a plurality of probes in a state where an intermediate portion in the axial direction is bent; and a rear end portion of the plurality of probes. A plurality of connection electrodes are provided so as to correspond to the one-to-one correspondence, and an electrode part for bringing the plurality of connection electrodes into contact with the corresponding rear ends of the probes, respectively; The plurality of probes and the plurality of connection electrodes are connected so that one end of the connection electrode that is in contact with the rear end is locked to the other end and both are electrically connected. An inspection jig for inspecting a substrate, wherein the inspection jig is configured.
【請求項2】 前記複数のプローブは一方向に撓んだ状
態で前記接触部に支持される請求項1記載の基板検査用
検査治具。
2. The inspection jig for inspecting a substrate according to claim 1, wherein the plurality of probes are supported by the contact portion in a state of being bent in one direction.
【請求項3】 前記一方端部が凸状に形成される一方、
前記他方端部が凹状に形成されており、前記一方端部の
凸状部分が前記他方端部の凹状部分の内壁面に係止され
ている請求項1または2記載の基板検査用検査治具。
3. The one end portion is formed in a convex shape,
The inspection jig according to claim 1, wherein the other end is formed in a concave shape, and the convex portion at the one end is locked to an inner wall surface of the concave portion at the other end. .
【請求項4】 前記一方端部が凸状に形成される一方、
前記他方端部が凹状に形成されており、前記一方端部の
凸状部分が前記他方端部の凹状部分に嵌入されている請
求項1または2記載の基板検査用検査治具。
4. The method according to claim 1, wherein the one end is formed in a convex shape.
3. The inspection jig according to claim 1, wherein the other end is formed in a concave shape, and the convex portion of the one end is fitted into the concave portion of the other end.
【請求項5】 前記接触部は、前記基板と対向配置され
て前記複数のプローブ先端部を貫通支持する第1プレー
トと、前記電極部と対向配置されて前記複数のプローブ
後端部を貫通支持する第2プレートと、前記第1プレー
トと前記第2プレートとの間に配置されて前記複数のプ
ローブの軸方向中間部の撓み状態を制御する撓み制御手
段とを備えている請求項1ないし4のいずれかに記載の
基板検査用検査治具。
5. The first contact plate is disposed to face the substrate and penetrates and supports the plurality of probe tips, and the contact portion is disposed to face the electrode portion and penetrates and supports rear ends of the plurality of probes. 5. A flexure control means disposed between the first plate and the second plate, and a flexure control means for controlling a flexure state of an intermediate portion in the axial direction of the plurality of probes. The inspection jig for substrate inspection according to any one of the above.
【請求項6】 前記撓み制御手段として、少なくとも1
枚以上の間隔調整プレートが前記第1プレート近傍に配
置されており、当該間隔調整プレートによって前記複数
のプローブ先端部を貫通支持して、前記間隔調整プレー
トのうち前記第2プレートに最も近い間隔調整プレート
から前記第2プレートまでの間隔を調整することによっ
て前記複数のプローブの軸方向中間部の撓み状態を制御
可能となっている請求項5記載の基板検査用検査治具。
6. The apparatus according to claim 1, wherein the deflection control means includes at least one
At least one gap adjusting plate is arranged near the first plate, and the tip of the plurality of probes is penetrated and supported by the gap adjusting plate to adjust the gap closest to the second plate among the gap adjusting plates. The inspection jig for inspecting a board according to claim 5, wherein a bending state of an intermediate portion in an axial direction of the plurality of probes can be controlled by adjusting an interval between a plate and the second plate.
【請求項7】 前記第1プレートおよび前記第2プレー
トは一定間隔だけ離間して平行配置されるとともに、相
対的に平行シフトされて前記複数のプローブの撓み方向
が平行シフト方向に揃えられている請求項5または6記
載の基板検査用検査治具。
7. The first plate and the second plate are arranged in parallel at a predetermined distance from each other, and are relatively shifted in parallel so that the bending directions of the plurality of probes are aligned in the parallel shift direction. The inspection jig for inspecting a substrate according to claim 5.
【請求項8】 前記複数のプローブの軸方向中間部は電
気絶縁外皮によって被覆されている請求項1ないし7の
いずれかに記載の基板検査用検査治具。
8. The inspection jig for inspecting a board according to claim 1, wherein an intermediate portion in the axial direction of the plurality of probes is covered with an electrically insulating sheath.
【請求項9】 請求項1ないし8のいずれかに記載の検
査治具と、 前記複数の接続用電極と電気的に接続されて前記複数の
プローブに選択的に電気信号を与えて基板検査を行う基
板検査部とを備えたことを特徴とする基板検査装置。
9. An inspection jig according to claim 1, wherein said inspection jig is electrically connected to said plurality of connection electrodes to selectively apply an electric signal to said plurality of probes to perform substrate inspection. A board inspection apparatus, comprising: a board inspection unit that performs the inspection.
JP2000277404A 2000-09-13 2000-09-13 Inspection jig for substrate inspection, substrate inspection device provided with the inspection jig, and method of assembling inspection jig for substrate inspection Expired - Fee Related JP3505495B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000277404A JP3505495B2 (en) 2000-09-13 2000-09-13 Inspection jig for substrate inspection, substrate inspection device provided with the inspection jig, and method of assembling inspection jig for substrate inspection
KR10-2001-0016405A KR100455097B1 (en) 2000-09-13 2001-03-29 Inspection jig for inspecting board and board inspection apparatus having the same
TW090109243A TW505792B (en) 2000-09-13 2001-04-18 Inspection jig for inspecting substrates, and substrate inspection device having such inspection jig

