TWI579106B - 低密度拋光墊 - Google Patents
低密度拋光墊 Download PDFInfo
- Publication number
- TWI579106B TWI579106B TW103126073A TW103126073A TWI579106B TW I579106 B TWI579106 B TW I579106B TW 103126073 A TW103126073 A TW 103126073A TW 103126073 A TW103126073 A TW 103126073A TW I579106 B TWI579106 B TW I579106B
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing pad
- polishing
- diameter
- trace elements
- polyurethane material
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims description 275
- 239000011148 porous material Substances 0.000 claims description 132
- 239000000463 material Substances 0.000 claims description 107
- 239000011573 trace mineral Substances 0.000 claims description 102
- 235000013619 trace mineral Nutrition 0.000 claims description 102
- 239000000203 mixture Substances 0.000 claims description 66
- 229920002635 polyurethane Polymers 0.000 claims description 66
- 239000004814 polyurethane Substances 0.000 claims description 66
- 229920001187 thermosetting polymer Polymers 0.000 claims description 61
- 238000009826 distribution Methods 0.000 claims description 58
- 238000000034 method Methods 0.000 claims description 50
- 238000000465 moulding Methods 0.000 claims description 33
- 238000010438 heat treatment Methods 0.000 claims description 27
- 239000003795 chemical substances by application Substances 0.000 claims description 20
- 239000004970 Chain extender Substances 0.000 claims description 16
- 230000002902 bimodal effect Effects 0.000 claims description 16
- 239000004971 Cross linker Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 239000007787 solid Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 14
- 239000000945 filler Substances 0.000 claims description 12
- -1 aromatic bisamine compound Chemical class 0.000 claims description 6
- 239000012948 isocyanate Substances 0.000 claims description 6
- 150000002513 isocyanates Chemical group 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 3
- 239000003431 cross linking reagent Substances 0.000 claims 1
- 238000005266 casting Methods 0.000 description 16
- 239000003361 porogen Substances 0.000 description 15
- 238000009472 formulation Methods 0.000 description 12
- 239000000126 substance Substances 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 239000002002 slurry Substances 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 239000002243 precursor Substances 0.000 description 6
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 4
- CJDPJFRMHVXWPT-UHFFFAOYSA-N barium sulfide Chemical compound [S-2].[Ba+2] CJDPJFRMHVXWPT-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000009966 trimming Methods 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- OYLGJCQECKOTOL-UHFFFAOYSA-L barium fluoride Chemical compound [F-].[F-].[Ba+2] OYLGJCQECKOTOL-UHFFFAOYSA-L 0.000 description 2
- 229910001632 barium fluoride Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004031 devitrification Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- QLOAVXSYZAJECW-UHFFFAOYSA-N methane;molecular fluorine Chemical compound C.FF QLOAVXSYZAJECW-UHFFFAOYSA-N 0.000 description 2
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- ITRNXVSDJBHYNJ-UHFFFAOYSA-N tungsten disulfide Chemical compound S=[W]=S ITRNXVSDJBHYNJ-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 150000004984 aromatic diamines Chemical group 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000008258 liquid foam Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/04—Zonally-graded surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
- B24D11/005—Making abrasive webs
- B24D11/006—Making abrasive webs without embedded abrasive particles
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/955,398 US20150038066A1 (en) | 2013-07-31 | 2013-07-31 | Low density polishing pad |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201509595A TW201509595A (zh) | 2015-03-16 |
