JP2013194102A - 接着剤組成物、接着シートおよび半導体装置の製造方法 - Google Patents
接着剤組成物、接着シートおよび半導体装置の製造方法 Download PDFInfo
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- JP2013194102A JP2013194102A JP2012061097A JP2012061097A JP2013194102A JP 2013194102 A JP2013194102 A JP 2013194102A JP 2012061097 A JP2012061097 A JP 2012061097A JP 2012061097 A JP2012061097 A JP 2012061097A JP 2013194102 A JP2013194102 A JP 2013194102A
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/24—Homopolymers or copolymers of amides or imides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J143/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium, or a metal; Adhesives based on derivatives of such polymers
- C09J143/04—Homopolymers or copolymers of monomers containing silicon
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
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Abstract
【解決手段】 本発明に係る接着剤組成物は、アクリル重合体(A)、不飽和炭化水素基を有する熱硬化性樹脂(B)および反応性二重結合基を有するカップリング剤(C)を含むことを特徴としている。
【選択図】なし
Description
(1)アクリル重合体(A)、不飽和炭化水素基を有する熱硬化性樹脂(B)および反応性二重結合基を有するカップリング剤(C)を含む接着剤組成物。
本発明に係る接着剤組成物は、アクリル重合体(A)(以下「(A)成分」とも言う。他の成分についても同様である。)、熱硬化性樹脂(B)、カップリング剤(C)を必須成分として含み、各種物性を改良するため、必要に応じ他の成分を含んでいても良い。以下、これら各成分について具体的に説明する。
アクリル重合体(A)としては従来公知のアクリル重合体を用いることができる。アクリル重合体(A)の重量平均分子量(Mw)は、1万〜200万であることが好ましく、10万〜150万であることがより好ましい。アクリル重合体(A)の重量平均分子量が低過ぎると、接着剤層と支持体との接着力が高くなってチップのピックアップ不良が起こることがある。アクリル重合体(A)の重量平均分子量が高すぎると、被着体の凹凸へ接着剤層が追従できないことがあり、ボイドなどの発生要因になることがある。アクリル重合体(A)の重量平均分子量は、ゲル・パーミエーション・クロマトグラフィー(GPC)法により測定されるポリスチレン換算値である。
熱硬化性樹脂(B)は、エポキシ樹脂および熱硬化剤からなり、本発明では、エポキシ樹脂および熱硬化剤の何れか一方または両方が不飽和炭化水素基を有する。エポキシ樹脂としては、不飽和炭化水素基を有するエポキシ樹脂(B1)および不飽和炭化水素基を有しないエポキシ樹脂(B1’)があり、熱硬化剤としては、不飽和炭化水素基を有する熱硬化剤(B2)および不飽和炭化水素基を有しない熱硬化剤(B2’)がある。本発明の熱硬化性樹脂(B)には、不飽和炭化水素基を有するエポキシ樹脂(B1)および不飽和炭化水素基を有する熱硬化剤(B2)の何れか一方を必須成分として含む。また、エポキシ樹脂(B1)およびエポキシ樹脂(B1’)の何れか一方を必須成分として含み、熱硬化剤(B2)および熱硬化剤(B2’)の何れか一方を必須成分として含む。ただし、エポキシ樹脂および熱硬化剤の両方が不飽和炭化水素基を有しない場合、すなわち成分(B1’)と成分(B2’)のみの組み合わせは除外される。
反応性二重結合基を有するカップリング剤(C)は、反応性二重結合基を有していれば特に限定されない。反応性二重結合基は、反応性を有するビニル基、アリル基、スチリル基または(メタ)アクリル基であることが好ましい。
接着剤組成物は、上記成分に加えて下記成分を含むことができる。
