JP3542956B2 - LCD panel substrate bonding equipment - Google Patents

LCD panel substrate bonding equipment Download PDF

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Publication number
JP3542956B2
JP3542956B2 JP2000331179A JP2000331179A JP3542956B2 JP 3542956 B2 JP3542956 B2 JP 3542956B2 JP 2000331179 A JP2000331179 A JP 2000331179A JP 2000331179 A JP2000331179 A JP 2000331179A JP 3542956 B2 JP3542956 B2 JP 3542956B2
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surface plate
substrates
platen
liquid crystal
substrate
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JP2002131762A (en
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一朗 石坂
国弘 宮下
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Shin Etsu Engineering Co Ltd
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Shin Etsu Engineering Co Ltd
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Priority to TW090126007A priority patent/TWI250338B/en
Priority to KR1020010066606A priority patent/KR100653339B1/en
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1341Filling or closing of cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Description

【0001】
【発明の属する技術分野】
本発明は、液晶ディスプレイ(LCD)に使用する液晶パネルの製造過程において、二枚の液晶パネル用基板を真空中でアライメント(粗合わせ及び微合わせ)するための液晶パネル用基板の貼り合わせ装置及び貼り合わせ方法に関する。詳しくは、上下一対の加圧板に対して夫々着脱自在に保持された二枚の基板を真空中で重ね合わせ、位置決め手段により相対的にXYθ方向へ調整移動して両基板の粗合わせ及び微合わせを行い、更に両基板を加圧して所定のギャップまで潰す液晶パネル用基板の貼り合わせ装置及び貼り合わせ方法に関する。
【0002】
【従来の技術】
従来、この種の液晶パネル用基板の貼り合わせ装置及び貼り合わせ方法は、例えば図5に示すように、上下一対の加圧板1′,2′と例えばXYテーブルなどの位置決め手段8′の全体を囲むように真空チャンバー11が上下方向へ開閉自在に形成され、この位置決め手段8′とその駆動源8b′とを連絡する駆動軸8c′が、例えばベローズなどの真空貫通部品12により真空チャンバー11を貫通して設けられている。
そして、上記真空チャンバー11が閉じられてその内部を真空にした後、その外部から駆動軸8c′で位置決め手段8′を作動して両加圧板1′,2′が相対的にXYθ方向へ調整移動されることにより、両基板A,Bの粗合わせ及び微合わせを行っていた。
【0003】
【発明が解決しようとする課題】
しかし乍ら、このような従来の液晶パネル用基板の貼り合わせ装置及び貼り合わせ方法では、外部から駆動伝達により真空チャンバー内の位置決め手段をXYθ移動してアライメントするため、駆動軸の真空貫通部品が複雑化して、真空チャンバー内外の真空遮断にコストがかさむだけでなく、シール材の粘度によっては、粗合わせや微合わせに相当な力が必要で、駆動形態の制約が多いという問題がある。
また、真空チャンバーが上下一対の加圧板及び位置決め手段の全体を囲むため、真空となる空間が大きくなってしまい、真空ポンプの容量を大きくする必要があると共に、使用できる基板の大きさにも限界があって、大型の基板は製造できないという問題がある。
【0004】
本発明のうち請求項記載の発明は、上定盤及び下定盤の間のみを密閉状態にしたままその外部でXYθ移動してアライメントすることを目的としたものである。
【0005】
【課題を解決するための手段】
前述した目的を達成するために、本発明のうち請求項1記載の発明は、上定盤及び下定盤の対向面に設けられた基板を移動不能に保持する保持手段と、
上定盤及び下定盤の対向する周縁部間の密閉状態を維持したまま相対的にXYθ方向へ移動自在に支持する移動シール手段と、
上定盤及び下定盤を相対的に接近移動して、これら上定盤及び下定盤の間に両基板が囲まれるように閉空間を区画形成すると共に、両基板を所定間隔まで接近させる加圧手段と、
上記閉空間内の気体を出し入れして所定の真空度にする吸気手段と、
記加圧手段の作動状態で、上定盤及び下定盤を相対的にXYθ方向へ調整移動させるための閉空間外に配設した位置決め手段とを備え
両基板を囲むように環状に設けられた移動シール手段の移動ブロックと上定盤をXYθ方向へ一体的に連結させ、この移動ブロックの上面には上定盤の周縁部と密接して圧縮変形可能な環状シール材を装着し、移動ブロックの下面には下定盤の周縁部と常時接触する駆動真空シールを装着したことを特徴とするものである。
請求項2記載の発明は、請求項1記載の発明の構成に、前記駆動真空シールに上定盤や移動ブロックの重量などの力が作用しないように支持する荷重受ボールを設けた構成を加えたことを特徴とする。
請求項3記載の発明は、請求項1または2記載の発明の構成に、前記上定盤から移動ブロックに亘って複数本の連結ピンを、上下方向へは往復動自在であるがXYθ方向へは移動不能に挿通させた構成を加えたことを特徴とする。
【0006】
【作用】
請求項1の発明は、二枚の基板を保持した上定盤及び下定盤が接近移動することにより、相互の周縁部の間を移動シール手段で密閉して閉空間が区画形成されると共に、両基板が所定間隔まで接近し、その後、この閉空間内の空気を抜きながら、上定盤及び下定盤を相対的にXYθ方向へ調整移動させて、両基板の粗合わせが行われ、所定の真空度に到達してから、上記移動シール手段を変形させて両基板の間が環状接着剤で密閉される位置まで更に接近し、この状態で、上定盤及び下定盤を相対的にXYθ方向へ調整移動させて、両基板の微合わせが行われ、その後、上定盤及び下定盤の一方からのみ基板を解放して、上記閉空間内を大気圧に戻すことにより、両基板の内外に生じる気圧差で均等に押し潰されて所定のギャップが形成されるものである。
