TWI583280B - 印刷電路板的製造方法及印刷電路板 - Google Patents
印刷電路板的製造方法及印刷電路板 Download PDFInfo
- Publication number
- TWI583280B TWI583280B TW103116414A TW103116414A TWI583280B TW I583280 B TWI583280 B TW I583280B TW 103116414 A TW103116414 A TW 103116414A TW 103116414 A TW103116414 A TW 103116414A TW I583280 B TWI583280 B TW I583280B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- coating layer
- forming
- plating
- coating
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 117
- 239000011247 coating layer Substances 0.000 claims description 386
- 239000010410 layer Substances 0.000 claims description 277
- 238000007747 plating Methods 0.000 claims description 178
- 239000000758 substrate Substances 0.000 claims description 126
- 238000000576 coating method Methods 0.000 claims description 83
- 239000011248 coating agent Substances 0.000 claims description 82
- 238000004519 manufacturing process Methods 0.000 claims description 64
- 239000011241 protective layer Substances 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 31
- 238000004080 punching Methods 0.000 claims description 31
- 230000003014 reinforcing effect Effects 0.000 claims description 30
- 238000010438 heat treatment Methods 0.000 claims description 25
- 238000007789 sealing Methods 0.000 claims description 22
- 238000000206 photolithography Methods 0.000 claims description 16
- 238000000059 patterning Methods 0.000 claims description 15
- 238000007772 electroless plating Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 230000008569 process Effects 0.000 description 83
- 239000010949 copper Substances 0.000 description 40
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 38
- 229910052802 copper Inorganic materials 0.000 description 33
- 238000007639 printing Methods 0.000 description 19
- 239000010408 film Substances 0.000 description 18
- 229920001721 polyimide Polymers 0.000 description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 230000004048 modification Effects 0.000 description 10
- 238000012986 modification Methods 0.000 description 10
- 238000005530 etching Methods 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 238000007765 extrusion coating Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000007646 gravure printing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010017 direct printing Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20130052070 | 2013-05-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201509260A TW201509260A (zh) | 2015-03-01 |
| TWI583280B true TWI583280B (zh) | 2017-05-11 |
Family
ID=51867495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103116414A TWI583280B (zh) | 2013-05-08 | 2014-05-08 | 印刷電路板的製造方法及印刷電路板 |
Country Status (4)
| Country | Link |
|---|---|
| KR (2) | KR101631746B1 (fr) |
| CN (1) | CN105379436B (fr) |
| TW (1) | TWI583280B (fr) |
| WO (1) | WO2014182094A1 (fr) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI566646B (zh) * | 2015-10-06 | 2017-01-11 | 挺暉工業股份有限公司 | 柔性印刷電路板、連接器組件及電子裝置 |
| CN109219259B (zh) * | 2017-07-05 | 2021-09-14 | 宏启胜精密电子(秦皇岛)有限公司 | 柔性电路板及其制作方法 |
| KR101957242B1 (ko) * | 2017-07-26 | 2019-06-20 | (주)잉크테크 | 인쇄회로기판 제조방법 |
| KR102465117B1 (ko) * | 2017-11-29 | 2022-11-11 | 주식회사 잉크테크 | 인쇄회로기판 제조방법 |
| KR102081078B1 (ko) | 2018-07-02 | 2020-02-25 | 도레이첨단소재 주식회사 | 연성동박적층필름 및 이의 제조방법 |
| CN109475044B (zh) * | 2018-12-07 | 2021-05-18 | 常熟东南相互电子有限公司 | 采用uv激光钻孔直接电镀制作fpc内层的方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200908339A (en) * | 2007-07-03 | 2009-02-16 | Matsushita Electric Ind Co Ltd | Semiconductor device, manufacturing method thereof and image display device |
| JP2009135415A (ja) * | 2007-10-29 | 2009-06-18 | Mitsubishi Electric Corp | プリント配線板およびその製造方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05259226A (ja) * | 1992-01-14 | 1993-10-08 | Hitachi Cable Ltd | スルーホール付電気回路構造物及びその製造方法 |
| JPH06260756A (ja) * | 1993-03-04 | 1994-09-16 | Ibiden Co Ltd | プリント配線板の製造方法 |
| JP3207663B2 (ja) * | 1994-03-22 | 2001-09-10 | 松下電器産業株式会社 | プリント配線基板及びその製造方法 |
| JP3279117B2 (ja) * | 1995-03-01 | 2002-04-30 | 株式会社デンソー | フレキシブル配線板の製造方法 |
| CN1155827A (zh) * | 1996-01-25 | 1997-07-30 | 金宝电子工业股份有限公司 | 纸质酚醛树脂线路板及其制造方法 |
| US7345350B2 (en) * | 2003-09-23 | 2008-03-18 | Micron Technology, Inc. | Process and integration scheme for fabricating conductive components, through-vias and semiconductor components including conductive through-wafer vias |
| KR100674293B1 (ko) * | 2005-09-09 | 2007-01-24 | 삼성전기주식회사 | 전자부품이 내장된 인쇄회로기판의 제조방법 |
| JP5245756B2 (ja) * | 2008-11-20 | 2013-07-24 | 富士通株式会社 | 回路基板、多層回路基板および多層回路基板の製造方法 |
| KR20100109698A (ko) * | 2009-04-01 | 2010-10-11 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 |
| CN102415222B (zh) * | 2009-04-24 | 2015-02-04 | 住友电气工业株式会社 | 用于印刷布线板的基板、印刷布线板及其制造方法 |
-
2014
- 2014-05-08 CN CN201480038435.3A patent/CN105379436B/zh not_active Expired - Fee Related
- 2014-05-08 TW TW103116414A patent/TWI583280B/zh not_active IP Right Cessation
- 2014-05-08 WO PCT/KR2014/004109 patent/WO2014182094A1/fr active Application Filing
- 2014-05-08 KR KR1020140054695A patent/KR101631746B1/ko active IP Right Grant
-
2015
- 2015-06-29 KR KR1020150092355A patent/KR101631801B1/ko active IP Right Grant
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200908339A (en) * | 2007-07-03 | 2009-02-16 | Matsushita Electric Ind Co Ltd | Semiconductor device, manufacturing method thereof and image display device |
| JP2009135415A (ja) * | 2007-10-29 | 2009-06-18 | Mitsubishi Electric Corp | プリント配線板およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105379436A (zh) | 2016-03-02 |
| TW201509260A (zh) | 2015-03-01 |
| KR20150084724A (ko) | 2015-07-22 |
| CN105379436B (zh) | 2018-08-14 |
| KR101631746B1 (ko) | 2016-07-07 |
| KR101631801B1 (ko) | 2016-07-07 |
| KR20140133464A (ko) | 2014-11-19 |
| WO2014182094A1 (fr) | 2014-11-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |