200941614 九、發明說明： 【發明所屬之技術領域】 本發明係關於貼合基板製造裝置及貼合基板製造方法。 本申請案基於2007年11月8日於曰本申請之曰本特願 2007-290912號來主張優先權，於此引用其内容。 【先前技術】 . 液晶顯示器或電漿顯示器等平面面板顯示器（FPD)係含 有貼合2片基板之構造。例如液晶顯示器係以數μηι程度之 ® 間隔對向配置複數TFT(薄膜電晶體）形成矩陣狀之陣列基 板（TFT基板）、及形成有彩色濾光器或遮光膜等之彩色濾 光器基板（CF基板），於兩基板間封入液晶，並且以含光硬 化性樹脂之密封構件（接著劑將兩基板互相貼合而製 造。此外’該2片基板之貼合係於真空環境下進行，用以 防止不純氣體之混入等。 作為該類使2片基板貼合之裝置，據知有例如專利文獻i ❹ 之基板貼合裝置。專利文獻1之基板貼合裝置具備：真空 腔室，其係以上侧容器及下側容器所構成；上基板搬送治 具，其係用以使上基板移動；第一支持棒，其係用以使上 側容器上下移動；基座板，其係支持該支持棒；及第二支 持棒’其係用以使上基板搬送治具上下移動。 於上述基板貼合裝置，使第一支持棒往下方移動，上側 谷器與下側容器抵接而構成真空腔室，並且使第二支持棒 往下方移動，降下上基板搬送治具，使上基板與下基板對 向配置為特定間隔。其後，進行上基板與下基板之對準貼 135990.doc 200941614 合0 [專利文獻1]曰本特開2007-212572號公報 【發明内容】 [發明所欲解決之問題] 上述專利文獻1之貼合基板製造裝置係將處理室内抽取 • 真空後’進行上基板與下基板之對準，使該等2片基板貼 合。然而’於進行上基板與下基板之對準後，若藉由使基 座板所備有之第二支持棒移動來移動上基板搬送治具，則 ® 唯恐上基板與下基板之位置會相對地偏離。此係由於複數 構件介在基座板至下基板間，配置有下基板之下側容器與 第二支持棒所備有之基座板進行不同之運動所致β如此， 具有良率由於上基板與下基板之相對位置偏離而降低之問 題》 本發明係有鑑於上述事情所完成者，其所欲解決之問題 在於提供一種可提升2片基板之對準精度、提升良率之貼 φ 合基板製造裝置及貼合基板製造方法。 [解決問題之技術手段] 關於本發明之貼合基板製造裝置之特徵為：一面將上基 板與下基板對準一面貼合而製造貼合基板；且包含：基座 ，，其係載置前述下基板；支持棒，其係立設於該基座 部，及上加壓構件，其係可沿著該支持棒上下移動，且可 '、夺前述上基板，n纟使前述上加壓構件下％，以貼合由 ’述上加壓構件所保持之前述上基板與載置於前述基座部 之前述下基板。 135990.doc 200941614 根據上述貼合基板製造裝置，由於保持有上基板之上加 壓構件係由立設於載置有下基板之基座部之支持棒所導引 而上下移動，因此可將介在上基板與下基板間之構件數抑 制在最小限度。藉此，於進行上基板與下基板之對準後至 貼合為止之期間，可防止上基板與下基板之相對位置偏 離。其結果，因而有提升2片基板之對準精度、提升良率 之效果。 於前述上加壓構件及前述基座部之至少任一方，以圍繞 配置前述上基板或前述下基板之區域之方式設置有密封構 件；藉由使前述上加壓構件下降，以於前述密封構件、前 述上加壓構件及前述基座部間形成貼合處理室。 該情况下，由於能以上加壓構件、基座部及密封構件來 構成貼合處理室，因此可減少零件數。其結果，可將裝置 予以小型•輕量化。 進一步包含減壓機構，其係將前述貼合處理室之内部減 壓，藉由該減壓機構將前述貼合處理室減壓時，前述貼合 處理室由前述密封構件所密閉亦可。 該情況下，由於密封構件介裝於上加壓構件與基座部 間’將貼合處理室減壓時，可確實地密閉該貼合處理室。 因此，可4實地將貼合處理室減壓，可製造所需之貼合基 板。 前述基座部亦可包含：下基板吸附裝置，其係、一面吸附 前述下基板之一部分’―面使該下基板移動；及下基板浮 起吸附裝置’其係於藉由該下基板吸附裝置移動前述下基 135990.doc 200941614 板時，使該下基板浮起，並且於前述上基板與前述下基板 之貼合時，可吸附前述下基板之未由前述下基板吸附裝置 所吸附之部分。 該情況下，使上基板與下基板貼合時，可藉由下基板浮 起寻附裝置來使下基板吸附於基座部。因此，可防止下基 板之位置偏離^其結果，可精度良好地使上基板與下基板 貼合。而且，由於不另外需要用以載置下基板之台，因此 可減少介在基座部與下基板間之構件數。再者，若使下基 板吸附於基座部，則下基板吸附裝置及下基板浮起吸附裝 置不會露出於貼合處理室，因此可防止從各裝置所產生之 粒子等流入貼合處理室内。因此’可確保貼合處理室内之 潔淨度。 前述密封構件亦可包+:接合部，其係對於前述基座部 及前述上加壓構件之一方上下移動，構成前述貼合處理室 之壁部’及②、封件’其係設置於前述接合部，抵接於前述 基座部或前述上加壓構件以確保前述貼合處理室之氣密 性。 ’ 該情況下，由於接合部係對於基座部或上加壓構件上下 移動而構成貼合處理室之壁部，因此即使上加壓構件上 升’仍可將貼合處理室保持於㈣狀態。藉此，即使於分 離配置下基板與上基板以增大氣導之狀態仍可將貼合處 理室減壓，其結果可縮短減壓時間。 而且，關於本發明之貼合基板製造方法係於基座部栽置 下基板#由可沿著立設於前述基座部之支持棒上下移動 135990.doc 200941614 之上加壓構件來保持上基板，一面將前述下基板與前述上 基板對準一面貼合而製造貼合基板；且包含以下步稀：第 一下基板移動步驟，其係藉由設置於前述基座部之下基板 吸附裝置一面吸附前述下基板之一部分，一面使該下基板 從前述基座部分離，並且藉由設置於前述基座部之下基板 浮起吸附裝置使前述下基板浮起；上基板移動步驟其係 使前述上加壓構件下降，使前述下基板與前述上基板對向 配置為特定間隔；基板對準步驟，其係藉由前述下基板吸 附裝置使前述下基板移動，進行前述下基板與前述上基板 之對準；上加壓構件上升步驟，其係使前述上加壓構件上 升，將前述下基板與前述上基板配置為離開特定距離；處 理室形成步驟，其係藉由密封構件密閉前述上加壓構件與 前述基座部間，形成收容前述上基板及前述下基板之貼合 處理室；第二下基板移動步驟，其係藉由前述下基板吸附 裝置一面吸附前述下基板之一部分，一面使該下基板抵接 於前述基座部，並且藉由前述下基板浮起吸附裝置吸附前 述下基板之未由前述下基板吸附裝置所吸附之部分；減壓 步驟’其係將前述貼合處理室内減壓；及基板貼合步驟， 其係於密閉前述貼合處理室内之狀態，使前述上加壓構件 下降以貼合前述下基板與前述上基板。 根據上述貼合基板製造方法，由於保持有上基板之上加 壓構件係由立設於載置有下基板之基座部之支持棒所導引 而上下移動，因此可將介在上基板與下基板間之構件數抑 制在最小限度。藉此’於進行上基板與下基板之對準後至 135990.doc •12· 200941614 貼合為止之期間’可防止上基板與下基板之位置關係偏 離。因此’可提升2片基板之對準精度、提升良率。 而且’使上加壓構件上升，將下基板與上基板配置為離 開特疋距離後’對貼合處理室進行減壓，因此可於氣導大 之狀態下減壓。藉此，可縮短減壓時間。 再者，使上基板與下基板貼合時，可藉由下基板浮起吸 . 附裝置來使下基板吸附於基座部。因此，可防止下基板之 位置偏離，可精度良好地使上基板與下基板貼合。而且， 由於不另外需要用以載置下基板之台，因此可減少介在基 座部與下基板間之構件數。再者，若使下基板吸附於基座 部，則下基板吸附裝置及下基板浮起吸附裝置不會露出於 貼合處理室，因此可防止從各裝置所產生之粒子等流入貼 合處理室内。因此，可於確保貼合處理室内之潔淨度之狀 態下’使上基板與下基板貼合。 [發明之效果] 參 由於保持上基板之上加壓構件係由立設於載置有下基板 之基座部之支持棒所導引而上下移動，因此可將介在上基 板與下基板間之構件數抑制在最小限度。 藉此’於進行上基板與下基板之對準後至貼合為止之期 間’可防止上基板與下基板之位置關係偏離。因此，具有 提升2片基板之對準精度、提升良率之效果。 【實施方式】 (第一實施型態）（貼合基板製造裝置） 根據圖1〜圖12來說明關於本發明之第一實施型態之貼合 135990.doc •13· 200941614 基板製造裝置。 圖1為貼合基板製造裝置之正面概略圖；圖2係沿著圖1 之A-A線之剖面圖。如圖1及圖2所示，貼合基板製造裝置 10具備：基座部11，其係載置下基板W1 ;支持棒13，其 係從基座部11立設；及上加壓構件15，其係由支持棒13所 支持，可沿著支持棒13上下移動而構成，且可保持上基板 W2而構成。 基座部11具有剛性’大致形成直方體形狀。基座部丨i係 於其下面21之四角設有腳22而載置於地板。另一方面，基 座部11之上面23係於俯視看來形成長方形，可載置下基板 W1 ^於上面23之俯視看來大致中央部，設有使下基板％1 往上下方向、正交2轴水平方向及水平旋轉方向（以下稱水 平面内方向）移動之驅動台25。 驅動台25配置於形成在基座部11之上面23之凹部24内》 驅動台25係以俯視看來大致圓形所形成’驅動台25之内部 形成空洞28。空洞28之天頂面形成複數空氣孔27,而且空 洞28係與設在其下方之排氣管29連接。排氣管29係貫通基 座部11而從下面21延伸而出，並與未圖示之排氣泵連接。 總言之’若於下基板W1載置於驅動台25上之狀態下，使 排氣泵可動，則可經由空氣孔27來使下基板W1吸附於驅 動台25。此外，於排氣管29之中途設有閥3 0，可調整排氣 量。而且，驅動台25之表面26係於通常時（非驅動時），配 置為與基座部11之上面23齊平面。 而且，於驅動台25之下方，設有用以使驅動台25往水平 135990.doc -14- 200941614 面内方向移動之第一移動裝置31。於第一移動裝置3ι之下 方，設有用以使驅動台25往上下方向移動之第2移動裝置 32第移動裝置31及第二移動裝置32之驅動方法並未特 別限定。於本實施型態’ ^移動裝置31係構成為利用致 動器機構，使其往水平面内方向移動；第二移動裝置”係 構成為藉由移動楔形狀之構件，來使驅動台25往上下方向 移動。 接著，於基座部11之上面23之與下基板W1之俯視尺寸 相對應之位置，設有複數（本實施型態為14個）氣墊35。氣 塾35配置於形成在基座部η之上面23之凹部36内。氣墊 係以俯視看來大致圓形所形成，氣墊35之内部形成空洞 39。空洞39之天頂面形成複數空氣孔38，而且空洞外係與 設在其下方之供氣排氣管40連接。供氣排氣管4〇係貫通基 座部11而從下面21延伸而出，並與未圖示之供氣排氣泵連 接。總5之，右於下基板W1載置於基座部11上之狀態 下，對氣墊35供氣’則空氣從空氣孔38朝向下基板臂丨喷 出，可使下基板W1浮起。另一方面，若於下基板wi載置 於基座部11上之狀態下，從氣墊35排氣，則可經由空氣孔 38來使下基板W1吸附於基座部11 ^此外，於供氣排氣管 40之中途設有閥41，可調整供氣排氣量。氣墊35之表面37 係配置為與基座部11之上面23齊平面。 而且，於基座部11之上面23未配置有驅動台25及氣墊35 之處，設有複數（本實施型態為24個）抬升銷45。抬升銷45 係於通常時，較基座部11之上面23配置於下方。而且，從 135990.doc •15- 200941614 未圖示之其他裝置交付下基板wi至貼合基板製造裝置10 時，抬升銷45上升’可從未圖示之機器人手臂收取下基板 W1。然後’收取下基板wi後，藉由使抬升銷45下降，可 將下基板W1載置於基座部11之上面23。而且，基板之貼 合處理完成後交付基板至其他裝置時，使抬升銷45上升以 使貼合基板W3從基座部11之上面23分離，可於該間隙插 入機器人手臂，搬送貼合基板W3。 而且，於基座部11之上面23形成有排氣口47。排氣口47 連接於貫通基座部11之排氣管48。排氣管48連接於安裝在 基座部11之下面21之真空泵49。 而且’於基座部11之上面23，以包圍上述驅動台25、氣 墊35、抬升銷45及排氣口 47之方式形成有凹部51。凹部51 係於俯視看來形成矩形狀。於俯視看來，沿著凹部51之内 周緣遍及全周形成有壁部53。壁部53之高度小於丁基板 W1及上基板W2之合計厚度。 圖3為圖1之B部放大圖。如圖3所示，於凹部51設有密封 構件55。密封構件55具備：管56，其係配置於凹部51之下 方’例如為橡膠製；及接合部57，其係配置於管56之上 方。藉由變動擴縮管56之空氣壓，接合部57可沿著凹部51 之側面60上下移動而追隨上加壓構件15之運動。接合部57 之上面58係較基座部11之上面23位於上方。而且，於接合 部57之上面58，設有密閉與上加壓構件15間之密封件52。 進一步於接合部57之側面59與基座部11之凹部5 1之側面60 間，設有密閉兩者間之密封件61。藉此，以基座部1丨、上 135990.doc -16 - 200941614 加壓構件15及密封構件55來構成腔室17。而且，壁部53係 支持接合部57’以便在將腔室17内抽取真空時，接合部57 不會往腔室17側倒下。 回到圖2，於凹部51之外侧，在基座部π之上面23立設 有支持棒13。支持棒13立設於基座部11之四角。而且，於 基座部11之上面23之短邊方向大致中間部之支持棒13間， 立設有驅動轴65。 驅動轴65具備：驅動源66 ’其係由安裝於基座部11之馬 達等所組成；及單側2支軸部67，其係按照來自驅動源66 之指示而上下移動。總言之，於基座部丨1，立設有4支支 持棒13及4支驅動轴65。此外，為了便於說明，圖丨係於右 侧圖示支持棒13，於左侧圖示驅動轴65。 例如驅動轴65係構成如轴部67藉由來自驅動源66之驅動 力而旋轉。於軸部67形成有公螺紋85。該公螺紋85係構成 為藉由轴部67旋轉而螺合於形成在基座部^之母螺紋％， 轴部67藉此而上升/下降》 於支持棒13之上方設有上加壓構件15。上加壓構件15係 於俯視看來，以與基座部11大致同一大小之長方形形成。 於俯視看來，於上加壓構件15之四角，在對應於支持棒13 之位置形成支持棒13可插通之貫通孔71 ^於貫通孔η之下 方配置導引導件83，其係為使上加壓構件15沿著支持棒13 往垂直方向升降。而且，於上加壓構件15之下面之對應於 驅動軸65之位置，設有加載單元69〇加載單元的之受壓面 (下面）與軸部_67之刖端部68係配置為該等鄰接。 135990.doc 17 200941614 於上加壓構件15之下面之對應於支持棒13之位置（短邊 方向之兩側部72)與其以外之位置間，形成有階差部73。 兩側Τ»卩72係形成如對於基座部11，較階差部η位於 遠處。於較兩側部72接近基座部u之位置，形成保持上基 板W2之保持面75。保持面乃之周緣部乃係形成如於俯視 看來’位於基座部11之凹部51之外側。 而且，於保持面75之保持有上基板臂2之位置，設有複 ㈣電炎頭部77。靜電夾頭部77之表面配置為與保持面乃 齊平面。而且，保持面75之未配置有靜電夾頭部77之處， 設有複數保持銷79。保持銷79係於其前端設有空氣吸入 口，可吸附保持上基板W2。保持銷79係於通常時較保持 面75配置於上方。從未圖示之其他裝置交付上基板貿2至 貼合基板製造裝置1〇時，保持銷79下降，可從未圖示之機 器人手臂收取上基板W2。收取上基板|2後，使保持銷79 上升，同時使靜電夾頭部77發揮功能，藉此可將上基板 W2保持於保持面75。 ❹ 進一步而言，於保持面75之保持有上基板W2之任意位 置（宜為上基板W2之周緣部附近），形成進行與下基板wi 之對準時所用之相機80之攝影部81β於攝影部81，形成貫 通上加壓構件15之貫通孔即相機配置部82。總言之，於相 機配置部82裝設相機80,以相機8〇透過攝影部_拍攝下 基板W1與上基板W2之對準標記M1、m，可檢測對準標 記ΜΙ、M2之偏離。 而且’設有未圖示之控制部，其係以相機8〇所拍攝到之 135990.doc •18· 200941614 結果為基礎，用以對於第一移動裝置31指示水平面内方 之移動量。 (作用） 接著，利用圖4〜圖U來說明用貼合基板製造裝置ι〇製造 貼合基板之順序。此外，圖4〜圖1G係表示利用貼合基板製 造裝置來製造貼合基板之過程之說明圖；_係表示製造 貼合基板之過程之流程圖。此外，後述各㈣號碼係對應 於圖11之步驟號碼。 首先，如圖4所示，貼合基板製造裝置1〇之上加壓構件 1 5係保持為位在其最高位之狀態。 於步驟Si，於該狀態下，藉由機器人手臂搬入下基板 W1，下基板之具體搬入方法表示於步驟以後。 於步驟S2,將未圖示之機器人手臂所搬送而來之下基板 wi配置於基座部u之上方。於此，使抬升銷45上升以 使下基板W1從機器人手臂浮起。 於步驟S3 ’使機器人手臂從腔室17内退避。 於步驟S4,使抬升銷45下降，將下基板W1載置於基座 部11之上面23。 於步驟S5，藉由從排氣管29排氣，使下基板W1吸附於 驅動台25 » 於步驟S6’驅動設於基座部η之第二移動裝置32，使驅 動台25往上方移動。 於步驟S7 ’與步驟S6大致同時對於氣墊35供氣，從空氣 孔38朝向下基板W1喷出空氣。如此一來，下基板|丨係由 135990.doc •19- 200941614 驅動台25抬起大致中央部，並進—步藉由氣塾取作用， 下基板wi之周緣部浮起。如此，將下基板Wl保持為水平 狀態（第一下基板移動步驟）。此時，下基板冒丨係從基座部 11之上面23浮起數十μηι程度。 於步驟S8,將未圖示之機器人手臂所搬送而來之上基板 W2 ’配置於上加壓構件丨5之保持面75之下方。 於步驟S9 ’使保持銷79下降以吸附上基板W2。 於步驟S10，使機器人手臂從腔室17内退避。 於步驟S11，使保持銷79上升。 