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000277404A JP3505495B2 (en) 2000-09-13 2000-09-13 Inspection jig for substrate inspection, substrate inspection device provided with the inspection jig, and method of assembling inspection jig for substrate inspection

Publications (2)

Publication Number Publication Date
JP2002090410A true JP2002090410A (en) 2002-03-27
JP3505495B2 JP3505495B2 (en) 2004-03-08

Family

ID=18762738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000277404A Expired - Fee Related JP3505495B2 (en) 2000-09-13 2000-09-13 Inspection jig for substrate inspection, substrate inspection device provided with the inspection jig, and method of assembling inspection jig for substrate inspection

Country Status (3)

Country Link
JP (1) JP3505495B2 (en)
KR (1) KR100455097B1 (en)
TW (1) TW505792B (en)

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006317412A (en) * 2005-05-16 2006-11-24 Totoku Electric Co Ltd Probing stylus having insulating film, and manufacturing method thereof
JP2007017219A (en) * 2005-07-06 2007-01-25 Totoku Electric Co Ltd Probe needle with insulating coating, and its manufacturing method
WO2007058037A1 (en) * 2005-11-16 2007-05-24 Nidec-Read Corporation Jig for inspecting substrate, and inspection probe
JP2007127488A (en) * 2005-11-02 2007-05-24 Rika Denshi Co Ltd Probe card
JP2007322179A (en) * 2006-05-30 2007-12-13 Nidec-Read Corp Jig for substrate inspection and substrate inspection apparatus equipped with same
JP2008002852A (en) * 2006-06-20 2008-01-10 Japan Electronic Materials Corp Connection pad for probe card and probe card using the same
JP2008256362A (en) * 2007-03-30 2008-10-23 Nidec-Read Corp Inspection tool
JP2008267833A (en) * 2007-04-16 2008-11-06 Nidec-Read Corp Jig for inspecting substrate and structure for electrode of connecting electrode in the jig
JP2008286788A (en) * 2007-04-17 2008-11-27 Nidec-Read Corp Substrate inspecting tool
JP2009008516A (en) * 2007-06-28 2009-01-15 Nidec-Read Corp Tool and method for substrate inspection
JP2009527759A (en) * 2006-02-20 2009-07-30 サエ ハン マイクロ テック カンパニー リミッテッド Probe pin assembly and manufacturing method thereof
JP2010085398A (en) * 2008-09-05 2010-04-15 Nidec-Read Corp Inspection tool for substrate inspection
JP2011169772A (en) * 2010-02-19 2011-09-01 Hioki Ee Corp Probe unit and circuit board inspection apparatus
JP2013100994A (en) * 2011-11-07 2013-05-23 Nidec-Read Corp Substrate inspection jig, jig base unit and substrate inspection device
JP2013137281A (en) * 2011-12-28 2013-07-11 Seiko Epson Corp Probe device
JP2014025769A (en) * 2012-07-26 2014-02-06 Hioki Ee Corp Probe unit, substrate inspection apparatus, and method for manufacturing the probe unit
