JP2000137235A - Sticking method of liquid crystal substrate - Google Patents

Sticking method of liquid crystal substrate

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Publication number
JP2000137235A
JP2000137235A JP31178498A JP31178498A JP2000137235A JP 2000137235 A JP2000137235 A JP 2000137235A JP 31178498 A JP31178498 A JP 31178498A JP 31178498 A JP31178498 A JP 31178498A JP 2000137235 A JP2000137235 A JP 2000137235A
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Prior art keywords
substrate
substrates
fixed
sticking
liquid
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JP31178498A
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Japanese (ja)
Inventor
Norihiko Egami
Hideki Matsukawa
Naoto Sakai
Shiro Sumida
Nobuo Yasuhira
宣夫 安平
秀樹 松川
典彦 江上
祉郎 炭田
直人 酒井
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Matsushita Electric Ind Co Ltd
松下電器産業株式会社
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Abstract

PROBLEM TO BE SOLVED: To contrive improvement of yield and quality by securing gap preci sion between two substrates in sticking the two substrates of a liquid crystal display device. SOLUTION: In sticking two substrates opposing each other, one substrate 23 is fixed by a fixing pin 25 with mounting it on a fixed disk 24 and the other substrate 26 is fixed by vacuum suction with a suction system 27 in a groove hole diameter of <=3 mm or a groove width of <=3 mm. And after carrying out positioning by relatively moving one substrate and the other, these two substrates are stuck with an adhesive 21 by pressurizing.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、パーソナルコンピュータやTV受像機等の画像表示パネルとして用いられる液晶表示装置などの液晶基板の貼り合わせ方法に関する。 The present invention relates to relates to bonding method for a liquid crystal substrate such as a liquid crystal display device used as an image display panel such as a personal computer or a TV receiver.

【0002】 [0002]

【従来の技術】従来の液晶表示装置の基板の貼り合わせ方法について図5〜図7を用いて説明する。 It will be described with reference to FIGS. 5 to 7 for bonding method for a substrate of a conventional liquid crystal display device. 液晶表示装置の構造は、図5に示すように、対向して配置された透光性材料からなる下基板1と上基板2との間に一定のギャップを保ちながら、その間に紫外線硬化型の接着剤3 Structure of the liquid crystal display device, as shown in FIG. 5, while maintaining a constant gap between the lower substrate 1 and the upper substrate 2 made of opposing light-transmitting material disposed, ultraviolet curable therebetween adhesive 3
が配置される。 There are located. この図5では、予め下基板1に四角枠状の接着剤3が塗布されたのち、上基板2をかぶせて接着するようにしている。 In FIG. 5, after the rectangular frame-like adhesive 3 it is applied in advance on the lower substrate 1, and to adhere covered on the substrate 2. また、図6(a)〜(c)に示すように液晶材料4を接着剤3内に配置する一つの方法として、下基板1の表面に、接着剤3を厚み30μmで四角枠状に塗布した後、接着剤3の四角枠の内部に液晶材料4を滴下し、その後、上基板2を重ね合わせて上基板2と下基板1の間隔を5μmまで加圧し、紫外線5により接着剤3を硬化させてパネルを完成させる液晶滴下工法がある。 Further, as a method of placing the liquid crystal material 4 in the adhesive 3 as shown in FIG. 6 (a) ~ (c), the surface of the lower substrate 1, a rectangular frame of an adhesive 3 to a thickness 30μm applied after, it dropped liquid crystal material 4 inside the rectangular frame of the adhesive 3, then pressurizing the spacing of the upper substrate 2 and lower substrate 1 to 5μm by superimposing on the substrate 2, an adhesive 3 by ultraviolet 5 cured there is a liquid crystal dropping process to complete the panel.

【0003】以下、2枚の基板の貼り合わせ方法に関して図7(a)〜(d)を用いて詳細に説明する。 [0003] Hereinafter, will be described in detail with reference to FIG. 7 (a) ~ (d) with respect to the bonding method of the two substrates. まず、 First of all,
図7(a)に示すように、表面に厚み30μmで四角枠状に塗布された紫外線硬化型の接着剤3及び該接着剤3 Figure 7 (a), the surface of the ultraviolet-curable coated in a square frame shape with a thickness 30μm adhesive 3 and the adhesive 3
の四角枠の内部に液晶4が配置された下基板1を、水平方向に移動可能なテーブル6上に搭載し、その周辺を固定ピン7で固定する。 Of the lower substrate 1, a liquid crystal 4 is disposed inside the rectangular frame, is mounted on the horizontally movable table 6, to fix the periphery thereof with fixing pins 7. 次に、図7(b)に示すように、 Next, as shown in FIG. 7 (b),
真空チャンバーC内で、上記下基板1に対向するように所定の間隔で配置された他方の上基板2の外側面全体を吸着機構8による真空吸着で固定する。 In the vacuum chamber C, and fixing the entire outer surface of the other on the substrate 2 arranged at a predetermined interval so as to face the lower substrate 1 in the vacuum suction by the suction mechanism 8. 次に、図7 Next, as shown in FIG. 7
(b)に示すように、真空チャンバーC内で、下基板1 (B), the in a vacuum chamber C, the lower substrate 1
を搭載したテーブル6を水平移動して、下基板1と上基板2との位置合わせをする。 The table 6 mounted with horizontally moving, the alignment of the lower substrate 1 and the upper substrate 2. 次に、図7(c)に示すように、真空チャンバーC内で、上基板2を垂直方向に5 Next, as shown in FIG. 7 (c), in a vacuum chamber C, and the upper substrate 2 in the vertical direction 5
μmまで加圧し、上基板2を接着剤3を介して下基板1 μm to pressurized under the upper substrate 2 through an adhesive 3 substrate 1
に貼り合わせる。 Bonded to. その後、図7(d)に示すように、紫外線5を照射して接着剤3を硬化させて、下基板1と上基板2の貼り合わせを完了する。 Thereafter, as shown in FIG. 7 (d), ultraviolet rays 5 are irradiated to cure the adhesive 3 to complete the bonding of the lower substrate 1 and the upper substrate 2.