【0007】
【発明の実施の形態】
以下、本発明の実施例を図面に基づいて説明する。
この実施例は、図1〜図2に示す如く上方の加圧板1が、上下方向へは往復動自在だがXYθ方向へは移動不能に支持された上定盤であると共に、下方の加圧板2が固定台板9上に例えばXYテーブルなどの位置決め手段8を介してXYθ方向へ調整移動自在に支持された下定盤であり、これら上定盤1及び下定盤2の対向面に吸着保持した二枚のガラス製基板A,Bを、真空雰囲気中でアライメントするものである。
【0008】
上定盤1及び下定盤2は、例えば金属やカーボンなどの剛体で構成され、これら対向面の中央部には、両基板A,Bを移動不能に保持する保持手段3として複数の吸引孔が開穿され、これら吸引孔3…と例えば真空ポンプなどの吸引源(図示せず)とを配管連絡させる。
この吸引源は、コントローラー(図示せず)で動作制御され、両基板A,Bをセットする初期状態に吸引が開始され、両基板A,Bの微合わせ後にどちらか一方、本実施例では上方基板Aの吸引を解除し、後述する閉空間Sが大気圧に戻った後は下方基板Bの吸引を解除して初期状態に戻す。
【0009】
これら基板A,Bには、例えば所望のパターンが形成されたカラーフィルターとTFT基板からなり、これら対向面のどちらか一方、図示例の場合には下方の基板Bの周縁部に沿って環状接着剤Cが枠状に塗布され、必要に応じて他方には多数のスペーサ(図示せず)が散布される。
【0010】
更に、上定盤1の周縁部1aと下定盤2の周縁部2aとの間には、これら両者間の密閉状態を維持したまま相対的にXYθ方向へ移動自在に支持する移動シール手段4が、両基板A,Bを囲むように環状に設けられる。
この移動シール手段4は、本実施例の場合、上定盤1及び下定盤2の平面形状に合わせて断面円形又は矩形に形成された移動ブロック4aと、この移動ブロック4aの上面に装着した上定盤1の周縁部1aと接離する例えばOリングなどの上下方向へ弾性変形可能な環状シール材4bと、移動ブロック4aの下面に装着した下定盤2の周縁部2aと常時接触する必要に応じて例えば真空グリースが使用された駆動真空シール4cと、この駆動真空シール4cに上定盤1や移動ブロック4aの重量などの力が作用しないように支持する荷重受ボール4dとから構成される。
【0011】
特に必要に応じて、これら上定盤1と移動ブロック4aがXYθ方向へ一体的に連結させるために、上定盤1から移動ブロック4aに亘って複数本の連結ピン4eを、上下方向へは往復動自在であるがXYθ方向へは移動不能に挿通させることが好ましく、更に移動ブロック4aと下定盤2が上下方向へ離れるのを防止するために両者に亘って例えば引っ張りバネなどの弾性材料4fを掛け渡すことが好ましい。
【0012】
そして、上定盤1には、図1の符号5に示すような例えば上下駆動用シリンダーなどからなる第一加圧手段が連設される。
この第一加圧手段5は、コントローラー(図示せず)で動作制御され、基板A,Bをセットする初期状態で、図1の一点鎖線及び図2(a)に示す如く上定盤1を上限位置で待機しており、基板A,Bのセット完了後に、図1の実線及び図2(b)に示す如く上定盤1を下降させて、下定盤2との間に閉空間Sが両基板A,Bを囲むように区画形成し、両基板A,Bの微合わせ終了後か、或いは後述する閉空間Sが大気圧に戻った後は上昇させて初期状態に戻す。
【0013】
この閉空間Sには、図1の符号6に示すような外部に配設した例えば真空ポンプと連絡して、該閉空間S内の気体、本実施例では空気を出し入れして所定の真空度にする吸気手段が設けられる。
この吸気手段6は、コントローラー(図示せず)で動作制御され、上定盤1及び下定盤2の接近移動により閉空間Sが形成された後に閉空間Sから吸気を開始し、両基板A,Bの微合わせの終了後は閉空間Sに空気を供給して大気圧に戻す。
【0014】
また、前記第一加圧手段5により接近させた両基板A,Bを、それらの間が環状接着剤Cで密閉される位置まで更に接近させる第二加圧手段7が設けられる。この第二加圧手段7は、本実施例の場合、前記移動ブロック4aの上面から上定盤1の周縁部1aへ向けて配設した上下方向へ伸縮自在なシリンダー7aからなり、このシリンダー7aを上下方向へ短縮化して前記環状シール4bを上下方向へ圧縮変形させることにより、両基板A,Bが更に加圧されるようにしている。
更に、この第二加圧手段7は、コントローラー(図示せず)で動作制御され、初期状態で図2(a)に示す如く上下方向へ伸長しており、両基板A,Bの粗合わせ終了後に図2(c)に示す如く短縮させ、両基板A,Bの微合わせ終了後か、或いは後述する閉空間Sが大気圧に戻った後は上昇させて初期状態に戻す。
【0015】
そして、前記閉空間Sの外側となる下定盤2の底面には、例えばXYテーブル8aと、下定盤2をXYθ方向へ移動させるための駆動源8bなどからなる位置決め手段8が連設され、両基板A,Bに表示されたマークを顕微鏡とカメラで構成した検出手段8cから出力されるデータに基づいて駆動源8bを作動させることにより、下定盤2及びこれに保持された下方基板BがXYθ方向へ調整移動して、粗合わせと微合わせを行う。
【0016】
更にまた、必要に応じて、前記上定盤1及び下定盤2の対向面の両基板A,Bと当接する中央部分には、クッション性に優れた材質でありながら上記位置決め手段8によるXYθ方向への調整移動の際に位置ズレが発生しない程度の厚さ寸法に形成された緩衝材10を配設しても良い。
図示例の場合には、下定盤2の対向面2bのみに、数mm厚さ寸法の緩衝材10を設けたが、これに限定されず、上定盤1及び下定盤2の対向面の両方か又は上定盤1の対向面のみに緩衝材10に設けても良い。
【0017】
次に、斯かる液晶パネル用基板の貼り合わせ方法を工程順に従って説明する。先ず、図2(a)に示す如く上定盤1及び下定盤2の対向面に基板A,Bを夫々プリアライメントしてセットする。
それにより、保持手段3で両基板A,Bが夫々移動不能に吸着保持される。
【0018】
その後、第一加圧手段5の作動で図2(b)に示す如く上定盤1と下定盤2を互いに近づけ、上定盤1の周縁部1aが環状シール4bに密接して、上定盤1と下定盤2との間には、これら捧持された両基板A,Bを囲むように閉空間Sが区画形成される。
【0019】
これと同時に両基板A,Bは、上定盤1と下定盤2の接近移動により、所定間隔まで接近し、この状態で1mm以下の隙間をもって対峙している。
しかし、一方の基板Bに塗布した環状接着剤Cには、他方の基板Aが接触せず、これら両基板A,Bの間と閉空間Sは連通している。
【0020】
その後、吸気手段6の作動で閉空間Sから空気が抜かれて所定の真空度になると共に、両基板A,Bの間からも空気が抜かれて真空となる。
この状態で、位置決め手段8の作動により上定盤1と下定盤2を相対的にXYθ方向へ調整移動させて、両基板A,Bの粗合わせが行われる。
