TWI564972B - 沒有流動之底部填充物 - Google Patents

沒有流動之底部填充物 Download PDF

Info

Publication number
TWI564972B
TWI564972B TW100139205A TW100139205A TWI564972B TW I564972 B TWI564972 B TW I564972B TW 100139205 A TW100139205 A TW 100139205A TW 100139205 A TW100139205 A TW 100139205A TW I564972 B TWI564972 B TW I564972B
Authority
TW
Taiwan
Prior art keywords
conductive
conductive elements
component
microelectronic
pillars
Prior art date
Application number
TW100139205A
Other languages
English (en)
Chinese (zh)
Other versions
TW201225188A (en
Inventor
貝勒卡塞姆 哈巴
艾里亞斯 穆翰米德
耶里斯 喬
李勝伊
克雪爾 狄賽
Original Assignee
泰斯拉公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 泰斯拉公司 filed Critical 泰斯拉公司
Publication of TW201225188A publication Critical patent/TW201225188A/zh
Application granted granted Critical
Publication of TWI564972B publication Critical patent/TWI564972B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07252—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07253—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/227—Multiple bumps having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/953—Materials of bond pads not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
TW100139205A 2010-11-02 2011-10-27 沒有流動之底部填充物 TWI564972B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/938,068 US8697492B2 (en) 2010-11-02 2010-11-02 No flow underfill

Publications (2)

Publication Number Publication Date
TW201225188A TW201225188A (en) 2012-06-16
TWI564972B true TWI564972B (zh) 2017-01-01

Family

ID=44999895

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100139205A TWI564972B (zh) 2010-11-02 2011-10-27 沒有流動之底部填充物

Country Status (6)

Country Link
US (2) US8697492B2 (https=)
JP (1) JP5649739B2 (https=)
KR (2) KR20130140759A (https=)
CN (1) CN103283007B (https=)
TW (1) TWI564972B (https=)
WO (1) WO2012061199A2 (https=)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5592055B2 (ja) 2004-11-03 2014-09-17 テッセラ，インコーポレイテッド 積層パッケージングの改良
US8058101B2 (en) 2005-12-23 2011-11-15 Tessera, Inc. Microelectronic packages and methods therefor
US9159708B2 (en) 2010-07-19 2015-10-13 Tessera, Inc. Stackable molded microelectronic packages with area array unit connectors
US8482111B2 (en) 2010-07-19 2013-07-09 Tessera, Inc. Stackable molded microelectronic packages
US20120146206A1 (en) * 2010-12-13 2012-06-14 Tessera Research Llc Pin attachment
US11830845B2 (en) 2011-05-03 2023-11-28 Tessera Llc Package-on-package assembly with wire bonds to encapsulation surface
KR101128063B1 (ko) 2011-05-03 2012-04-23 테세라, 인코포레이티드 캡슐화 층의 표면에 와이어 본드를 구비하는 패키지 적층형 어셈블리
US8618659B2 (en) 2011-05-03 2013-12-31 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US8963340B2 (en) * 2011-09-13 2015-02-24 International Business Machines Corporation No flow underfill or wafer level underfill and solder columns
US8836136B2 (en) 2011-10-17 2014-09-16 Invensas Corporation Package-on-package assembly with wire bond vias
US8586408B2 (en) * 2011-11-08 2013-11-19 Taiwan Semiconductor Manufacturing Company, Ltd. Contact and method of formation
US8946757B2 (en) 2012-02-17 2015-02-03 Invensas Corporation Heat spreading substrate with embedded interconnects
US8372741B1 (en) 2012-02-24 2013-02-12 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US9917035B2 (en) * 2012-10-24 2018-03-13 Taiwan Semiconductor Manufacturing Co., Ltd. Bump-on-trace interconnection structure for flip-chip packages
US9646923B2 (en) 2012-04-17 2017-05-09 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
US8835228B2 (en) 2012-05-22 2014-09-16 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US9391008B2 (en) 2012-07-31 2016-07-12 Invensas Corporation Reconstituted wafer-level package DRAM
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US8889486B2 (en) * 2012-09-05 2014-11-18 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and apparatus for package on package structures
US9385098B2 (en) * 2012-11-21 2016-07-05 Nvidia Corporation Variable-size solder bump structures for integrated circuit packaging
US8878353B2 (en) 2012-12-20 2014-11-04 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
US9136254B2 (en) 2013-02-01 2015-09-15 Invensas Corporation Microelectronic package having wire bond vias and stiffening layer
US20140356986A1 (en) * 2013-05-31 2014-12-04 International Business Machines Corporation Precision controlled collapse chip connection mapping
US9167710B2 (en) 2013-08-07 2015-10-20 Invensas Corporation Embedded packaging with preformed vias
US9685365B2 (en) 2013-08-08 2017-06-20 Invensas Corporation Method of forming a wire bond having a free end
US20150076714A1 (en) 2013-09-16 2015-03-19 Invensas Corporation Microelectronic element with bond elements to encapsulation surface
US9263394B2 (en) 2013-11-22 2016-02-16 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9583456B2 (en) 2013-11-22 2017-02-28 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9379074B2 (en) 2013-11-22 2016-06-28 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US10381326B2 (en) 2014-05-28 2019-08-13 Invensas Corporation Structure and method for integrated circuits packaging with increased density
US9646917B2 (en) 2014-05-29 2017-05-09 Invensas Corporation Low CTE component with wire bond interconnects
US9412714B2 (en) 2014-05-30 2016-08-09 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
JP5873152B1 (ja) * 2014-09-29 2016-03-01 日本特殊陶業株式会社 配線基板
US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
US9502372B1 (en) 2015-04-30 2016-11-22 Invensas Corporation Wafer-level packaging using wire bond wires in place of a redistribution layer
US9761554B2 (en) 2015-05-07 2017-09-12 Invensas Corporation Ball bonding metal wire bond wires to metal pads
US9603283B1 (en) * 2015-10-09 2017-03-21 Raytheon Company Electronic module with free-formed self-supported vertical interconnects
US10490528B2 (en) 2015-10-12 2019-11-26 Invensas Corporation Embedded wire bond wires
US9490222B1 (en) 2015-10-12 2016-11-08 Invensas Corporation Wire bond wires for interference shielding
US10332854B2 (en) 2015-10-23 2019-06-25 Invensas Corporation Anchoring structure of fine pitch bva
US10181457B2 (en) 2015-10-26 2019-01-15 Invensas Corporation Microelectronic package for wafer-level chip scale packaging with fan-out
US10043779B2 (en) 2015-11-17 2018-08-07 Invensas Corporation Packaged microelectronic device for a package-on-package device
US9659848B1 (en) 2015-11-18 2017-05-23 Invensas Corporation Stiffened wires for offset BVA
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
KR101799668B1 (ko) * 2016-04-07 2017-11-20 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조 방법
US9935075B2 (en) 2016-07-29 2018-04-03 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding
US10299368B2 (en) 2016-12-21 2019-05-21 Invensas Corporation Surface integrated waveguides and circuit structures therefor
US10750614B2 (en) * 2017-06-12 2020-08-18 Invensas Corporation Deformable electrical contacts with conformable target pads
KR102830541B1 (ko) 2020-09-23 2025-07-07 삼성전자주식회사 반도체 칩의 접속 구조물 및 접속 구조물을 포함하는 반도체 패키지