| TWI579106B true TWI579106B (zh) | 2017-04-21 |
Family
ID=51263570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103126073A TWI579106B (zh) | 2013-07-31 | 2014-07-30 | 低密度拋光墊 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20150038066A1 (enExample) |
| EP (1) | EP3027363B1 (enExample) |
| JP (3) | JP6517802B2 (enExample) |
| KR (1) | KR101801693B1 (enExample) |
| CN (1) | CN105408063B (enExample) |
| SG (1) | SG11201600242PA (enExample) |
| TW (1) | TWI579106B (enExample) |
| WO (1) | WO2015017138A1 (enExample) |
Families Citing this family (70)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| CN107078048B (zh) | 2014-10-17 | 2021-08-13 | 应用材料公司 | 使用加成制造工艺的具复合材料特性的cmp衬垫建构 |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US9586304B2 (en) * | 2014-12-19 | 2017-03-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Controlled-expansion CMP PAD casting method |
| US10005172B2 (en) * | 2015-06-26 | 2018-06-26 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Controlled-porosity method for forming polishing pad |
| KR20230169424A (ko) | 2015-10-30 | 2023-12-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법 |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| CN113146464A (zh) | 2016-01-19 | 2021-07-23 | 应用材料公司 | 多孔化学机械抛光垫 |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| JP7148226B2 (ja) | 2016-09-21 | 2022-10-05 | 東友ファインケム株式会社 | 赤色硬化性樹脂組成物 |
| US10596763B2 (en) | 2017-04-21 | 2020-03-24 | Applied Materials, Inc. | Additive manufacturing with array of energy sources |
| US20180345449A1 (en) * | 2017-06-06 | 2018-12-06 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pads for improved removal rate and planarization |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| KR101949905B1 (ko) | 2017-08-23 | 2019-02-19 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
| JP7273796B2 (ja) * | 2017-08-25 | 2023-05-15 | スリーエム イノベイティブ プロパティズ カンパニー | 表面突起研磨パッド |
| CN109689299A (zh) | 2017-09-11 | 2019-04-26 | Skc株式会社 | 多孔聚氨酯抛光垫及其制备方法 |
| KR102088919B1 (ko) | 2017-09-11 | 2020-03-13 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
| KR101949911B1 (ko) | 2017-09-11 | 2019-02-19 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
| KR102054309B1 (ko) | 2018-04-17 | 2019-12-10 | 에스케이씨 주식회사 | 다공성 연마 패드 및 이의 제조방법 |
| KR102058877B1 (ko) | 2018-04-20 | 2019-12-24 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
| CN112654655A (zh) | 2018-09-04 | 2021-04-13 | 应用材料公司 | 先进抛光垫配方 |
| KR102185265B1 (ko) | 2018-12-26 | 2020-12-01 | 에스케이씨 주식회사 | 연마패드용 조성물, 연마패드 및 이의 제조방법 |
| KR102202076B1 (ko) | 2018-12-26 | 2021-01-12 | 에스케이씨 주식회사 | 연마패드용 조성물, 연마패드 및 이의 제조방법 |
| TWI735101B (zh) | 2018-12-26 | 2021-08-01 | 南韓商Ｓｋｃ索密思股份有限公司 | 用於研磨墊之組成物、研磨墊及用於製備其之方法 |
| KR102283399B1 (ko) | 2018-12-26 | 2021-07-30 | 에스케이씨솔믹스 주식회사 | 연마패드용 조성물, 연마패드 및 이의 제조방법 |
| KR20200079865A (ko) | 2018-12-26 | 2020-07-06 | 에스케이씨 주식회사 | 연마패드용 조성물, 연마패드 및 이의 제조방법 |
| KR20200079847A (ko) | 2018-12-26 | 2020-07-06 | 에스케이씨 주식회사 | 연마패드용 조성물, 연마패드 및 이의 제조방법 |
| KR102174958B1 (ko) | 2019-03-27 | 2020-11-05 | 에스케이씨 주식회사 | 결함 발생을 최소화시키는 연마패드 및 이의 제조방법 |
| KR102277418B1 (ko) | 2019-05-21 | 2021-07-14 | 에스케이씨솔믹스 주식회사 | 가교 밀도가 향상된 연마패드 및 이의 제조방법 |
| KR102237367B1 (ko) | 2019-06-17 | 2021-04-07 | 에스케이씨솔믹스 주식회사 | 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법 |
| US11207757B2 (en) | 2019-06-17 | 2021-12-28 | Skc Solmics Co., Ltd. | Composition for polishing pad, polishing pad and preparation method of semiconductor device |
| KR102237362B1 (ko) | 2019-06-17 | 2021-04-07 | 에스케이씨솔믹스 주식회사 | 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법 |
| KR102237357B1 (ko) | 2019-06-17 | 2021-04-07 | 에스케이씨솔믹스 주식회사 | 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법 |