於步驟S12 ’使靜電夾頭部77發揮功能，將上基板％2吸 附於保持面75。圖5係完成至上述步驟S12時之說明圖。 此外，步驟S1〜S5之搬入下基板W1之步驟與步驟S8〜S12 之搬入上基板W2之步驟係何者為先均可。其中，由於上 基板W2有從吸附銷57落下之虞，因此藉由先準行上基板 W2之搬入，可防止上基板W2落下所造成之影響殃及下基 板W1。特別於製造液晶面板之情況時，由於下基板W1之 上面塗布有液晶，因此宜先進行上基板W2之搬入。 接著，於步驟S13，如圖6所示，於下基板W1保持水平 之狀態下，驅動驅動軸65，使上加壓構件15朝向基座部 11(下基板W1)下降（上基板移動步驟）。此時’按照來自驅 動源66之指示，轴部67旋轉，軸部67藉此下降。由於上加 壓構件15係由轴部67所支持’因此會同時下降。而且’由 於支持棒13插通於上加壓構件15之四角之導引導件83，因 此上加壓構件15係原樣保持水平狀態而下降。然後，使上 135990.doc • 20· 200941614 加壓構件15下降至下基板W〗與上基板W2間成為特定間 隔。 於步驟S14，如圖7所示，若下基板W1與上基板臂2間成 為特定間隔（數百μιη程度），則相機8〇動作，於下基板W1 及上基板W2之對準標記Ml、M2依序對焦點拍攝。然後， 將下基板W1往水平面内方向移動，以使分別之對準標記 . 一致（基板對準步驟）。此時，以對準標記之偏離量為基 礎，驅動第一移動裝置31以使驅動台25往水平面内方向移 霸 動’將下基板W1移動至適當位置。 此外，於進行該下基板W1與上基板W2之對準時，保持 面75與密封構件55之接合部57抵接。總言之，構成由基座 部11、上加壓構件15及密封構件55所密閉封住之腔室 17(處理室形成步驟）^具體而言，若上加壓構件15按壓接 合部57,則接合部57按壓管56〇於管56連接有未圖示之釋 放閥，因此於内壓保持為一定之狀態下，管56收縮。藉 0 此，可防止官56之破損，同時維持上加壓構件15與接合部 57之密閉狀態。 於步驟S15,如圖8所示，若下基板W1與上基板W2之對 準完成’使下基板W1之驅動台25下降，並且停止氣墊35 之供氣’使下基板wi下降至基座部u之上面23。然後， 從氣墊35排氣，使下基板W1吸附於上面23以使位置不偏 離（第二下基板移動步驟）^其後，稍微使上加壓構件15往 上方移動（上加壓構件上升步驟）。如此，較對準時增長下 基板W1與上基板W2之距離。此係為了於其後所進行之腔 135990.doc •21· 200941614 室17内之真空抽取時’增大氣導’縮短真空抽取時間，並 且確實將基板Wl、W2間之空氣排氣。因此，即使稍微將 上加壓構件15往上方移動時，仍調整為保持面75與接合部 57確實地抵接。 具體而言’與上述相反，於内壓保持一定之狀態下，管 56膨脹，可維持上加壓構件15與接合部57之密閉狀態。總 言之’藉由調整密封構件55之管56之空氣壓，來調整接合 _ 部57之上面58之位置。而且，即使升降接合部57，仍藉由 密封件61保持腔室17内之氣密性。此外，使上加壓構件15 上升後再使下基板W1下降至基座部11之上面23亦可。而 且於上加壓構件上升步驟後實施處理室形成步驟亦可。 於步驟S16’使真空泵49稼動’從排氣口 47將腔室17内 部予以排氣（減壓步驟然後，將腔室17内保持於真空狀 態（約0_4 Pa以下）。 於步驟S17’腔室17内之真空抽取完成後，再度降下上 | 加壓構件15。 於步驟S18,如圖9所示，使下基板W1與上基板W2貼合 (基板貼合步驟）。此時，藉由上加壓構件15之自重之一部 刀’於兩基板Wl、W2加壓。於此，藉由設置於軸部67之 前端部68與上加壓構件15之兩側部72間之加載單元69，一 面檢出作用於兩基板Wl、W2之荷重，一面調整為以適當 荷重貼合基板。 於步驟S19，如圖10所示，若下基板W1與上基板W2之 貼合完成，使上加壓構件15上升。此時，使貼合基板W3 135990.doc -22- 200941614 配置於基座部11上。總言之，解除上加壓構件15之靜電夾 頭部77之功能，使上基板W2從上加壓構件15分離》 於步驟S20，使基座部11之抬升銷45上升，以使貼合基 板W3從上面23上升。 於步驟S21 ’於貼合基板W3與基座部11之上面23之間 • 隙，插入機器人手臂，從抬升銷45交付貼合基板W3至機 器人手臂。然後，機器人手臂將貼合基板W3搬送至未圖 示之其他裝置，完成處理。 ❹ 若根據本實施型態’於一面將上基板W2與下基板W1對 準一面貼合，以製造貼合基板W3之貼合基板製造裝置 10’其具備：基座部11，其係載置下基板W1 ;支持棒 13 ’其係立設於基座部丨丨；及上加壓構件15，其係可沿著 支持棒13上下移動’且構成為可保持上基板W2;且藉由 使上加壓構件15下降’以貼合上基板评2與下基板W1。 因此’由於保持上基板W2之上加壓構件15係由立設於 φ 載置有下基板评1之基座部Π之支持棒13所導引而上下移 動。總言之，將介在上基板冒2與下基板贾丨間之構件數抑 制在最小限度。藉此，於進行上基板琛2與下基板|丨之對 準後至貼合為止之期間，可防止上基板貨2與下基板之 相對位置偏離。因此，可提升2片基板W1、12之對準精 度、提升良率》 而且，於關於本實施型態之貼合基板製造裝置1〇，於基 座部11，以圍繞下基板西丨之配置區域之方式設置有密封 構件5 5，藉由使上加壓構件〗5下降以於密封構件Η、上 135990.doc •23· 200941614 加壓構件15及基座部11間形成腔室17。 因此，能以上加壓構件15、基座部11及密封構件55來構 成腔室17’可減少零件數。因此，可將裝置予以小型•輕 量化。 而且’關於本實施型態之貼合基板製造裝置1〇進一步具 備真空泵49，其係將腔室17之内部減壓；藉由真空泵49進 行腔室17之減壓時，腔室17係由密封構件55所密閉。 如此，藉由密封構件55介裝於上加壓構件15與基座部11 間’將腔室17減壓時’可確實地密閉腔室17。因此，可確 實地將腔室17減壓，可製造所需之貼合基板W3。 進一步而言’於基座部11設有：驅動台25，其係一面吸 附下基板W1之一部分’ 一面使下基板wi移動；及氣塾 35，其係於藉由驅動台25移動下基板W1時，使下基板W1 浮起’並且於上基板W2與下基板W1之貼合時，可吸附下 基板W1。 因此’使上基板W2與下基板W1貼合時，可藉由氣塾35 來使下基板W1吸附於基座部11。因此，可防止不基板界1 之位置偏離，具有可精度良好地使上基板W2與下基板W1 貼合之效果。而且，由於不另外需要用以載置下基板W1 之台，因此可減少介在基座部11與下基板W1間之零件 數。進一步而言’若使下基板W1吸附於基座部丨丨，則驅 動台25及氣墊35不會露出於腔室17，因此可防止從各裝置 所發生之粒子等流入腔室17内。因此，可確保腔室17内之 潔淨度。 135990.doc • 24- 200941614 然後，密封構件55具備：接合部57，其係對於基座部11 上下移動，構成腔室17之壁部；及密封件52，其係設置於 接合部57，抵接於上加壓構件15以確保腔室17之氣密性。 因此，接合部57係對於基座部11上下移動而構成腔室17 之壁部，即使上加壓構件15上升，仍可建構密閉之腔室 17。藉此，即使於分離配置下基板W1與上基板贾2以增大 氣導之狀態，仍可將腔室17内減壓，可縮短減壓時間。 此外’於圖12表示本實施型態之密封構件55之其他態 樣。如圖12所示，密封構件255設置於凹部51，具備形成 於凹部51之下方之空氣供給部256、及配置於空氣供給部 25 6之上方之接合部57。藉由變動空氣供給部256之空氣 壓，接合部57可沿著凹部51之側面60上下移動，可追隨上 加壓構件15之運動、接合部57之上面58係較基座部11之上 面23位於上方。 而且，於接合部57之上面58,設有密閉與上加壓構件15 間之密封件52。進一步於接合部57之側面59與基座部11之 凹部5 1之側面60間，設有2處密閉兩者間之密封件6 1。於 該密封件61、61間之空間部263，連接與外部（大氣）連通之 未圖示之連通管。藉此，可減輕對於密封件61之壓力負 載。而且，於設有密封件61之相反側，設有遮斷空氣供給 部256與外部（大氣）間之密封件262。 藉此，密封構件255可獲得與上述密封構件55大致同一 作用效果。 (第二實施型態） 135990.doc -25- 200941614 接著’根據圖13來說明關於本發明之第二實施型態之貼 合基板製造裝置。此外，本實施型態係與第一實施型態僅 有密封構件之結構不同，關於其他結構大致相同，因此於 同一處附以同一符號，並省略詳細說明。 圖13為密封構件之結構圖。如圖13所示，密封構件ι55 設置於上加壓構件15側。具體而言，於上加壓構件15之保 持面75形成有凹部15ι。凹部ι51係形成於與第一實施型態 之凹部51大致相對向之位置。 於凹部151設有密封構件155。密封構件155具備：彈簧 156’其係配置於凹部151之底部；及接合部157，其係配 置於彈簧156之上方。藉由彈簧156收縮，接合部157進行 上下移動。而且，於接合部157之前端面162設有密封件 164。進一步於接合部157之側面159與凹部151之側面160 間’設有側密封件161。從凹部151之侧面160朝向接合部 157之侧面159立設止動器165，以使接合部157不會從凹部 151落下。藉此，能以基座部u、上加壓構件15及密封構 件155來構成腔室17。 (作用） 使基板貼合前（裝置之初始狀態），接合部157係以彈簧 156之施力及自重而往下方垂下，並由止動器π所扣止。 若為了使基板貼合而使上加壓構件15下降，則上基板W2 會同時下降。如此一來，接合部157之密封件164抵接於基 座部1 1之上面23，以基座部11、上加壓構件15及密封構件 155構成腔室17。其後，若進一步使上加壓構件15下降， 135990.doc • 26- 200941614 則彈簧156收縮，將接合部157收納於凹部151内。其後， 即使使上加壓構件15稍微升降，彈簧156之施力發揮作 用’仍可將密封件164與基座部11之上面23保持抵接狀 態。 因此，於基板Wl、W2之貼合時，可確實地構成腔室 I7，可製造所需之貼合基板W3。 此外’為了以機器人手臂，從腔室17取放上基板W2及 貼合基板W3 ’密封構件155配置為不構成妨礙。而且，若 接合部157可僅藉由自重往下方移動，則於密封構件155不 設置彈著156亦可。該情況下，由於不需要接合部157之升 降機構，因此可減少零件數，其結果不花費用即可製作裝 置。而且’於基板取放時，由於有機器人手臂之取放，因 此上加壓構件15上升至接合部157不構成妨礙之程度。 此外，本發明之技術範圍不限定於上述實施型態，於不 脫離本發明之旨趣之範圍内，包含上述實施型態加入有各 種變更者。亦即’實施型態所舉出之具體形狀或結構等只 不過為一例’可予以適宜地變更。 例如於本實施型態雖說明採用管或彈簧，用以使接合部 上下移動之情況’但利用致動器等亦可。 而且，於本實施型態雖說明於上加壓構件設置相機之情 況，但設置於基座部亦可。 [產業上之可利用性] 可提供一種可提升2片基板之對準精度、提升良率之贴 合基板製造裝置及貼合基板製造方法。 135990.doc -27· 200941614 【圖式簡單說明】 圖1係關於本發明之第一實施型態之貼合基板製造裝置 之正面概略圖。 圖2係沿著圖1之A-A線之剖面圖。 圖3為圖1之b部放大圖。 圖4係表示利用關於同實施型態之貼合基板製造裝置來 製造貼合基板之過程之說明圖（1)。 圖5係表示利用關於同實施型態之貼合基板製造裝置來 製造貼合基板之過程之說明圖（2)。 圖6係表示利用關於同實施型態之貼合基板製造裝置來 製造貼合基板之過程之說明圖（3)。 圖7係表示利用關於同實施型態之貼合基板製造裝置來 製造貼合基板之過程之說明圖（4)。 圖8係表示利用關於同實施型態之貼合基板製造裝置來 製造貼合基板之過程之說明圖（5)。 圖9係表示利用關於同實施型態之貼合基板製造裝置來 製造貼合基板之過程之說明圖（6)。 圖1〇係表示利用關於同實施型態之貼合基板製造裝置來 製造貼合基板之過程之說明圖（7)。 圖11係表示製造關於同實施型態之貼合基板之過程之流 程圖。 圖12係表示關於同實施型態之密封構件之其他態樣之結 構圖。 圖13係關於本發明之第二實施型態之密封構件之結構 135990.doc -28 - 200941614 圖。 【主要元件符號說明】 ίο 貼合基板製造裝置 11 基座部 13 支持棒 15 上加壓構件 17 腔體腔室（貼合處理室） 25 驅動台（下基板吸著吸附裝置） ❿ 35 氣墊（下基板浮起吸著吸附裝置） 49 真空泵（減壓設備機構） 52 密封墊密封件 55 密封構件 56 管（擴縮構件） 57 接合部 W1 下基板 W2 上基板 擊 W3 貼合基板 135990.doc -29·200941614 IX. Description of the Invention: TECHNICAL FIELD The present invention relates to a bonded substrate manufacturing apparatus and a bonded substrate manufacturing method. The present application claims priority based on Japanese Patent Application No. 2007-290912, the entire disclosure of which is incorporated herein. [Prior Art]. A flat panel display (FPD) such as a liquid crystal display or a plasma display includes a structure in which two substrates are bonded. For example, a liquid crystal display is a matrix substrate (TFT substrate) in which a plurality of TFTs (thin film transistors) are arranged to face each other at a level of several μm, and a color filter substrate on which a color filter or a light shielding film is formed ( In the CF substrate, a liquid crystal is sealed between the two substrates, and a sealing member containing a photocurable resin is used (the adhesive is used to bond the two substrates to each other. The bonding of the two substrates is performed in a vacuum environment, and the like) In order to prevent the incorporation of impure gas, etc., as a device for bonding two substrates, there is known a substrate bonding apparatus of Patent Document 1. The substrate bonding apparatus of Patent Document 1 includes a vacuum chamber. The upper substrate and the lower container are configured; the upper substrate transporting fixture is configured to move the upper substrate; the first support rod is configured to move the upper container up and down; and the base plate supports the support rod And a second support bar for moving the upper substrate transporting fixture up and down. In the substrate bonding apparatus, the first support bar is moved downward, and the upper side bar is abutted against the lower container. The vacuum chamber is opened, and the second support rod is moved downward, and the upper substrate is conveyed to lower the workpiece, so that the upper substrate and the lower substrate are opposed to each other at a specific interval. Thereafter, the alignment between the upper substrate and the lower substrate is performed. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2007-212572 [Drafts of the Invention] [Problems to be Solved by the Invention] The laminated substrate manufacturing apparatus of Patent Document 1 is obtained by extracting a treatment chamber and vacuuming The upper substrate and the lower substrate are aligned to bond the two substrates. However, after the alignment between the upper substrate and the lower substrate, if the upper substrate transporting jig is moved by moving the second support bar provided on the base plate, the position of the upper substrate and the lower substrate is opposed to each other. Deviate from the ground. This is because the plurality of members are disposed between the base plate and the lower substrate, and the bottom plate of the lower substrate and the base plate provided by the second support bar are arranged to perform different movements, so that the yield is due to the upper substrate and The problem that the relative position of the lower substrate is deviated and reduced. The present invention has been made in view of the above, and the problem to be solved is to provide a φ-bonded substrate which can improve the alignment accuracy and improve the yield of two substrates. Device and method of manufacturing a bonded substrate. [Means for Solving the Problem] The laminated substrate manufacturing apparatus of the present invention is characterized in that a bonded substrate is bonded while the upper substrate and the lower substrate are aligned with each other, and a pedestal is mounted thereon. a lower substrate; a support rod erected on the base portion, and an upper pressing member movable up and down along the support rod, and staking the upper substrate to nraw the upper pressing member The lower portion is bonded to the upper substrate held by the pressing member and the lower substrate placed on the base portion. 135990. Doc 200941614 According to the above-described bonded substrate manufacturing apparatus, since the pressing member on the upper substrate is held up and down by the support rod standing on the base portion on which the lower substrate is placed, it can be placed on the upper substrate. The number of members between the lower substrate and the lower substrate is suppressed to a minimum. Thereby, the relative position of the upper substrate and the lower substrate can be prevented from being deviated during the alignment between the upper substrate and the lower substrate and after bonding. As a result, there is an effect of improving the alignment accuracy of the two substrates and improving the yield. At least one of the upper pressing member and the base portion is provided with a sealing member so as to surround a region where the upper substrate or the lower substrate is disposed; and the upper pressing member is lowered to form the sealing member A bonding processing chamber is formed between the upper pressing member and the base portion. In this case, since the bonding processing chamber can be configured by the above pressing member, the base portion, and the sealing member, the number of parts can be reduced. As a result, the device can be reduced in size and weight. Further, the pressure reducing mechanism is configured to reduce the pressure inside the bonding processing chamber, and when the pressure reducing mechanism decompresses the bonding processing chamber, the bonding processing chamber may be sealed by the sealing member. In this case, when the sealing member is interposed between the upper pressing member and the base portion to decompress the bonding processing chamber, the bonding processing chamber can be reliably sealed. Therefore, the bonding processing chamber can be decompressed in a practical manner to manufacture a desired bonding substrate. The base portion may further include: a lower substrate adsorption device that adsorbs one of the lower substrate on one side to move the lower substrate; and a lower substrate floating adsorption device that is attached to the lower substrate adsorption device Move the aforementioned lower base 135990. In the case of the doc 200941614, the lower substrate is floated, and when the upper substrate and the lower substrate are bonded together, the portion of the lower substrate that is not adsorbed by the lower substrate adsorption device can be adsorbed. In this case, when the upper substrate and the lower substrate are bonded together, the lower substrate can be attracted to the base portion by the lower substrate floating the seek device. Therefore, it is possible to prevent the position of the lower substrate from being deviated, and as a result, the upper substrate and the lower substrate can be bonded with high precision. Further, since the stage for placing the lower substrate is not separately required, the number of members interposed between the base portion and the lower substrate can be reduced. Further, when the lower substrate is adsorbed to the base portion, the lower substrate adsorption device and the lower substrate floating adsorption device are not exposed to the bonding processing chamber, so that particles or the like generated from the respective devices can be prevented from flowing into the bonding processing chamber. . Therefore, it is possible to ensure the cleanliness of the processing chamber. The sealing member may include a joint portion that moves up and down one of the base portion and the upper pressing member, and the wall portion 'and the second member that constitutes the bonding processing chamber are provided in the foregoing The joint portion abuts against the base portion or the upper pressing member to ensure airtightness of the bonding processing chamber. In this case, since the joint portion moves up and down with respect to the base portion or the upper pressing member to constitute the wall portion of the bonding processing chamber, the bonding processing chamber can be held in the (four) state even if the upper pressing member is raised. Thereby, even if the substrate and the upper substrate are separated from each other to increase the air conduction state, the bonding processing chamber can be decompressed, and as a result, the decompression time can be shortened. Further, the method for manufacturing a bonded substrate according to the present invention is that the substrate is placed on the base portion. The substrate # is movable up and down along a support bar that is erected on the base portion. Doc 200941614 The upper pressing member holds the upper substrate, and the lower substrate is bonded to the upper substrate to form a bonded substrate; and the following steps are performed: a first lower substrate moving step, which is set by The substrate adsorbing device adsorbs one of the lower substrates on the lower surface of the base portion, and separates the lower substrate from the base portion, and the lower substrate is suspended by the substrate floating device disposed under the base portion. Floating; the upper substrate moving step of lowering the upper pressing member to face the lower substrate and the upper substrate at a specific interval; and the substrate aligning step of the lower substrate by the lower substrate adsorbing device Moving, performing alignment of the lower substrate and the upper substrate; and an upper pressing member ascending