TWI573693B - 層合體、層合體之分離方法、及分離層之評估方法 - Google Patents

層合體、層合體之分離方法、及分離層之評估方法 Download PDF

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Publication number
TWI573693B
TWI573693B TW102134822A TW102134822A TWI573693B TW I573693 B TWI573693 B TW I573693B TW 102134822 A TW102134822 A TW 102134822A TW 102134822 A TW102134822 A TW 102134822A TW I573693 B TWI573693 B TW I573693B
Authority
TW
Taiwan
Prior art keywords
separation layer
light
substrate
laminate
layer
Prior art date
Application number
TW102134822A
Other languages
English (en)
Chinese (zh)
Other versions
TW201420355A (zh
Inventor
高瀬真治
松下淳
Original Assignee
東京應化工業股份有限公司
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Publication date
Application filed by 東京應化工業股份有限公司 filed Critical 東京應化工業股份有限公司
Publication of TW201420355A publication Critical patent/TW201420355A/zh
Application granted granted Critical
Publication of TWI573693B publication Critical patent/TWI573693B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D1/00—Evaporating
    • B01D1/14—Evaporating with heated gases or vapours or liquids in contact with the liquid

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
TW102134822A 2012-09-28 2013-09-26 層合體、層合體之分離方法、及分離層之評估方法 TWI573693B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012218718 2012-09-28

Publications (2)

Publication Number Publication Date
TW201420355A TW201420355A (zh) 2014-06-01
TWI573693B true TWI573693B (zh) 2017-03-11

Family

ID=50388219

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102134822A TWI573693B (zh) 2012-09-28 2013-09-26 層合體、層合體之分離方法、及分離層之評估方法

Country Status (3)

Country Link
JP (1) JP6261508B2 (ja)
TW (1) TWI573693B (ja)
WO (1) WO2014050820A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6378929B2 (ja) * 2014-05-15 2018-08-22 東京応化工業株式会社 積層体の製造方法および積層体
JP6298393B2 (ja) * 2014-10-30 2018-03-20 東京応化工業株式会社 支持体分離方法
JP6437805B2 (ja) * 2014-12-03 2018-12-12 東京応化工業株式会社 積層体の製造方法、封止基板積層体の製造方法及び積層体
JP6486735B2 (ja) * 2015-03-17 2019-03-20 東芝メモリ株式会社 半導体製造方法および半導体製造装置
WO2020080276A1 (ja) * 2018-10-16 2020-04-23 富士フイルム株式会社 レーザ剥離用の積層体、組成物およびキット
CN116847981A (zh) * 2021-04-01 2023-10-03 东丽株式会社 层叠体及半导体装置的制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012056969A1 (ja) * 2010-10-29 2012-05-03 東京応化工業株式会社 積層体、およびその積層体の分離方法
TW201233562A (en) * 2010-11-15 2012-08-16 Tokyo Ohka Kogyo Co Ltd Laminate and method for separating the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007015377A (ja) * 2005-06-07 2007-01-25 Fujifilm Holdings Corp 機能性膜含有構造体、及び、機能性膜の製造方法
JP5257314B2 (ja) * 2009-09-29 2013-08-07 大日本印刷株式会社 積層体、準備用支持体、積層体の製造方法、及びデバイスの製造方法
JP5756334B2 (ja) * 2010-10-29 2015-07-29 東京応化工業株式会社 積層体、およびその積層体の分離方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012056969A1 (ja) * 2010-10-29 2012-05-03 東京応化工業株式会社 積層体、およびその積層体の分離方法
TW201233562A (en) * 2010-11-15 2012-08-16 Tokyo Ohka Kogyo Co Ltd Laminate and method for separating the same

Also Published As

Publication number Publication date
WO2014050820A1 (ja) 2014-04-03
JP6261508B2 (ja) 2018-01-17
TW201420355A (zh) 2014-06-01
JPWO2014050820A1 (ja) 2016-08-22

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