【0021】
そして、所定の真空度に到達したら、第二加圧手段7の作動で図2(c)に示す如く上定盤1と下定盤2が更に接近して環状シール4bを圧縮変形させ、それにより両基板A,Bが更に接近して、一方の基板Bに塗布した環状接着剤Cに、他方の基板Aが密接して両者間が密閉される。
この状態で、位置決め手段8の作動により上定盤1と下定盤2を相対的にXYθ方向へ調整移動させて、両基板A,Bの微合わせが行われる。
【0022】
その後、図2(d)に示す如く保持手段3の作動により上定盤1からのみ上方基板Aの吸着を解除して、吸気手段6の作動により閉空間S内に空気を入れてその雰囲気を大気圧に戻す。
それにより、両基板A,Bの内外に生じる気圧差で均等に押し潰され、所定のギャップが形成される。
【0023】
この際、粗合わせを行う前の時点、具体的には両基板A,Bのセット時に適正量の液晶を適正状態で封入すれば、閉空間S内の雰囲気を大気圧に戻すことにより、両基板A,Bの内外に生じる気圧差で均等に押し潰されて、液晶が封入された状態で所定のギャップ形成が可能となり、後工程で液晶を注入せずに液晶パネルが制作できる。
【0024】
それ以降は、閉空間S内が大気圧に戻ったら、第一加圧手段5の作動により上定盤1と下定盤2を離して閉空間Sが開放され、アライメントされた両基板A,Bを取り出して、上述した動作が繰り返される。
【0025】
従って、上定盤1及び下定盤2の間のみを密閉状態にしたままその外部でXYθ移動してアライメントできる。
その結果、位置決め手段8やその駆動源8bなどが大気中に設置可能となり、通常部品が使用できると共に、真空貫通部品もなくなり、それにより、構造の簡略化が図れ、しかも真空遮断にコストもかかず、粗合わせや微合わせに相当な力を必要としないから、駆動形態の制約が無い。
また、真空となる空間を最小にして、その分だけ真空ポンプの容量が小さくてすみ、大型の基板でも生産性が高く製造できる。
【0026】
更に必要に応じて、前記上定盤1及び下定盤2の対向面のどちらか一方又は両方に、クッション性に優れてXYθ方向への調整移動の際に位置ズレが発生しない緩衝材10を配設した場合には、上定盤1及び下定盤2の片当たりを防止して均一なギャップ形成が容易となる。
【0027】
一方、図3及び図4に示すものは、本発明の他の実施例であり、このものは、前記第二加圧手段7が、移動ブロック4aの上面から上定盤1の周縁部1aへ向けて配設した上下方向へ伸縮自在なシリンダー7aに代えて、上定盤1の対向面中央に形成された凹部1bを閉塞すると共に上方基板Aを移動不能に保持する上下方向のみ弾性変形可能な可撓性薄板材7bと、この可撓性薄板材7bで閉鎖された凹部1b内の気体を出し入れして微合わせ時に可撓性薄板材7bが下方へ基板Bへ向け膨出するように変形させる加圧部7cとからなる構成が、前記図1及び図2に示した実施例とは異なり、それ以外の構成は図1及び図2に示した実施例と同じものである。
【0028】
上記可撓性薄板材7bは、例えばステンレスなどの金属製フィルムなどの上下方向へは弾性変形可能であるがXYθ方向へは変形不能に形成され、その中央には、保持手段3として複数の吸引孔が開穿される。
上記加圧部7cは、コントローラー(図示せず)で動作制御され、図4(a)に示す上記状態及び図4(b)に示す粗合わせまで、閉鎖凹部1bの内圧が吸気手段6による閉空間Sの内圧と同じになるように空気を出し入れし、粗合わせ後のみ図4(c)に示す如く閉鎖凹部1bの内圧が閉空間Sの内圧より大きくなるように空気を入れる。
【0029】
従って、図3及び図4に示すものは、粗合わせ後、図4(c)に示す如く閉鎖凹部1bの内圧上昇により可撓性薄板材7bが膨出変形して、それに保持された上方基板Aを下方基板Bへ更に接近して両者間が環状接着剤Cで密閉させることにより、これら両基板A,Bが微合わせ時に最終ギャップ近くまで均等に潰される。
その結果、前記図1及び図2に示した実施例よりも剛体製上定盤1及び下定盤2は対向面の平坦度や定盤間の平行精度により基板A,B同士の局所加圧を招き易いが、これら基板A,B同士の局所加圧を完全に防止できて製品が傷付かないという利点がある。
【0030】
尚、前示実施例では、上方の加圧板1が、上下方向へ往復動自在な上定盤であり、下方の加圧板2がXYθ方向へ調整移動自在に支持された下定盤である場合を示したが、これに限定されず、これと逆に上定盤をXYθ方向へ調整移動自在に支持し、下定盤を上下方向へ往復動自在に支持しても良い。
更に真空雰囲気中でアライメントする場合を示したが、これに限定されず、特殊ガス雰囲気中でアラメイントする場合も同様である
【0031】
また、基板A,Bの保持手段3、移動シール手段4、第一加圧手段5、吸気手段6、第二加圧手段7及び位置決め手段8は、図示された構造に限定されず、同様に作用すれば他の構造でも良い。
特に基板A,Bを移動不能に保持する保持手段3は、吸気手段6による閉空間S内の真空度が低真空であれば、真空差を利用した真空吸着を使用できるが、この真空差を利用できなくなる程度まで閉空間S内が高真空になる場合には、保持手段3として静電チャックや粘着フィルムを使用することにより基板A,Bを移動不能に保持する必要がある。
また更に移動シール手段4の駆動真空シール4cに代えて磁性流体式真空シールを使用しても良い。
【0032】
【発明の効果】
以上説明したように、本発明のうち請求項1記載の発明は、二枚の基板を保持した上定盤及び下定盤が接近移動することにより、相互の周縁部の間を移動シール手段で密閉して閉空間が区画形成されると共に、両基板が所定間隔まで接近し、その後、この閉空間内の空気を抜きながら、上定盤及び下定盤を相対的にXYθ方向へ調整移動させて、両基板の粗合わせが行われ、所定の真空度に到達してから、上記移動シール手段を変形させて両基板の間が環状接着剤で密閉される位置まで更に接近し、この状態で、上定盤及び下定盤を相対的にXYθ方向へ調整移動させて、両基板の微合わせが行われ、その後、上定盤及び下定盤の一方からのみ基板を解放して、上記閉空間内を大気圧に戻すことにより、両基板の内外に生じる気圧差で均等に押し潰されて所定のギャップが形成されるので、上定盤及び下定盤の間のみを密閉状態にしたままその外部でXYθ移動してアライメントできる。
従って、外部から駆動伝達により真空チャンバー内の位置決め手段をXYθ移動してアライメントする従来のものに比べ、位置決め手段やその駆動源などが大気中に設置可能となり、通常部品が使用できると共に、真空貫通部品もなくなり、その結果、構造の簡略化が図れ、しかも真空遮断にコストもかかず、粗合わせや微合わせに相当な力を必要としないから、駆動形態の制約が無い。
また、真空となる空間を最小にして、その分だけ真空ポンプの容量が小さくてすみ、大型の基板でも生産性が高く製造できる。
【図面の簡単な説明】
【図1】本発明の一実施例を示す液晶パネル用基板の貼り合わせ装置の縦断正面図である。
【図2】(a)〜(d)は液晶パネルの製造方法を工程順に示す説明図である。
【図3】本発明の他の実施例を示す液晶パネル用基板の貼り合わせ装置の縦断正面図である。
