JP2002236292A - Manufacturing method for liquid crystal panel and substrate sticking device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for a liquid crystal panel, by which manufacturing stages can be simplified and to provide a substrate sticking device used for the method. SOLUTION: In a substrate sticking stage, a lower substrate 4 is attracted to a lower surface plate 2 through an elastic body 5 in which attracting holes 51 are formed with a pitch 52 which is integral multiple of a pitch 22 of an attracting grooves 21 of the lower surface plate 2. After the positioning of an upper and a lower substrates 3 and 4 is performed, the substrates are stuck to each other by pressing the substrates through an upper surface plate 1 and the lower surface plate 2 to crush a sealing resin 6. Even if the surface working precision of the upper and the lower surface plates 1 and 2 is insufficient, sticking and uniform pressing of the upper and the lower substrates 3 and 4 can be simultaneously performed and a pressing stage for crushing the sealing resin, which has been conventionally needed after the substrate sticking stage, is not required and the manufacturing stages can be simplified.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a liquid crystal panel and a substrate bonding apparatus used for the method.

[0002]

2. Description of the Related Art FIG. 3 is a schematic cross-sectional view showing a substrate bonding step in a conventional liquid crystal panel manufacturing method. As shown in FIG. 3, in the conventional liquid crystal panel, the upper and lower substrates 3, 4 are directly vacuum-adsorbed to the upper and lower platens 1, 2, and
After the alignment of the above, the bonding was performed.

[0003]

The cell gap accuracy required for a liquid crystal panel is generally ± 0.3 μm for a TN panel.
Hereinafter, it is ± 0.05 μm or less for STN panels,
On the other hand, the planar processing accuracy of the upper and lower stools 1 and 2 made of metal can be expected only about ± 20 μm. For this reason, it is impossible to pressurize the upper and lower substrates 3 and 4 uniformly in the conventional substrate bonding process. It was necessary to pressurize the upper and lower substrates 3 and 4 uniformly by using a pressing machine to crush the sealing resin 6 by a predetermined amount. As described above, conventionally, after the substrate bonding step, a separate pressurizing step was required to uniformly crush the seal resin 6.

An object of the present invention is to provide a method of manufacturing a liquid crystal panel which can simplify a manufacturing process, and a substrate bonding apparatus used for the method.

[0005]

According to a first aspect of the present invention, there is provided a method of manufacturing a liquid crystal panel, comprising the steps of:
A step of applying a sealing material for bonding the pair of substrates and sealing the liquid crystal, and using a substrate bonding apparatus having an upper surface plate and a lower surface plate, one of the substrates is With the suction surface of the side platen having suction grooves or suction holes formed thereon, the vacuum suction is performed through the elastic body having the suction holes formed therein, and the other substrate is vacuum suctioned to the suction surface of the upper surface plate, A pair of substrates are opposed to each other to perform alignment, and a substrate bonding step of pressing the pair of substrates through the upper surface plate and the lower surface plate and crushing and sealing the sealing material is performed. The pitch is such that in the substrate bonding step, pressure unevenness on a pair of substrates due to mechanical interference caused by the mutual positional relationship between the suction holes of the elastic body and the suction grooves or suction holes of the lower surface plate, The suction groove or suction hole on the lower platen Characterized in that it is a 1-fold Tsu integral multiple or an integer fraction of the switch.

According to the manufacturing method of the first aspect, in the substrate bonding step, the substrate is sucked to the lower surface plate through the elastic body having the suction hole formed therein, and the position is adjusted. By pressing the substrates and squeezing the sealing material and bonding them together, even if the surface processing accuracy of the upper and lower platens is insufficient, a pair of substrates can be uniformly pressed at the same time as the bonding. A pressing step for crushing the sealing material, which was conventionally required after the bonding step, is not required, and the manufacturing process can be simplified. Also,
By making the pitch of the suction holes of the elastic body an integral multiple or a fraction of the pitch of the suction grooves or the suction holes of the lower surface plate, the suction holes of the elastic material and the suction grooves of the lower surface plate are made. Alternatively, unevenness in pressurization of the pair of substrates due to mechanical interference caused by the mutual positional relationship with the suction holes is suppressed, and a liquid crystal panel having a uniform cell gap can be produced.