【0004】 [0004]

【発明が解決しようとする課題】しかしながら、このような従来の方法では、上基板2の外側面全体を吸着する吸着機構8の各吸着穴の穴径が5mm以上又は吸着溝部の溝幅が5mm以上であるため、大気中及び真空中での基板変形が大きくなり、特に0.7mmの板厚の上基板2の場合、吸着穴又は吸着溝部において基板が部分的に大きく膨らんでしまい、下基板1との間でのギャップ精度が0.1μm以上になってしまい、ギャップムラによる画像ムラ不良という問題を有していた。 [SUMMARY OF THE INVENTION However, such a conventional method, the groove width of the hole diameter is 5mm or more or adsorption grooves of each suction holes of the suction mechanism 8 for adsorbing the entire outer surface of the upper substrate 2 is 5mm since or more, substrate deformation in the atmosphere and in vacuum is increased, especially in the case of the thickness of the substrate 2 of 0.7 mm, it will swell substrate partially larger in the suction holes or suction grooves, the lower substrate 1 gap accuracy becomes more than 0.1μm between the, there is a problem that the image nonuniformity defect caused by gap irregularity. このような基板変形を回避すべく、吸着機構8の各吸着穴の穴径を0.5 To avoid such deformation of the substrate, the hole diameter of the suction holes of the suction mechanism 8 0.5
mm以下又は吸着溝部の溝幅を0.5mm以下にすると、吸着機構8の各吸着穴又は吸着溝部での流路抵抗が大きくなり、所定の吸着能力が得られないといった問題がある。 When mm or less or the groove width of the suction groove to 0.5mm or less, the flow path resistance in the suction holes or suction grooves of the suction mechanism 8 is increased, there is a predetermined problem adsorption capacity can not be obtained. また、接着剤3及び液晶4が配置されている領域外の領域も加圧してしまうため、そのような上基板2及び下基板1の接着剤3の領域外の領域が上基板と下基板との間の内側に変形してしまい、その反力で接着剤3及び液晶4の領域内が部分的に上基板と下基板との間に対して外側に変形し大きく膨らんでしまい、ギャップ精度が0.1μm以上になってしまい、ギャップムラによる画像ムラ不良という問題を有していた。 Further, since the adhesive 3 and the liquid crystal 4 is thus pressed region pressure outside the region being arranged, such area outside the area of ​​the adhesive 3 of the upper substrate 2 and lower substrate 1 and the upper and lower substrates, such It will be deformed inwardly between its cause swells greatly deformed outward relative between the area of ​​the adhesive 3 and the liquid crystal 4 is an upper substrate and a lower substrate partially in the reaction force, the gap precision becomes more than 0.1 [mu] m, it has a problem that image unevenness defect due uneven gap. 従って、本発明の目的は、上記問題を解決することにあって、接着剤及び液晶材料の領域内のギャップムラをなくし、ギャップ精度を0.1μm以内に抑制し、画像ムラ不良をなくすことができて、歩留まり向上及び品質向上を図ることができる液晶表示装置の液晶基板の貼り合わせ方法を提供することにある。 Accordingly, an object of the present invention is to provide, for solving the above problems, eliminating the uneven gap in the area of ​​the adhesive and the liquid crystal material, to suppress the gap accuracy within 0.1 [mu] m, it is possible to eliminate image unevenness defect it can be to provide a bonding method of the liquid crystal substrate of the liquid crystal display device capable of achieving improved yield and quality.

【0005】 [0005]

【課題を解決するための手段】上記目的を達成するために、本発明は以下のように構成する。 To achieve the above object of the Invention The present invention is constructed as follows. 本発明の第1態様によれば、真空チャンバー内で、基板表面に接着剤が塗布され液晶材料が挿入された下基板を接着剤側及び液晶材料側が上側に向くように固定し、上記下基板に対向するように所定の間隔で配置された上基板の外側面全面を、溝穴径3mm以下又は溝幅3mm以下の吸着部による真空吸着で固定し、上記下基板と上記上基板の両方の基板を相対的に基板面方向に移動させて位置合わせを行い、 According to a first aspect of the present invention, in a vacuum chamber, a lower substrate in which the adhesive is inserted liquid crystal material is coated adhesive side and the liquid crystal material side is fixed so as to face the upper surface of the substrate, the lower substrate the outer entire surface of the substrate on which are arranged at a predetermined interval so as to face, fixed with vacuum suction by the following adsorption unit Mizoana径 3mm or less, or groove width 3mm, both of the lower substrate and the substrate moving the substrate relative the substrate surface direction aligns with,
少なくともどちらか一方の基板を基板面垂直方向に移動させて加圧し、上記上基板と上記下基板を貼り合わせることを特徴とする液晶基板の貼り合わせ方法を提供する。 Moving at least one of the substrate on the substrate surface vertically pressurized to provide a bonding method of the liquid crystal substrate, wherein the bonding the substrate and the lower substrate. 上記構成によれば、対向する位置に配置された2枚の基板のギャップ精度を0.1μm以下に抑制できる。 According to the above configuration, it is possible to suppress the two gap accuracy of the substrate disposed at a position opposed to 0.1μm or less.

【0006】本発明の第2態様によれば、上記下基板の下側の外側面全面を、溝穴径が0.5mmを超えて3mm以下又は溝幅が0.5mmを超えて3mm以下の吸着部による真空吸着で固定する第1態様に記載の液晶基板の貼り合わせ方法を提供する。 According to a second aspect of the present invention, a outer surface entire lower side of the lower substrate, Mizoana径 is 0.5mm to less than 3mm, or groove width is 0.5mm below 3mm beyond beyond It provides a bonding method of the liquid crystal substrate according to the first aspect for fixing by vacuum suction by the suction unit. 上記構成によれば、対向する位置に配置された2枚の基板のギャップ精度を0.1μm以下に抑制できる。 According to the above configuration, it is possible to suppress the two gap accuracy of the substrate disposed at a position opposed to 0.1μm or less.

【0007】本発明の第3態様によれば、真空チャンバー内で、基板表面に接着剤が塗布され液晶材料が挿入された下基板の下側に上記接着剤及び上記液晶材料の領域内にスペーサを配置して、接着剤側及び液晶材料側が上側に向くように加圧ユニットに固定し、上記下基板に対向するように所定の間隔で配置された上基板の外側面全面を吸着部による真空吸着で固定し、上記下基板と上記上基板の両方の基板を相対的に基板面方向に移動させて位置合わせを行い、少なくともどちらか一方の基板を基板面垂直方向に移動させて加圧し、上記上基板と上記下基板を貼り合わせることを特徴とする液晶基板の貼り合わせ方法を提供する。 According to a third aspect of the invention, in a vacuum chamber, in the region of the adhesive and the liquid crystal material on the lower side of the lower substrate to which the adhesive is inserted liquid crystal material is applied within the substrate surface spacer the arranged, vacuum bonding agent side and the liquid crystal material side is fixed to the pressure unit so as to face upward, the outer entire surface of the substrate on which are arranged at a predetermined interval so as to face the lower substrate by the suction unit fixed with suction, it aligns by moving the substrate in both the lower substrate and the substrate relative substrate surface direction, pressed by moving at least one of the substrate on the substrate surface vertically, It provides a bonding method for a liquid crystal substrate, wherein the bonding the substrate and the lower substrate. 上記構成によれば、対向する位置に配置された2枚の基板のギャップ精度を0.1μm以下に抑制できる。 According to the above configuration, it is possible to suppress the two gap accuracy of the substrate disposed at a position opposed to 0.1μm or less.