【図4】(a)〜(d)は液晶パネルの製造方法を工程順に示す説明図である。
【図5】従来の液晶パネル用基板の貼り合わせ装置の一例を示す縦断正面図である。
【符号の説明】
A,B 基板 C 環状接着剤
S 閉空間 1 加圧板(上定盤)
1a 周縁部 1b 凹部
2 加圧板(下定盤) 2a 周縁部
3 保持手段 4 移動シール手段
5 第一加圧手段 6 吸気手段
7 第二加圧手段 7b 可撓性薄板材
7c 加圧部 8 位置決め手段
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention provides a liquid crystal panel substrate bonding apparatus for aligning (roughly and finely) two liquid crystal panel substrates in a vacuum in a manufacturing process of a liquid crystal panel used for a liquid crystal display (LCD). Related to the bonding method. Specifically, two substrates, each detachably held on a pair of upper and lower pressing plates, are superposed in a vacuum, and are relatively adjusted and moved in the X, Y, and θ directions by positioning means to roughly and finely adjust the two substrates. The present invention also relates to a bonding apparatus and a bonding method for a liquid crystal panel substrate in which both substrates are pressed and crushed to a predetermined gap.
[0002]
[Prior art]
Conventionally, as shown in FIG. 5, for example, this type of liquid crystal panel substrate bonding apparatus and bonding method includes a pair of upper and lower pressing plates 1 'and 2' and an entire positioning means 8 'such as an XY table. A vacuum chamber 11 is formed so as to be openable and closable in the vertical direction so as to surround it. A drive shaft 8c 'connecting the positioning means 8' and a drive source 8b 'thereof is connected to the vacuum chamber 11 by a vacuum penetrating part 12 such as a bellows. It is provided through.
After the vacuum chamber 11 is closed and the inside thereof is evacuated, the positioning means 8 'is actuated by the drive shaft 8c' from the outside to adjust the two pressing plates 1 'and 2' relatively in the XYθ direction. By being moved, the substrates A and B are roughly and finely aligned.
[0003]
[Problems to be solved by the invention]
However, in such a conventional liquid crystal panel substrate bonding apparatus and bonding method, since the positioning means in the vacuum chamber is moved XYθ by external drive transmission to perform alignment, the vacuum penetrating component of the drive shaft is required. In addition to the increase in complexity, the cost of shutting off the vacuum inside and outside the vacuum chamber increases, and depending on the viscosity of the sealing material, a considerable force is required for rough alignment and fine alignment, and there is a problem that there are many restrictions on the driving form.
In addition, since the vacuum chamber surrounds the entire pair of upper and lower pressure plates and the positioning means, the space for vacuum becomes large, and the capacity of the vacuum pump needs to be increased, and the size of the usable substrate is limited. Therefore, there is a problem that a large-sized substrate cannot be manufactured.
[0004]
According to one aspect of the present invention is intended to be aligned with XYθ moves only between the upper platen and the lower platen remains that external was sealed.