| KR102237351B1 (ko) | 2019-06-17 | 2021-04-07 | 에스케이씨솔믹스 주식회사 | 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법 |
| KR102197481B1 (ko) | 2019-06-27 | 2020-12-31 | 에스케이씨 주식회사 | 연마패드 및 이의 제조방법 |
| KR102273097B1 (ko) | 2019-10-23 | 2021-07-05 | 에스케이씨솔믹스 주식회사 | 연마패드용 조성물, 연마패드 및 이의 제조방법 |
| KR102188525B1 (ko) | 2019-10-29 | 2020-12-08 | 에스케이씨 주식회사 | 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법 |
| KR102304965B1 (ko) | 2019-10-30 | 2021-09-24 | 에스케이씨솔믹스 주식회사 | 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법 |
| TWI741753B (zh) | 2019-10-29 | 2021-10-01 | 南韓商Ｓｋｃ索密思股份有限公司 | 研磨墊、製造該研磨墊之方法及使用該研磨墊以製造半導體裝置之方法 |
| KR102287923B1 (ko) | 2019-10-30 | 2021-08-09 | 에스케이씨솔믹스 주식회사 | 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법 |
| KR102287235B1 (ko) | 2019-10-30 | 2021-08-06 | 에스케이씨솔믹스 주식회사 | 가교도가 조절된 연마패드 및 이의 제조방법 |
| KR102298114B1 (ko) | 2019-11-05 | 2021-09-03 | 에스케이씨솔믹스 주식회사 | 연마패드, 이의 제조방법 및 이를 이용한 반도체 소자의 제조방법 |
| KR102300038B1 (ko) | 2019-11-15 | 2021-09-08 | 에스케이씨솔믹스 주식회사 | 연마패드로부터 재생된 폴리올 조성물 및 이의 제조방법 |
| KR102300050B1 (ko) | 2019-11-15 | 2021-09-08 | 에스케이씨솔믹스 주식회사 | 연마패드로부터 재생된 폴리올 및 이의 제조방법 |
| KR102298111B1 (ko) | 2019-11-15 | 2021-09-03 | 에스케이씨솔믹스 주식회사 | 재생 폴리올을 포함하는 폴리우레탄 연마패드 및 이의 제조방법 |
| KR102293765B1 (ko) | 2019-11-21 | 2021-08-26 | 에스케이씨솔믹스 주식회사 | 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법 |
| KR102177748B1 (ko) | 2019-11-28 | 2020-11-11 | 에스케이씨 주식회사 | 다공성 연마 패드 및 이의 제조방법 |
| US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
| JP7576396B2 (ja) * | 2020-01-20 | 2024-10-31 | ニッタ・デュポン株式会社 | 研磨パッド |
| US11667061B2 (en) * | 2020-04-18 | 2023-06-06 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of forming leveraged poromeric polishing pad |
| US11806829B2 (en) * | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
| KR20200105465A (ko) | 2020-08-28 | 2020-09-07 | 에스케이씨 주식회사 | 연마패드용 조성물, 연마패드 및 이의 제조방법 |
| KR20200105790A (ko) | 2020-09-01 | 2020-09-09 | 에스케이씨 주식회사 | 연마패드용 조성물, 연마패드 및 이의 제조방법 |
| CN112091817B (zh) * | 2020-09-08 | 2022-06-17 | 中国航发贵州黎阳航空动力有限公司 | 一种薄壁环形零件端面研磨工具 |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
| CN120051356A (zh) * | 2022-09-22 | 2025-05-27 | Cmc材料有限责任公司 | 具有二硫键的化学机械抛光垫 |
| KR102731712B1 (ko) | 2023-04-14 | 2024-11-19 | 에스케이엔펄스 주식회사 | 염소 함량이 조절된 연마패드 및 이를 이용한 반도체 소자의 제조방법 |
| KR102884111B1 (ko) | 2023-04-25 | 2025-11-17 | 주식회사 브러쉬텍 | 씨엠피용 패드 컨디셔닝 디스크 및 그 제조방법 |
| KR102889774B1 (ko) | 2023-11-06 | 2025-11-24 | 엔펄스 주식회사 | 결함 발생이 감소된 연마패드 및 이를 이용한 반도체 소자의 제조방법 |
| KR102741574B1 (ko) | 2023-07-26 | 2024-12-12 | 에스케이엔펄스 주식회사 | 결함 발생이 저감된 연마패드 및 이를 이용한 반도체 소자의 제조방법 |
| US20250033160A1 (en) | 2023-07-26 | 2025-01-30 | Sk Enpulse Co., Ltd. | Polishing pad with reduced defect and method of preparing a semiconductor device using the same |
| KR20250066238A (ko) | 2023-11-06 | 2025-05-13 | 엔펄스 주식회사 | 연마패드 및 이를 이용한 반도체 소자의 제조 방법 |
| TW202531364A (zh) | 2023-11-06 | 2025-08-01 | 南韓商Ｓｋ恩普士股份有限公司 | 拋光墊及使用其來製備半導體裝置的方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI312305B (en) * | 2003-01-10 | 2009-07-21 | 3M Innovative Properties Co | Pad constructions for chemical mechanical planarization applications |
| TWI329045B (en) * | 2003-10-09 | 2010-08-21 | Rohm & Haas Elect Mat | Polishing pad and method of polishing semiconductor substrate |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5885312A (en) * | 1997-06-17 | 1999-03-23 | Speedfam Corporation | Grinding composition using abrasive particles on bubbles |
| US6231942B1 (en) * | 1998-01-21 | 2001-05-15 | Trexel, Inc. | Method and apparatus for microcellular polypropylene extrusion, and polypropylene articles produced thereby |
| TWI228522B (en) * | 1999-06-04 | 2005-03-01 | Fuji Spinning Co Ltd | Urethane molded products for polishing pad and method for making same |
| US6368200B1 (en) * | 2000-03-02 | 2002-04-09 | Agere Systems Guardian Corporation | Polishing pads from closed-cell elastomer foam |