According to a second aspect of the invention, there is provided a method of manufacturing a liquid crystal panel.
A step of applying a sealing material for bonding the pair of substrates and sealing the liquid crystal to one of the pair of substrates, and dropping a predetermined amount of a liquid crystal material on one of the pair of substrates; Process, using a substrate bonding apparatus having an upper surface plate and a lower surface plate in a chamber, and forming a suction groove or a suction hole of the lower surface plate on one of the pair of substrates on which the liquid crystal material is dropped. Vacuum suction is performed on the suction surface that has been formed through an elastic body having suction holes, and the other substrate is vacuum-adsorbed to the suction surface of the upper surface plate, and the inside of the chamber is set to a vacuum degree lower than the vacuum suction of the substrate. In the held state, a pair of substrates are positioned to face each other, alignment is performed, and a substrate bonding step is performed in which the pair of substrates are pressed through the upper surface plate and the lower surface plate, and the sealing material is crushed and bonded.
The pitch of the suction holes of the elastic body is such that the unevenness of the pressure applied to a pair of substrates due to mechanical interference caused by the mutual positional relationship between the suction holes of the elastic body and the suction grooves or the suction holes of the lower surface plate in the substrate bonding process. The pitch of the suction grooves or the suction holes of the lower surface plate is an integral multiple or 1 / integer of the pitch of the lower surface plate so as to suppress the above.

According to the manufacturing method of the second aspect, in the substrate bonding step, the substrate is sucked through the elastic body having the suction hole formed on the lower surface plate, and the position is adjusted. By pressing the substrates and squeezing the sealing material and bonding them together, even if the surface processing accuracy of the upper and lower platens is insufficient, a pair of substrates can be uniformly pressed at the same time as the bonding. A pressing step for crushing the sealing material, which was conventionally required after the bonding step, is not required, and the manufacturing process can be simplified. Also,
By making the pitch of the suction holes of the elastic body an integral multiple or a fraction of the pitch of the suction grooves or the suction holes of the lower surface plate, the suction holes of the elastic material and the suction grooves of the lower surface plate are made. Alternatively, unevenness in pressurization of the pair of substrates due to mechanical interference caused by the mutual positional relationship with the suction holes is suppressed, and a liquid crystal panel having a uniform cell gap can be produced.

A method for manufacturing a liquid crystal panel according to claim 3 is
For upper surface plate and lower surface plate in substrate bonding process
The degree of vacuum of vacuum suction of the substrate is 0.1 × 1.33322.
× 10^TwoPa or less and the degree of vacuum in the vacuum chamber
0.5 × 1.33322 × 10 ^TwoPa-1.0 x 1.3
3322 × 10^TwoIt is characterized by Pa. This
It is preferable to set the degree of vacuum as described above.

According to a fourth aspect of the present invention, there is provided a substrate bonding apparatus comprising an upper surface plate and a lower surface plate each having a suction groove or a suction hole formed on a substrate suction surface, and the upper surface plate and the lower surface plate adsorb. A pair of substrates can be held at a fixed distance for positioning, and a pair of substrates can be pressurized via an upper surface plate and a lower surface plate, and the substrate suction surface of the lower surface plate An elastic body having suction holes formed therein is installed, and the pitch of the suction holes of the elastic body is an integral multiple or a fraction of the pitch of the suction grooves or the suction holes of the lower surface plate. .

By using the substrate bonding apparatus according to the fourth aspect, the substrate bonding step according to the first aspect can be performed, and the manufacturing process can be simplified.

According to a fifth aspect of the present invention, there is provided a substrate bonding apparatus according to the fourth aspect, wherein an upper surface plate and a lower surface plate provided with an elastic body are provided in a chamber capable of adjusting an internal pressure. It is a thing.