【0008】本発明の第4態様によれば、上記上基板の上側に上記下基板の上記接着剤及び上記液晶材料の領域内に相当する領域にもスペーサを配置して加圧する第3 [0008] According to a fourth aspect of the present invention, a third pressurizing arranged spacers also in a region corresponding to the region of the adhesive and the liquid crystal material of the lower substrate to the upper side of the substrate
態様に記載の液晶基板の貼り合わせ方法を提供する。 It provides a bonding method for a liquid crystal substrate according to embodiments. 上記構成によれば、対向する位置に配置された2枚の基板のギャップ精度を0.1μm以下に抑制できる。 According to the above configuration, it is possible to suppress the two gap accuracy of the substrate disposed at a position opposed to 0.1μm or less.

【0009】本発明の第5態様によれば、上記吸着部により上記上基板を固定する第3態様に記載の液晶基板の貼り合わせ方法を提供する。 According to a fifth aspect of the present invention provides a bonding method for a liquid crystal substrate according to a third embodiment for fixing the substrate by the suction unit. 上記構成によれば、対向する位置に配置された2枚の基板のギャップ精度を0.1 According to the above configuration, the two gap accuracy of the substrate disposed in opposing positions 0.1
μm以下に抑制できる。 μm can be suppressed to below.

【0010】本発明の第6態様によれば、上記吸着部が複数の吸着穴より構成され、上記基板の吸着盤に接触する面の全面積に対しての吸着穴開口率が50%以上である第1〜5のいずれかの態様に記載の液晶基板の貼り合わせ方法を提供する。 According to a sixth aspect of the present invention, the suction unit is composed of a plurality of suction holes, the adsorption hole aperture ratio of the total area of ​​the surface in contact with the suction cups of the substrate is 50% or more It provides a bonding method for a liquid crystal substrate according to a first to fifth any aspect.

【0011】 [0011]

【発明の実施の形態】以下に、本発明にかかる実施の形態を図面に基づいて詳細に説明する。 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS be described in detail with reference to embodiments according to the present invention with reference to the accompanying drawings.

【0012】(第1実施形態)本発明の第1実施形態にかかる液晶基板の貼り合わせ方法の一例としての2枚の基板の貼り合わせ方法について、液晶装置の場合を例に、 [0012] The two bonding method of the substrate as an example of a bonding method of a liquid crystal substrate according to First Embodiment The first embodiment of the present invention, the case of the liquid crystal device as an example,
図1(a),(b),(c),(d)及び図2を用いて説明する。 Figure 1 (a), (b), (c), will be described with reference to (d) and FIG. 図1(a),(b),(c),(d)は貼り合わせ方法を説明するための模式的断面図である。 Figure 1 (a), (b), (c), are schematic sectional views for explaining a (d) of bonding method. まず、図1(a)に示すように、表面に例えば厚み30μ First, as shown in FIG. 1 (a), thickness of, for example, the surface 30μ
mで四角枠状に塗布された紫外線硬化型の接着剤21及びその接着剤21の四角枠の内部に液晶材料22が滴下等により配置されかつ透光性材料からなる下基板23を水平方向に移動可能なテーブル24上に搭載し、固定ピン25で下基板23の外周をテーブル24に移動不可に固定する(ステップS1)。 The lower substrate 23 in which the liquid crystal material 22 is composed of arranged and light-transmitting material dropwise or the like inside the rectangular frame of the adhesive 21 and the adhesive 21 of ultraviolet curable coated in a square frame shape in a horizontal direction m mounted on the movable table 24 is fixed to not move the outer periphery of the lower substrate 23 on the table 24 by fixing pins 25 (step S1). この固定方法は吸着でもよい。 The fixing method may be adsorbed. 上記テーブル24の例としては、X方向及びY方向駆動装置のそれぞれにより、独立的にX方向と該X方向と直交するY方向との2方向に水平方向面内で往復移動可能でかつ回転可能なXYテーブルがよい。 Examples of the table 24, the respective X-direction and Y-direction driving device, independently and rotatably reciprocally moved in two directions horizontally plane between the Y direction perpendicular to the X direction and the X direction it is a XY table. なお、接着剤21の厚みは30μmに限らず、他の例として15μ The thickness of the adhesive 21 is not limited to 30 [mu] m, 15.mu. as another example
m〜35μmが多用されている。 m~35μm have been widely used.

【0013】次に、図1(b)に示すように、テーブル24に固定された下基板23を真空チャンバーCに入れ、真空吸引装置127に連結された各穴径3mm以下の多数の吸着穴又は溝幅3mm以下の吸着溝部などの吸着部27aを有する吸着盤27により、透光性材料からなる上基板26の外側全面すなわち図1(b)では上面を真空吸着(例えば、吸着部27aの圧力が約0.1Tor [0013] Next, as shown in FIG. 1 (b), placed in the lower substrate 23 fixed to the table 24 in the vacuum chamber C, a number of suction holes below the hole diameter 3mm, which is connected to a vacuum suction device 127 or by suction cup 27 having a suction portion 27a, such as the following suction groove groove width 3 mm, the outer entire surface i.e. FIG 1 (b) in the upper surface vacuum suction on a substrate 26 made of a translucent material (e.g., adsorption section 27a the pressure is about 0.1Tor
rレベルとなるように真空吸着)で固定して、上基板2 Fixed by vacuum suction) such that r level, the upper substrate 2
6の内側全面すなわち図1(b)では下面が水平方向沿いに沿うように配置する。 Entire inner surface i.e. FIG 1 (b) in the lower surface 6 is arranged along the horizontal direction along. その後、下基板23を搭載したテーブル24を水平方向に移動させて、下基板23と上基板26との位置合わせをする(ステップS2)。 Then, by moving the table 24 mounted with the lower substrate 23 in the horizontal direction, and the alignment of the lower substrate 23 and upper substrate 26 (Step S2). 上基板26の透光性材料の具体例及び下基板23の材料の具体例としては、ガラスやプラスチックがある。 Specific examples of the material of the embodiment and the lower substrate 23 of the translucent material of the upper substrate 26, glass or plastic.

