CN103837715B - Fixture - Google Patents

Fixture Download PDF

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Publication number
CN103837715B
CN103837715B CN201310589686.8A CN201310589686A CN103837715B CN 103837715 B CN103837715 B CN 103837715B CN 201310589686 A CN201310589686 A CN 201310589686A CN 103837715 B CN103837715 B CN 103837715B
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CN
China
Prior art keywords
probe
lock dog
dog body
circuit pattern
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201310589686.8A
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Chinese (zh)
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CN103837715A (en
Inventor
李彩甲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LEENO PRECISION Co Ltd
Original Assignee
LEENO PRECISION Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LEENO PRECISION Co Ltd filed Critical LEENO PRECISION Co Ltd
Publication of CN103837715A publication Critical patent/CN103837715A/en
Application granted granted Critical
Publication of CN103837715B publication Critical patent/CN103837715B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Abstract

The fixture of the present invention comprises one end and contacts with the circuit pattern of substrate, the other end with judge probe that described circuit pattern has N/R inspection portion to be connected and guide described probe, it is arranged on base station and the change position, direction vertical with described probe when fixing of described base station, with described change position, the described probe location of described guiding is changed over the block unit of the target location of described circuit pattern, therefore can be easily changed the position of probe according to the tolerance of circuit pattern.

