TWI565778B - 電子組件用黏著劑 - Google Patents

電子組件用黏著劑 Download PDF

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Publication number
TWI565778B
TWI565778B TW101140402A TW101140402A TWI565778B TW I565778 B TWI565778 B TW I565778B TW 101140402 A TW101140402 A TW 101140402A TW 101140402 A TW101140402 A TW 101140402A TW I565778 B TWI565778 B TW I565778B
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TW
Taiwan
Prior art keywords
adhesive composition
wafer
adhesive
adhesive layer
wiring board
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TW101140402A
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English (en)
Chinese (zh)
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TW201323558A (zh
Inventor
村田容子
堀口有亮
佐野美惠子
吉娜 洪
Original Assignee
亨克爾股份有限及兩合公司
漢高智慧財產控股公司
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=48192591&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI565778(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 亨克爾股份有限及兩合公司, 漢高智慧財產控股公司 filed Critical 亨克爾股份有限及兩合公司
Publication of TW201323558A publication Critical patent/TW201323558A/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
TW101140402A 2011-11-02 2012-10-31 電子組件用黏著劑 TWI565778B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161554698P 2011-11-02 2011-11-02

Publications (2)

Publication Number Publication Date
TW201323558A TW201323558A (zh) 2013-06-16
TWI565778B true TWI565778B (zh) 2017-01-11

Family

ID=48192591

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101140402A TWI565778B (zh) 2011-11-02 2012-10-31 電子組件用黏著劑

Country Status (6)

Country Link
US (2) US9305892B2 (https=)
JP (1) JP6165754B2 (https=)
KR (1) KR101924049B1 (https=)
CN (1) CN104039913B (https=)
TW (1) TWI565778B (https=)
WO (1) WO2013066597A1 (https=)