【0014】なお、図8の(B)には、吸着盤27の吸着部27aの構成の一例として、吸着盤27の基板面内に対応する領域に配置された吸着穴27a−2の各穴径3がmm以下の多数の吸着穴の配置例の平面図である。 [0014] Note that (B) in FIG. 8, as an example of the configuration of the suction portion 27a of the suction cups 27, each well of suction holes 27a-2 which are arranged in an area corresponding to the substrate surface of the suction plate 27 diameter 3 is a plan view of the following number of arrangement of the suction holes mm. 図8の(A),(C)には、それぞれ、吸着盤27の吸着部27aの構成の一例として、吸着盤27の基板面内に対応する領域に配置された、溝幅3mm以下の矩形状の吸着溝部27a−1の配置例の平面図及び溝幅3mm以下の矩形渦巻き状の吸着溝部27a−3の配置例の平面図を示す。 (A) in FIG. 8, the (C), respectively, as an example of the configuration of the suction portion 27a of the suction cups 27, which are disposed in regions corresponding to the substrate surface of the suction plate 27, the groove width less than 3mm rectangular It shows a plan view of a plan view and a groove width 3mm following arrangement of rectangular spiral suction groove 27a-3 of the arrangement of the suction groove 27a-1 of the shape. このとき、上記吸着盤27の吸着部27aの全ての吸着穴又は吸着溝部の開孔面積の50%以上、すなわち、上記基板の吸着盤27に接触する面の全面積に対しての吸着穴又は吸着溝部の開口率の50%以上を確保するようにすれば、基板がガラスの場合を想定したとき、 At this time, more than 50% of all open area of ​​the suction holes or suction grooves of the suction portion 27a of the suction cup 27, i.e., the suction holes of the total area of ​​the surface in contact with the suction cups 27 of the substrate or If so as to ensure more than 50% of the opening ratio of the suction groove, when the substrate is assumed that the glass,
例えば厚さ0.7mmのガラス製の基板をチャンバー圧力0.8Torrの状態で持ち上げうることが可能となる。 For example a glass substrate with a thickness of 0.7mm and it is possible to be lifted while the chamber pressure 0.8 Torr. また、吸着機構の各吸着穴の穴径を0.5mm以下又は吸着溝部の溝幅を0.5mm以下にしたときの従来の欠点を確実に回避するためには、吸着機構の各吸着穴の穴径を0.5mmを超えて3mm以下又は吸着溝部の溝幅を0.5mmを超えて3mm以下にする。 Further, in order to reliably avoid the deficiencies of the prior art when the groove width of the hole diameter 0.5mm or less or adsorption grooves of the suction holes of the suction mechanism to 0.5mm or less, for each suction hole of the suction mechanism less than 3mm hole diameter beyond 0.5mm or exceed 0.5mm groove width of the suction groove to 3mm or less. なお、安定して実際に使用するためには、吸着穴開口率は70%以上を確保するのが好ましい。 In order to actually use stable, the suction holes opening ratio is preferably secured over 70%.

【0015】次に、図1(c)に示すように、加圧ユニットの一例としてのエアシリンダーのような押圧装置1 [0015] Next, as shown in FIG. 1 (c), the pressing device such as an air cylinder as an example of a pressurization unit 1
28により、吸着盤27を垂直方向に下降させて、上基板26を接着剤21を介して下基板23に貼り合わせ、 By 28, it lowers the suction cups 27 in a vertical direction, bonded to the lower substrate 23 on the substrate 26 through the adhesive 21,
上基板26と下基板23との間隔が5μmになるまで加圧する(ステップS3)。 Distance between the upper substrate 26 and lower substrate 23 is pressurized until the 5 [mu] m (step S3). なお、上基板26と下基板2 Incidentally, the upper substrate 26 and lower substrate 2
3との間隔が5μmになるまで加圧するものに限らず、 Distance between 3 is not limited to pressurize until the 5 [mu] m,
8μm前後もあれば3μm前後になるまで加圧するようにしてもよい。 Some longitudinal 8 [mu] m 3 [mu] m may be pressurized to be around. その後、図1(d)に示すように、貼り合せた2つの基板26,23をテーブル24とともに真空チャンバーCから取り出し、貼り合せた2つの基板26,23の上方から紫外線照射ランプ28から紫外線を照射する。 Thereafter, as shown in FIG. 1 (d), the two substrates 26, 23 bonded together with the table 24 is taken out from the vacuum chamber C, and ultraviolet from the ultraviolet irradiation lamp 28 from above the two substrates 26, 23 bonded together irradiated. このとき、上基板26は透光性材料からなっているため紫外線照射ランプ28からの紫外線を透過することができ、貼り合せた2つの基板26,23間の接着剤21にこの紫外線を照射することができて該接着剤21を紫外線硬化させて、下基板23と上基板26の貼り合わせは完了する(ステップS4)。 In this case, the upper substrate 26 can pass through the ultraviolet rays from the ultraviolet irradiation lamp 28 because that is a transparent material, irradiating the ultraviolet rays to the adhesive 21 between the two substrates 26, 23 bonded together it thereby ultraviolet curing the adhesive 21 can, in bonding of the lower substrate 23 and upper substrate 26 is completed (step S4).

【0016】この方法によれば、吸着部27aの圧力が約0.1Torrレベルであるとき吸着盤27の吸着部27aの各吸着穴の穴径又は各吸着溝部の溝幅を3mm [0016] 3mm According to this method, the hole diameter or the suction holes of the suction portion 27a of the suction cups 27 when the pressure of the suction portion 27a is about 0.1Torr level the groove width of each of the adsorption grooves
以下(好ましくは、0.5mmを超えて3mm以下)とすることにより、対向する位置に配置された2枚の基板2 Or less (preferably, exceed 0.5 mm 3 mm or less) by the two substrates are arranged in opposite positions 2
6,23のギャップ精度を0.1μm以下に抑制でき、 Gap accuracy of 6,23 can be suppressed to 0.1μm or less,
画像ムラ不良をなくすことができる。 It is possible to eliminate the image non-uniformity defects. これに対して、もし、吸着盤27の吸着部27aの各吸着穴の穴径又は各吸着溝部の溝幅が3mmを超えるようにすると、吸着による基板の変形量が大きくなり、2枚の基板26,23 In contrast, if the hole diameter or the suction holes of the suction portion 27a of the suction disk 27 is the groove width of each suction groove is to exceed 3 mm, the greater the amount of deformation of the substrate by adsorption, of the two substrates 26, 23
のギャップ精度を0.1μm以下に抑制できなくなり、 It can no longer be suppressed to 0.1μm below the gap accuracy,
画像ムラ不良を発生させる可能性がある。 It can cause image unevenness defect.