step of raising the upper pressing member to dispose the lower substrate and the upper substrate at a specific distance; and processing a chamber forming step Separating the upper pressing member from the base portion by a sealing member to form a fitting for accommodating the upper substrate and the lower substrate a second lower substrate moving step of abutting the lower substrate against the base portion while the lower substrate adsorbing device adsorbs one of the lower substrates, and the lower substrate floating adsorption device a portion of the lower substrate that is not adsorbed by the lower substrate adsorption device; a depressurization step of decompressing the bonding chamber; and a substrate bonding step of sealing the bonding chamber The upper pressing member is lowered to bond the lower substrate and the upper substrate. According to the method of manufacturing a bonded substrate, since the pressing member on the upper substrate is held up and down by the support rod standing on the base portion on which the lower substrate is placed, the upper substrate and the lower substrate can be placed. The number of members between the substrates is suppressed to a minimum. By this, the alignment between the upper substrate and the lower substrate is performed until 135990. Doc •12· 200941614 The period until the bonding can prevent the positional relationship between the upper substrate and the lower substrate from deviating. Therefore, the alignment accuracy of the two substrates can be improved and the yield can be improved. Further, when the upper pressing member is raised and the lower substrate and the upper substrate are disposed apart from each other, the bonding processing chamber is depressurized, so that the pressure can be reduced in a state where the air conduction is large. Thereby, the decompression time can be shortened. Furthermore, when the upper substrate and the lower substrate are bonded together, the lower substrate can be floated and sucked up. A device is attached to adsorb the lower substrate to the base portion. Therefore, the positional deviation of the lower substrate can be prevented, and the upper substrate and the lower substrate can be bonded with high precision. Further, since the stage for placing the lower substrate is not separately required, the number of members interposed between the base portion and the lower substrate can be reduced. Further, when the lower substrate is adsorbed to the base portion, the lower substrate adsorption device and the lower substrate floating adsorption device are not exposed to the bonding processing chamber, so that particles or the like generated from the respective devices can be prevented from flowing into the bonding processing chamber. . Therefore, the upper substrate and the lower substrate can be bonded together while ensuring the cleanliness in the bonding processing chamber. [Effects of the Invention] Since the pressing member on the upper substrate is held up and down by the support rod standing on the base portion on which the lower substrate is placed, it can be interposed between the upper substrate and the lower substrate. The number of components is suppressed to a minimum. Thereby, the positional relationship between the upper substrate and the lower substrate can be prevented from deviating from the positional relationship between the upper substrate and the lower substrate. Therefore, it has the effect of improving the alignment accuracy of the two substrates and improving the yield. [Embodiment] (First embodiment) (bonding substrate manufacturing apparatus) A first embodiment of the present invention will be described with reference to Figs. 1 to 12 135990. Doc •13· 200941614 Substrate manufacturing equipment. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front plan view showing a device for manufacturing a bonded substrate; Fig. 2 is a cross-sectional view taken along line A-A of Fig. 1. As shown in FIGS. 1 and 2, the bonded substrate manufacturing apparatus 10 includes a base portion 11 on which a lower substrate W1 is placed, a support rod 13 which is erected from the base portion 11, and an upper pressing member 15 It is supported by the support rod 13, and is configured to be movable up and down along the support rod 13, and can be configured by holding the upper substrate W2. The base portion 11 has a rigidity 'substantially formed into a rectangular parallelepiped shape. The base portion 丨i is provided with a foot 22 at the four corners of the lower surface 21 and is placed on the floor. On the other hand, the upper surface 23 of the base portion 11 is formed in a rectangular shape in plan view, and the lower substrate W1 can be placed on the upper surface of the upper surface 23 in a substantially central portion, and the lower substrate %1 is placed in the vertical direction and orthogonally. The drive table 25 that moves in the horizontal direction and the horizontal rotation direction (hereinafter referred to as the horizontal direction) of the two axes. The drive table 25 is disposed in the recess 24 formed in the upper surface 23 of the base portion 11. The drive table 25 is formed in a substantially circular shape in a plan view to form a cavity 28 in the interior of the drive table 25. The zenith surface of the cavity 28 forms a plurality of air holes 27, and the cavity 28 is connected to the exhaust pipe 29 provided therebelow. The exhaust pipe 29 extends through the base portion 11 from the lower surface 21 and is connected to an exhaust pump (not shown). In the state where the lower substrate W1 is placed on the drive table 25, the exhaust pump is movable, and the lower substrate W1 can be adsorbed to the drive table 25 via the air holes 27. Further, a valve 30 is provided in the middle of the exhaust pipe 29 to adjust the amount of exhaust gas. Further, the surface 26 of the drive table 25 is normally flush (when not driven) and is disposed flush with the upper surface 23 of the base portion 11. Moreover, under the driving platform 25, the driving platform 25 is provided to the horizontal level 135990. Doc -14- 200941614 The first mobile device 31 that moves in the in-plane direction. The second mobile device 32 for moving the drive table 25 in the vertical direction is provided below the first moving device 3i. The driving method of the first mobile device 31 and the second mobile device 32 is not particularly limited. In the present embodiment, the "moving device 31 is configured to move in the horizontal direction by the actuator mechanism; the second moving device" is configured to move the driving table 25 up and down by moving the wedge-shaped member. Then, a plurality of (14 in the present embodiment) air cushions 35 are provided at positions corresponding to the top surface of the lower substrate W1 on the upper surface 23 of the base portion 11. The air bladders 35 are disposed on the base portion. The recessed portion 36 of the upper surface 23 of the η. The air cushion is formed in a substantially circular shape in a plan view, and the inside of the air cushion 35 forms a cavity 39. The zenith surface of the cavity 39 forms a plurality of air holes 38, and the outer portion of the cavity is disposed below it. The air supply and exhaust pipe 40 is connected. The air supply and exhaust pipe 4 extends through the base portion 11 and extends from the lower surface 21, and is connected to an air supply and exhaust pump (not shown). When W1 is placed on the base portion 11, air is supplied to the air cushion 35, and air is ejected from the air hole 38 toward the lower substrate arm, so that the lower substrate W1 can be floated. On the other hand, if the lower substrate is wi When it is placed on the base portion 11, it is exhausted from the air cushion 35, and The lower substrate W1 is adsorbed to the base portion 11 by the air holes 38. Further, a valve 41 is provided in the middle of the air supply and exhaust pipe 40 to adjust the amount of supply and exhaust. The surface 37 of the air cushion 35 is arranged to be combined with the base. The upper surface 23 of the seat portion 11 is flush with each other. Further, the drive table 25 and the air cushion 35 are not disposed on the upper surface 23 of the base portion 11, and a plurality of (24 in the present embodiment) lift pins 45 are provided. The lift pins 45 are provided. When it is normal, it is disposed below the upper surface 23 of the base portion 11. Moreover, from 135990. Doc •15- 200941614 When the other device (not shown) delivers the lower substrate wi to the bonded substrate manufacturing apparatus 10, the lift pin 45 rises. The lower substrate W1 can be collected from a robot arm (not shown). Then, after the lower substrate wi is collected, the lower substrate W1 can be placed on the upper surface 23 of the base portion 11 by lowering the lift pins 45. When the substrate is transferred to another device after the bonding process of the substrate is completed, the lift pin 45 is raised to separate the bonded substrate W3 from the upper surface 23 of the base portion 11, and the robot arm can be inserted into the gap to transport the bonded substrate W3. . Further, an exhaust port 47 is formed on the upper surface 23 of the base portion 11. The exhaust port 47 is connected to the exhaust pipe 48 that penetrates the base portion 11. The exhaust pipe 48 is connected to a vacuum pump 49 mounted on the lower surface 21 of the base portion 11. Further, a concave portion 51 is formed on the upper surface 23 of the base portion 11 so as to surround the drive table 25, the air cushion 35, the lift pin 45, and the exhaust port 47. The recess 51 is formed in a rectangular shape in plan view. The wall portion 53 is formed along the entire circumference of the inner periphery of the recess 51 in a plan view. The height of the wall portion 53 is smaller than the total thickness of the butyl plate W1 and the upper substrate W2. Fig. 3 is an enlarged view of a portion B of Fig. 1; As shown in Fig. 3, a sealing member 55 is provided in the recess 51. The sealing member 55 is provided with a tube 56 which is disposed under the recess 51, for example, made of rubber, and a joint portion 57 which is disposed above the tube 56. By changing the air pressure of the expansion/contraction tube 56, the joint portion 57 can move up and down along the side surface 60 of the recess 51 to follow the movement of the upper pressing member 15. The upper surface 58 of the joint portion 57 is located above the upper surface 23 of the base portion 11. Further, a seal 52 that seals between the upper pressing member 15 is provided on the upper surface 58 of the joint portion 57. Further, a seal member 61 is provided between the side surface 59 of the joint portion 57 and the side surface 60 of the recess portion 51 of the base portion 11. Thereby, the base part 1丨, upper 135990. Doc -16 - 200941614 The pressing member 15 and the sealing member 55 constitute the chamber 17. Further, the wall portion 53 supports the joint portion 57' so that the joint portion 57 does not fall down toward the chamber 17 side when the vacuum is evacuated from the chamber 17. Referring back to Fig. 2, on the outer side of the concave portion 51, a support rod 13 is erected on the upper surface 23 of the base portion π. The support bars 13 are erected at the four corners of the base portion 11. Further, a drive shaft 65 is erected between the support bars 13 at the substantially intermediate portion in the short side direction of the upper surface 23 of the base portion 11. The drive shaft 65 is provided with a drive source 66' which is composed of a motor or the like attached to the base portion 11, and a one-side two-shaft portion 67 which moves up and down in accordance with an instruction from the drive source 66. In summary, four support rods 13 and four drive shafts 65 are erected on the base portion 丨1. Further, for convenience of explanation, the figure is shown on the right side of the support rod 13, and the drive shaft 65 is shown on the left side. For example, the drive shaft 65 is configured such that the shaft portion 67 is rotated by the driving force from the drive source 66. A male screw 85 is formed in the shaft portion 67. The male screw 85 is configured to be screwed to the female thread % formed in the base portion by the rotation of the shaft portion 67, and the shaft portion 67 is thereby raised/lowered. The upper pressing member is provided above the support rod 13. 15. The upper pressing member 15 is formed in a rectangular shape having substantially the same size as the base portion 11 in plan view. In a plan view, at the four corners of the upper pressing member 15, a through hole 71 through which the support rod 13 can be inserted is formed at a position corresponding to the support rod 13, and a guide guide 83 is disposed below the through hole η. The upper pressing member 15 is raised and lowered in the vertical direction along the support rod 13. Further, at a position corresponding to the drive shaft 65 on the lower surface of the upper pressing member 15, a pressure receiving surface (lower surface) of the loading unit 69 and the shaft portion 67 is disposed so as to be the same. Adjacent. 135990. Doc 17 200941614 A step portion 73 is formed between the lower surface of the upper pressing member 15 corresponding to the position of the support rod 13 (the both side portions 72 in the short side direction) and the other positions. The two sides Τ»卩72 are formed such that, for the base portion 11, the step portion η is located far away. At a position closer to the base portion u than the side portions 72, a holding surface 75 for holding the upper substrate W2 is formed. The peripheral portion of the holding surface is formed on the outer side of the concave portion 51 of the base portion 11 as viewed from the top. Further, a (four) electro-inflammatory head portion 77 is provided at a position where the upper substrate arm 2 is held by the holding surface 75. The surface of the electrostatic chuck head 77 is disposed in a plane with the holding surface. Further, a plurality of holding pins 79 are provided where the holding surface 75 is not provided with the electrostatic chuck portion 77. The holding pin 79 is provided with an air suction port at its front end to adsorb and hold the upper substrate W2. The holding pin 79 is disposed above the holding surface 75 in the normal state. When the upper substrate 2 to the bonded substrate manufacturing apparatus 1 is delivered from another device (not shown), the holding pin 79 is lowered, and the upper substrate W2 can be collected from the robot arm (not shown). After the upper substrate|2 is received, the holding pin 79 is raised and the electrostatic chuck head 77 is activated, whereby the upper substrate W2 can be held on the holding surface 75. Further, at any position of the holding surface 75 where the upper substrate W2 is held (preferably in the vicinity of the peripheral portion of the upper substrate W2), the image forming portion 81β of the camera 80 used for alignment with the lower substrate wi is formed in the photographing portion. 