By using the substrate bonding apparatus according to the fifth aspect, the substrate bonding step according to the second and third aspects can be performed, and the manufacturing process can be simplified.

[0014]

Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic view of a substrate bonding step in the first method for manufacturing a liquid crystal panel of the present invention. FIG. 1A is a sectional view, FIG. 1B is a plan view of an elastic body 5, and FIG. c) shows a plan view of the lower stool 2. FIG. 2 is a schematic sectional view showing a substrate bonding step in the second liquid crystal panel manufacturing method of the present invention. FIG. 1 shows the case where the filling of the liquid crystal is performed by the vacuum injection method, and FIG. 2 shows the case where the filling of the liquid crystal is performed by the liquid crystal dropping method.

In the following, seven sets of 10.4 inch amorphous silicon TFT liquid crystal panels were manufactured under different conditions and compared.

First, a panel having a size of 300 mm × 400 mm and a 10.4 inch panel is patterned on two sides.
Prepare 7 sets of FT array substrate and color filter substrate, wash and form polyimide alignment film on each substrate,
Hardening and a predetermined rubbing treatment were performed.

Next, resin spacer particles 7 having a particle size of 4.5 μm are arranged on the array substrate side at 100 to 100 mm 2 per square millimeter.
200 pieces were sprayed, and on the color filter side, a UV-curable sealing resin 6 containing 2.0% of glass fiber having a fiber diameter of 5.5 μm was pattern-formed by screen printing. At this time, a pattern having an injection port is provided on the first to fourth sets of color filter substrates, and the fifth to seventh sets are provided.
A pattern having no injection port was formed on each of the set of color filter substrates.

Using these seven sets of array substrates and color filter substrates, they were bonded as follows.

First, the first set was bonded using a conventional manufacturing method. As shown in FIG. 3, the color filter substrate is vacuum-adsorbed to the lower surface plate 2 as the lower substrate 4 and the array substrate is vacuum-adsorbed to the upper surface plate 1 as the upper substrate 3 to hold the upper and lower substrates 3 and 4 at a fixed distance. After positioning (alignment), the upper and lower substrates 3 and 4 were bonded together.

Next, the bonded substrate was taken out of the substrate bonding apparatus, subjected to vacuum packing (pressurizing step) to crush the sealing resin 6, and then cured by irradiation with ultraviolet rays.

As shown in FIG. 1A, the second to fourth sets were bonded by inserting an elastic body 5 between the lower platen 2 and the lower substrate 4 of the substrate bonding apparatus. Here, three kinds of elastic members 5 made of silicon rubber having a thickness of 1.2 mm and pitches 52 of suction holes 51 shown in FIG. 1B of 6 mm, 10 mm and 24 mm were prepared. The pitch 22 of the suction grooves 21 of the lower platen 2 of the substrate bonding apparatus used here was 12 mm. This will be described in detail below.

Vacuum is applied to the lower platen (lower platen) 2 via the elastic body 5 prepared in advance as a color filter substrate as the lower substrate 4 and to the upper platen (upper platen) 1 as the array substrate as the upper substrate 3. After the suction and holding of the upper and lower substrates 3 and 4 at a predetermined distance for alignment (alignment), the upper and lower substrates 3 and 4 are bonded to each other, and the upper and lower substrates 1 and 2 are connected to each other.
Pressure was applied with 5 tons to sufficiently crush the sealing resin 6.
At this time, it is necessary to fix the upper and lower bases 1 and 2 by vacuum suction so that the positioning of the upper and lower substrates 3 and 4 does not shift. For this reason, the elastic body 5 installed between the lower substrate 4 and the lower base 2 is required. It is necessary to leave the suction hole 51 open. 2nd set, 3rd
The pitches 52 of the suction holes 51 of the elastic body 5 used for assembling the set and the fourth set were 10 mm, 6 mm, and 24 mm, respectively.

Next, the bonded substrates (the second to fourth sets) were taken out of the substrate bonding apparatus, and the sealing resin 6 was cured by irradiation with ultraviolet rays.