【0017】また、図2に示すように、下基板23の下側の外側面全面すなわち下面全面を、真空吸引装置12 Further, as shown in FIG. 2, the outer entire surface i.e. the entire lower surface below the lower substrate 23, the vacuum suction device 12
9に連結された各穴径3mm以下(好ましくは、0.5mm Below each hole diameter 3mm linked to 9 (preferably, 0.5 mm
を超えて3mm以下)の多数の吸着穴又は溝幅3mm以下(好ましくは、0.5mmを超えて3mm以下)の吸着溝部などの吸着部120aを有する吸着盤120による真空吸着で固定してもよい。 3mm or less) number of suction holes or the groove width less than 3mm (preferably of beyond, be fixed by vacuum suction by the suction panel 120 having a suction portion 120a, such as adsorption groove beyond 0.5 mm less than 3mm) good. 図2の例は、テーブル24の表面に、このような吸着盤を配置している状態を示す。 The example of FIG. 2, the surface of the table 24, showing a state of disposing such suction cup.

【0018】(第2実施形態)本発明の第2実施形態にかかる液晶基板の貼り合わせ方法の一例としての2枚の基板の貼り合わせ方法について、液晶装置の場合を例に、 [0018] (Second Embodiment) The second embodiment combined according to two substrates as an example of a bonding method of the liquid crystal substrate bonding method of the present invention, the case of the liquid crystal device as an example,
図3(a),(b),(c),(d)及び図4を用いて説明する。 Figure 3 (a), (b), will be described with reference to (c), (d) and FIG. 図3(a),(b),(c),(d)は貼り合わせ方法を説明するための模式的断面図である。 Figure 3 (a), (b), (c), are schematic sectional views for explaining a (d) of bonding method. まず、図3(a)に示すように、表面に例えば厚み30μ First, as shown in FIG. 3 (a), thickness of, for example, the surface 30μ
mで四角枠状に塗布された紫外線硬化型の接着剤21及びその接着剤21の四角枠の内部に液晶材料22が滴下等により配置されかつ透光性材料からなる下基板23の下側の、接着剤21及び液晶22の領域内に相当する領域に対応する領域に、スペーサ29を配置して、下基板23を吸着可能でかつ水平方向に移動可能でかつ回転可能なテーブル24上に搭載し、固定ピン25で下基板2 m in the liquid crystal material 22 inside the square frame of rectangular frame shape is coated the ultraviolet-curable adhesive 21 and the adhesive 21 is below the lower substrate 23 made of and translucent material disposed dropwise like , mounted in a region corresponding to the region corresponding to the region of the adhesive 21 and the liquid crystal 22, by disposing the spacer 29, the lower substrate 23 on possible and and rotatable tables 24 can be moved in the horizontal direction adsorption and, under a fixed pin 25 the substrate 2
3の外周をテーブル24に移動不可に固定する(ステップS11)。 3 of the outer periphery is fixed immovably table 24 (step S11). 上記テーブル24の例としては、X方向及びY方向駆動装置のそれぞれにより、独立的にX方向と該X方向と直交するY方向との2方向に水平方向面内で往復移動可能なXYテーブルがよい。 Examples of the table 24, the respective X-direction and Y-direction drive device, the XY table capable reciprocated in two directions in the horizontal direction plane of the Y-direction to independently perpendicular to the X direction and the X direction good. スペーサ29の一例として、その材質はゴムであり、厚さは0.5〜3m As an example of the spacer 29, the material is rubber, thickness 0.5~3m
mであり、その形状としては、テーブル24にスペーサ29を介して下基板23を吸着させるための吸引用の多数の穴があいており、かつ、スペーサ29自体としてはやわらかいものであり、0.1kg/mm 2程度の剛性を有するものが好ましい。 M, and as its shape, and Ai are a number of holes for suction for attracting the lower substrate 23 through the spacer 29 to the table 24, and is a soft one as spacer 29 itself, 0. those with 1 kg / mm 2 approximately rigidity are preferred. 上記接着剤21及び液晶22 The adhesive 21 and the liquid crystal 22
の領域内に相当する領域に対応する領域にスペーサ29 Spacer 29 in a region corresponding to a region corresponding to the region
を配置することにより、上記接着剤21及び液晶22の領域での2枚の基板26,23のギャップ精度を所定範囲内により確実に確保することができる。 By placing the can be reliably secured by the predetermined range of gap accuracy of the two substrates 26, 23 in the area of ​​the adhesive 21 and the liquid crystal 22.

【0019】次に、図3(b)に示すように、テーブル24に固定された下基板23を真空チャンバーCに入れ、真空吸引装置127に連結された各穴径3mm以下の多数の吸着穴又は溝幅3mm以下の吸着溝部などの吸着部27aを有する吸着盤27により、透光性材料からなる上基板26の外側全面すなわち図3(b)では上面を真空吸着で固定して、上基板26の内側全面すなわち図3 Next, as shown in FIG. 3 (b), placed in the lower substrate 23 fixed to the table 24 in the vacuum chamber C, a number of suction holes below the hole diameter 3mm, which is connected to a vacuum suction device 127 or by suction cup 27 having a suction portion 27a, such as the following suction groove groove width 3 mm, and the outer entire surface i.e. FIG 3 (b) in the upper surface of the upper substrate 26 made of a translucent material fixed with vacuum suction, an upper substrate 26 entire inner surface i.e. Figure 3
(b)では下面が水平方向沿いに沿うように配置する。 (B) the lower surface is arranged along the horizontal direction along.
その後、下基板23を搭載したテーブル24を水平方向に移動させて、下基板23と上基板26との位置合わせをする(ステップS12)。 Then, by moving the table 24 mounted with the lower substrate 23 in the horizontal direction, and the alignment of the lower substrate 23 and upper substrate 26 (step S12).

【0020】次に、図3(c)に示すように、加圧ユニットの一例としてのエアシリンダーのような押圧装置1 Next, as shown in FIG. 3 (c), the pressing device such as an air cylinder as an example of a pressurization unit 1
28により、吸着盤27を垂直方向に下降させて、上基板26を接着剤21を介して下基板23に貼り合わせ、 By 28, it lowers the suction cups 27 in a vertical direction, bonded to the lower substrate 23 on the substrate 26 through the adhesive 21,
上基板26と下基板23との間隔が5μmまで加圧する(ステップS13)。 Distance between the upper substrate 26 and lower substrate 23 is pressurized to 5 [mu] m (step S13). その後、図3(d)に示すように、貼り合せた2つの基板26,23をテーブル24とともに真空チャンバーCから取り出し、貼り合せた2つの基板26,23の上方から紫外線照射ランプ28から紫外線をする。 Thereafter, as shown in FIG. 3 (d), the two substrates 26, 23 bonded together with the table 24 is taken out from the vacuum chamber C, and ultraviolet from the ultraviolet irradiation lamp 28 from above the two substrates 26, 23 bonded together to. このとき、上基板26は透光性材料からなっているため紫外線照射ランプ28からの紫外線を透過することができ、貼り合せた2つの基板26,23間の接着剤21にこの紫外線を照射することができて該接着剤21を紫外線硬化させて、下基板23と上基板26 In this case, the upper substrate 26 can pass through the ultraviolet rays from the ultraviolet irradiation lamp 28 because that is a transparent material, irradiating the ultraviolet rays to the adhesive 21 between the two substrates 26, 23 bonded together it thereby ultraviolet curing the adhesive 21 can, lower substrate 23 and upper substrate 26
の貼り合わせは完了する(ステップS14)。 The bonding of the completed (step S14).