81. A camera arrangement portion 82 that penetrates the through hole of the upper pressing member 15 is formed. In summary, the camera 80 is mounted in the camera arrangement unit 82, and the camera 8 transmits the alignment marks M1 and m of the lower substrate W1 and the upper substrate W2 through the imaging unit _ to detect the deviation of the alignment marks ΜΙ and M2. Moreover, there is a control unit (not shown) which is photographed by the camera 8 135 135990. The doc • 18· 200941614 results are based on indicating the amount of movement in the horizontal plane for the first mobile device 31. (Operation) Next, the procedure for manufacturing the bonded substrate by the bonded substrate manufacturing apparatus ι will be described with reference to Figs. 4 to 9 . Further, Fig. 4 to Fig. 1G are explanatory views showing a process of manufacturing a bonded substrate by using a bonded substrate manufacturing apparatus; and Fig. 4 is a flow chart showing a process of manufacturing a bonded substrate. Further, each (four) number described later corresponds to the step number of Fig. 11. First, as shown in Fig. 4, the pressing member 15 is held in the state of the highest position on the bonded substrate manufacturing apparatus 1A. In step S, in this state, the robot substrate is carried into the lower substrate W1, and the specific loading method of the lower substrate is shown after the step. In step S2, the robot arm (not shown) is transported, and the lower substrate wi is placed above the base portion u. Here, the lift pin 45 is raised to float the lower substrate W1 from the robot arm. The robot arm is retracted from the chamber 17 in step S3'. In step S4, the lift pin 45 is lowered, and the lower substrate W1 is placed on the upper surface 23 of the base portion 11. In step S5, the lower substrate W1 is adsorbed to the drive table 25 by exhausting from the exhaust pipe 29, and the second moving device 32 provided on the base portion η is driven in step S6' to move the drive table 25 upward. Air is supplied to the air cushion 35 substantially simultaneously with step S6 in step S7', and air is ejected from the air hole 38 toward the lower substrate W1. As a result, the lower substrate|丨 is made up of 135990. Doc •19- 200941614 The drive table 25 is lifted up to the center of the center, and the peripheral portion of the lower substrate wi is lifted by the gas extraction action. In this manner, the lower substrate W1 is maintained in a horizontal state (first lower substrate moving step). At this time, the lower substrate is ejected from the upper surface 23 of the base portion 11 by several tens of μm. In step S8, the robot arm (not shown) is conveyed, and the upper substrate W2' is disposed below the holding surface 75 of the upper pressing member 丨5. The holding pin 79 is lowered in step S9' to adsorb the upper substrate W2. In step S10, the robot arm is retracted from the chamber 17. In step S11, the holding pin 79 is raised. In step S12', the electrostatic chuck portion 77 is made to function, and the upper substrate %2 is attracted to the holding surface 75. Fig. 5 is an explanatory diagram when the above step S12 is completed. Further, the steps of the steps S1 to S5 for loading the lower substrate W1 and the steps for moving the upper substrate W2 for the steps S8 to S12 may be preceded. Here, since the upper substrate W2 is dropped from the adsorption pin 57, the influence of the falling of the upper substrate W2 and the lower substrate W1 can be prevented by the first loading of the upper substrate W2. In particular, in the case of manufacturing a liquid crystal panel, since the liquid crystal is coated on the upper substrate W1, it is preferable to carry in the upper substrate W2 first. Next, in step S13, as shown in FIG. 6, the drive shaft 65 is driven while the lower substrate W1 is horizontal, and the upper pressing member 15 is lowered toward the base portion 11 (lower substrate W1) (upper substrate moving step) . At this time, the shaft portion 67 rotates in accordance with an instruction from the driving source 66, and the shaft portion 67 is thereby lowered. Since the upper pressing member 15 is supported by the shaft portion 67, it is simultaneously lowered. Further, since the support rod 13 is inserted into the guide guides 83 at the four corners of the upper pressing member 15, the upper pressing member 15 is lowered as it is in the horizontal state. Then, make up 135990. Doc • 20· 200941614 The pressing member 15 is lowered to a specific interval between the lower substrate W and the upper substrate W2. In step S14, as shown in FIG. 7, when the lower substrate W1 and the upper substrate arm 2 are at a certain interval (a few hundred μm), the camera 8 is operated, and the alignment marks M1 of the lower substrate W1 and the upper substrate W2 are The M2 is shot in focus. Then, the lower substrate W1 is moved in the horizontal direction to align the marks respectively. Consistent (substrate alignment step). At this time, based on the amount of deviation of the alignment marks, the first moving means 31 is driven to move the drive table 25 in the horizontal direction to move the lower substrate W1 to an appropriate position. Further, when the alignment between the lower substrate W1 and the upper substrate W2 is performed, the holding surface 75 abuts against the joint portion 57 of the sealing member 55. In short, the chamber 17 that is hermetically sealed by the base portion 11, the upper pressing member 15, and the sealing member 55 is formed (process chamber forming step). Specifically, if the upper pressing member 15 presses the joint portion 57, Then, the joint portion 57 presses the tube 56 and the release valve (not shown) is connected to the tube 56. Therefore, the tube 56 is contracted while the internal pressure is kept constant. By this, it is possible to prevent breakage of the official member 56 while maintaining the sealed state of the upper pressing member 15 and the engaging portion 57. In step S15, as shown in FIG. 8, if the alignment of the lower substrate W1 and the upper substrate W2 is completed, 'the driving stage 25 of the lower substrate W1 is lowered, and the air supply of the air cushion 35 is stopped', the lower substrate wi is lowered to the base portion. u above 23. Then, the air is vented from the air cushion 35, and the lower substrate W1 is attracted to the upper surface 23 so that the position does not deviate (the second lower substrate moving step). Thereafter, the upper pressing member 15 is slightly moved upward (the upper pressing member is raised step). ). Thus, the distance between the lower substrate W1 and the upper substrate W2 is increased in comparison with the alignment. This is for the cavity to be carried out 135990. Doc •21· 200941614 During vacuum extraction in chamber 17, 'increase air conduction' shortens the vacuum extraction time and reliably vents air between substrates W1 and W2. Therefore, even when the upper pressing member 15 is slightly moved upward, the holding surface 75 is surely abutted against the engaging portion 57. Specifically, in contrast to the above, in a state where the internal