After cutting the peripheral parts of the first to fourth sets of bonded substrates, a liquid crystal material was filled by using a vacuum injection method, and the injection port was sealed to produce a liquid crystal panel.

As shown in FIG. 2, a fifth set to a seventh set are prepared by dropping a liquid crystal material 8 on a color filter substrate in advance, and then, similarly to the second to fourth sets, of a substrate bonding apparatus. The elastic body 5 was inserted between the lower surface plate 2 and the lower substrate 4 and bonded. The details will be described below. The plan view of the elastic body 5 and the lower surface plate 2 in FIG. 2 is shown in FIG.
Same as (c).

The color filter substrate on which the liquid crystal material 8 has been previously dropped is vacuum-adsorbed to the lower surface plate 2 via the elastic body 5 as the lower substrate 4 and the array substrate to the upper surface plate 1 as the upper substrate 3 to form a vacuum chamber 9 The degree of vacuum inside is 0.5 × 1.33
322 × 10 ² Pa to 1.0 × 1.33322 × 10 ²
Vacuuming was performed until Pa was reached. At this time, the degree of vacuum of vacuum suction of the substrate by the upper and lower platens 1 and 2 is 0.1 × 1.
33322 × 10 ² Pa or less.

Here, the degree of vacuum in the vacuum chamber 9 is
0.5 × 1.33322 × 10^TwoIf less than Pa,
The vacuum suction force between the upper substrate 3 and the upper surface plate 1 becomes insufficient.
Vacuum suction between the lower substrate 4 and the lower platen 2 via the elastic body 5.
Insufficient adhesion may cause the upper substrate 3 to fall or
Mention shift occurs. In addition, the true
Void is 1.0 × 1.33322 × 10^TwoPlace that exceeds Pa
In this case, bubbles will remain in the LCD panel.
U. In addition, the vacuum of vacuum suction of the substrate by the upper and lower
The degree is 0.1 × 1.33322 × 10^TwoIf it exceeds Pa,
The vacuum suction force between the upper substrate 3 and the upper platen 1 or the lower substrate 4
Insufficient vacuum suction force with lower platen 2 via elastic body 5
As described above, the drop of the upper substrate 3 and misalignment
appear. The vacuum suction of the substrate by the upper and lower platens 1 and 2
The degree of vacuum is preferably closer to 0 Pa, and theoretically 0 Pa
Is the best, but in fact, the design of the pump and the vacuum system
There is a limit of the degree of vacuum possible, and in this embodiment,
0.05 × 1.33322 × 10 ^TwoPa is the limit
Was. In the present embodiment, the elastic body 5 is made of silicon rubber.
Is used. There is a pore expansion in a porous elastic body,
I can not use it. In addition, paper or a material with a high elastic modulus (hard
) Is not preferable because the pressure is not uniform.
It is considered that the smaller the elastic modulus, the better.

After the upper and lower substrates 3 and 4 are held at a predetermined distance for alignment (alignment) while holding the inside of the vacuum chamber 9 at the above-mentioned degree of vacuum, the upper and lower substrates 3 and 4 are bonded to each other. The sealing resin 6 was sufficiently crushed by applying a pressure of 1.5 tons through the platens 1 and 2. At this time, it is necessary to fix the upper and lower bases 1 and 2 by vacuum suction so that the positioning of the upper and lower substrates 3 and 4 does not shift. For this reason, the elastic body 5 installed between the lower substrate 4 and the lower base 2 is required. It is necessary to leave the suction hole 51 open. Fifth, sixth, seventh
Pitch 52 of suction holes 51 of elastic body 5 used for assembling sets
Were 10 mm, 6 mm, and 24 mm, respectively.

Next, the bonded substrates (fifth to seventh sets) are taken out of the substrate bonding apparatus, the sealing resin 6 is cured by ultraviolet irradiation, and the peripheral portion of the substrate is cut. Then, a liquid crystal panel was produced. As described above, when the liquid crystal material 8 is dropped before bonding the substrates, the steps of vacuum injection and sealing of the injection port (sealing) can be omitted.

