JP6517802B2 - 低密度研磨パッド - Google Patents

低密度研磨パッド Download PDF

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Publication number
JP6517802B2
JP6517802B2 JP2016531739A JP2016531739A JP6517802B2 JP 6517802 B2 JP6517802 B2 JP 6517802B2 JP 2016531739 A JP2016531739 A JP 2016531739A JP 2016531739 A JP2016531739 A JP 2016531739A JP 6517802 B2 JP6517802 B2 JP 6517802B2
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Japan
Prior art keywords
polishing pad
closed cell
polishing
diameter mode
thermosetting polyurethane
Prior art date
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JP2016531739A
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English (en)
Japanese (ja)
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JP2016525459A (ja
Inventor
ピン フアン，
ピン フアン，
ウィリアム シー． アリソン，
ウィリアム シー． アリソン，
リチャード フレンツェル，
リチャード フレンツェル，
ポール アンドレ ルフェーブル，
ポール アンドレ ルフェーブル，
ロバート ケープリッチ，
ロバート ケープリッチ，
ダイアン スコット，
ダイアン スコット，
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CMC Materials LLC
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Cabot Microelectronics Corp
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Publication of JP2016525459A publication Critical patent/JP2016525459A/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/04—Zonally-graded surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B24D11/005—Making abrasive webs
    • B24D11/006—Making abrasive webs without embedded abrasive particles

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
JP2016531739A 2013-07-31 2014-07-17 低密度研磨パッド Active JP6517802B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/955,398 US20150038066A1 (en) 2013-07-31 2013-07-31 Low density polishing pad
US13/955,398 2013-07-31
PCT/US2014/047065 WO2015017138A1 (en) 2013-07-31 2014-07-17 Low density polishing pad

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2016234679A Division JP6415521B2 (ja) 2013-07-31 2016-12-02 低密度研磨パッド
JP2018238139A Division JP2019077036A (ja) 2013-07-31 2018-12-20 低密度研磨パッド

Publications (2)

Publication Number Publication Date
JP2016525459A JP2016525459A (ja) 2016-08-25
JP6517802B2 true JP6517802B2 (ja) 2019-05-22

Family

ID=51263570

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2016531739A Active JP6517802B2 (ja) 2013-07-31 2014-07-17 低密度研磨パッド
JP2016234679A Active JP6415521B2 (ja) 2013-07-31 2016-12-02 低密度研磨パッド
JP2018238139A Withdrawn JP2019077036A (ja) 2013-07-31 2018-12-20 低密度研磨パッド

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2016234679A Active JP6415521B2 (ja) 2013-07-31 2016-12-02 低密度研磨パッド
JP2018238139A Withdrawn JP2019077036A (ja) 2013-07-31 2018-12-20 低密度研磨パッド

Country Status (8)

Country Link
US (1) US20150038066A1 (enExample)
EP (1) EP3027363B1 (enExample)
JP (3) JP6517802B2 (enExample)
KR (1) KR101801693B1 (enExample)
CN (1) CN105408063B (enExample)
SG (1) SG11201600242PA (enExample)
TW (1) TWI579106B (enExample)
WO (1) WO2015017138A1 (enExample)

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JP2016525459A (ja) 2016-08-25
SG11201600242PA (en) 2016-02-26
EP3027363B1 (en) 2020-01-15
JP6415521B2 (ja) 2018-10-31
JP2019077036A (ja) 2019-05-23
EP3027363A1 (en) 2016-06-08
TW201509595A (zh) 2015-03-16
US20150038066A1 (en) 2015-02-05
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