| US20020016139A1 (en) * | 2000-07-25 | 2002-02-07 | Kazuto Hirokawa | Polishing tool and manufacturing method therefor |
| US8062098B2 (en) * | 2000-11-17 | 2011-11-22 | Duescher Wayne O | High speed flat lapping platen |
| WO2003066284A1 (en) * | 2002-02-06 | 2003-08-14 | Applied Materials, Inc. | Method and apparatus for chemical mechanical polishing with an eddy current monitoring system |
| US6841221B2 (en) * | 2002-02-20 | 2005-01-11 | Congoleum Corporation | Heat activated coating texture |
| US6960120B2 (en) * | 2003-02-10 | 2005-11-01 | Cabot Microelectronics Corporation | CMP pad with composite transparent window |
| JP2004345014A (ja) * | 2003-05-21 | 2004-12-09 | Hitachi Chem Co Ltd | 研磨用パッドとそれを用いた研磨方法 |
| US20050017122A1 (en) * | 2003-07-23 | 2005-01-27 | Conitex-Sonoco Llc | Apparatus and method for forming enlarged base on yarn carrier, and yarn carrier with enlarged base |
| JP2006128563A (ja) * | 2004-11-01 | 2006-05-18 | Toyo Tire & Rubber Co Ltd | 半導体ウエハ研磨用研磨パッドおよび半導体デバイスの製造方法 |
| EP1704965A1 (de) * | 2005-03-24 | 2006-09-27 | Solvay Fluor GmbH | Schleifmittelzusatz |
| JP4986129B2 (ja) * | 2007-01-15 | 2012-07-25 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP5117147B2 (ja) * | 2007-09-11 | 2013-01-09 | 富士紡ホールディングス株式会社 | 研磨パッドおよび研磨パッドの製造方法 |
| CN101990483B (zh) * | 2008-04-01 | 2013-10-16 | 音诺帕德股份有限公司 | 具有经控制的孔隙形态的抛光垫 |
| EP2182024A3 (en) * | 2008-10-30 | 2011-04-20 | Rohm and Haas Company | Flexible acrylic foam composition |
| JP5393434B2 (ja) * | 2008-12-26 | 2014-01-22 | 東洋ゴム工業株式会社 | 研磨パッド及びその製造方法 |
| JP5521243B2 (ja) * | 2009-07-03 | 2014-06-11 | 日本発條株式会社 | 研磨保持用パッド |
| US20120009458A1 (en) * | 2010-07-12 | 2012-01-12 | Wu Donald P H | Connecting structure for exteriorly connecting a battery cell and a load |
| US8702479B2 (en) * | 2010-10-15 | 2014-04-22 | Nexplanar Corporation | Polishing pad with multi-modal distribution of pore diameters |
| US20120302148A1 (en) * | 2011-05-23 | 2012-11-29 | Rajeev Bajaj | Polishing pad with homogeneous body having discrete protrusions thereon |
| JP5738731B2 (ja) * | 2011-09-22 | 2015-06-24 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP5945874B2 (ja) * | 2011-10-18 | 2016-07-05 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
-
2013
- 2013-07-31 US US13/955,398 patent/US20150038066A1/en not_active Abandoned
-
2014
- 2014-07-17 WO PCT/US2014/047065 patent/WO2015017138A1/en not_active Ceased
- 2014-07-17 JP JP2016531739A patent/JP6517802B2/ja active Active
- 2014-07-17 SG SG11201600242PA patent/SG11201600242PA/en unknown
- 2014-07-17 EP EP14747270.8A patent/EP3027363B1/en active Active
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2016
- 2016-12-02 JP JP2016234679A patent/JP6415521B2/ja active Active
-
2018
- 2018-12-20 JP JP2018238139A patent/JP2019077036A/ja not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI312305B (en) * | 2003-01-10 | 2009-07-21 | 3M Innovative Properties Co | Pad constructions for chemical mechanical planarization applications |
| TWI329045B (en) * | 2003-10-09 | 2010-08-21 | Rohm & Haas Elect Mat | Polishing pad and method of polishing semiconductor substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6517802B2 (ja) | 2019-05-22 |
| JP2017042910A (ja) | 2017-03-02 |
| KR101801693B1 (ko) | 2017-11-27 |
| CN105408063B (zh) | 2018-01-30 |
| KR20160027075A (ko) | 2016-03-09 |
| JP2016525459A (ja) | 2016-08-25 |
| SG11201600242PA (en) | 2016-02-26 |
| EP3027363B1 (en) | 2020-01-15 |
| JP6415521B2 (ja) | 2018-10-31 |
| JP2019077036A (ja) | 2019-05-23 |
| EP3027363A1 (en) | 2016-06-08 |
| TW201509595A (zh) | 2015-03-16 |
| US20150038066A1 (en) | 2015-02-05 |
| CN105408063A (zh) | 2016-03-16 |
| WO2015017138A1 (en) | 2015-02-05 |
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