JP7362313B2 - 電子部品および電子部品の製造方法および検査方法、機器 - Google Patents
電子部品および電子部品の製造方法および検査方法、機器 Download PDFInfo
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- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
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- H01L27/144—Devices controlled by radiation
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- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14698—Post-treatment for the devices, e.g. annealing, impurity-gettering, shor-circuit elimination, recrystallisation
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Description
前記対向板および前記第2樹脂部材を介して前記素子板に光を照射し、前記素子板と前記第2樹脂部材との間での反射光と、前記対向板と前記第2樹脂部材との間での反射光から、前記対向板と前記素子板のギャップを測定することを特徴とする。
次に図5(a)に示す様に、対向板20を貼り合せる。詳細には、対向板20を素子板10の上方まで移動させたのち、対向板20の自重もしくは、制御された力でスペーサ60に接するまで移動させる。第一実施形態では、対向板20と素子板10のそれぞれの位置を機械的に移動することでギャップが制御されるが、本実施形態では、スペーサ60によりギャップが制御される。樹脂部材30となる液体の樹脂材料31を配置した後であって、対向板20を配置する前には、樹脂部材40となる樹脂材料41は球状のスペーサ60を内包する液体である。これにより、スペーサ60により素子板10と対向板20の間隔を制御できる。仮に、樹脂材料41が固体の樹脂部材40であると、樹脂部材40の厚みによって素子板10と対向板20の間隔が規定される可能性があるため、スペーサ60を用いる効果が低下する。
20 対向板
100 機能素子
50 素子領域
70 周辺領域
30 樹脂部材
40 樹脂部材
EC 電子部品
Claims (15)
- 表示素子または光電変換素子である、機能素子が設けられた素子領域および前記素子領域の周囲に配された周辺領域と、を備える素子板と、
前記素子領域および前記周辺領域に対向する対向板と、
前記素子領域および前記周辺領域の少なくとも一方と前記対向板との間に配置された第1樹脂部材と、
前記周辺領域と前記対向板との間に配置され、前記対向板との屈折率の差が0.2以上である第2樹脂部材と、を備え、
前記第2樹脂部材の屈折率と前記対向板の屈折率との差が、前記第1樹脂部材の屈折率と前記対向板の前記屈折率との差よりも大きい、電子部品を用意し、
前記対向板および前記第2樹脂部材を介して前記素子板に光を照射し、
前記素子板と前記第2樹脂部材との間での反射光と、前記対向板と前記第2樹脂部材との間での反射光から、前記対向板と前記素子板のギャップを測定することを特徴とする方法。 - 前記第1樹脂部材の屈折率と前記対向板の屈折率との差が0.1以下である、請求項1に記載の方法。
- 前記第2樹脂部材は、各々が互いに離間して設けられた第1部材と第2部材と第3部材とを含み、前記第1部材と前記第2部材とを結ぶ直線上に前記第3部材が位置しない、請求項1または2に記載の方法。
- 前記第2樹脂部材は、各々が互いに離間して設けられた第1部材と第2部材と第3部材とを含み、前記第1部材と前記第2部材とを結ぶ直線上に前記第3部材が位置する、請求項1乃至3のいずれか一項に記載の方法。
- 前記第2樹脂部材は、各々が互いに離間して設けられた第1部材と第2部材と第3部材とを含み、前記第1部材と前記第2部材とを結ぶ円弧上に前記第3部材が位置する、請求項1乃至4のいずれか一項に記載の方法。
- 前記素子板と前記対向板との間にはスペーサが設けられており、前記スペーサは前記第2樹脂部材に覆われている、請求項1乃至5のいずれか一項に記載の方法。
- 前記第1樹脂部材は前記素子領域および前記周辺領域と前記対向板との間に配置されており、前記第2樹脂部材は前記第1樹脂部材で囲まれている、請求項1乃至6のいずれか一項に記載の方法。
- 前記第1樹脂部材は少なくとも前記素子領域に設けられており、
前記周辺領域と前記対向板との間に配置された第3樹脂部材を更に備え、