Description

Fixture
Technical field
The present invention relates to and lead to galvanoscopic fixture for circuit pattern.
Background technology
Generally adopt in field of printed circuit board fabrication or field of semiconductor manufacture and substrate is measured, processes or inspection etc..
When the circuit pattern that substrate surface is formed carries out the mensuration of precision, process, inspection etc., it is desirable to the tolerance of circuit pattern minimizes.
But, actually it is difficult to get rid of the tolerance of tool, the tolerance of baseplate material, the tolerance of pattern.Due to these tolerances, fixture is utilized to be likely to circuit pattern cannot be carried out the inspection that is energized reliably.
The smooth substrate fixture that circuit pattern is checked maintaining substrate is disclosed in Ebrean Registered Patent publication the 0809648th.But do not disclose owing to tolerance makes circuit pattern check limited Corresponding Countermeasures.
Look-ahead technique document
Patent documentation
Ebrean Registered Patent publication the 0809648th
Summary of the invention
The technical problem to be addressed by invention
It is an object of the invention to provide and reliably carry out circuit pattern and lead to galvanoscopic fixture.
It is an object of the invention to reach technical task as above, but be not limited to described technical task, other technical task not carried can be should be clearly understood that by the technical staff at technical field with usual knowledge by following record.
Solve the technical scheme of problem
The fixture of the present invention can comprise its one end and contact with the circuit pattern of substrate, the other end with judge probe that described circuit pattern has N/R inspection portion to be connected and guide described probe, it is arranged on base station and the change position, direction vertical with described probe when fixing of described base station, with described change position, the described probe location of described guiding is changed over the block unit of the target location of described circuit pattern.
The effect of the present invention is as follows.
The fixture of the present invention changes the position of block unit when fixing base station, can be easily changed the position of probe according to the tolerance of circuit pattern.
Therefore, it can be reliably prevented and then tolerance and can not complete the problem that circuit pattern checks.This effect is by being divided into a plurality of block by the block unit guiding probe and making each block separately change position can more to improve.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of present clip.
Fig. 2 is the disassembly and assembly structure schematic diagram of the lock dog body of present clip and base plate block.
Fig. 3 is the schematic cross-section of the probe constituting present clip.
In figure:
100-probe, 111-the 1st probe, 112-the 2nd probe, 113-elastic, 130-block unit, 131-lock dog body, 132-base plate block, 133-the 1st groove, 135-the 2nd groove, 139-connecting portion, 150-base station, 170-support sector, 190-holding wire, 210-substrate.
Detailed description of the invention
Hereinafter, in conjunction with accompanying drawing, embodiments of the invention are described in detail.The size of the constituent element shown on accompanying drawing in the process or image etc. can expand display for the definition illustrated and convenience.It addition, consider composition and the effect of the present invention, especially the term of definition can change according to user, the intention of operator or convention.The definition of these terms must be given a definition according to the content that this specification is overall.
Fig. 1 is the schematic diagram of present clip.
Probe 110 and block unit 130 can be comprised at Fig. 1 fixture shown.
One end of probe 110 contacts with the circuit pattern of substrate 210, and the other end can have N/R inspection portion to be connected with decision circuitry pattern.The state being connected with the other end of probe 110 in inspection portion and probe 110 is disclosed with the holding wire 190 of electric wire etc. of electrical connection at Fig. 1.
Such as inspection portion has without exception for decision circuitry pattern, can apply signal by the probe contacted with the circuit pattern measured and obtain signal.If the signal obtained judges that within the scope expected state is normal, otherwise may determine that circuit pattern has exception.
Probe 110 (probe) is the appliance measuring detection object circuit pattern state.Probe 100 can have, according to circuit pattern, the image that electrical characteristic is good.Such as one end has sharp-pointed form and the size according to circuit pattern can have from some tens of pm unit to the thickness of hundreds of units of micrometers.Recently very strong according to the trend of various electronic apparatus miniaturizations, the circuit pattern also miniaturization of highly integrated trend substrate 210.Thus the size of probe 100 also has the thickness of the thickness as hair or thinner.
Even if circuit substrate 210 produces owing to many factors can have tolerance at same system.This tolerance is in fine circuit substrate generation as the same.When fine circuit substrate 210 exists tolerance, probe 110 is likely to not contact the circuit pattern of initial stage design attitude.This problem along with after the trend of the lasting miniaturization/miniaturization of circuit pattern it is possible that bigger problem.