接着剤組成物は、光重合開始剤を含有することが好ましい。光重合開始剤を含有することで、たとえば本発明の接着シートを、ダイシング・ダイボンディングシートとして用いた場合に、ウエハに貼付後、ダイシング工程前に紫外線を照射することで反応性二重結合基を有するカップリング剤および熱硬化性樹脂の有する不飽和炭化水素基を反応せしめ、予備硬化させることができる。予備硬化を行うことにより、硬化前には接着剤層が比較的軟化しているのでウエハへの密着性がよく、かつダイシング時には適度な硬度を有しダイシングブレードへの接着剤の付着その他の不具合を防止することができる。また、支持体(樹脂フィルムまたはダイシングテープ)と、接着剤層の界面の密着性のコントロール等も可能となる。さらに、予備硬化状態では未硬化状態よりも硬度が高くなるため、ワイヤボンディング時の安定性が向上する。
硬化促進剤(E)は、接着剤組成物の硬化速度を調整するために用いられる。好ましい硬化促進剤としては、トリエチレンジアミン、ベンジルジメチルアミン、トリエタノールアミン、ジメチルアミノエタノール、トリス(ジメチルアミノメチル)フェノールなどの3級アミン類;2−メチルイミダゾール、2−フェニルイミダゾール、2−フェニル−4−メチルイミダゾール、2−フェニル−4,5−ジヒドロキシメチルイミダゾール、2−フェニル−4−メチル−5−ヒドロキシメチルイミダゾールなどのイミダゾール類;トリブチルホスフィン、ジフェニルホスフィン、トリフェニルホスフィンなどの有機ホスフィン類;テトラフェニルホスホニウムテトラフェニルボレート、トリフェニルホスフィンテトラフェニルボレートなどのテトラフェニルボロン塩などが挙げられる。これらは1種単独で、または2種以上混合して使用することができる。
接着剤組成物には、接着剤層の初期接着力および凝集力を調節するために、架橋剤(F)を添加することもできる。なお、架橋剤を配合する場合には、前記アクリル重合体(A)には、架橋剤と反応する官能基が含まれる。架橋剤(F)としては有機多価イソシアネート化合物、有機多価イミン化合物などが挙げられる。
接着剤組成物には、未硬化時、半硬化時および硬化後の接着剤層の硬度を調製するため、フィラーが含まれていても良い。フィラーは、いわゆる無機充填剤、有機充填剤のいずれであってもよいが、耐熱性の観点から無機充填剤が好ましく用いられる。
接着剤組成物には、エネルギー線重合性化合物が配合されていてもよい。エネルギー線重合性化合物(H)は、エネルギー線重合性基を含み、紫外線、電子線等のエネルギー線の照射を受けると重合硬化する。このようなエネルギー線重合性化合物(H)として具体的には、トリメチロールプロパントリアクリレート、ペンタエリスリトールトリアクリレート、ペンタエリスリトールテトラアクリレート、ジペンタエリスリトールモノヒドロキシペンタアクリレート、ジペンタエリスリトールヘキサアクリレートあるいは1,4−ブチレングリコールジアクリレート、1,6−ヘキサンジオールジアクリレート、ポリエチレングリコールジアクリレート、オリゴエステルアクリレート、ウレタンアクリレート系オリゴマー、エポキシ変性アクリレート、ポリエーテルアクリレートおよびイタコン酸オリゴマーなどのアクリレート系化合物が挙げられる。このような化合物は、分子内に少なくとも1つの重合性二重結合を有し、通常は、重量平均分子量が100〜30000、好ましくは300〜10000程度である。エネルギー線重合性化合物(H)を用いる場合、その配合量は、特に限定はされないが、接着剤組成物の固形分全量100質量部に対して、1〜50質量部程度の割合で用いることが好ましい。
接着剤組成物には、熱可塑性樹脂(I)を用いてもよい。熱可塑性樹脂(I)は、硬化後の接着剤層の可とう性を保持するために配合される。熱可塑性樹脂(I)としては、重量平均分子量が1000〜10万のものが好ましく、3000〜8万のものがさらに好ましい。熱可塑性樹脂(I)を含有することにより、半導体チップのピックアップ工程における支持体と接着剤層との層間剥離を容易に行うことができ、さらに基板の凹凸へ接着剤層が追従しボイドなどの発生を抑えることができる。
また、接着剤組成物には、前記カップリング剤(C)以外にも、反応性二重結合を有しないカップリング剤を配合してもよい。このようなカップリング剤(J)としては、反応性二重結合を有しないシランカップリング剤が挙げられ、具体的には、γ−グリシドキシプロピルトリメトキシシラン、γ−グリシドキシプロピルメチルジエトキシシラン、β−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、γ−アミノプロピルトリメトキシシラン、N−6−(アミノエチル)−γ−アミノプロピルトリメトキシシラン、N−6−(アミノエチル)−γ−アミノプロピルメチルジエトキシシラン、N−フェニル−γ−アミノプロピルトリメトキシシラン、γ−ウレイドプロピルトリエトキシシラン、γ−メルカプトプロピルトリメトキシシラン、γ−メルカプトプロピルメチルジメトキシシラン、ビス(3−トリエトキシシリルプロピル)テトラスルファン、メチルトリメトキシシラン、メチルトリエトキシシラン、イミダゾールシランなどが挙げられる。これらは1種単独で、または2種以上混合して使用することができる。