[0005]
[Means for Solving the Problems]
In order to achieve the above-described object, the invention according to claim 1 of the present invention includes a holding unit that immovably holds a substrate provided on a facing surface of an upper surface plate and a lower surface plate ,
The upper platen and lower platen opposing relatively movably supported to that move the sealing means to the XYθ direction while maintaining the sealed state between the peripheral portion,
And relatively moved closer to the upper platen and lower platen, pressure of approaching with both substrates between these upper platen and the lower platen to define a closed space to be surrounded by the two substrates to a predetermined distance Means,
Suction means for taking in and out gas in the closed space to a predetermined degree of vacuum,
In the operating state of the upper Symbol pressurizing means, and a positioning means is disposed outside the closed space in order to adjust the movement of the upper platen and lower platen relatively in XYθ direction,
The moving block of the moving sealing means provided annularly so as to surround both substrates and the upper platen are integrally connected in the XYθ directions, and the upper surface of the moving block is in close contact with the peripheral portion of the upper platen and is compressed and deformed. A movable annular seal material is mounted, and a drive vacuum seal that is always in contact with the peripheral portion of the lower platen is mounted on the lower surface of the moving block .
The invention according to claim 2 has a structure in which a load receiving ball for supporting the drive vacuum seal so that a force such as the weight of an upper platen or a moving block does not act is added to the structure of the invention according to claim 1. It is characterized by having.
According to a third aspect of the present invention, in the configuration of the first or second aspect, a plurality of connecting pins are reciprocally movable up and down in the XYθ direction from the upper surface plate to the moving block. Is characterized by adding a configuration in which it is immovably inserted.
[0006]
[Action]
According to the first aspect of the present invention, the upper surface plate and the lower surface plate holding the two substrates move close to each other, so that the space between the peripheral portions is sealed by moving sealing means to form a closed space. The two substrates approach each other up to a predetermined interval. Thereafter, while bleeding air in the closed space, the upper platen and the lower platen are relatively adjusted and moved in the XYθ directions, and the two substrates are roughly adjusted to each other. After the degree of vacuum has been reached, the moving seal means is deformed to further approach the position where the two substrates are sealed with the annular adhesive. In this state, the upper platen and the lower platen are relatively moved in the XYθ direction. The substrate is released from only one of the upper surface plate and the lower surface plate, and the inside of the closed space is returned to the atmospheric pressure. A predetermined gap is formed by being evenly crushed by the resulting pressure difference Things.
[0007]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In this embodiment, as shown in FIGS. 1 and 2, an upper pressing plate 1 is an upper platen supported so as to be able to reciprocate up and down but not move in XYθ directions. Is a lower platen supported on a fixed base plate 9 via a positioning means 8 such as an XY table so as to be adjustable in the XYθ direction. The lower platen is held by suction on the opposing surfaces of the upper platen 1 and the lower platen 2. The glass substrates A and B are aligned in a vacuum atmosphere.
[0008]
The upper stool 1 and the lower stool 2 are made of a rigid body such as metal or carbon. A plurality of suction holes are provided in the center of these opposing surfaces as holding means 3 for holding the substrates A and B immovably. The suction holes 3 are connected to a suction source (not shown) such as a vacuum pump by piping.
The operation of this suction source is controlled by a controller (not shown), and suction is started in an initial state in which both substrates A and B are set. After the suction of the substrate A is released and the closed space S described later returns to the atmospheric pressure, the suction of the lower substrate B is released to return to the initial state.
[0009]
These substrates A and B are composed of, for example, a color filter and a TFT substrate on which a desired pattern is formed, and are annularly bonded along one of these opposing surfaces, in the illustrated example, along the peripheral edge of the substrate B below. The agent C is applied in a frame shape, and a number of spacers (not shown) are sprayed on the other side as necessary.
[0010]
Further, between the peripheral portion 1a of the upper stool 1 and the peripheral portion 2a of the lower stool 2, a movable sealing means 4 for supporting the movable portions relatively in the XYθ directions while maintaining the hermetically sealed state therebetween is provided. Are provided in an annular shape so as to surround both substrates A and B.
In the case of the present embodiment, the moving seal means 4 includes a moving block 4a formed in a circular or rectangular cross section in accordance with the planar shape of the upper stool 1 and the lower stool 2, and an upper surface mounted on the upper surface of the moving block 4a. An annular sealing material 4b, such as an O-ring, which is elastically deformable in the vertical direction, such as an O-ring, which comes into contact with and separates from the peripheral portion 1a of the surface plate 1, and a peripheral portion 2a of the lower surface plate 2 mounted on the lower surface of the moving block 4a. Accordingly, the drive vacuum seal 4c is made of, for example, vacuum grease, and a load receiving ball 4d that supports the drive vacuum seal 4c so that a force such as the weight of the upper platen 1 or the moving block 4a does not act on the drive vacuum seal 4c. .
[0011]
In particular, if necessary, in order to connect the upper surface plate 1 and the moving block 4a integrally in the XYθ directions, a plurality of connecting pins 4e are vertically extended from the upper surface plate 1 to the moving block 4a. Although it is reciprocally movable, it is preferable that the movable block 4a and the lower platen 2 are inserted so as to be immovable in the X, Y, and θ directions. Is preferably crossed over.
[0012]
The upper platen 1 is provided with a first pressurizing means, such as a vertical drive cylinder, as indicated by reference numeral 5 in FIG.
The operation of the first pressurizing means 5 is controlled by a controller (not shown). In an initial state in which the substrates A and B are set, the upper platen 1 as shown by a dashed line in FIG. 1 and FIG. After the substrates A and B have been set, the upper platen 1 is lowered as shown in the solid line of FIG. 1 and FIG. A partition is formed so as to surround both substrates A and B, and after the fine alignment of both substrates A and B is completed, or after a closed space S described later returns to the atmospheric pressure, it is raised and returned to the initial state.
[0013]
The closed space S is communicated with, for example, a vacuum pump provided outside as shown by reference numeral 6 in FIG. Is provided.