The cell gaps of the first to seventh sets of liquid crystal panels produced as described above were measured (100 points in the plane). Further, peripheral circuits were mounted, panel display was performed, and a visual evaluation of display uniformity was performed. Table 1 shows the results. The cell gap uniformity 3σ in Table 1 is a value three times the standard deviation σ, assuming that the dispersion of the measured values in the cell gap measurement is a normal distribution.

[0031]

[Table 1]

As is clear from Table 1, in order to obtain the same cell gap accuracy as that of the first set of the conventional method, as shown in the fourth set and the seventh set, the insert between the lower substrate 4 and the lower surface plate 2 is required. The pitch 52 of the suction holes 51 of the elastic body 5 to be formed is an integral multiple of the pitch 22 of the suction grooves 21 of the lower surface plate 2, or as in the third and sixth sets, Pitch 2
2 is an integral multiple of the pitch 52 of the suction holes 51 of the elastic body 5, that is, the pitch 52 of the suction holes 51 of the elastic body 5 is an integral multiple of the pitch 22 of the suction grooves 21 of the lower surface plate 2. is necessary.

When the suction hole pitch 52 of the elastic body 5 and the suction groove pitch 22 of the lower platen 2 do not satisfy the above relationship, the pitch corresponding to the least common multiple of the suction hole pitch 52 and the suction groove pitch 22 is set. Display unevenness occurs (second set, fifth set). This is because the mechanical interference caused by the mutual positional relationship between the suction hole 51 of the elastic body 5 and the suction groove 21 of the lower surface plate 2 is reflected on the loads applied to the upper and lower substrates 3 and 4 when the substrates are pressed. The above-described design can avoid interference and uniform the cell gap.

As described above, in the substrate bonding step, the lower platen 2 is provided on the lower platen 2 with an integral multiple or a fraction of the pitch 22 of the suction grooves 21 of the lower platen 2 (the integer is 1, 2, 3,...).
After the lower substrate 4 is sucked through the elastic body 5 having the suction holes 51 formed at the pitch 52 of () and the upper and lower substrates 3 and 4 are aligned, the lower substrate 4 is moved through the upper surface plate 1 and the lower surface plate 2. By pressurizing and squeezing the seal resin 6 and laminating, even if the planar processing accuracy of the upper and lower platens 1 and 2 is insufficient, the upper and lower substrates 3 and 4 can be uniformly pressed simultaneously with the lamination. A pressure step for crushing the sealing resin, which is conventionally required after the bonding step, is not required, so that the manufacturing process can be simplified and a liquid crystal panel having a uniform cell gap can be produced.

When the suction grooves 21 are arranged on the lower surface plate 2 at a pitch 22 in the x direction (lateral direction) as shown in FIG. 1C, the suction holes 51 of the elastic body 5 are in the x direction (lateral direction). ) Are arranged at a pitch 52 so that the pitch 52 satisfies the relationship of the integral multiple of the pitch 22 or 1 / integer. In this case, the pitch of the suction holes 51 of the elastic body 5 in the y-direction (vertical direction) may be the same as or different from the pitch 52 of the x-direction. At intervals). Also in this case,
In actual operation, by increasing the number of the suction holes 51 of the elastic body 5, the overlap between the suction holes 51 of the elastic body 5 and the suction grooves 21 of the lower stool 2 can be sufficiently achieved without adjusting the position. Is obtained.

On the other hand, when the lower platen 2 is provided with suction holes instead of the suction grooves 21, the suction holes are arranged in the x direction and the y direction like the suction holes 51 of the elastic body 5. They are arranged at a pitch (or at equal intervals). In this case, the pitch 52 of the suction holes 51 of the elastic body 5 in the x direction satisfies the relationship of an integral multiple or a fraction of the pitch of the suction holes of the lower stool 2 in the x direction. The pitch of the holes 51 in the y direction is set to satisfy the relationship of an integral multiple or a fraction of the integer of the pitch of the suction holes of the lower platen 2 in the y direction. Also in this case, in actual operation, by increasing the number of the suction holes 51 of the elastic body 5, the suction holes 51 of the elastic body 5 and the suction holes of the lower stool 2 can be formed without adjusting the position. Are sufficiently obtained.

