TWI584389B - Semiconductor device manufacturing method and manufacturing device - Google Patents
Semiconductor device manufacturing method and manufacturing device Download PDFInfo
- Publication number
- TWI584389B TWI584389B TW104123088A TW104123088A TWI584389B TW I584389 B TWI584389 B TW I584389B TW 104123088 A TW104123088 A TW 104123088A TW 104123088 A TW104123088 A TW 104123088A TW I584389 B TWI584389 B TW I584389B
- Authority
- TW
- Taiwan
- Prior art keywords
- mounting member
- bonding
- substrate
- adsorption
- position information
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims description 100
- 238000004519 manufacturing process Methods 0.000 title claims description 49
- 239000000758 substrate Substances 0.000 claims description 84
- 238000000034 method Methods 0.000 claims description 73
- 238000001179 sorption measurement Methods 0.000 claims description 63
- 230000008569 process Effects 0.000 claims description 54
- 238000007689 inspection Methods 0.000 claims description 32
- 238000005259 measurement Methods 0.000 claims description 19
- 238000001514 detection method Methods 0.000 claims description 17
- 238000004886 process control Methods 0.000 claims 1
- 230000007246 mechanism Effects 0.000 description 72
- 239000000853 adhesive Substances 0.000 description 30
- 230000001070 adhesive effect Effects 0.000 description 29
- 230000003287 optical effect Effects 0.000 description 26
- 230000002950 deficient Effects 0.000 description 12
- 238000005304 joining Methods 0.000 description 12
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 11
- 239000005304 optical glass Substances 0.000 description 11
- 238000004364 calculation method Methods 0.000 description 9
- 230000007547 defect Effects 0.000 description 9
- 238000006073 displacement reaction Methods 0.000 description 8
- 238000002834 transmittance Methods 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 7
- 238000001723 curing Methods 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 6
- 230000003595 spectral effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000010183 spectrum analysis Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Wire Bonding (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014216578A JP6128337B2 (ja) | 2014-10-23 | 2014-10-23 | 半導体装置の製造方法及び製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201622027A TW201622027A (zh) | 2016-06-16 |
| TWI584389B true TWI584389B (zh) | 2017-05-21 |
Family
ID=55831047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104123088A TWI584389B (zh) | 2014-10-23 | 2015-07-16 | Semiconductor device manufacturing method and manufacturing device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6128337B2 (enExample) |
| CN (1) | CN105551930B (enExample) |
| TW (1) | TWI584389B (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018200685A2 (en) | 2017-04-27 | 2018-11-01 | Ecosense Lighting Inc. | Methods and systems for an automated design, fulfillment, deployment and operation platform for lighting installations |
| CN106449489B (zh) * | 2016-12-01 | 2023-07-18 | 辽宁超粤激光科技集团有限公司 | 一种ld封装管的自动化生产设备 |
| JP6598811B2 (ja) * | 2017-03-23 | 2019-10-30 | Ｔｏｗａ株式会社 | 半導体パッケージ配置装置、製造装置、半導体パッケージの配置方法および電子部品の製造方法 |
| US10508971B2 (en) * | 2017-09-07 | 2019-12-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Optical test system and method for determining size of gap between two substrates of optical element |
| CN107734957A (zh) * | 2017-10-11 | 2018-02-23 | 广州煌牌自动设备有限公司 | 一种集成定位识别相机的贴片头部装置 |
