TWI588513B - 梯度聚合物結構及方法 - Google Patents
梯度聚合物結構及方法 Download PDFInfo
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
- C08L2205/18—Spheres
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0362—Manufacture or treatment of packages of encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
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- Physics & Mathematics (AREA)
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- Optics & Photonics (AREA)
- Silicon Polymers (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Chemical & Material Sciences (AREA)
- Led Device Packages (AREA)
- Health & Medical Sciences (AREA)
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| US201261596959P | 2012-02-09 | 2012-02-09 |
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| JP (1) | JP6358960B2 (https=) |
| KR (1) | KR102001403B1 (https=) |
| CN (1) | CN104220902B (https=) |
| TW (1) | TWI588513B (https=) |
| WO (1) | WO2013119796A1 (https=) |
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| KR102001403B1 (ko) | 2012-02-09 | 2019-07-18 | 다우 코닝 도레이 캄파니 리미티드 | 구배 중합체 구조물 및 방법 |
| EP2936581B1 (en) | 2012-12-21 | 2018-11-21 | Dow Silicones Corporation | Layered polymer structures and methods |
| WO2014150841A2 (en) * | 2013-03-15 | 2014-09-25 | Dow Corning Corporation | Powdered resin linear organopolysiloxane compositions |
| KR20150132380A (ko) * | 2013-03-15 | 2015-11-25 | 다우 코닝 코포레이션 | 수지-선형 유기실록산 블록 공중합체의 조성물 |
| WO2014197617A1 (en) * | 2013-06-05 | 2014-12-11 | Dow Corning Corporation | Compositions of resin-linear organosiloxane block copolymers |
| US9765192B2 (en) | 2013-09-18 | 2017-09-19 | Dow Corning Corporation | Compositions of resin-linear organosiloxane block copolymers |
| CN106796978B (zh) * | 2014-06-25 | 2019-09-17 | 美国陶氏有机硅公司 | 层状聚合物结构和方法 |
| US9930750B2 (en) * | 2014-08-20 | 2018-03-27 | Lumens Co., Ltd. | Method for manufacturing light-emitting device packages, light-emitting device package strip, and light-emitting device package |
| US20170306201A1 (en) * | 2014-09-23 | 2017-10-26 | Dow Corning Corporation | Adhesive compositions and uses thereof |
| FR3038710B1 (fr) * | 2015-07-10 | 2021-05-28 | Cpc Tech | Capteur d'une caracteristique physique, comportant de preference une structure multicouches |
| EP3356140A4 (en) * | 2015-09-30 | 2019-05-08 | 3M Innovative Properties Company | COMPOSITE STRUCTURE WITH GLASS-TYPE LAYER AND METHOD OF FORMING |
| DE102016114921A1 (de) * | 2016-08-11 | 2018-02-15 | Osram Opto Semiconductors Gmbh | Silikonzusammensetzung |
| JPWO2018066559A1 (ja) * | 2016-10-04 | 2019-07-18 | 東レ・ダウコーニング株式会社 | 化粧料組成物または外用剤組成物、および化粧料原料組成物 |
| WO2019022861A1 (en) | 2017-07-27 | 2019-01-31 | Dow Silicones Corporation | HYDROSILYLATION-CURABLE POLYSILOXANE |
| JP6562044B2 (ja) * | 2017-07-28 | 2019-08-21 | セイコーエプソン株式会社 | 電気光学装置、電子機器、及び電気光学装置の製造方法 |
| KR102334936B1 (ko) * | 2017-11-08 | 2021-12-02 | 시아먼 산안 옵토일렉트로닉스 테크놀로지 캄파니 리미티드 | 자외선 led 패키징 구조 |
| WO2025170712A1 (en) | 2024-02-07 | 2025-08-14 | Dow Silicones Corporation | Epoxy-functional resin-linear polyorganosiloxane copolymer, composition containing the copolymer, and methods for their preparation and use |
| WO2025178717A1 (en) | 2024-02-20 | 2025-08-28 | Dow Silicones Corporation | Alkenyl ester – functional resin – linear polyorganosiloxane block copolymer, composition containing the copolymer, and methods for their preparation and use |
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Also Published As
| Publication number | Publication date |
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| TW201344232A (zh) | 2013-11-01 |
| US20150207047A1 (en) | 2015-07-23 |
| EP2812738B1 (en) | 2016-10-12 |
| JP2015511332A (ja) | 2015-04-16 |
| EP2812738A1 (en) | 2014-12-17 |
| CN104220902B (zh) | 2018-06-26 |
| CN104220902A (zh) | 2014-12-17 |
| WO2013119796A1 (en) | 2013-08-15 |
| US9705056B2 (en) | 2017-07-11 |
| JP6358960B2 (ja) | 2018-07-18 |
| KR20140125843A (ko) | 2014-10-29 |
| KR102001403B1 (ko) | 2019-07-18 |
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