pressure is kept constant, the tube 56 is expanded, and the sealed state of the upper pressing member 15 and the joint portion 57 can be maintained. In general, the position of the upper surface 58 of the engaging portion 57 is adjusted by adjusting the air pressure of the tube 56 of the sealing member 55. Moreover, even if the joint portion 57 is lifted and lowered, the airtightness in the chamber 17 is maintained by the seal member 61. Further, the upper pressing member 15 may be raised and then the lower substrate W1 may be lowered to the upper surface 23 of the base portion 11. Further, the processing chamber forming step may be performed after the step of raising the upper pressing member. The vacuum pump 49 is caused to evacuate the inside of the chamber 17 from the exhaust port 47 in step S16' (decompression step, and then the chamber 17 is kept in a vacuum state (about 0-4 Pa or less). In the step S17' chamber After the vacuum extraction in 17 is completed, the upper pressing member 15 is lowered again. In step S18, as shown in Fig. 9, the lower substrate W1 and the upper substrate W2 are bonded together (substrate bonding step). The weight of the pressing member 15 is pressed by the two substrates W1, W2. Here, the loading unit 69 is disposed between the front end portion 68 of the shaft portion 67 and the both side portions 72 of the upper pressing member 15. When the load applied to the two substrates W1 and W2 is detected, the substrate is adjusted to be bonded to the appropriate load. In step S19, as shown in FIG. 10, if the bonding between the lower substrate W1 and the upper substrate W2 is completed, the upper substrate is added. The pressing member 15 is raised. At this time, the bonding substrate W3 135990 is made. Doc -22- 200941614 is disposed on the base portion 11. In short, the function of the electrostatic chuck portion 77 of the upper pressing member 15 is released, and the upper substrate W2 is separated from the upper pressing member 15". In step S20, the lifting pin 45 of the base portion 11 is raised to make the fitting. The substrate W3 rises from the upper surface 23. In step S21', between the bonded substrate W3 and the upper surface 23 of the base portion 11, a robot arm is inserted, and the bonded substrate W3 is delivered from the lift pin 45 to the robot arm. Then, the robot arm transports the bonded substrate W3 to another device not shown, and the processing is completed. In the present embodiment, the bonded substrate manufacturing apparatus 10' for manufacturing the bonded substrate W3 is formed by aligning the upper substrate W2 and the lower substrate W1 on one surface, and the base portion 11 is mounted thereon. a lower substrate W1; a support rod 13' is erected on the base portion; and an upper pressing member 15 which is movable up and down along the support rod 13 and configured to hold the upper substrate W2; The upper pressing member 15 is lowered 'to fit the upper substrate 2 and the lower substrate W1. Therefore, the holding member 15 on the upper substrate W2 is held up and down by the support rod 13 which is erected on the base portion of the lower substrate. In summary, the number of components between the upper substrate 2 and the lower substrate is minimized. Thereby, the relative positional deviation between the upper substrate 2 and the lower substrate can be prevented during the alignment of the upper substrate 琛2 and the lower substrate 丨 to the bonding. Therefore, the alignment accuracy and the improvement of the yield of the two substrates W1 and 12 can be improved. Further, in the laminated substrate manufacturing apparatus 1 of the present embodiment, the base portion 11 is disposed around the lower substrate. The area is provided with a sealing member 55, by lowering the upper pressing member 〖5 to seal the member Η, upper 135990. Doc • 23· 200941614 A chamber 17 is formed between the pressurizing member 15 and the base portion 11. Therefore, the cavity 17' can be formed by the above pressing member 15, the base portion 11, and the sealing member 55, and the number of parts can be reduced. Therefore, the device can be made small and lightweight. Further, the laminated substrate manufacturing apparatus 1 of the present embodiment further includes a vacuum pump 49 for decompressing the inside of the chamber 17; when the chamber 17 is decompressed by the vacuum pump 49, the chamber 17 is sealed. The member 55 is sealed. Thus, when the sealing member 55 is interposed between the upper pressing member 15 and the base portion 11 to decompress the chamber 17, the chamber 17 can be reliably sealed. Therefore, the chamber 17 can be reliably decompressed, and the desired bonded substrate W3 can be manufactured. Further, the base portion 11 is provided with a driving table 25 that moves one side of the lower substrate W1 while moving the lower substrate wi, and a gas cylinder 35 that is moved by the driving table 25 to move the lower substrate W1. When the lower substrate W1 is floated' and the upper substrate W2 is bonded to the lower substrate W1, the lower substrate W1 can be adsorbed. Therefore, when the upper substrate W2 and the lower substrate W1 are bonded together, the lower substrate W1 can be adsorbed to the base portion 11 by the gas cylinder 35. Therefore, it is possible to prevent the positional deviation of the substrate boundary 1 from being caused, and it is possible to accurately bond the upper substrate W2 and the lower substrate W1. Further, since the stage for placing the lower substrate W1 is not separately required, the number of parts interposed between the base portion 11 and the lower substrate W1 can be reduced. Further, when the lower substrate W1 is adsorbed to the base portion, the drive table 25 and the air cushion 35 are not exposed to the chamber 17, and therefore it is possible to prevent particles or the like generated from the respective devices from flowing into the chamber 17. Therefore, the cleanliness in the chamber 17 can be ensured. 135990. Doc • 24-200941614 Then, the sealing member 55 includes a joint portion 57 that moves up and down with respect to the base portion 11 to form a wall portion of the chamber 17, and a seal member 52 that is provided at the joint portion 57 to abut The upper pressing member 15 is used to ensure the airtightness of the chamber 17. Therefore, the joint portion 57 moves up and down with respect to the base portion 11 to constitute the wall portion of the chamber 17, and even if the upper pressing member 15 rises, the sealed chamber 17 can be constructed. Thereby, even if the substrate W1 and the upper substrate Jia 2 are separated and disposed to increase the state of the air conduction, the inside of the chamber 17 can be decompressed, and the decompression time can be shortened. Further, other aspects of the sealing member 55 of the present embodiment are shown in Fig. 12. As shown in Fig. 12, the sealing member 255 is provided in the recess 51, and includes an air supply portion 256 formed below the recess portion 51 and a joint portion 57 disposed above the air supply portion 256. By changing the air pressure of the air supply unit 256, the joint portion 57 can move up and down along the side surface 60 of the recess 51, and can follow the movement of the upper pressing member 15, and the upper surface 58 of the joint portion 57 is closer to the upper surface of the base portion 11 Located above. Further, a seal 52 that seals