The operation of the suction means 6 is controlled by a controller (not shown), and after the closed space S is formed by the approaching movement of the upper surface plate 1 and the lower surface plate 2, air suction is started from the closed space S. After the completion of the fine adjustment of B, air is supplied to the closed space S to return to the atmospheric pressure.
[0014]
Further, there is provided a second pressurizing means 7 for bringing the two substrates A and B brought closer by the first pressurizing means 5 closer to a position where the substrates A and B are closed by the annular adhesive C. In the case of the present embodiment, the second pressurizing means 7 comprises a vertically expandable and contractible cylinder 7a disposed from the upper surface of the moving block 4a toward the peripheral portion 1a of the upper platen 1. Is shortened in the vertical direction to compress and deform the annular seal 4b in the vertical direction, so that the substrates A and B are further pressed.
Further, the operation of the second pressurizing means 7 is controlled by a controller (not shown), and in the initial state, the second pressurizing means 7 extends in the vertical direction as shown in FIG. Thereafter, as shown in FIG. 2 (c), the length is shortened, and after fine alignment of the two substrates A and B is completed, or after a closed space S described later returns to the atmospheric pressure, it is raised and returned to the initial state.
[0015]
On the bottom surface of the lower stool 2 outside the closed space S, for example, an XY table 8a and a positioning means 8 including a drive source 8b for moving the lower stool 2 in the XYθ direction are continuously provided. By operating the drive source 8b based on the data output from the detection means 8c composed of a microscope and a camera, the lower platen 2 and the lower substrate B held by the lower platen XYθ are displayed on the marks displayed on the substrates A and B. Adjusting and moving in the direction, rough and fine adjustments are performed.
[0016]
Further, if necessary, the central portion of the opposing surface of the upper surface plate 1 and the lower surface plate 2 which comes into contact with both substrates A and B may be made of a material having excellent cushioning properties, but in the XYθ direction by the positioning means 8. The cushioning member 10 may be provided so as to have a thickness such that no positional deviation occurs during the adjustment movement.
In the case of the illustrated example, the cushioning material 10 having a thickness of several mm is provided only on the facing surface 2b of the lower surface plate 2, but the present invention is not limited thereto. Alternatively, the cushioning material 10 may be provided only on the facing surface of the upper stool 1.
[0017]
Next, a method of bonding the liquid crystal panel substrate will be described in the order of steps. First, as shown in FIG. 2A, substrates A and B are pre-aligned and set on opposing surfaces of an upper surface plate 1 and a lower surface plate 2, respectively.
As a result, both substrates A and B are suction-held by the holding means 3 so as to be immovable.
[0018]
Thereafter, the upper platen 1 and the lower platen 2 are brought close to each other by the operation of the first pressurizing means 5 as shown in FIG. 2 (b), and the peripheral portion 1a of the upper platen 1 comes into close contact with the annular seal 4b. A closed space S is defined between the board 1 and the lower stool 2 so as to surround the two substrates A and B thus held.
[0019]
At the same time, the substrates A and B approach each other up to a predetermined interval due to the approach movement of the upper surface plate 1 and the lower surface plate 2, and confront each other with a gap of 1 mm or less in this state.
However, the annular adhesive C applied to one of the substrates B does not contact the other substrate A, and the closed space S communicates between the two substrates A and B.
[0020]
Thereafter, the air is evacuated from the closed space S by the operation of the suction means 6 to achieve a predetermined degree of vacuum, and the air is also evacuated from between the substrates A and B to create a vacuum.
In this state, the upper surface plate 1 and the lower surface plate 2 are relatively adjusted and moved in the XYθ directions by the operation of the positioning means 8, so that the two substrates A and B are roughly aligned.
[0021]
Then, when a predetermined degree of vacuum is reached, the upper platen 1 and the lower platen 2 are further approached as shown in FIG. 2C by the operation of the second pressurizing means 7 to compress and deform the annular seal 4b. The two substrates A and B come closer to each other, and the other substrate A comes into close contact with the annular adhesive C applied to the one substrate B, so that the two are sealed.
In this state, the upper surface plate 1 and the lower surface plate 2 are relatively adjusted and moved in the X, Y, and θ directions by the operation of the positioning means 8, so that the two substrates A and B are finely adjusted.
[0022]
Thereafter, as shown in FIG. 2D, the suction of the upper substrate A is released only from the upper surface plate 1 by the operation of the holding means 3, and air is introduced into the closed space S by the operation of the suction means 6 to reduce the atmosphere. Return to atmospheric pressure.
Thereby, the substrates A and B are evenly crushed by a pressure difference between the inside and outside of the substrates, and a predetermined gap is formed.
[0023]
At this time, if a proper amount of liquid crystal is sealed in a proper state at the time before the rough alignment is performed, specifically, when the substrates A and B are set, the atmosphere in the closed space S is returned to the atmospheric pressure, and The gaps are evenly crushed by the pressure difference between the inside and outside of the substrates A and B, and a predetermined gap can be formed in a state where the liquid crystal is sealed. Thus, a liquid crystal panel can be manufactured without injecting the liquid crystal in a later process.
[0024]
Thereafter, when the inside of the closed space S returns to the atmospheric pressure, the closed space S is opened by the operation of the first pressurizing means 5 to separate the upper surface plate 1 and the lower surface plate 2, and the aligned substrates A, B And the above-described operation is repeated.
[0025]
Therefore, alignment can be performed by moving XYθ outside the upper surface plate 1 and the lower surface plate 2 while keeping only the space between the upper surface plate 1 and the lower surface plate 2 in a sealed state.
As a result, the positioning means 8 and its driving source 8b can be installed in the atmosphere, normal components can be used, and there are no vacuum penetrating components, thereby simplifying the structure and increasing the cost of vacuum shut-off. Since there is no need for a considerable force for rough alignment or fine alignment, there is no restriction on the driving mode.
In addition, the vacuum space can be minimized, and the capacity of the vacuum pump can be reduced accordingly, so that a large substrate can be manufactured with high productivity.