WO2014123031A1 (en) * 2013-02-07 2014-08-14 日置電機株式会社 Probe unit, substrate inspection device, and method for assembling probe unit
JP5651333B2 (en) * 2007-07-17 2015-01-14 日本発條株式会社 Probe unit
JP2017102117A (en) * 2015-12-01 2017-06-08 旺▲夕▼科技股▲分▼有限公司 Probe holder of vertical type probe module
TWI670383B (en) * 2017-04-28 2019-09-01 日商揖斐電股份有限公司 Probe, manufacturing method thereof and conduction inspection method using the same
WO2019187957A1 (en) * 2018-03-30 2019-10-03 日本電産リード株式会社 Inspection jig, and inspecting device provided with same
KR102072451B1 (en) * 2018-07-27 2020-02-04 주식회사 에스디에이 Probe Card Head Block
CN116298435A (en) * 2023-03-17 2023-06-23 圆周率半导体(南通)有限公司 Vertical probe assembly capable of effectively reducing contact resistance

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100535676C (en) * 2005-04-21 2009-09-02 株式会社光阳科技 Inspection jig and inspection equipment
JP2009036532A (en) 2007-07-31 2009-02-19 Koyo Technos:Kk Inspection tool and inspection device
JP6237441B2 (en) * 2014-04-24 2017-11-29 日本電産リード株式会社 Electrode structure, inspection jig, and manufacturing method of electrode structure
KR101457199B1 (en) * 2014-08-22 2014-10-31 (주)청공정밀 Testing system of image display device and Test Jig used therein
KR101457200B1 (en) * 2014-08-22 2014-10-31 (주)청공정밀 Testing system of image display device and Test Jig used therein
KR101613810B1 (en) 2015-01-11 2016-04-19 김일 Contact Device for Test

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63154971A (en) * 1986-12-19 1988-06-28 Tokyo Electron Ltd Printed circuit board inspection jig
JPS6435382A (en) * 1987-07-31 1989-02-06 Tokyo Electron Ltd Probe card
JPH07248337A (en) * 1994-03-11 1995-09-26 Okano Denki Kk Contact probe
JPH11258295A (en) * 1997-11-05 1999-09-24 Feinmetall Gmbh Energizing device
JP2000028686A (en) * 1998-03-19 2000-01-28 Hewlett Packard Co <Hp> Fixture for guide probe testing

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61129166U (en) * 1985-01-31 1986-08-13
JPH09274054A (en) * 1996-04-08 1997-10-21 Furukawa Electric Co Ltd:The Prober
JPH09281139A (en) * 1996-09-13 1997-10-31 Furukawa Electric Co Ltd:The Manufacture of prober
JP2992512B1 (en) * 1998-07-15 1999-12-20 日本電子材料株式会社 Probe card

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63154971A (en) * 1986-12-19 1988-06-28 Tokyo Electron Ltd Printed circuit board inspection jig
JPS6435382A (en) * 1987-07-31 1989-02-06 Tokyo Electron Ltd Probe card
JPH07248337A (en) * 1994-03-11 1995-09-26 Okano Denki Kk Contact probe
JPH11258295A (en) * 1997-11-05 1999-09-24 Feinmetall Gmbh Energizing device
JP2000028686A (en) * 1998-03-19 2000-01-28 Hewlett Packard Co <Hp> Fixture for guide probe testing