between the upper pressing member 15 is provided on the upper surface 58 of the joint portion 57. Further, between the side surface 59 of the joint portion 57 and the side surface 60 of the recess portion 51 of the base portion 11, two seal members 6 1 for sealing therebetween are provided. A space portion 263 between the seal members 61 and 61 is connected to a communication pipe (not shown) that communicates with the outside (atmosphere). Thereby, the pressure load on the seal 61 can be alleviated. Further, on the side opposite to the seal member 61, a seal member 262 for blocking the air supply portion 256 from the outside (atmosphere) is provided. Thereby, the sealing member 255 can obtain substantially the same operational effects as the above-described sealing member 55. (Second embodiment) 135990. Doc -25- 200941614 Next, a bonded substrate manufacturing apparatus according to a second embodiment of the present invention will be described based on Fig. 13 . The present embodiment is different from the first embodiment only in the configuration of the sealing member, and the same reference numerals are given to the same portions, and the detailed description is omitted. Figure 13 is a structural view of a sealing member. As shown in FIG. 13, the sealing member ι55 is provided on the side of the upper pressing member 15. Specifically, a recess 1515 is formed in the holding surface 75 of the upper pressing member 15. The concave portion ι51 is formed at a position substantially opposite to the concave portion 51 of the first embodiment. A sealing member 155 is provided in the recess 151. The sealing member 155 includes a spring 156' disposed at the bottom of the recess 151, and a joint portion 157 disposed above the spring 156. The contraction portion 157 is moved up and down by the contraction of the spring 156. Further, a seal member 164 is provided on the front end surface 162 of the joint portion 157. Further, a side seal 161 is provided between the side surface 159 of the joint portion 157 and the side surface 160 of the recess portion 151. A stopper 165 is erected from the side surface 160 of the recess 151 toward the side surface 159 of the joint portion 157 so that the joint portion 157 does not fall from the recess portion 151. Thereby, the chamber 17 can be constituted by the base portion u, the upper pressing member 15, and the sealing member 155. (Operation) Before the substrate is bonded (in the initial state of the device), the joint portion 157 is suspended downward by the biasing force and the weight of the spring 156, and is engaged by the stopper π. When the upper pressing member 15 is lowered in order to bond the substrates, the upper substrate W2 is simultaneously lowered. As a result, the sealing member 164 of the engaging portion 157 abuts against the upper surface 23 of the base portion 1 1 , and the base portion 11 , the upper pressing member 15 and the sealing member 155 constitute the chamber 17 . Thereafter, if the upper pressing member 15 is further lowered, 135990. Doc • 26- 200941614 The spring 156 is contracted, and the joint portion 157 is housed in the recess 151. Thereafter, even if the upper pressing member 15 is slightly raised and lowered, the biasing force of the spring 156 acts to hold the sealing member 164 in contact with the upper surface 23 of the base portion 11. Therefore, when the substrates W1 and W2 are bonded together, the chamber I7 can be reliably formed, and the desired bonded substrate W3 can be manufactured. Further, in order to take the upper substrate W2 and the bonded substrate W3 from the chamber 17 by the robot arm, the sealing member 155 is disposed so as not to interfere. Further, if the joint portion 157 can be moved downward only by its own weight, the sealing member 155 may not be provided with the projecting 156. In this case, since the raising and lowering mechanism of the joint portion 157 is not required, the number of parts can be reduced, and as a result, the apparatus can be manufactured without cost. Further, when the substrate is picked up and lowered, the robot arm is picked up and lowered, so that the upper pressing member 15 rises to the extent that the joint portion 157 does not hinder. In addition, the technical scope of the present invention is not limited to the above-described embodiments, and various modifications are possible in the above-described embodiments without departing from the scope of the present invention. In other words, the specific shape, configuration, and the like of the embodiment may be changed as appropriate. For example, in the present embodiment, a tube or a spring is used to move the joint portion up and down. However, an actuator or the like may be used. Further, in the present embodiment, the case where the camera is attached to the upper pressing member is described, but the base portion may be provided. [Industrial Applicability] A bonded substrate manufacturing apparatus and a bonded substrate manufacturing method capable of improving the alignment accuracy of two substrates and improving the yield can be provided. 135990. Doc -27 - 200941614 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front schematic view showing a manufacturing apparatus of a bonded substrate according to a first embodiment of the present invention. Figure 2 is a cross-sectional view taken along line A-A of Figure 1. Fig. 3 is an enlarged view of a portion b of Fig. 1; Fig. 4 is an explanatory view (1) showing a process of manufacturing a bonded substrate by using a bonded substrate manufacturing apparatus of the same embodiment. Fig. 5 is an explanatory view (2) showing a process of manufacturing a bonded substrate by using a bonded substrate manufacturing apparatus of the same embodiment. Fig. 6 is an explanatory view (3) showing a process of manufacturing a bonded substrate by using a bonded substrate manufacturing apparatus of the same embodiment. Fig. 7 is an explanatory view (4) showing a process of manufacturing a bonded substrate by using a bonded substrate manufacturing apparatus of the same embodiment. Fig. 8 is an explanatory view (5) showing a process of manufacturing a bonded substrate by using the bonded substrate manufacturing apparatus of the same embodiment. Fig. 9 is an explanatory view (6) showing a process of manufacturing a bonded substrate by using a bonded substrate manufacturing apparatus of the same embodiment. Fig. 1 is an explanatory view (7) showing a process of manufacturing a bonded substrate by using a bonded substrate manufacturing apparatus of the same embodiment. Fig. 11 is a flow chart showing the process of manufacturing a bonded substrate of the same embodiment. Fig. 12 is a structural view showing another aspect of the sealing member of the same embodiment. Figure 13 is a view showing the structure of a sealing member according to a second embodiment of the present invention 135990. Doc -28 - 200941614 Figure. [Main component symbol description] ίο Alignment substrate manufacturing apparatus 11 Base portion 13 Support rod 15 Upper pressing member 17 Cavity chamber (bonding processing chamber) 25 Driving table (lower substrate absorbing adsorption device) ❿ 35 Air cushion (below Substrate floating suction adsorption device) 49 Vacuum pump (decompression device mechanism) 52 Seal seal 55 Sealing member 56 Tube (expansion member) 57 Joint portion W1 Lower substrate W2 Upper substrate W3 Bonding substrate 135990. Doc -29·