[0026]
Further, if necessary, a cushioning material 10 which is excellent in cushioning property and does not generate a positional shift when performing adjustment movement in the XYθ direction is disposed on one or both of the opposing surfaces of the upper surface plate 1 and the lower surface plate 2. When it is provided, it is possible to prevent the upper surface plate 1 and the lower surface plate 2 from coming into contact with each other and to easily form a uniform gap.
[0027]
On the other hand, what is shown in FIGS. 3 and 4 is another embodiment of the present invention, in which the second pressing means 7 moves from the upper surface of the moving block 4a to the peripheral portion 1a of the upper platen 1. Instead of the vertically extending and retractable cylinder 7a disposed toward the upper surface plate 1, a concave portion 1b formed at the center of the facing surface of the upper surface plate 1 is closed, and the upper substrate A is elastically deformable only in the vertical direction to keep the upper substrate A immovable. The flexible thin plate member 7b and the gas in the concave portion 1b closed by the flexible thin plate member 7b are taken in and out so that the flexible thin plate member 7b swells downward toward the substrate B during fine alignment. The configuration including the pressurizing portion 7c to be deformed is different from the embodiment shown in FIGS. 1 and 2, and the other configuration is the same as the embodiment shown in FIGS. 1 and 2.
[0028]
The flexible thin plate member 7b is formed so as to be elastically deformable in a vertical direction such as a metal film such as stainless steel but is not deformable in the XYθ directions. A hole is drilled.
The operation of the pressurizing section 7c is controlled by a controller (not shown), and the internal pressure of the closing recess 1b is closed by the intake means 6 until the state shown in FIG. 4A and the rough adjustment shown in FIG. Air is taken in and out so as to be the same as the internal pressure in the space S, and air is introduced only after the rough adjustment so that the internal pressure in the closed concave portion 1b becomes larger than the internal pressure in the closed space S as shown in FIG.
[0029]
Therefore, the one shown in FIG. 3 and FIG. 4 shows that after the rough alignment, the flexible thin plate member 7b swells and deforms due to an increase in the internal pressure of the closed recess 1b, as shown in FIG. By further bringing A closer to the lower substrate B and sealing between them with the annular adhesive C, the substrates A and B are evenly crushed to near the final gap at the time of fine alignment.
As a result, compared to the embodiment shown in FIGS. 1 and 2, the rigid upper platen 1 and lower platen 2 reduce the local pressure between the substrates A and B due to the flatness of the facing surface and the parallel accuracy between the platens. Although it is easy to invite, there is an advantage that the local pressurization between the substrates A and B can be completely prevented and the product is not damaged.
[0030]
In the embodiment described above, it is assumed that the upper pressing plate 1 is an upper platen capable of reciprocating vertically and the lower pressing plate 2 is a lower platen supported movably in the XYθ directions. However, the present invention is not limited to this, and conversely, the upper platen may be supported so as to be adjustable and movable in the XYθ directions, and the lower platen may be supported so as to be reciprocable vertically.
Furthermore, although the case where alignment is performed in a vacuum atmosphere has been described, the present invention is not limited to this, and the same applies to the case where alaminate is performed in a special gas atmosphere.
Further, the holding means 3, the moving sealing means 4, the first pressing means 5, the suction means 6, the second pressing means 7 and the positioning means 8 for the substrates A and B are not limited to the structures shown in the drawing, but similarly. Other structures may be used as long as they work.
In particular, the holding means 3 for holding the substrates A and B immovably can use vacuum suction utilizing a vacuum difference if the degree of vacuum in the closed space S by the suction means 6 is low vacuum. When the inside of the closed space S becomes high vacuum to the extent that it cannot be used, the substrates A and B need to be immovably held by using an electrostatic chuck or an adhesive film as the holding means 3.
Further, a magnetic fluid type vacuum seal may be used in place of the driving vacuum seal 4c of the moving sealing means 4.
[0032]
【The invention's effect】
As described above, the invention of claim 1 Symbol placement of the present invention is that two of the upper surface plate and lower surface plate which holds the substrate is moved closer, between the periphery of each other in the moving sealing means A closed space is defined by hermetic sealing, and both substrates approach each other up to a predetermined distance. Thereafter, while bleeding air from the closed space, the upper and lower stools are relatively adjusted and moved in the XYθ directions. After the two substrates are roughly aligned and reach a predetermined degree of vacuum, the moving sealing means is deformed to further approach the position where the two substrates are sealed with the annular adhesive. In this state, The upper surface plate and the lower surface plate are adjusted and moved relatively in the XYθ direction, and fine adjustment of both substrates is performed. Thereafter, the substrate is released from only one of the upper surface plate and the lower surface plate, and the inside of the closed space is moved. By returning to atmospheric pressure, the pressure is evenly distributed by the pressure difference between the inside and outside of both substrates. Since a predetermined gap is formed by crushing, it is possible to perform XYθ movement outside for alignment while keeping only the space between the upper surface plate and the lower surface plate in a sealed state.
Therefore, the positioning means and its driving source can be installed in the atmosphere as compared with the conventional method in which the positioning means in the vacuum chamber is moved by XYθ by external drive transmission, so that normal components can be used and the vacuum penetration can be performed. There are no parts, and as a result, the structure can be simplified, and there is no cost for breaking off the vacuum, and no considerable force is required for rough or fine adjustment, so that there is no restriction on the driving form.
In addition, the vacuum space can be minimized, and the capacity of the vacuum pump can be reduced accordingly, so that a large substrate can be manufactured with high productivity.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional front view of a liquid crystal panel substrate bonding apparatus according to an embodiment of the present invention.
FIGS. 2A to 2D are explanatory views showing a method of manufacturing a liquid crystal panel in the order of steps.
FIG. 3 is a longitudinal sectional front view of a liquid crystal panel substrate bonding apparatus according to another embodiment of the present invention.