接着剤組成物には、上記の他に、必要に応じて各種添加剤が配合されてもよい。各種添加剤としては、可塑剤、帯電防止剤、酸化防止剤、顔料、染料、ゲッタリング剤などが挙げられる。
上記のような各成分からなる接着剤組成物からなる接着剤層は、感圧接着性と加熱硬化性とを有し、未硬化状態では各種被着体に軽く押圧して貼付することができる。また、接着剤層には、カップリング剤(C)が均一に分散しているため、チップ同士あるいはチップと基板とを相互に密着する。このため、多段パッケージの製造に際して接着剤層を一括硬化するプロセスを採用した場合であっても、ワイヤボンディングを安定して行え、しかも優れた接着強度で半導体チップを他の半導体チップや基板に接合することができ、過酷な環境下においても、高いパッケージ信頼性を示す半導体装置を得ることができる。光重合開始剤(D)が含まれる場合には、エネルギー線硬化性をも有し、本硬化の前にエネルギー線照射により予備硬化することができる。予備硬化により接着剤層の硬度が増し、ワイヤボンディング時の安定性が向上する。
本発明に係る半導体装置の製造方法は、上記接着シートの接着剤層に半導体ウエハを貼着し、該半導体ウエハ及び接着剤層をダイシングして半導体チップとし、該半導体チップ裏面に接着剤層を固着残存させて支持体から剥離し、該半導体チップを有機基板やリードフレームのダイパッド部上、または別の半導体チップ上に接着剤層を介して接着する工程を含む。
本発明に係る半導体装置の製造方法においては、まず、表面に回路が形成され、裏面が研削された半導体ウエハを準備する。
実施例および比較例で調製した接着剤組成物を、剥離フィルム上に20μmの厚みになるように塗工し、スジ発生の有無を目視にて確認した。フィラーの分散性が悪く、凝集している場合にはスジが発生する。
実施例および比較例で調製した接着剤組成物を、剥離フィルム上に乾燥後の厚みが20μmの厚みになるように塗工、乾燥し、接着フィルムを得た。箔張り積層板(三菱ガス化学株式会社製CCL-HL830)の銅箔(18μm厚)に回路パターンが形成され、パターン上にソルダーレジスト(太陽インキ製PSR-4000 AUS303)を有している基板 (株式会社ちの技研製LN001E−001 PCB(Au)AUS303)の上に接着フィルムを貼り付けたガラスチップ(8mm×8mm 厚み150μm)を、接着フィルムを介して150℃, 100gf, 1秒間の条件で圧着し、その後、モールド工程を仮定しヒートシールテスター(テスター産業社製TP-701)でチップ一個あたりにかかる圧力6.9Mpa、175℃、2分で熱圧着を行った。その後デジタル顕微鏡(キーエンス社製VHX-200)を用い倍率20倍でガラスチップ上面を観察し埋め込み性を確認した。埋め込み性はボイドなどの空気層を含んだ部分を除いてチップ面積の95%以上を埋め込んでいれば埋め込み性良好とした。
(半導体チップの製造)
ドライポリッシュ仕上げシリコンウエハ(150mm径, 厚さ75μm)の研磨面に、実施例および比較例の接着シートの貼付をテープマウンター(リンテック社製, Adwill RAD2500)により行い、ウエハダイシング用リングフレームに固定した。その後、紫外線照射装置(リンテック社製, Adwill RAD2000)を用いて支持体面から紫外線を照射(220mW/cm2, 160mJ/cm2)した。次いで、ダイシング装置(株式会社ディスコ製, DFD651)を使用して8mm×8mmのチップサイズにダイシングした。ダイシングの際の切り込み量は、支持体を20μm切り込むようにした。
基板として銅箔張り積層板(三菱ガス化学株式会社製CCL-HL830)の銅箔(18μm厚)に回路パターンが形成され、パターン上にソルダーレジスト(太陽インキ製PSR-4000 AUS303)を有している基板を用いた(株式会社ちの技研製LN001E−001 PCB(Au)AUS303)。上記で得た接着シート上のチップを接着剤層とともに支持体から取り上げ、基板上に、接着剤層を介して120℃, 250gf, 0.5秒間の条件で圧着した。その後、さらに接着した半導体チップの上に、別の半導体チップを接着剤層を介して再度120℃, 250gf, 0.5秒間の条件で圧着し半導体チップを2段積層した。その後、モールド樹脂(京セラケミカル株式会社製KE-1100AS3)で封止厚400μmになるように封止し (封止装置 アピックヤマダ株式会社製MPC-06M TriAl Press)、175℃,5時間で樹脂を硬化させた。ついで、封止された基板をダイシングテープ(リンテック株式会社製Adwill D-510T)に貼付して、ダイシング装置(株式会社ディスコ製, DFD651)を使用して8mm×8mmサイズにダイシングすることで信頼性評価用の半導体パッケージを得た。