Cited By (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006317412A (en) * 2005-05-16 2006-11-24 Totoku Electric Co Ltd Probing stylus having insulating film, and manufacturing method thereof
JP2007017219A (en) * 2005-07-06 2007-01-25 Totoku Electric Co Ltd Probe needle with insulating coating, and its manufacturing method
JP4611822B2 (en) * 2005-07-06 2011-01-12 東京特殊電線株式会社 Probe needle with insulating coating and method for manufacturing the same
JP2007127488A (en) * 2005-11-02 2007-05-24 Rika Denshi Co Ltd Probe card
TWI416114B (en) * 2005-11-16 2013-11-21 Nidec Read Corp Substrate inspection tool and inspection probe
KR100989300B1 (en) 2005-11-16 2010-10-22 니혼덴산리드가부시키가이샤 Jig for inspecting substrate, and inspection probe
WO2007058037A1 (en) * 2005-11-16 2007-05-24 Nidec-Read Corporation Jig for inspecting substrate, and inspection probe
JP2009527759A (en) * 2006-02-20 2009-07-30 サエ ハン マイクロ テック カンパニー リミッテッド Probe pin assembly and manufacturing method thereof
JP2007322179A (en) * 2006-05-30 2007-12-13 Nidec-Read Corp Jig for substrate inspection and substrate inspection apparatus equipped with same
JP2008002852A (en) * 2006-06-20 2008-01-10 Japan Electronic Materials Corp Connection pad for probe card and probe card using the same
JP2008256362A (en) * 2007-03-30 2008-10-23 Nidec-Read Corp Inspection tool
JP4625480B2 (en) * 2007-03-30 2011-02-02 日本電産リード株式会社 Inspection jig
JP2008267833A (en) * 2007-04-16 2008-11-06 Nidec-Read Corp Jig for inspecting substrate and structure for electrode of connecting electrode in the jig
JP2008286788A (en) * 2007-04-17 2008-11-27 Nidec-Read Corp Substrate inspecting tool
JP2009008516A (en) * 2007-06-28 2009-01-15 Nidec-Read Corp Tool and method for substrate inspection
JP5651333B2 (en) * 2007-07-17 2015-01-14 日本発條株式会社 Probe unit
JP2010085398A (en) * 2008-09-05 2010-04-15 Nidec-Read Corp Inspection tool for substrate inspection
JP2011169772A (en) * 2010-02-19 2011-09-01 Hioki Ee Corp Probe unit and circuit board inspection apparatus
JP2013100994A (en) * 2011-11-07 2013-05-23 Nidec-Read Corp Substrate inspection jig, jig base unit and substrate inspection device
JP2013137281A (en) * 2011-12-28 2013-07-11 Seiko Epson Corp Probe device
CN104508498A (en) * 2012-07-26 2015-04-08 日置电机株式会社 Probe unit, circuit board inspection device, and manufacturing method for probe units
JP2014025769A (en) * 2012-07-26 2014-02-06 Hioki Ee Corp Probe unit, substrate inspection apparatus, and method for manufacturing the probe unit
KR101979060B1 (en) 2012-07-26 2019-05-15 히오끼 덴끼 가부시끼가이샤 Probe unit, circuit board inspection device, and manufacturing method for probe units
KR20150037736A (en) * 2012-07-26 2015-04-08 히오끼 덴끼 가부시끼가이샤 Probe unit, circuit board inspection device, and manufacturing method for probe units
CN104937424A (en) * 2013-02-07 2015-09-23 日置电机株式会社 Probe unit, substrate inspection device, and method for assembling probe unit
JP2014153148A (en) * 2013-02-07 2014-08-25 Hioki Ee Corp Probe unit, substrate inspection device and probe unit assembly method
TWI608236B (en) * 2013-02-07 2017-12-11 Hioki Electric Works Probe unit, substrate inspection apparatus, and probe unit combination method
CN104937424B (en) * 2013-02-07 2018-01-09 日置电机株式会社 Probe unit, base board checking device and probe unit assemble method
WO2014123031A1 (en) * 2013-02-07 2014-08-14 日置電機株式会社 Probe unit, substrate inspection device, and method for assembling probe unit
JP2017102117A (en) * 2015-12-01 2017-06-08 旺▲夕▼科技股▲分▼有限公司 Probe holder of vertical type probe module
TWI670383B (en) * 2017-04-28 2019-09-01 日商揖斐電股份有限公司 Probe, manufacturing method thereof and conduction inspection method using the same
WO2019187957A1 (en) * 2018-03-30 2019-10-03 日本電産リード株式会社 Inspection jig, and inspecting device provided with same
JPWO2019187957A1 (en) * 2018-03-30 2021-04-22 日本電産リード株式会社 Inspection jig and inspection equipment equipped with this
US11327094B2 (en) 2018-03-30 2022-05-10 Nidec-Read Corporation Inspection jig, and inspection device including the same
KR102072451B1 (en) * 2018-07-27 2020-02-04 주식회사 에스디에이 Probe Card Head Block
CN116298435A (en) * 2023-03-17 2023-06-23 圆周率半导体(南通)有限公司 Vertical probe assembly capable of effectively reducing contact resistance
CN116298435B (en) * 2023-03-17 2023-09-15 圆周率半导体(南通)有限公司 Vertical probe assembly capable of effectively reducing contact resistance