| CN107734958A (zh) * | 2017-10-11 | 2018-02-23 | 广州煌牌自动设备有限公司 | 一种全透明的贴片机吸嘴 |
| JP7343891B2 (ja) * | 2019-06-07 | 2023-09-13 | 株式会社ブイ・テクノロジー | 貼り合わせ装置、貼り合わせ方法及び表示装置の製造方法 |
| JP7362313B2 (ja) * | 2019-06-28 | 2023-10-17 | キヤノン株式会社 | 電子部品および電子部品の製造方法および検査方法、機器 |
| DE102019209610A1 (de) * | 2019-07-01 | 2021-01-07 | Carl Zeiss Smt Gmbh | Verfahren und Vorrichtung zum Herstellen einer Klebeverbindung zwischen einer ersten Komponente und einer zweiten Komponente |
| JP7300353B2 (ja) * | 2019-09-13 | 2023-06-29 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
| WO2021084582A1 (ja) * | 2019-10-28 | 2021-05-06 | パナソニックＩｐマネジメント株式会社 | 真空貼合装置 |
| CN112967953B (zh) * | 2020-12-31 | 2023-09-08 | 深圳中科飞测科技股份有限公司 | 半导体处理设备的使用方法、半导体处理设备、及存储介质 |
| CN112858880A (zh) * | 2021-01-12 | 2021-05-28 | 安徽华为硕半导体科技有限公司 | 一种集成电路的测试装置 |
| JP7140930B1 (ja) * | 2022-03-07 | 2022-09-21 | Ckd株式会社 | 基板検査装置及び基板検査方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07113609A (ja) * | 1993-08-24 | 1995-05-02 | Nikon Corp | 干渉計 |
| TW527510B (en) * | 2000-04-19 | 2003-04-11 | Hitachi Ind Co Ltd | Substrate sticking device |
| US20050196897A1 (en) * | 2004-03-04 | 2005-09-08 | Olympus Corporation | Method and apparatus for joining semiconductor |
| TW200941614A (en) * | 2007-11-08 | 2009-10-01 | Ulvac Inc | Apparatus and method for manufacturing laminated substrate |
| TWI340230B (enExample) * | 2007-06-08 | 2011-04-11 | Shinkawa Kk | |
| TW201207974A (en) * | 2010-02-26 | 2012-02-16 | Tokyo Electron Ltd | Junction device |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0640576B2 (ja) * | 1984-02-01 | 1994-05-25 | 松下電器産業株式会社 | 固体撮像素子へのフイルタ−接着方法及びその装置 |
| JPH07113609B2 (ja) * | 1987-03-23 | 1995-12-06 | 石川島播磨重工業株式会社 | 接着不良部検出方法 |
| TW278212B (enExample) * | 1992-05-06 | 1996-06-11 | Sumitomo Electric Industries | |
| JP2002093858A (ja) * | 2000-09-14 | 2002-03-29 | Toray Eng Co Ltd | チップ実装装置及びそれにおけるキャリブレーション方法 |
| JP4119098B2 (ja) * | 2001-02-27 | 2008-07-16 | 芝浦メカトロニクス株式会社 | 部品保持ヘッド、及びそれを用いた部品実装装置並びに部品実装方法 |
| JP2004281626A (ja) * | 2003-03-14 | 2004-10-07 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法および固体撮像素子組立装置 |
| JP4476764B2 (ja) * | 2004-03-26 | 2010-06-09 | 富士フイルム株式会社 | 基板接合装置及び方法 |
| JP5682422B2 (ja) * | 2011-04-01 | 2015-03-11 | 株式会社デンソー | 有機ｅｌ装置およびその製造方法 |
| JP5959104B2 (ja) * | 2011-09-27 | 2016-08-02 | 芝浦メカトロニクス株式会社 | 貼り合せ板状体検査装置及び方法 |
| JP5879493B2 (ja) * | 2012-04-23 | 2016-03-08 | パナソニックＩｐマネジメント株式会社 | 電子部品搭載方法 |
-
2014
- 2014-10-23 JP JP2014216578A patent/JP6128337B2/ja active Active
-
2015
- 2015-07-16 TW TW104123088A patent/TWI584389B/zh active
- 2015-09-17 CN CN201510593549.0A patent/CN105551930B/zh active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07113609A (ja) * | 1993-08-24 | 1995-05-02 | Nikon Corp | 干渉計 |
| TW527510B (en) * | 2000-04-19 | 2003-04-11 | Hitachi Ind Co Ltd | Substrate sticking device |
| US20050196897A1 (en) * | 2004-03-04 | 2005-09-08 | Olympus Corporation | Method and apparatus for joining semiconductor |
| TWI340230B (enExample) * | 2007-06-08 | 2011-04-11 | Shinkawa Kk | |
| TW200941614A (en) * | 2007-11-08 | 2009-10-01 | Ulvac Inc | Apparatus and method for manufacturing laminated substrate |
| TW201207974A (en) * | 2010-02-26 | 2012-02-16 | Tokyo Electron Ltd | Junction device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105551930A (zh) | 2016-05-04 |
| TW201622027A (zh) | 2016-06-16 |
| JP6128337B2 (ja) | 2017-05-17 |
| CN105551930B (zh) | 2018-02-16 |
| JP2016086039A (ja) | 2016-05-19 |
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