得られた半導体パッケージを60℃,湿度60%RH条件下および85℃,湿度60%RH条件下に120時間放置し、吸湿させた後、プレヒート160℃で最高温度が260℃になる加熱時間1分間のIRリフロー(リフロー炉:相模理工製WL-15-20DNX型)を3回行なった際に接合部の浮き・剥がれの有無、パッケージクラック発生の有無を走査型超音波探傷装置(日立建機ファインテック株式会社製Hye-Focus)および断面研磨機(リファインテック株式会社製 リファイン・ポリッシャーHV)により断面を削り出し、(株式会社キーエンス製 VHX−100)を用いて断面観察により評価した。基板/半導体チップ接合部に長さ0.5mm以上の剥離を観察した場合を剥離していると判断して、パッケージを27個試験に投入し剥離が発生しなかった個数を数えた。
接着剤組成物を構成する各成分を下記に示す。
(A)アクリル重合体:日本合成化学工業社製 N−4617(水酸基含有)
(B)熱硬化性樹脂:
(B−1)アクリロイル基付加クレゾールノボラック型エポキシ樹脂(日本化薬株式会社製CNA−147)
(B−2)熱硬化剤:アラルキルフェノール樹脂(三井化学株式会社製ミレックスXLC−4L)
(C)カップリング剤:
(C−1)メタクリル基を有するシランカップリング剤(信越シリコーン社製 KBM-5103)
(C−2)エポキシ基を有するシランカップリング剤(信越シリコーン社製 KBE-402)
(C−3)エポキシ基を有するシランカップリング剤(信越シリコーン社製 KBE-403)
(C−4)メルカプト基を有するシランカップリング剤(信越シリコーン社製 KBM-803)
なお、カップリング剤の使用量は、接着剤組成物に含まれるカップリング剤由来のメトキシ基のモル数が実施例および比較例でほぼ等しくなるように調整した。
(D)光重合開始剤(チバ・スペシャルティ・ケミカルズ株式会社製イルガキュア184)
(E)硬化促進剤:イミダゾール(四国化成工業株式会社製キュアゾール2PHZ)
(F)架橋剤:芳香族性多価イソシアナート(日本ポリウレタン工業株式会社製コロネートL)
(G)フィラー:日産化学工業株式会社製 シリカゾルMEK−ST 平均フィラー粒径12nm
上記各成分を表1に記載の量(質量比)で配合し、接着剤組成物を得た。得られた組成物のメチルエチルケトン溶液(固形濃度30質量%)を用い、分散性を評価した。結果を表1に示す。また、接着剤組成物溶液を、シリコーンで剥離処理された剥離フィルム(リンテック株式会社製、SP−PET381031)の剥離処理面上に乾燥後20μmの厚みになるように塗布、乾燥(乾燥条件:オーブンにて100℃、1分間)した後に支持体(ポリエチレンフィルム、厚さ100μm、表面張力33mN/m)と貼り合せて、接着剤層を支持体上に転写することで接着シートを得た。得られた接着シートを用いて半導体パッケージを作成し、その信頼性を評価した。結果を表1に示す。表1中PKG信頼性はパッケージ信頼性を意味し、上述の評価において剥離が発生しなかった個数/27(試験に投入したパッケージの個数)であらわした。
Claims (8)
- アクリル重合体(A)、不飽和炭化水素基を有する熱硬化性樹脂(B)および反応性二重結合基を有するカップリング剤(C)を含む接着剤組成物。
- 前記カップリング剤(C)が、反応性二重結合を有するシランカップリング剤である請求項1に記載の接着剤組成物。
- フィラー(G)を含有する請求項1または2に記載の接着剤組成物。
- 請求項1〜3の何れかに記載の接着剤組成物からなる単層接着フィルム。
- 請求項1〜3の何れかに記載の接着剤組成物からなる接着剤層が、支持体上に形成されてなる接着シート。
- 支持体が、樹脂フィルムである請求項5に記載の接着シート。
- 支持体が、ダイシングシートである請求項5に記載の接着シート。
- 請求項5〜7の何れかに記載の接着シートの接着剤層に半導体ウエハを貼付し、前記半導体ウエハ及び接着剤層をダイシングして半導体チップとし、前記半導体チップに接着剤層を固着残存させて支持体から剥離し、前記半導体チップをダイパッド部上または他の半導体チップ上に前記接着剤層を介して接着する工程を含む半導体装置の製造方法。
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JP7326102B2 (ja) | 2019-10-07 | 2023-08-15 | リンテック株式会社 | 保護膜形成用フィルム及び保護膜形成用複合シート |
JP7326100B2 (ja) | 2019-10-07 | 2023-08-15 | リンテック株式会社 | 保護膜形成用フィルム及び保護膜形成用複合シート |
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JP5917215B2 (ja) | 2012-03-16 | 2016-05-11 | リンテック株式会社 | 接着剤組成物、接着シートおよび半導体装置の製造方法 |
WO2014192745A1 (ja) * | 2013-05-28 | 2014-12-04 | リンテック株式会社 | 接着剤組成物、接着シートおよび半導体装置の製造方法 |
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