KR102001403B1 - 구배 중합체 구조물 및 방법 - Google Patents

구배 중합체 구조물 및 방법 Download PDF

Info

Publication number
KR102001403B1
KR102001403B1 KR1020147025160A KR20147025160A KR102001403B1 KR 102001403 B1 KR102001403 B1 KR 102001403B1 KR 1020147025160 A KR1020147025160 A KR 1020147025160A KR 20147025160 A KR20147025160 A KR 20147025160A KR 102001403 B1 KR102001403 B1 KR 102001403B1
Authority
KR
South Korea
Prior art keywords
composition
region
refractive index
resin
sio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020147025160A
Other languages
English (en)
Korean (ko)
Other versions
KR20140125843A (ko
Inventor
마사아키 아마코
제프리 브루스 가드너
스티븐 스위어
신 요시다
Original Assignee
다우 코닝 도레이 캄파니 리미티드
다우 실리콘즈 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다우 코닝 도레이 캄파니 리미티드, 다우 실리콘즈 코포레이션 filed Critical 다우 코닝 도레이 캄파니 리미티드
Publication of KR20140125843A publication Critical patent/KR20140125843A/ko
Application granted granted Critical
Publication of KR102001403B1 publication Critical patent/KR102001403B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • H10H20/854Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/14Polymer mixtures characterised by other features containing polymeric additives characterised by shape
    • C08L2205/18Spheres
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0362Manufacture or treatment of packages of encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0363Manufacture or treatment of packages of optical field-shaping means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Silicon Polymers (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Chemical & Material Sciences (AREA)
  • Led Device Packages (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
KR1020147025160A 2012-02-09 2013-02-07 구배 중합체 구조물 및 방법 Expired - Fee Related KR102001403B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261596959P 2012-02-09 2012-02-09
US61/596,959 2012-02-09
PCT/US2013/025126 WO2013119796A1 (en) 2012-02-09 2013-02-07 Gradient polymer structures and methods

Publications (2)

Publication Number Publication Date
KR20140125843A KR20140125843A (ko) 2014-10-29
KR102001403B1 true KR102001403B1 (ko) 2019-07-18

Family

ID=47741314

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147025160A Expired - Fee Related KR102001403B1 (ko) 2012-02-09 2013-02-07 구배 중합체 구조물 및 방법

Country Status (7)

Country Link
US (1) US9705056B2 (https=)
EP (1) EP2812738B1 (https=)
JP (1) JP6358960B2 (https=)
KR (1) KR102001403B1 (https=)
CN (1) CN104220902B (https=)
TW (1) TWI588513B (https=)
WO (1) WO2013119796A1 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102001403B1 (ko) 2012-02-09 2019-07-18 다우 코닝 도레이 캄파니 리미티드 구배 중합체 구조물 및 방법
EP2936581B1 (en) 2012-12-21 2018-11-21 Dow Silicones Corporation Layered polymer structures and methods
WO2014150841A2 (en) * 2013-03-15 2014-09-25 Dow Corning Corporation Powdered resin linear organopolysiloxane compositions
KR20150132380A (ko) * 2013-03-15 2015-11-25 다우 코닝 코포레이션 수지-선형 유기실록산 블록 공중합체의 조성물
WO2014197617A1 (en) * 2013-06-05 2014-12-11 Dow Corning Corporation Compositions of resin-linear organosiloxane block copolymers
US9765192B2 (en) 2013-09-18 2017-09-19 Dow Corning Corporation Compositions of resin-linear organosiloxane block copolymers
CN106796978B (zh) * 2014-06-25 2019-09-17 美国陶氏有机硅公司 层状聚合物结构和方法
US9930750B2 (en) * 2014-08-20 2018-03-27 Lumens Co., Ltd. Method for manufacturing light-emitting device packages, light-emitting device package strip, and light-emitting device package
US20170306201A1 (en) * 2014-09-23 2017-10-26 Dow Corning Corporation Adhesive compositions and uses thereof
FR3038710B1 (fr) * 2015-07-10 2021-05-28 Cpc Tech Capteur d'une caracteristique physique, comportant de preference une structure multicouches
EP3356140A4 (en) * 2015-09-30 2019-05-08 3M Innovative Properties Company COMPOSITE STRUCTURE WITH GLASS-TYPE LAYER AND METHOD OF FORMING
DE102016114921A1 (de) * 2016-08-11 2018-02-15 Osram Opto Semiconductors Gmbh Silikonzusammensetzung
JPWO2018066559A1 (ja) * 2016-10-04 2019-07-18 東レ・ダウコーニング株式会社 化粧料組成物または外用剤組成物、および化粧料原料組成物
WO2019022861A1 (en) 2017-07-27 2019-01-31 Dow Silicones Corporation HYDROSILYLATION-CURABLE POLYSILOXANE
JP6562044B2 (ja) * 2017-07-28 2019-08-21 セイコーエプソン株式会社 電気光学装置、電子機器、及び電気光学装置の製造方法
KR102334936B1 (ko) * 2017-11-08 2021-12-02 시아먼 산안 옵토일렉트로닉스 테크놀로지 캄파니 리미티드 자외선 led 패키징 구조
WO2025170712A1 (en) 2024-02-07 2025-08-14 Dow Silicones Corporation Epoxy-functional resin-linear polyorganosiloxane copolymer, composition containing the copolymer, and methods for their preparation and use
WO2025178717A1 (en) 2024-02-20 2025-08-28 Dow Silicones Corporation Alkenyl ester – functional resin – linear polyorganosiloxane block copolymer, composition containing the copolymer, and methods for their preparation and use