Block unit 130 guides probe 110.Block 130 is utilized in order to make the plurality of probes 110 with multiple thickness contact circuit pattern.Block unit 130 is formed in the position of corresponding circuits pattern and can place the groove of probe, hole etc..Probe 110 can be housed in groove or the hole of block unit 130 formation.
For a plurality of substrate 210 of inspection repeatedly, block unit 130 is arranged on fixing base station 150.The block unit 130 being arranged on base station 150 is also secured at same position.But owing to block unit is fixed the tolerance being difficult to tackle substrate 210 circuit pattern.Therefore, block unit 130 direction to be perpendicular to probe when base station 150 is fixed constituting present clip can change position.Probe 110 position block unit 130 guided with the position change of block unit 130 can change over the target location of circuit pattern.
Probe 110 can contact with circuit pattern with the direction of the direction of vertical circuit pattern or almost vertical circuit pattern.Probe 110 is the factor directly contacting circuit pattern, so necessarily be formed reliable contact to check, does not cause the formation contact of damage circuit pattern better in checking process simultaneously.The elastic 113 of spring etc. can be comprised for this probe 110.
Elastic 113 can have variform.Such as spring can be set at probe 110, or probe 110 is as elastomer.The situation of the latter can utilize line (wire) probe 110 of straight line or tracing pattern.
Trend according to the circuit pattern of highly integrated, miniaturization/miniaturization as previously mentioned, the wide grade of the circuit pattern that probe 110 to contact is designed to produce with very little direction.This miniaturization/miniaturization makes the tolerance produced in the production process of substrate 210 reach debatable level in checking process uncontrollablely.This trend acceleration more backward, therefore considering tolerance needs configuration probe 110 reliably to contact circuit pattern.The configuration of probe 110 can be determined by the block unit 130 guiding probe 110.
Especially because it is the situation that the circuit pattern direction of principal axis to probe 110 has vertical direction (the x/y plane direction of Fig. 1) tolerance that tolerance becomes the part of problem.Therefore, the block unit 130 constituting present clip can change position in the direction vertical with the direction of principal axis of probe 110.The scheme of block unit 130 position is changed, thus it is possible to vary base station 150 position of block unit 130 is set or directly changes the position of block unit 130 as the direction to be perpendicular to probe 110.The position change of the base station 150 connecting gear, belt does not meet the purpose of the present invention owing to the connection of gear, belt etc. has tolerance.
Therefore, the position change of probe 110 is undertaken better by the position change of block unit 130.Block unit 130 is likely to has tolerance, but can carry out more reliable position change compared to base station 150.
Tolerance will not at all circuit of circuit substrate 210 in the same direction, same numerical value produces.Such as partial sector is better in original probe 110 position detection, and it is better in probe 110 position detection changed that other section then considers tolerance.Thus, whole probe 110 be likely to according to the situation of circuit substrate 210 with change position, same direction less suitable.Block unit 130 is divided into a plurality of block and each block can change position independently of each other to tackle this situation.Fig. 1 discloses block unit 130 and is divided into the state of 3 blocks.
Probe 110 can comprise the 1st probe 111 of end thereof contacts substrate 210, one end contact with the other end of the 1st probe 111 and the other end connect inspection portion the 2nd probe 112.
Block unit 130 can comprise and run through by the 1st probe 111 and can change, with the direction of vertical 1st probe 111, the base plate block 132 that the lock dog body 131 of position, collecting the 2nd probe and lock block opposite lock block body 131 are fixing.
Form the perforation run through by the 1st probe 111 at lock dog body 131, form the perforation run through by the 2nd probe 112 at base plate block 132.These perforation determine probe 110 position of associate circuit pattern.
The position range of the 1st probe the 111 or the 2nd probe 112 is configured with field at Fig. 1Scope represent.1st probe the 111 or the 2nd probe 112 can be formed in field with multiple thickness and positionScope within.
It is divided into the 1st probe the 111 and the 2nd probe 112, for instance the 2nd probe 112 is arranged in whole field to tackle multiple circuit patternThen unrelated with the number of the 1st probe 111, position carrying out checks.That is, simply exchange the lock dog body 131 being provided with the 1st probe 111 and just can check multiple circuit pattern.
Exchange the 1st probe 111 is relatively difficult respectively, so the lock dog body 131 that exchange is provided with the 1st probe 111 is whole better.Can dismount at base plate block 132 for this lock dog body 131.Now, base plate block 132 is fixed on base station 150.Disclose base plate block 132 at Fig. 1 and be fixed on the state of base station 150 by the support sector 170 of pillar or rod shape.
Lock dog body 131 can dismount in a variety of ways at the base plate block 132 being fixed on base station 150.