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WO2013035205A1 (ja) * 2011-09-09 2013-03-14 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン アンダーフィル用組成物
WO2013035204A1 (ja) * 2011-09-09 2013-03-14 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 電子装置用組成物
JP5435520B1 (ja) * 2013-03-29 2014-03-05 古河電気工業株式会社 有機電子デバイス用素子封止用樹脂組成物、有機電子デバイス用素子封止用樹脂シート、有機エレクトロルミネッセンス素子、及び画像表示装置
CN105934488A (zh) * 2014-01-29 2016-09-07 日立化成株式会社 粘接剂组合物、由粘接剂组合物得到的树脂固化物、使用了粘接剂组合物的半导体装置的制造方法、以及固体摄像元件
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JP6556743B2 (ja) * 2014-02-19 2019-08-07 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ 液晶シーリング用の硬化性樹脂組成物
KR101828644B1 (ko) 2014-03-25 2018-02-14 주식회사 엘지화학 방열 점착 테이프용 점착제 조성물 및 방열 점착 테이프
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JP2017103289A (ja) * 2015-11-30 2017-06-08 日立化成株式会社 半導体用接着剤、半導体装置、及び半導体装置の製造方法
JP6791626B2 (ja) * 2015-12-14 2020-11-25 デクセリアルズ株式会社 熱硬化性接着シート、及び半導体装置の製造方法
JP6638380B2 (ja) * 2015-12-22 2020-01-29 日立化成株式会社 先供給型アンダーフィル材及びその硬化物、並びに電子部品装置及びその製造方法
JP6707856B2 (ja) * 2015-12-22 2020-06-10 日立化成株式会社 先供給型アンダーフィル材、電子部品装置の製造方法、及び電子部品装置
JP6631238B2 (ja) * 2015-12-22 2020-01-15 日立化成株式会社 先供給型アンダーフィル材、先供給型アンダーフィル材の硬化物、電子部品装置及び電子部品装置の製造方法
JP2017179176A (ja) * 2016-03-31 2017-10-05 ナミックス株式会社 フィルム状半導体封止剤、および半導体装置
WO2017209044A1 (ja) 2016-05-31 2017-12-07 三菱瓦斯化学株式会社 樹脂組成物、積層体、樹脂組成物層付き半導体ウェハ、樹脂組成物層付き半導体搭載用基板及び半導体装置
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JP6706995B2 (ja) * 2016-08-05 2020-06-10 三井化学東セロ株式会社 アンダーフィル用絶縁フィルム
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KR20190103351A (ko) * 2017-01-12 2019-09-04 헨켈 아게 운트 코. 카게아아 방사선 경화성 실란트 조성물
KR101872375B1 (ko) * 2017-02-13 2018-06-29 주식회사 로보스타 파티클 제거 방법 및 그 장치
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WO2018212215A1 (ja) * 2017-05-16 2018-11-22 デクセリアルズ株式会社 アンダーフィル材、アンダーフィルフィルム、及びこれを用いた半導体装置の製造方法
JP6920723B2 (ja) 2017-07-14 2021-08-18 ナミックス株式会社 加圧実装用ｎｃｆ
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EP3786233B1 (en) * 2018-04-26 2025-04-23 Mitsubishi Gas Chemical Company, Inc. Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device
JP6597845B2 (ja) * 2018-06-25 2019-10-30 日立化成株式会社 先供給型アンダーフィル材、電子部品装置及び電子部品装置の製造方法
WO2020019703A1 (en) * 2018-07-24 2020-01-30 Henkel Ag & Co. Kgaa Flame retardant adhesive composition
JP2020107754A (ja) * 2018-12-27 2020-07-09 東京応化工業株式会社 電子部品の製造方法、及びキット
JP7110090B2 (ja) * 2018-12-28 2022-08-01 東京エレクトロン株式会社 基板処理方法および基板処理システム
EP3991968A4 (en) 2019-06-28 2023-07-12 Mitsubishi Gas Chemical Company, Inc. FILM, MULTILAYER BODY, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH FILM LAYER, AND SEMICONDUCTOR DEVICE
CN114144467B (zh) 2019-06-28 2023-05-23 三菱瓦斯化学株式会社 树脂组合物、树脂片、层叠体、带树脂组合物层的半导体晶圆、基板和半导体装置
JP7515787B2 (ja) 2019-06-28 2024-07-16 三菱瓦斯化学株式会社 フィルム、積層体、フィルム層付き半導体ウェハ、フィルム層付き半導体搭載用基板、及び半導体装置
JP7565016B2 (ja) 2019-06-28 2024-10-10 三菱瓦斯化学株式会社 フィルム、積層体、フィルム層付き半導体ウェハ、フィルム層付き半導体搭載用基板、及び半導体装置
JP7406336B2 (ja) * 2019-10-11 2023-12-27 三星電子株式会社 半導体装置の製造方法
JP6844680B2 (ja) * 2019-12-12 2021-03-17 昭和電工マテリアルズ株式会社 先供給型アンダーフィル材、先供給型アンダーフィル材の硬化物、電子部品装置及び電子部品装置の製造方法
JP6844685B2 (ja) * 2019-12-26 2021-03-17 昭和電工マテリアルズ株式会社 先供給型アンダーフィル材及びその硬化物、並びに電子部品装置及びその製造方法
CN114051647B (zh) * 2020-01-29 2023-02-03 株式会社村田制作所 带电极的无源部件和带电极的无源部件的集合体
GB2593754B (en) 2020-04-01 2022-12-28 Henkel Ag & Co Kgaa Redox curable compositions and methods of manufacture thereof
FR3113771B1 (fr) * 2020-08-27 2022-10-21 Commissariat Energie Atomique Procédé de fabrication d'un substrat-poignée destiné au collage temporaire d'un substrat.
CN114316872B (zh) 2020-09-29 2023-09-05 上海飞凯材料科技股份有限公司 一种临时粘合剂及其应用和应用方法
CN113427839A (zh) * 2021-08-26 2021-09-24 金石(天津)科技发展有限公司 复合膜袋及其制备方法
WO2026050296A1 (en) * 2024-08-26 2026-03-05 Henkel Ag & Co. Kgaa B-stage thermally conductive adhesive

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