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008532795A (ja) 2005-02-28 2008-08-21 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 光学素子及び放射線を発する素子の製造方法及び光学素子ならびに放射線を発する素子

Family Cites Families (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3017385A (en) 1959-01-21 1962-01-16 Gen Electric Novel organopolysiloxanes
US3294737A (en) * 1963-12-23 1966-12-27 Gen Electric Organopolysiloxanes
US3436439A (en) * 1965-08-13 1969-04-01 Dow Corning Preparation of siloxane block copolymers
FR2633088B1 (fr) 1988-06-15 1990-11-16 Sgn Soc Gen Tech Nouvelle Dispositif pour cisailler un assemblage de tubes
US5075103A (en) 1990-07-06 1991-12-24 Dow Corning Corporation Hair fixatives comprising nonpolar silsesquioxanes
JPH04325645A (ja) 1991-04-25 1992-11-16 Furukawa Alum Co Ltd 焼付け硬化後の強度に優れたアルミニウム合金およびその製造方法
JP2646046B2 (ja) 1991-10-21 1997-08-25 信越化学工業株式会社 高減衰性シリコーン組成物及びその硬化物
JPH0827036A (ja) 1994-07-12 1996-01-30 Chuo Aerosol Kagaku Kk 液体溶剤組成物
JPH0841446A (ja) 1994-08-03 1996-02-13 Chuo Aerosol Kagaku Kk 均一に相溶してなる混合液体組成物
JPH0892600A (ja) 1994-09-22 1996-04-09 Canon Inc 混合溶剤組成物、それを用いる洗浄方法及び洗浄装置
IT1282378B1 (it) 1996-04-24 1998-03-20 Ausimont Spa Perfluoroelastomeri a base di diossoli
US6144795A (en) 1996-12-13 2000-11-07 Corning Incorporated Hybrid organic-inorganic planar optical waveguide device
IT1293515B1 (it) 1997-07-31 1999-03-01 Ausimont Spa Dispersioni di fluoropolimeri
IT1293516B1 (it) 1997-07-31 1999-03-01 Ausimont Spa Dispersione di perfluoropolimeri
JPH1160720A (ja) 1997-08-22 1999-03-05 Showa Denko Kk ポリエーテル化合物及び磁気記録媒体
ITMI981506A1 (it) 1998-06-30 1999-12-30 Ausimont Spa Manufatti di fluoropolimeri amorfi
JP2001031997A (ja) 1999-07-21 2001-02-06 Asahi Glass Co Ltd 溶剤組成物
KR100335663B1 (ko) * 1999-10-19 2002-05-06 윤종용 테입리스 loc 패키징용 폴리(이미드-실록산) 화합물
EP1160313A1 (en) 2000-06-02 2001-12-05 The Procter & Gamble Company Cleaning composition and device for electronic equipment
US6419858B1 (en) * 2000-06-13 2002-07-16 Zms, Llc Morphology trapping and materials suitable for use therewith
ATE394442T1 (de) 2000-10-27 2008-05-15 Procter & Gamble Zusammensetzungen und verfahren zur behandlung von oberflächen
EP1341895A2 (en) 2000-11-08 2003-09-10 SOLVAY (Société Anonyme) Solvent compositions
JP2003064345A (ja) 2001-08-28 2003-03-05 Sony Corp 表面改質材、表面改質膜用組成物、表面改質膜、光学部品及び表示装置
EP1306417B1 (en) 2001-10-23 2012-08-01 Solvay Specialty Polymers Italy S.p.A. Use of fluorinated liquids for the heat exchange or as working fluids in the presence of ionizing radiations and/or irradiation with neutrons
JP2004075736A (ja) 2002-08-12 2004-03-11 Nikko Materials Co Ltd 撥水・撥油剤およびその製造方法
US7426328B2 (en) * 2002-08-28 2008-09-16 Phosistor Technologies, Inc. Varying refractive index optical medium using at least two materials with thicknesses less than a wavelength
JP2004115622A (ja) 2002-09-25 2004-04-15 Int Screen:Kk 含フッ素樹脂組成物
US7072564B2 (en) 2003-11-25 2006-07-04 Rohm And Haas Electronic Materials Llc Waveguide compositions and waveguides formed therefrom
JP4744077B2 (ja) 2003-12-18 2011-08-10 京セラ株式会社 シロキサンポリマ皮膜形成方法および光導波路の作製方法
JP4789809B2 (ja) 2004-01-15 2011-10-12 サムスン エレクトロニクス カンパニー リミテッド ナノ結晶をドーピングしたマトリックス
US7288797B2 (en) * 2004-01-20 2007-10-30 Nichia Corporation Semiconductor light emitting element
US7352011B2 (en) 2004-11-15 2008-04-01 Philips Lumileds Lighting Company, Llc Wide emitting lens for LED useful for backlighting
ITMI20050006A1 (it) 2005-01-05 2006-07-06 Solvay Solexis Spa Composizioni a base di oli perfluoropolieterei per la formazione di film lubrificanti
US7373060B2 (en) 2005-02-28 2008-05-13 Chisso Corporation Optical waveguide using polymer composed of silsesquioxane derivative
EP1801163B1 (en) 2005-12-22 2009-08-05 Rohm and Haas Company Siloxane Encapsulants
US7655486B2 (en) * 2006-05-17 2010-02-02 3M Innovative Properties Company Method of making light emitting device with multilayer silicon-containing encapsulant