【0021】この方法によれば、下基板32の接着剤2 According to this method, the lower substrate 32 adhesive 2
1及び液晶22の領域内に相当する領域にスペーサ29 1 and the spacer 29 in a region corresponding to the region of the liquid crystal 22
を配置することにより、テーブル24や吸着盤27の平面度に影響されずに、対向する位置に配置された2枚の基板26,23のギャップ精度を0.1μm以下に抑制でき、画像ムラ不良をなくすことができる。 By placing the table without being affected by the 24 and flatness of the suction cups 27, it can suppress the gap precision of opposed two substrates arranged at a position 26, 23 to 0.1μm or less, image nonuniformity defect it can be eliminated.

【0022】なお、第2実施形態でも、第1実施形態と同様に吸着盤27の吸着部27aの構成を各穴径3mm以下(好ましくは、0.5mmを超えて3mm以下)の多数の吸着穴又は溝幅3mm以下(好ましくは、0.5mmを超えて3mm以下)の吸着溝部より構成するとともに、上記吸着盤27の吸着部27aの全ての吸着穴又は吸着溝部の開孔面積の50%を確保することにより、対向する位置に配置された2枚の基板26,23のギャップ精度を0.1μm以下にさらに確実に抑制でき、画像ムラ不良をより一層なくすことができる。 [0022] Also in the second embodiment, the configuration of the first embodiment similarly to the adsorption section 27a of the suction disk 27 Kakuana径 3mm or less (preferably, less than 3mm beyond 0.5 mm) of a large number of adsorption hole or groove width 3mm or less (preferably, exceed 0.5 mm less than 3mm) with composing than adsorption groove, 50% of all open area of ​​the suction holes or suction grooves of the suction portion 27a of the suction cups 27 the by securing, the two gap accuracy of the substrate 26, 23 which are arranged to face be more surely suppressed in the 0.1μm or less, the image nonuniformity defects more can be eliminated more. このように構成することにより、基板がガラスの場合を想定したとき、例えば厚さ0.7mmのガラス製の基板をチャンバー圧力0. With this structure, when the substrate is assumed that the glass, for example, a glass substrate with a thickness of 0.7mm chamber pressure 0.
8Torrの状態で持ち上げうることが可能となる。 It becomes possible to be lifted in the state of 8 Torr. また、吸着機構の各吸着穴の穴径を0.5mm以下又は吸着溝部の溝幅を0.5mm以下にしたときの従来の欠点を確実に回避するためには、吸着機構の各吸着穴の穴径を0.5mmを超えて3mm以下又は吸着溝部の溝幅を0.5 Further, in order to reliably avoid the deficiencies of the prior art when the groove width of the hole diameter 0.5mm or less or adsorption grooves of the suction holes of the suction mechanism to 0.5mm or less, for each suction hole of the suction mechanism the groove width of less than 3mm or suction groove hole diameter beyond 0.5 mm 0.5
mmを超えて3mm以下にする。 To less than 3mm beyond the mm. なお、安定して実際に使用するためには、吸着穴開口率は70%以上を確保するのが好ましい。 In order to actually use stable, the suction holes opening ratio is preferably secured over 70%. また、図4に示すように、上基板26の上側に、下基板23の接着剤21及び液晶22の領域内に相当する領域にもスペーサ30を配置して加圧してもよい。 Further, as shown in FIG. 4, the upper side of the upper substrate 26 may be pressurized by placing a spacer 30 in a region corresponding to the region of the adhesive 21 and the liquid crystal 22 of the lower substrate 23. スペーサ30にも吸着盤27の吸着溝部と大略同様な位置に吸着溝部が形成されており、スペーサ30を介して吸着盤27により上基板26を確実に吸着できるようにしている。 Spacers 30 are also adsorbed groove is formed in the suction groove and approximately similar position of suction cups 27, so that the upper substrate 26 can be reliably adsorbed by the suction cups 27 through the spacer 30.

【0023】このように、上基板26の上側に、下基板23の接着剤21及び液晶22の領域内に相当する領域にもスペーサ30を配置することにより、吸着盤27の平面度に影響されずに、対向する位置に配置された2枚の基板26,23のギャップ精度を0.1μm以下に抑制でき、画像ムラ不良をなくすことができる。 [0023] Thus, the upper side of the upper substrate 26, by disposing the spacer 30 also in a region corresponding to the region of the adhesive 21 and the liquid crystal 22 of the lower substrate 23 is affected by the flatness of the suction cups 27 not in the two gaps accuracy of the substrate 26, 23 which are arranged to face can be suppressed to 0.1μm or less, it is possible to eliminate image unevenness defect.

【0024】 [0024]

