JP6128337B2 - 半導体装置の製造方法及び製造装置 - Google Patents

半導体装置の製造方法及び製造装置 Download PDF

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JP6128337B2
JP6128337B2 JP2014216578A JP2014216578A JP6128337B2 JP 6128337 B2 JP6128337 B2 JP 6128337B2 JP 2014216578 A JP2014216578 A JP 2014216578A JP 2014216578 A JP2014216578 A JP 2014216578A JP 6128337 B2 JP6128337 B2 JP 6128337B2
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bonding
mounting
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JP2016086039A5 (enExample
JP2016086039A (ja
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大輔 櫻井
大輔 櫻井
繁 近藤
繁 近藤
貴大 三宅
貴大 三宅
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Panasonic Intellectual Property Management Co Ltd
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Priority to JP2014216578A priority Critical patent/JP6128337B2/ja
Priority to TW104123088A priority patent/TWI584389B/zh
Priority to CN201510593549.0A priority patent/CN105551930B/zh
Publication of JP2016086039A publication Critical patent/JP2016086039A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Wire Bonding (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2014216578A 2014-10-23 2014-10-23 半導体装置の製造方法及び製造装置 Active JP6128337B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014216578A JP6128337B2 (ja) 2014-10-23 2014-10-23 半導体装置の製造方法及び製造装置
TW104123088A TWI584389B (zh) 2014-10-23 2015-07-16 Semiconductor device manufacturing method and manufacturing device
CN201510593549.0A CN105551930B (zh) 2014-10-23 2015-09-17 半导体装置的制造方法以及制造装置

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JP2014216578A JP6128337B2 (ja) 2014-10-23 2014-10-23 半導体装置の製造方法及び製造装置

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JP2016086039A JP2016086039A (ja) 2016-05-19
JP2016086039A5 JP2016086039A5 (enExample) 2016-07-14
JP6128337B2 true JP6128337B2 (ja) 2017-05-17

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JP (1) JP6128337B2 (enExample)
CN (1) CN105551930B (enExample)
TW (1) TWI584389B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018200685A2 (en) 2017-04-27 2018-11-01 Ecosense Lighting Inc. Methods and systems for an automated design, fulfillment, deployment and operation platform for lighting installations
CN106449489B (zh) * 2016-12-01 2023-07-18 辽宁超粤激光科技集团有限公司 一种ld封装管的自动化生产设备
JP6598811B2 (ja) * 2017-03-23 2019-10-30 Ｔｏｗａ株式会社 半導体パッケージ配置装置、製造装置、半導体パッケージの配置方法および電子部品の製造方法
US10508971B2 (en) * 2017-09-07 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Optical test system and method for determining size of gap between two substrates of optical element
CN107734957A (zh) * 2017-10-11 2018-02-23 广州煌牌自动设备有限公司 一种集成定位识别相机的贴片头部装置
CN107734958A (zh) * 2017-10-11 2018-02-23 广州煌牌自动设备有限公司 一种全透明的贴片机吸嘴
JP7343891B2 (ja) * 2019-06-07 2023-09-13 株式会社ブイ・テクノロジー 貼り合わせ装置、貼り合わせ方法及び表示装置の製造方法
JP7362313B2 (ja) * 2019-06-28 2023-10-17 キヤノン株式会社 電子部品および電子部品の製造方法および検査方法、機器
DE102019209610A1 (de) * 2019-07-01 2021-01-07 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zum Herstellen einer Klebeverbindung zwischen einer ersten Komponente und einer zweiten Komponente
JP7300353B2 (ja) * 2019-09-13 2023-06-29 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
WO2021084582A1 (ja) * 2019-10-28 2021-05-06 パナソニックＩｐマネジメント株式会社 真空貼合装置
CN112967953B (zh) * 2020-12-31 2023-09-08 深圳中科飞测科技股份有限公司 半导体处理设备的使用方法、半导体处理设备、及存储介质
CN112858880A (zh) * 2021-01-12 2021-05-28 安徽华为硕半导体科技有限公司 一种集成电路的测试装置
JP7140930B1 (ja) * 2022-03-07 2022-09-21 Ckd株式会社 基板検査装置及び基板検査方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0640576B2 (ja) * 1984-02-01 1994-05-25 松下電器産業株式会社 固体撮像素子へのフイルタ−接着方法及びその装置
JPH07113609B2 (ja) * 1987-03-23 1995-12-06 石川島播磨重工業株式会社 接着不良部検出方法
TW278212B (enExample) * 1992-05-06 1996-06-11 Sumitomo Electric Industries
JP3379186B2 (ja) * 1993-08-24 2003-02-17 株式会社ニコン 干渉計
JP3492284B2 (ja) * 2000-04-19 2004-02-03 株式会社 日立インダストリイズ 基板貼合装置
JP2002093858A (ja) * 2000-09-14 2002-03-29 Toray Eng Co Ltd チップ実装装置及びそれにおけるキャリブレーション方法
JP4119098B2 (ja) * 2001-02-27 2008-07-16 芝浦メカトロニクス株式会社 部品保持ヘッド、及びそれを用いた部品実装装置並びに部品実装方法
JP2004281626A (ja) * 2003-03-14 2004-10-07 Matsushita Electric Ind Co Ltd 半導体装置の製造方法および固体撮像素子組立装置
JP4530688B2 (ja) * 2004-03-04 2010-08-25 オリンパス株式会社 半導体接合方法及び接合装置
JP4476764B2 (ja) * 2004-03-26 2010-06-09 富士フイルム株式会社 基板接合装置及び方法
JP4825172B2 (ja) * 2007-06-08 2011-11-30 株式会社新川 ボンディング装置用撮像装置及び撮像方法
CN101801646B (zh) * 2007-11-08 2013-04-17 株式会社爱发科 粘合基板制造装置和粘合基板制造方法
JP5355451B2 (ja) * 2010-02-26 2013-11-27 東京エレクトロン株式会社 接合装置
JP5682422B2 (ja) * 2011-04-01 2015-03-11 株式会社デンソー 有機ｅｌ装置およびその製造方法
JP5959104B2 (ja) * 2011-09-27 2016-08-02 芝浦メカトロニクス株式会社 貼り合せ板状体検査装置及び方法
JP5879493B2 (ja) * 2012-04-23 2016-03-08 パナソニックＩｐマネジメント株式会社 電子部品搭載方法

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Publication number Publication date
TWI584389B (zh) 2017-05-21
CN105551930A (zh) 2016-05-04
TW201622027A (zh) 2016-06-16
CN105551930B (zh) 2018-02-16
JP2016086039A (ja) 2016-05-19

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