Such as, lock dog body 131 may be embodied in a plurality of 1st dismounting portions that the relative face of base plate block 132 is formed.Base plate block 132 may be embodied in a plurality of 2nd dismounting portions that the relative face of lock dog body 131 is formed.Now, the 2nd dismounting portion and the dismounting of the 1st dismounting portion.Dismount all 1st dismounting portions not to the utmost when dismounting lock dog body 131 and base plate block 132 and all 2nd dismounting portions are also harmless.Such as select mutually corresponding 2 to dismount reliably respectively in the 1st dismounting portion and the 2nd dismounting portion.The number in selected 1st dismounting portion and the 2nd dismounting portion is also harmless more than more than 3.Can rotate in the horizontal direction with dismounting portion for shaft lock block body 131 and base plate block 132 according to disassembly and assembly structure time only with 1 dismounting portion, therefore must notice.
The change position of lock dog body 131 is may decide that with the position in the 1st dismounting portion selected and the 2nd dismounting portion of selection.
Fig. 2 is the disassembly and assembly structure schematic diagram of the lock dog body 131 of present clip and base plate block 132.
As in figure 2 it is shown, lock dog body 131 may be embodied in a plurality of 1st grooves 133 that the relative face of base plate block 132 is formed, base plate block 132 may be embodied in a plurality of 2nd grooves 135 that the relative face of lock dog body 131 is formed.
Now, the 1st groove 133 is equivalent to the 1st dismounting portion, and the 2nd groove 135 is equivalent to the 2nd dismounting portion.Owing to sandwiching the connecting portion 139 of the groove selected in the 1st groove the 133 and the 2nd groove 135, lock dog body 131 can be installed at base plate block 132 and maybe can take apart.It addition, the position change of lock dog body 131 can be completed according to the selection of the groove sandwiching connecting portion 139.
Such as Fig. 2 on the right side of lock dog body 131 and base plate block 132 tangible the groove of pluralizing.Now, being x1 with the interval between length direction (the x-axis direction of Fig. 1) the 1st groove 133 of block unit 130, when the interval between the 2nd groove 135 is x2, x1 and x2 can be unequal.When being respectively compared left side groove and the right side groove that connecting portion 139 is sandwiched in formation x1, lock dog body 131 can complete position change with the size of length direction such as x1 and the x2 phase difference of block unit 130.
Same, with and interval between vertical direction (the y-axis direction of Fig. 1) the 1st groove 133 of block unit 130 length direction be y1, when the interval between the 2nd groove 135 is y2, y1 and y2 can be unequal.Being respectively compared connecting portion 139 and be sandwiched in when forming the upper side channel of y1 and lower side channel, lock dog body 131 can complete position change with the size of the direction vertical with block unit 130 length direction such as y1 and y2 phase difference.
Make at least one corresponding tolerance can release, when forming the 1st groove 133 and 2 groove 135, the problem caused by tolerance above in x1 and x2 phase difference, y1 and y2 phase difference.
When lock dog body 131 is arranged on base plate block 132, the 1st probe the 111 and the 2nd probe 112 can contact with each other, if stagger and can not contact with each other in the position of the 1st probe the 111 and the 2nd probe 112 during the position change of lock dog body 131.This kind of problem can eliminate with following scheme.
Fig. 3 is the schematic cross-section of the probe 110 constituting present clip.
The probe 110 of Fig. 3 can comprise the 1st probe 111 being arranged on lock dog body 131 and the 2nd probe 112 being arranged on base plate block 132.
1st probe 111 is the factor directly contacting circuit pattern.2nd probe 112 is the factor connecting inspection portion.In order to the inspection lock dog body 131 of circuit pattern to contact with one end of the 2nd probe 112 with base plate block 132 one end of the 1st probe 111 in mounted situation.But, owing to formed in each dismounting portion the 1st probe the 111 and the 2nd probe 112 of each block unit 130 may change position, even if position change must prepare the means that the 1st probe 111 contacts with the 2nd probe 112 phase mutual energy.
Such as at the sectional area of the 2nd probe 112 end of Fig. 3 and the 1 probe 111 ends contact sectional area more than the 1st probe 111 end.
Specifically, the thickness of the 1st probe 111 end is w1, and when the thickness of the 2nd probe 112 end is w2, the formation of w2 is more than w1.Certain the two can phase interchangeable.
The difference of w1 and w2 as previously mentioned can according to the difference of x1 and x2, and the difference of y1 and y2 etc. determines.
Although it addition, formed on the 2nd probe 112 in Fig. 3 elastic 113, but being formed at the 1st probe 111 or all formed also harmless at the 1st probe the 111 and the 2nd probe 112.Or do not utilize extra spring can utilize the elasticity of probe 111 itself or the elasticity of probe 112 itself as elastic 113.
Comprehensive, the sectional area of the 1st probe 111 end of contact the 2nd probe 112 can be not mutually equal mutually with the sectional area of the 2nd probe 112 end contacting the 1st probe 111.The difference of each sectional area need to be considered when the tolerance of circuit pattern, so each sectional area difference is likely to and the change distance dependent of the probe 110 changing position.
Being illustrated according to embodiments of the invention above, but this only illustrates, what have usual knowledge in this area skilled artisans appreciated that the embodiment that thus can implement various deformation and equivalency range.Therefore, the real technical protection scope of the present invention must limit according to claims.