JP4325645B2 (ja) 2006-06-14 2009-09-02 日亜化学工業株式会社 トランスファーモールド用タブレット、その製造方法、発光装置及びその製造方法
JP4636275B2 (ja) 2006-07-18 2011-02-23 信越化学工業株式会社 シリコーン樹脂組成物で封止された半導体装置及び該半導体装置封止用シリコーン樹脂タブレット
JP5666775B2 (ja) 2006-07-21 2015-02-12 株式会社カネカ ポリシロキサン系組成物およびそれから得られる成形体、オプトデバイス部材
JP4930830B2 (ja) * 2006-07-27 2012-05-16 日亜化学工業株式会社 発光装置
WO2008027283A2 (en) * 2006-08-25 2008-03-06 Dow Global Technologies Inc. Production of meta-block copolymers by polymer segment interchange
JP4400752B2 (ja) 2006-11-06 2010-01-20 信越化学工業株式会社 コーティング剤組成物
JP2008133342A (ja) * 2006-11-28 2008-06-12 Shin Etsu Chem Co Ltd エマルジョンコーティング剤組成物及びそれを被覆した物品
US9944031B2 (en) 2007-02-13 2018-04-17 3M Innovative Properties Company Molded optical articles and methods of making same
WO2008103229A1 (en) * 2007-02-22 2008-08-28 Dow Corning Corporation Reinforced silicone resin film and method of preparing same
JP4927019B2 (ja) 2007-04-10 2012-05-09 信越化学工業株式会社 蛍光体含有接着性シリコーン組成物、該組成物からなる組成物シート、及び該シートを使用する発光装置の製造方法
EP2168757B1 (en) 2007-07-25 2015-04-29 Hoya Corporation Method of manufacturing a plastic lens
US20090065792A1 (en) 2007-09-07 2009-03-12 3M Innovative Properties Company Method of making an led device having a dome lens
US7566409B1 (en) 2008-01-24 2009-07-28 Mainstream Engineering Corporation Replacement solvents having improved properties for refrigeration flushes
EP2100909A1 (en) 2008-03-14 2009-09-16 Solvay Solexis S.p.A. (Per)fluorinated addition products
JP2010107680A (ja) 2008-10-29 2010-05-13 Seiko Epson Corp 光学素子および光学素子の製造方法
CN101736346A (zh) 2008-11-24 2010-06-16 3M创新有限公司 在不锈钢表面形成易清洁层的制品及其制备方法
WO2010063745A1 (en) 2008-12-05 2010-06-10 Solvay Solexis S.P.A. Polyfunctional (per)fluoropolyethers
JP5245902B2 (ja) 2009-02-20 2013-07-24 信越化学工業株式会社 微粉末状又はペースト状の重合生成物の製造方法
TWI510516B (zh) 2009-05-15 2015-12-01 Solvay Solexis Spa 多元醇pfpe衍生物之純化方法
JP5165644B2 (ja) 2009-07-02 2013-03-21 信越化学工業株式会社 オルガノポリシロキサン組成物及びその製造方法
JP5404225B2 (ja) 2009-07-15 2014-01-29 株式会社Lixil 防汚塗料及びガラス層をもつ製品
US20110062424A1 (en) 2009-09-11 2011-03-17 Nitto Denko Corporation Polymer compositions comprising additive block copolymers
EP2517052B1 (en) * 2009-12-21 2019-06-12 Dow Silicones Corporation Methods for fabricating flexible waveguides using alkyl-functional silsesquioxane resins
US8043173B2 (en) * 2010-01-26 2011-10-25 Nasrin Menalagha Sports training system
US20120009382A1 (en) 2010-07-06 2012-01-12 Tosoh F-Tech, Inc. Guard substrate for optical electromotive force equipment, and its production process
KR101829336B1 (ko) 2010-09-22 2018-02-19 다우 코닝 코포레이션 수지-선형 유기실록산 블록 공중합체를 함유하는 열안정성 조성물
EP2619246B1 (en) 2010-09-22 2014-07-16 Dow Corning Corporation Resin-linear organosiloxane block copolymers
KR101477609B1 (ko) 2010-09-22 2014-12-31 다우 코닝 코포레이션 수지-선형 유기실록산 블록 공중합체를 함유하는 고굴절률 조성물
US9045668B2 (en) 2010-09-22 2015-06-02 Dow Corning Corporation Organosiloxane block copolymer
JP2012102167A (ja) 2010-11-05 2012-05-31 Nitto Denko Corp シリコーン樹脂、封止材料および光半導体装置
CN103339171B (zh) * 2011-02-04 2016-05-04 道康宁公司 可固化有机硅氧烷嵌段共聚物乳剂
KR20140106642A (ko) 2011-12-02 2014-09-03 다우 코닝 코포레이션 수지―선형 유기실록산 블록 공중합체의 경화성 조성물
WO2013090691A1 (en) * 2011-12-14 2013-06-20 Dow Corning Corporation Curable compositions of resin-linear organosiloxane block copolymers
EP2798024B1 (en) * 2011-12-30 2016-07-20 Dow Corning Corporation Solid state light and method of forming
WO2013109607A1 (en) 2012-01-16 2013-07-25 Dow Corning Corporation Optical article and method of forming
KR102001403B1 (ko) 2012-02-09 2019-07-18 다우 코닝 도레이 캄파니 리미티드 구배 중합체 구조물 및 방법
WO2013134018A1 (en) 2012-03-09 2013-09-12 Dow Corning Corporation Compositions of resin-linear organosiloxane block copolymers
US9175140B2 (en) * 2012-03-21 2015-11-03 Dow Corning Corporation Compositions of resin-linear organosiloxane block copolymers
WO2013142140A1 (en) * 2012-03-21 2013-09-26 Dow Corning Corporation Process for preparing resin- linear organosiloxane block copolymers