The upper surface plate 1 is provided with a suction groove or a suction hole (not shown) for sucking the upper substrate 3 on a surface on which the upper substrate 3 is sucked.

The substrate bonding apparatus in the case of FIG. 1 includes the upper surface plate 1 and the lower surface plate 2 having the suction grooves or the suction holes formed on the substrate suction surface as described above, respectively. The upper and lower substrates 3 and 4 adsorbed on the substrate 2 can be aligned while holding them at a fixed distance, and the upper and lower substrates 3 and 4 can be pressed via the upper and lower stools 1 and 2. At the same time, the elastic body 5 having the suction holes 51 formed on the substrate suction surface of the lower stool 2 is installed, and the pitch of the suction holes 51 of the elastic body 5 is set so as to satisfy the above-described relationship.

Further, the substrate bonding apparatus in the case of FIG. 2 has the configuration of the substrate bonding apparatus in FIG. 1 provided in a chamber 9 capable of adjusting the internal pressure.

In this embodiment, the elastic member 5 is made of silicon rubber. However, as the elastic member 5, for example, Japanese Patent Application Laid-Open No. H11-264991 (Japanese Patent Application No.
No. 136924), a two-layer structure having a flexible portion and a rigid portion is used, and a suction hole 51 is provided therein as in the present embodiment. By providing the lower substrate 4 so as to be in contact therewith, the uniformity of the cell gap in the panel surface can be further improved.

In this embodiment, the case where the spacer particles 7 for defining the cell gap are sprayed on the upper substrate 3 side as shown in FIGS. , May be sprayed on the lower substrate 4 side. Instead of spraying the spacer particles 7, a photosensitive resin is applied to one of the upper substrate 3 and the lower substrate 4 to form a pattern of projections by applying a photolithography technique, or a resin is formed. May be printed to provide projections.

As shown in FIG. 1, a sealing resin 6 for bonding the upper and lower substrates 3 and 4 and sealing the liquid crystal is provided on the lower substrate 4.
However, it may be formed not on the lower substrate 4 but on the upper substrate 3. However, in the case of FIG. 2, it is preferable that the sealing resin 6 is formed on the lower substrate 4 on which the liquid crystal material 8 is dropped.

In the present embodiment, the color filter substrate is the lower substrate 4 and the TFT array substrate is the upper substrate 3. On the contrary, the color filter substrate is the upper substrate 3 and the TFT array substrate is the lower substrate. The substrate 4 may be used.

[0044]

As described above, according to the present invention, in the substrate bonding step, the pitch of the suction groove or the suction hole of the lower surface plate is an integral multiple or 1 / integer of the pitch of the lower surface plate. The substrate is sucked through the elastic body having the suction holes formed therein,
After aligning the pair of substrates, the pair of substrates is pressed through the upper and lower platens, and the sealing material is crushed and adhered to each other, thereby deteriorating the planar processing accuracy of the upper and lower platens. Even if it is sufficient, a pair of substrates can be uniformly pressed at the same time as the bonding, and the pressing process for crushing the sealing material, which was conventionally required after the substrate bonding process, is not required, and the manufacturing process is not required. Simplification can be achieved, and a liquid crystal panel having a uniform cell gap can be produced.

[Brief description of the drawings]

FIG. 1A is a schematic cross-sectional view illustrating a substrate bonding step in a first liquid crystal panel manufacturing method of the present invention, and FIG.
Is a schematic plan view of the elastic body, and (c) is a schematic plan view of the lower platen.

FIG. 2 is a schematic cross-sectional view showing a substrate bonding step in a second liquid crystal panel manufacturing method of the present invention.