【発明の効果】以上のように、本発明によれば、真空チャンバー内にて下基板を固定し、上基板の外側面全面を溝穴径3mm以下(好ましくは、0.5mmを超えて3mm以下)又は溝幅3mm以下(好ましくは、0.5mmを超えて3mm以下)の吸着機構による真空吸着で固定し、位置合わせを行った後、基板面垂直方向に移動させて加圧する方法により、2枚の基板のギャップ精度を向上させることができるという効果がある。 As evident from the foregoing description, according to the present invention, the lower substrate was fixed in a vacuum chamber, the outer surface entire of the upper substrate Mizoana径 3mm or less (preferably, by more than 0.5 mm 3mm the following) or groove width 3mm or less (preferably, beyond the 0.5mm fixed with vacuum suction by the suction mechanism of 3mm or less), after the alignment, the method of pressurizing by moving direction perpendicular to the substrate surface, there is an effect that it is possible to improve the gap accuracy of the two substrates. より詳しくは、上記吸着機構による真空吸着の圧力が約0.1Torrレベルであり、上記吸着機構の各吸着穴の穴径を3mm以下(好ましくは、0.5mmを超えて3mm以下)又は各吸着溝部の溝幅を3mm以下(好ましくは、0.5mmを超えて3mm以下)とすることにより、対向する位置に配置された2枚の基板のギャップ精度を例えば0.1μm以下に抑制でき、画像ムラ不良をなくすことができる。 More particularly, the a pressure of about 0.1Torr level of vacuum suction by the suction mechanism, hereinafter 3mm hole diameter of the suction hole of the suction mechanism (preferably, 3mm or less beyond 0.5 mm) or each suction the groove width of the groove 3mm or less (preferably, by more than 0.5 mm less than 3mm) with, can be suppressed gap accuracy of the two substrates which are arranged to face, for example, in 0.1μm or less, the image it is possible to eliminate the non-uniformity defects. これに対して、もし、上記吸着機構の各吸着穴の穴径又は各吸着溝部の溝幅が3mmを超えるようにすると、吸着による基板の変形量が大きくなり、2枚の基板のギャップ精度を0.1μm以下に抑制できなくなり、画像ムラ不良を発生させる可能性がある。 In contrast, if the hole diameter or the suction holes of the suction mechanism when the groove width of each suction groove is to exceed 3 mm, the amount of deformation of the substrate by the suction is increased, the two substrates gap accuracy can no longer be suppressed to 0.1μm or less, it can cause image unevenness defect. また、本発明においては、少なくとも上記吸着機構の全ての吸着穴又は全ての吸着溝部の開孔面積の50%を確保するようにすれば、仮に基板がガラスの場合を想定したとき、例えば厚さ0.7mm In the present invention, it suffices to reserve 50% of all open area of ​​the suction holes or all of the suction grooves of at least the suction mechanism, if when the substrate is assumed that the glass, for example, a thickness 0.7mm
のガラス製の基板をチャンバー圧力0.8Torrの状態で持ち上げうることが可能となる。 The glass substrate can be be lifted in the state of the chamber pressure 0.8Torr of. また、吸着機構の各吸着穴の穴径を0.5mm以下又は吸着溝部の溝幅を0.5mm以下にしたときの従来の欠点を確実に回避するためには、吸着機構の各吸着穴の穴径を0.5mmを超えて3mm以下又は吸着溝部の溝幅を0.5mmを超えて3mm Further, in order to reliably avoid the deficiencies of the prior art when the groove width of the hole diameter 0.5mm or less or adsorption grooves of the suction holes of the suction mechanism to 0.5mm or less, for each suction hole of the suction mechanism 3 mm 3 mm below the hole diameter beyond 0.5mm or the groove width of the suction groove beyond 0.5mm
以下にする。 It is less than or equal to. なお、吸着穴開口率は70%以上を確保すれば、より安定して使用することができる。 Incidentally, the suction holes opening ratio can be secured more than 70% to more stably used.

【0025】また、真空チャンバー内にて下基板の下側に接着剤及び液晶の領域内にスペーサを配置して、接着剤側及び液晶側が上側に向くように加圧ユニットに固定し、上基板を吸着機構による真空吸着で固定し、位置合わせを行った後、基板を基板面垂直方向に移動させて加圧する方法により、下基板を載置する部材や吸着盤などの平面度に影響されずに、2枚の基板のギャップ精度を向上させることができるという効果がある。 Further, by arranging a spacer in the adhesive and the liquid crystal in the region on the lower side of the lower substrate in a vacuum chamber, the adhesive side and the liquid crystal side is fixed to the pressure unit so as to face upward, the upper substrate were fixed with vacuum suction by the suction mechanism, after the alignment, the method of pressurizing and moving the substrate direction perpendicular to the substrate surface, without being affected by the flatness of such member or suction cup for mounting a lower substrate , there is an effect that it is possible to improve the gap accuracy of the two substrates. 以上により、液晶表示装置の貼り合わせの場合では、従来の方法で発生した画像不良や画像ムラ不良の発生を防止することができる。 Thus, in the case of bonding of the liquid crystal display device can prevent the image defects and image nonuniformity failure occurring in a conventional manner.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】 (a),(b),(c),(d)は本発明の第1実施形態にかかる液晶基板の貼り合わせ方法である2枚の基板を貼り合わせる方法を説明するための模式的説明図である。 [1] (a), (b), (c), (d) is for explaining a method of bonding two substrates is a bonding method of a liquid crystal substrate according to a first embodiment of the present invention it is a schematic illustration.

【図2】 本発明の第1実施形態にかかる2枚の基板を貼り合わせる方法の変形例を示す模式的断面図である。 2 is a schematic sectional view showing a modified example of a method of bonding two substrates according to the first embodiment of the present invention.

【図3】 (a),(b),(c),(d)は本発明の第2実施形態にかかる液晶基板の貼り合わせ方法である2枚の基板を貼り合わせる方法を説明するための模式的断面図である。 [3] (a), (b), (c), (d) is for explaining a method of bonding two substrates is a bonding method of a liquid crystal substrate according to a second embodiment of the present invention it is a schematic cross-sectional view.

【図4】 本発明の第2実施形態にかかる2枚の基板を貼り合わせる方法の変形例を示す模式的断面図である。 It is a schematic cross-sectional view showing a modified example of a method of bonding two substrates according to the second embodiment of the present invention; FIG.

【図5】 一般的な液晶表示装置の構造を説明するための模式的な分解斜視図である。 5 is a schematic exploded perspective view for illustrating the structure of a general liquid crystal display device.

【図6】 (a),(b),(c)は従来の液晶滴下工法を説明するための模式的断面図である。 6 (a), a schematic sectional view for explaining a (b), (c) the conventional liquid crystal dropping process.

【図7】 (a),(b),(c),(d)は従来例における2枚の基板を貼り合わせる方法を説明するための模式的断面図である。 7 (a), a schematic sectional view for explaining a (b), (c), (d) a method of bonding two substrates in a conventional example.

【図8】 (A)は、吸着盤27の吸着部27aの構成の一例として、溝幅3mm以下の矩形状の吸着溝部27a 8 (A), as an example of the configuration of the suction portion 27a of the suction cup 27, the groove width less than 3mm rectangular suction groove 27a
−1の配置例の平面図、(B)は、吸着盤27の吸着部27aの構成の一例として、吸着穴27a−2の各穴径3がmm以下の多数の吸着穴の配置例の平面図、(C) Plan view of the arrangement of -1, (B), as an example of the configuration of the suction portion 27a of the suction cup 27, the plane of arrangement of the plurality of suction holes below each hole diameter 3 of the suction holes 27a-2 mm Figure, (C)
は、吸着盤27の吸着部27aの構成の一例として、溝幅3mm以下の矩形渦巻き状の吸着溝部27a−3の配置例の平面図である。 As an example of the configuration of the suction portion 27a of the suction disk 27 is a plan view of the arrangement of the suction grooves 27a-3 of the groove width less than 3mm rectangular spiral.