Also Published As

Publication number Publication date
TW505792B (en) 2002-10-11
KR20020020980A (en) 2002-03-18
JP3505495B2 (en) 2004-03-08
KR100455097B1 (en) 2004-11-08

Similar Documents

Publication Publication Date Title
JP2002090410A (en) Checking fixture for board inspection and board inspection apparatus with checking fixture
US20190178910A1 (en) Contact terminal, inspection jig, and inspection device
US20210041482A1 (en) Electrical contactor and electrical connecting apparartus
WO2014017426A1 (en) Probe unit, circuit board inspection device, and manufacturing method for probe units
JP2007304008A (en) Contact and tool for board inspection, and board inspection apparatus
JP2017054773A (en) Connection jig, substrate inspection device, and manufacturing method for connection jig
JP2006349692A (en) Probe card
CN212749137U (en) Test apparatus with configurable probe fixture
JP4574222B2 (en) Substrate inspection contact, substrate inspection jig and substrate inspection apparatus using the same
JP7237470B2 (en) probe assembly
JP5179301B2 (en) Probe unit and inspection device
TW200819755A (en) Electronic component inspection probe
JP2008076268A (en) Inspection tool
JP5528532B2 (en) Board inspection equipment
JP2019219368A (en) Probe card
JP2007232558A (en) Electronic component inspection probe
JP2008197009A (en) Electronic component inspection probe
JP5353968B2 (en) Substrate inspection jig
JP5228610B2 (en) PCB inspection jig
JP6176466B1 (en) PCB inspection jig
JP5333829B2 (en) Probe assembly
JP5130782B2 (en) Inspection jig and inspection device
JP2013164304A (en) Tool for substrate inspection
JP7154835B2 (en) probe assembly
JP2005180922A (en) Cable wiring structure for inspection apparatus

Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20031121

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20031215

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081219

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101219

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101219

Year of fee payment: 7

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313117

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101219

Year of fee payment: 7

R360 Written notification for declining of transfer of rights

Free format text: JAPANESE INTERMEDIATE CODE: R360

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101219

Year of fee payment: 7

R360 Written notification for declining of transfer of rights

Free format text: JAPANESE INTERMEDIATE CODE: R360

R371 Transfer withdrawn

Free format text: JAPANESE INTERMEDIATE CODE: R371

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101219

Year of fee payment: 7

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313117

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101219

Year of fee payment: 7

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101219

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111219

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111219

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121219

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121219

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131219

Year of fee payment: 10

LAPS Cancellation because of no payment of annual fees