FIG. 3 is a schematic cross-sectional view showing a substrate bonding step in a conventional liquid crystal panel manufacturing method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Upper surface plate 2 Lower surface plate 21 Lower surface plate suction groove 22 Lower surface plate suction groove pitch 3 Upper substrate 4 Lower substrate 5 Elastic body 51 Elastic body adsorption hole 52 Elastic body adsorption hole pitch 6 Seal resin 7 Spacer particles 8 Liquid crystal material 9 Vacuum chamber

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Hideki Matsukawa 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F term (reference) 2H088 FA30 HA08 HA12 MA17 2H089 LA49 QA14 TA09 TA12 2H090 JC11 LA15

Claims (5)

[Claims] A step of applying a sealing material for bonding the pair of substrates and sealing a liquid crystal to one of the pair of substrates; and a substrate having an upper platen and a lower platen. Using a bonding device, one of the pair of substrates is vacuum-adsorbed to the suction surface of the lower platen on which the suction groove or the suction hole is formed via an elastic body having a suction hole. In a state where the other substrate is vacuum-sucked to the suction surface of the upper surface plate, the pair of substrates are aligned with each other by facing each other, and the pair of substrates is moved through the upper surface plate and the lower surface plate. A substrate bonding step of pressing and squeezing the sealing material to bond the sealing material, wherein the pitch of the suction holes of the elastic body is the suction hole of the elastic body and the suction groove of the lower surface plate in the substrate bonding step. Position relative to the suction hole The pitch of the suction grooves or suction holes of the lower platen is an integral multiple or a fraction of an integer so as to suppress unevenness in pressure on the pair of substrates due to mechanical interference generated in the step. Liquid crystal panel manufacturing method. 2. A step of applying a sealing material for bonding the pair of substrates and sealing liquid crystal to one of the pair of substrates; and applying a sealing material to one of the pair of substrates. A step of dropping a fixed amount of liquid crystal material, and using a substrate bonding apparatus having an upper surface plate and a lower surface plate in a chamber, one of the pair of substrates onto which the liquid crystal material is dropped is placed on the lower side. The suction surface of the surface plate having the suction groove or the suction hole formed thereon is vacuum-sucked through the elastic body having the suction hole formed therein, and the other substrate is vacuum-sucked to the suction surface of the upper surface plate, and the chamber While holding the inside at a degree of vacuum lower than the vacuum suction of the substrate, the pair of substrates are opposed to each other to perform alignment,
A substrate bonding step in which the pair of substrates are pressed through the upper surface plate and the lower surface plate, and the sealing material is crushed and bonded to each other. In the lower fixed portion, the unevenness of the pressure applied to the pair of substrates due to mechanical interference generated by the mutual positional relationship between the suction hole of the elastic body and the suction groove or the suction hole of the lower platen is suppressed. A method of manufacturing a liquid crystal panel, wherein the pitch is an integral multiple or a fraction of an integral pitch of a suction groove or a suction hole of a board. 3. The degree of vacuum suction of a substrate by an upper surface plate and a lower surface plate in a substrate bonding step is set to 0.1 ×.
1.33322 × and 10 ² Pa or less, 0.5 × the degree of vacuum in the vacuum chamber 1.33322 × 10 ² Pa to
3. The method for manufacturing a liquid crystal panel according to claim ^{2, wherein the} pressure is set to 1.0 × 1.33322 × 10 ² Pa. 4. An upper surface plate and a lower surface plate each having a suction groove or a suction hole formed on a substrate suction surface, and a fixed distance between a pair of substrates sucked on the upper surface plate and the lower surface plate. The upper platen and the lower platen can be positioned and pressurized on the pair of substrates via the upper platen and the lower platen, and a suction hole is formed on the substrate suction surface of the lower platen. Wherein the pitch of the suction holes of the elastic body is an integral multiple or a fraction of the pitch of the suction grooves or the suction holes of the lower surface plate. apparatus. 5. In a chamber capable of adjusting the internal pressure,
The substrate bonding apparatus according to claim 4, further comprising a lower surface plate on which the upper surface plate and the elastic body are installed.