【符号の説明】 DESCRIPTION OF SYMBOLS

21…接着剤、22…液晶材料、23…下基板、24… 21 ... adhesive, 22 ... liquid crystal material, 23 ... lower substrate, 24 ...
テーブル、25…固定ピン、26…上基板、27…吸着盤、27a…吸着部、27a−2…吸着穴、27a− Table 25: fixing pins, 26 ... upper substrate, 27 ... suction cups, 27a ... suction portion, 27a-2 ... suction holes, 27a-
1、27a−3…吸着溝部、28…紫外線照射ランプ、 1,27a-3 ... suction groove 28 ... ultraviolet irradiation lamp,
29…スペーサ、30…スペーサ、120…吸着盤、1 29 ... spacer 30 ... spacer 120 ... suction cups, 1
20a…吸着部、127…真空吸引装置、128…押圧装置、129…真空吸引装置、C…真空チャンバー。 20a ... suction portion, 127 ... vacuum suction device, 128 ... pressing device, 129 ... vacuum suction device, C ... vacuum chamber.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 炭田 祉郎 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 酒井 直人 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 松川 秀樹 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Fターム(参考) 2H089 NA24 NA38 NA44 NA48 NA53 NA56 NA60 QA12 QA13 QA14 TA01 TA06 ────────────────────────────────────────────────── ─── of the front page continued (72) inventor coalfield 祉郎 Osaka Prefecture Kadoma Oaza Kadoma 1006 address Matsushita Electric industrial Co., Ltd. in the (72) inventor Naoto Sakai Osaka Prefecture Kadoma Oaza Kadoma 1006 address Matsushita Electric industrial Co., Ltd. in (72) inventor Hideki Matsukawa Osaka Prefecture Kadoma Oaza Kadoma 1006 address Matsushita Electric industrial Co., Ltd. in the F-term (reference) 2H089 NA24 NA38 NA44 NA48 NA53 NA56 NA60 QA12 QA13 QA14 TA01 TA06

Claims (6)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 真空チャンバー内で、基板表面に接着剤が塗布され液晶材料が挿入された下基板を接着剤側及び液晶材料側が上側に向くように固定し、上記下基板に対向するように所定の間隔で配置された上基板の外側面全面を、溝穴径3mm以下又は溝幅3mm以下の吸着部による真空吸着で固定し、上記下基板と上記上基板の両方の基板を相対的に基板面方向に移動させて位置合わせを行い、少なくともどちらか一方の基板を基板面垂直方向に移動させて加圧し、上記上基板と上記下基板を貼り合わせることを特徴とする液晶基板の貼り合わせ方法。 In 1. A vacuum chamber as a lower substrate which adhesive is inserted liquid crystal material is applied is the surface of the substrate adhesive side and the liquid crystal material side fixed to face upward, opposite to the lower substrate predetermined outer entire surface of the substrate on which are arranged at intervals, fixed with vacuum suction by the following adsorption unit Mizoana径 3mm or less, or groove width 3mm, relatively substrates both of the lower substrate and the substrate moving the substrate surface direction aligns with and pressed by moving at least one of the substrate on the substrate surface vertically, bonding of the liquid crystal substrate, wherein the bonding the substrate and the lower substrate Method.
  2. 【請求項2】 上記下基板の下側の外側面全面を、溝穴径が0.5mmを超えて3mm以下又は溝幅が0.5mmを超えて3mm以下の吸着部による真空吸着で固定する請求項1に記載の液晶基板の貼り合わせ方法。 2. A method outside the entire surface of the lower side of the lower substrate, Mizoana径 there is 3mm or less, or groove width beyond 0.5mm is fixed by vacuum suction by the following adsorption unit 3mm beyond 0.5mm bonding method of the liquid crystal substrate according to claim 1.
  3. 【請求項3】 真空チャンバー内で、基板表面に接着剤が塗布され液晶材料が挿入された下基板の下側に上記接着剤及び上記液晶材料の領域内にスペーサを配置して、 In 3. vacuum chamber, by placing a spacer on the lower side of the lower substrate where the liquid crystal material adhesive is applied to the substrate surface is inserted into the adhesive and the area of ​​the liquid crystal material,
    接着剤側及び液晶材料側が上側に向くように加圧ユニットに固定し、上記下基板に対向するように所定の間隔で配置された上基板の外側面全面を吸着部による真空吸着で固定し、上記下基板と上記上基板の両方の基板を相対的に基板面方向に移動させて位置合わせを行い、少なくともどちらか一方の基板を基板面垂直方向に移動させて加圧し、上記上基板と上記下基板を貼り合わせることを特徴とする液晶基板の貼り合わせ方法。 Adhesive side and the liquid crystal material side is fixed to the pressure unit so as to face upward, the outer entire surface of the substrate on which are arranged at a predetermined interval so as to face the lower substrate was fixed by vacuum suction by the suction unit, performs alignment by moving the substrate in both the lower substrate and the substrate relative substrate surface direction, pressed by moving at least one of the substrate on the substrate surface vertically, the substrate and the bonding method of the liquid crystal substrate, wherein the bonding the lower substrate.
  4. 【請求項4】 上記上基板の上側に上記下基板の上記接着剤及び上記液晶材料の領域内に相当する領域にもスペーサを配置して加圧する請求項3に記載の液晶基板の貼り合わせ方法。 4. The bonding method of the liquid crystal substrate according to claim 3 for pressurizing by placing a spacer in the region corresponding to the region of the adhesive and the liquid crystal material of the lower substrate to the upper side of the substrate .
  5. 【請求項5】 上記吸着部により上記上基板を固定する請求項3に記載の液晶基板の貼り合わせ方法。 5. The bonding method of the liquid crystal substrate according to claim 3 for fixing the substrate by the suction unit.
  6. 【請求項6】 上記吸着部が複数の吸着穴より構成され、上記基板の吸着盤に接触する面の全面積に対しての吸着穴開口率が50%以上である請求項1〜5のいずれかに記載の液晶基板の貼り合わせ方法。 Wherein the suction portion is composed of a plurality of suction holes, one of the claims 1 to 5 suction holes opening ratio of the total area of ​​the surface in contact with the suction cups of the substrate is not less than 50% bonding method of the liquid crystal substrate of crab described.
JP31178498A 1998-11-02 1998-11-02 Sticking method of liquid crystal substrate Pending JP2000137235A (en)

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