前記第3樹脂部材の屈折率と前記対向板の前記屈折率との差は、前記第1樹脂部材の前記屈折率と前記対向板の前記屈折率との差よりも大きく、かつ、前記第2樹脂部材の前記屈折率と前記対向板の前記屈折率との差よりも小さい、請求項1乃至7のいずれか一項記載の方法。 - 前記素子板は前記対向板に対向しない領域を有する、請求項1乃至8のいずれか一項に記載の方法。
- 前記第1樹脂部材および前記第2樹脂部材は前記対向板に接する、請求項1乃至9のいずれか一項に記載の方法。
- 前記対向板はガラス基板を含む、請求項1乃至10のいずれか一項に記載の方法。
- 前記素子板はシリコン基板を含む、請求項1乃至11のいずれか一項に記載の方法。
- 前記素子領域と前記第1樹脂部材との間にカラーフィルタアレイが設けられている、請求項1乃至12のいずれか一項に記載の方法。
- 前記素子領域と前記第1樹脂部材との間にマイクロレンズアレイが設けられている、請求項1乃至13のいずれか一項に記載の方法。
- 請求項1乃至14のいずれか一項に記載の方法によって検査された電子部品と、
前記電子部品に接続された配線部品と、
前記電子部品に前記配線部品を介して接続された回路部品と、を備える機器。
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JP2004152664A (ja) | 2002-10-31 | 2004-05-27 | Seiko Epson Corp | 表示パネル及びその表示パネルを備えた電子機器並びに表示パネルの製造方法 |
US20090283887A1 (en) | 2008-05-16 | 2009-11-19 | Panasonic Corporation | Optical semiconductor device |
WO2014148276A1 (ja) | 2013-03-18 | 2014-09-25 | ソニー株式会社 | 半導体装置、電子機器 |
WO2015115553A1 (ja) | 2014-01-29 | 2015-08-06 | 日立化成株式会社 | 接着剤組成物、接着剤組成物を用いた半導体装置の製造方法、及び固体撮像素子 |
JP2016086039A (ja) | 2014-10-23 | 2016-05-19 | パナソニックIpマネジメント株式会社 | 半導体装置の製造方法及び製造装置 |
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JP4794283B2 (ja) | 2005-11-18 | 2011-10-19 | パナソニック株式会社 | 固体撮像装置 |
KR20150064203A (ko) | 2012-10-11 | 2015-06-10 | 파나소닉 아이피 매니지먼트 가부시키가이샤 | 유기 전계 발광 소자 및 조명 장치 |
JP2015056211A (ja) | 2013-09-10 | 2015-03-23 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
JP2017134886A (ja) | 2014-06-19 | 2017-08-03 | パナソニックIpマネジメント株式会社 | 発光装置 |
JP2016138992A (ja) | 2015-01-27 | 2016-08-04 | Jsr株式会社 | 液晶表示素子および感放射線性樹脂組成物 |
JP2019029137A (ja) | 2017-07-27 | 2019-02-21 | 双葉電子工業株式会社 | 有機el表示装置 |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2004152664A (ja) | 2002-10-31 | 2004-05-27 | Seiko Epson Corp | 表示パネル及びその表示パネルを備えた電子機器並びに表示パネルの製造方法 |
US20090283887A1 (en) | 2008-05-16 | 2009-11-19 | Panasonic Corporation | Optical semiconductor device |
WO2014148276A1 (ja) | 2013-03-18 | 2014-09-25 | ソニー株式会社 | 半導体装置、電子機器 |
WO2015115553A1 (ja) | 2014-01-29 | 2015-08-06 | 日立化成株式会社 | 接着剤組成物、接着剤組成物を用いた半導体装置の製造方法、及び固体撮像素子 |
JP2016086039A (ja) | 2014-10-23 | 2016-05-19 | パナソニックIpマネジメント株式会社 | 半導体装置の製造方法及び製造装置 |
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