FIGS. 4A to 4D are explanatory views showing a method of manufacturing a liquid crystal panel in the order of steps.
FIG. 5 is a longitudinal sectional front view showing an example of a conventional liquid crystal panel substrate bonding apparatus.
[Explanation of symbols]
A, B substrate C annular adhesive S closed space 1 pressure plate (upper platen)
1a Peripheral edge 1b Recess 2 Pressing plate (lower platen) 2a Peripheral edge 3 Holding means 4 Moving sealing means 5 First pressing means 6 Inhaling means 7 Second pressing means 7b Flexible thin plate material 7c Pressing section 8 Positioning means

Claims (3)

上定盤(1)及び下定盤(2)に対して夫々着脱自在に保持された二枚の基板(A,B)を、上定盤(1)と下定盤(2)との間に区画形成された真空な閉空間(S)内で重ね合わせ、位置決め手段(8)により相対的にXYθ方向へ調整移動して両基板(A,B)のアライメントを行い、更に両基板(A,B)の内外に生じる気圧差で所定のギャップまで潰す液晶パネル用基板の貼り合わせ装置において、
前記上定盤(1)及び下定盤(2)の対向面に設けられた基板(A,B)を移動不能に保持する保持手段(3)と、
上定盤(1)及び下定盤(2)の対向する周縁部(1a,2a)間の密閉状態を維持したまま相対的にXYθ方向へ移動自在に支持する移動シール手段(4)と、
上定盤(1)及び下定盤(2)を相対的に接近移動して、これら上定盤(1)及び下定盤(2)の間に両基板(A,B)が囲まれるように閉空間(S)を区画形成すると共に、両基板(A,B)を所定間隔まで接近させる加圧手段(5,7)と、
上記閉空間(S)内の気体を出し入れして所定の真空度にする吸気手段(6)と、
記加圧手段(5,7)の作動状態で、上定盤(1)及び下定盤(2)を相対的にXYθ方向へ調整移動させるための閉空間(S)外に配設した位置決め手段(8)とを備え
両基板(A,B)を囲むように環状に設けられた移動シール手段(4)の移動ブロック(4a)と上定盤(1)をXYθ方向へ一体的に連結させ、この移動ブロック(4a)の上面には上定盤(1)の周縁部(1a)と密接して圧縮変形可能な環状シール材(4b)を装着し、移動ブロック(4a)の下面には下定盤(2)の周縁部(2a)と常時接触する駆動真空シール(4c)を装着したことを特徴とする液晶パネル用基板の貼り合わせ装置。
The two substrates (A, B) detachably held on the upper surface plate (1) and the lower surface plate (2) are partitioned between the upper surface plate (1) and the lower surface plate (2). the formed vacuum closed space between superimposed within (S), performs alignment of two substrates to adjust moved relatively XYθ direction by the positioning means (8) (a, B), further two substrates (a, B In a device for bonding a substrate for a liquid crystal panel, which is crushed to a predetermined gap by a pressure difference generated inside and outside of the liquid crystal panel,
Holding means (3) for immovably holding substrates (A, B) provided on opposing surfaces of the upper surface plate (1) and the lower surface plate (2) ;
Upper platen (1) and the opposing periphery of the lower surface plate (2) and (1a, 2a) you relatively movably supported to the XYθ direction while maintaining the sealed state between moving sealing means (4) ,
The upper surface plate (1) and the lower surface plate (2) are moved relatively close to each other, and closed between the upper surface plate (1) and the lower surface plate (2) so that both substrates (A, B) are surrounded. Pressurizing means (5, 7) for partitioning the space (S) and bringing the two substrates (A, B) closer to a predetermined distance;
Suction means (6) for taking in and out gas in the closed space (S) to make a predetermined degree of vacuum;
In the operating state of the upper Symbol pressurizing means (5,7), positioning which is arranged in closed space (S) out of order to adjust moving the upper platen (1) and the lower surface plate (2) to relatively XYθ direction and means (8),
The moving block (4a) of the moving sealing means (4) and the upper platen (1), which are provided annularly so as to surround both substrates (A, B), are integrally connected in the XYθ direction. ) Is provided with an annular seal member (4b) which is in close contact with the peripheral portion (1a) of the upper platen (1) and which can be compressed and deformed, and the lower surface of the lower platen (2) is mounted on the lower surface of the moving block (4a). A device for bonding a substrate for a liquid crystal panel, comprising a driving vacuum seal (4c) which is always in contact with a peripheral portion (2a) .
前記駆動真空シール(4c)に上定盤Upper platen on the driving vacuum seal (4c) (( 1 )) や移動ブロック(4a)の重量などの力が作用しないように支持する荷重受ボール(4d)を設けたReceiving ball (4d) that supports so that a force such as the weight of the moving block (4a) or the like does not act. 請求項1記載の液晶パネル用基板の貼り合わせ装置。An apparatus for bonding a substrate for a liquid crystal panel according to claim 1. 前記上定盤(1)から移動ブロック(4a)に亘って複数本の連結ピン(4e)を、上下方向へは往復動自在であるがXYθ方向へは移動不能に挿通させた請求項1または2記載の液晶パネル用基板の貼り合わせ装置。A plurality of connecting pins (4e) are inserted through the upper platen (1) from the upper platen (1) to the moving block (4a) so as to be able to reciprocate up and down but not move in the XYθ directions. 3. The apparatus for bonding a substrate for a liquid crystal panel according to 2.
JP2000331179A 2000-10-30 2000-10-30 LCD panel substrate bonding equipment Expired - Fee Related JP3542956B2 (en)

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JP2000331179A JP3542956B2 (en) 2000-10-30 2000-10-30 LCD panel substrate bonding equipment
TW090126007A TWI250338B (en) 2000-10-30 2001-10-22 Lamination device for laminating substrate for liquid crystal panel
KR1020010066606A KR100653339B1 (en) 2000-10-30 2001-10-29 Apparatus and method for attaching substrate for Liquid Crystal Panel

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