Claims (5)

1. a fixture, comprises:
One end contacts with the circuit pattern of substrate, the other end with judge that described circuit pattern has the probe that N/R inspection portion is connected;And
Guide described probe, be arranged on base station and described base station is when fixing, the direction change position vertical with described probe, and with described change position, the described probe location of described guiding is changed over the block unit of the target location of described circuit pattern,
Described fixture is characterised by,
Described probe comprises the 1st probe of substrate described in end thereof contacts, one end contact with the other end of described 1st probe and the other end connect described inspection portion the 2nd probe,
Described block unit comprises the lock dog body being run through and changing with the direction of vertically described 1st probe position by described 1st probe, houses the base plate block that described 2nd probe and relatively described lock dog body are fixing.
2. fixture according to claim 1, it is characterised in that
Described lock dog body dismounts at described base plate block.
3. fixture according to claim 1, it is characterised in that
Described lock dog body is included in a plurality of 1st dismounting portions that the relative face of described base plate block is formed,
Described base plate block comprises and is formed in the relative face of described lock dog body and in a plurality of 2nd dismounting portions of described 1st dismounting portion dismounting,
The position in selected 1st dismounting portion and the position in selected 2nd dismounting portion determine the position change of described lock dog body.
4. fixture according to claim 1, it is characterised in that
Described lock dog body is included in a plurality of 1st grooves that the relative face of described base plate block is formed,
Described base plate block is included in a plurality of 2nd grooves that the relative face of described lock dog body is formed,
Owing to sandwiching the connecting portion of the groove selected in described 1st groove and described 2nd groove, described lock dog body is arranged on described base plate block, determines the position change of described lock dog body.
5. fixture according to claim 1, it is characterised in that
The sectional area of described 1st probe tips contacting described 2nd probe is not mutually equal mutually with the sectional area of described 2nd probe tips contacting described 1st probe.
CN201310589686.8A 2012-11-20 2013-11-20 Fixture Active CN103837715B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120131281A KR101410991B1 (en) 2012-11-20 2012-11-20 Jig
KR10-2012-0131281 2012-11-20

Publications (2)

Publication Number Publication Date
CN103837715A CN103837715A (en) 2014-06-04
CN103837715B true CN103837715B (en) 2016-07-20

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KR (1) KR101410991B1 (en)
CN (1) CN103837715B (en)
TW (1) TWI511227B (en)

Families Citing this family (1)

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Publication number Priority date Publication date Assignee Title
KR101575318B1 (en) 2014-05-28 2015-12-07 현대자동차 주식회사 Air flow control system of vehicle

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EP0849599A1 (en) * 1996-12-20 1998-06-24 Lsi Logic Corporation Apparatus for contacting semiconductor die
KR20060072916A (en) * 2004-12-24 2006-06-28 주식회사 파이컴 A probe card manufacturing method include sensing probe and the probe card, probe card inspection system
KR20080085322A (en) * 2007-03-19 2008-09-24 (주) 미코티엔 Probe card
CN101290329A (en) * 2007-04-17 2008-10-22 日本麦可罗尼克斯股份有限公司 Probe unit and checking device
TW201011301A (en) * 2008-06-20 2010-03-16 Tokyo Electron Ltd Contact structure for inspection
KR20120066418A (en) * 2010-12-14 2012-06-22 엘지디스플레이 주식회사 Probe unit and testing apparatus of thin film pattern using the same

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KR100991367B1 (en) * 2010-03-15 2010-11-02 (주)아테코 Module for testing display device
TWM413858U (en) * 2011-06-07 2011-10-11 Qi-Zong Lv Fine-tuning device of circuit board inspection jig
TWM428360U (en) * 2011-12-13 2012-05-01 Soon Tan Entpr Co Ltd Jig structure allowing separate angle adjustment

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0849599A1 (en) * 1996-12-20 1998-06-24 Lsi Logic Corporation Apparatus for contacting semiconductor die
KR20060072916A (en) * 2004-12-24 2006-06-28 주식회사 파이컴 A probe card manufacturing method include sensing probe and the probe card, probe card inspection system
KR20080085322A (en) * 2007-03-19 2008-09-24 (주) 미코티엔 Probe card
CN101290329A (en) * 2007-04-17 2008-10-22 日本麦可罗尼克斯股份有限公司 Probe unit and checking device
JP2008267873A (en) * 2007-04-17 2008-11-06 Micronics Japan Co Ltd Probe unit and inspection apparatus
TW201011301A (en) * 2008-06-20 2010-03-16 Tokyo Electron Ltd Contact structure for inspection
KR20120066418A (en) * 2010-12-14 2012-06-22 엘지디스플레이 주식회사 Probe unit and testing apparatus of thin film pattern using the same

Also Published As

Publication number Publication date
CN103837715A (en) 2014-06-04
KR20140064214A (en) 2014-05-28
TW201430989A (en) 2014-08-01
KR101410991B1 (en) 2014-06-23
TWI511227B (en) 2015-12-01

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