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008532795A (ja) 2005-02-28 2008-08-21 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 光学素子及び放射線を発する素子の製造方法及び光学素子ならびに放射線を発する素子

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
SPIE Vol. 539 Advances in Resist Technology and Processing || (1985), Pp. 90-96*

Also Published As

Publication number Publication date
TW201344232A (zh) 2013-11-01
US20150207047A1 (en) 2015-07-23
EP2812738B1 (en) 2016-10-12
JP2015511332A (ja) 2015-04-16
TWI588513B (zh) 2017-06-21
EP2812738A1 (en) 2014-12-17
CN104220902B (zh) 2018-06-26
CN104220902A (zh) 2014-12-17
WO2013119796A1 (en) 2013-08-15
US9705056B2 (en) 2017-07-11
JP6358960B2 (ja) 2018-07-18
KR20140125843A (ko) 2014-10-29

Similar Documents

Publication Publication Date Title
KR102001403B1 (ko) 구배 중합체 구조물 및 방법
KR102067384B1 (ko) 고체 조명 장치 및 형성 방법
JP6309898B2 (ja) 光学物品及び形成方法
KR102091994B1 (ko) 층상 중합체 구조물 및 방법
US20160032148A1 (en) A method for making an optical assembly comprising depositing a solid silicone-containing hot melt composition in powder form and forming an encapsulant thereof
KR20140138311A (ko) 광 가이드 및 관련된 광 어셈블리
WO2020241369A1 (ja) 硬化性オルガノポリシロキサン組成物、及びその硬化物からなる光学部材
CN106433452A (zh) 硅树脂薄膜、可固化硅树脂组成物、光学半导体装置及其封装方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

FPAY Annual fee payment

Payment date: 20220615

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20230713

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20230713

R18 Changes to party contact information recorded

Free format text: ST27 STATUS EVENT CODE: A-5-5-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000