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008219052A (ja) * 2008-06-13 2008-09-18 Fujitsu Ltd 半導体装置の製造方法
US20090258460A1 (en) * 2008-04-15 2009-10-15 Shinko Electric Industries Co., Ltd. Manufacturing method of semiconductor device

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7022A (en) * 1850-01-15 Cideb-mill
JP2716336B2 (ja) * 1993-03-10 1998-02-18 日本電気株式会社 集積回路装置
US6177636B1 (en) 1994-12-29 2001-01-23 Tessera, Inc. Connection components with posts
JPH0997791A (ja) 1995-09-27 1997-04-08 Internatl Business Mach Corp <Ibm> バンプ構造、バンプの形成方法、実装接続体
JP3971500B2 (ja) 1998-02-20 2007-09-05 ソニー株式会社 半導体素子実装用配線基板の製造方法
US6225206B1 (en) 1999-05-10 2001-05-01 International Business Machines Corporation Flip chip C4 extension structure and process
AU2002245103A1 (en) * 2000-11-14 2002-07-30 Henkel Loctite Corporation Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith
US6599775B2 (en) 2001-05-18 2003-07-29 Advanpack Solutions Pte Ltd Method for forming a flip chip semiconductor package, a semiconductor package formed thereby, and a substrate therefor
US7323360B2 (en) 2001-10-26 2008-01-29 Intel Corporation Electronic assemblies with filled no-flow underfill
US8641913B2 (en) 2003-10-06 2014-02-04 Tessera, Inc. Fine pitch microcontacts and method for forming thereof
JP2006100552A (ja) 2004-09-29 2006-04-13 Rohm Co Ltd 配線基板および半導体装置
US7573137B2 (en) * 2006-03-31 2009-08-11 Texas Instruments Incorporated Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices
JP2009158593A (ja) * 2007-12-25 2009-07-16 Tessera Interconnect Materials Inc バンプ構造およびその製造方法
US20100044860A1 (en) 2008-08-21 2010-02-25 Tessera Interconnect Materials, Inc. Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layer
JP5056718B2 (ja) * 2008-10-16 2012-10-24 株式会社デンソー 電子装置の製造方法
US7569935B1 (en) * 2008-11-12 2009-08-04 Powertech Technology Inc. Pillar-to-pillar flip-chip assembly
US8008122B1 (en) * 2010-09-21 2011-08-30 International Business Machines Corporation Pressurized underfill cure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090258460A1 (en) * 2008-04-15 2009-10-15 Shinko Electric Industries Co., Ltd. Manufacturing method of semiconductor device
JP2008219052A (ja) * 2008-06-13 2008-09-18 Fujitsu Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
US8697492B2 (en) 2014-04-15
KR20180061419A (ko) 2018-06-07
CN103283007B (zh) 2016-02-03
KR20130140759A (ko) 2013-12-24
TW201225188A (en) 2012-06-16
WO2012061199A2 (en) 2012-05-10
JP2013541858A (ja) 2013-11-14
US20120104595A1 (en) 2012-05-03
CN103283007A (zh) 2013-09-04
JP5649739B2 (ja) 2015-01-07
US20140217584A1 (en) 2014-08-07
KR101967322B1 (ko) 2019-04-09
WO2012061199A3 (en) 2012-06-28
US9196581B2 (en) 2015-11-24

Similar Documents

Publication Publication Date Title
TWI564972B (zh) 沒有流動之底部填充物
KR101388538B1 (ko) 이중 포스트를 사용하여 플립칩 상호연결한 마이크로전자 어셈블리
US8299626B2 (en) Microelectronic package
TWI763841B (zh) 形成具有豎立指向的電子構件的電子裝置結構的方法及相關結構
JP2009158593A (ja) バンプ構造およびその製造方法
JP2004343030A (ja) 配線回路基板とその製造方法とその配線回路基板を備えた回路モジュール
CN104685622A (zh) Bva中介结构
US20180166371A1 (en) Package structure and manufacturing method thereof
WO2010070806A1 (ja) 半導体装置とフリップチップ実装方法およびフリップチップ実装装置
JP2017028156A (ja) 実装構造体及びその製造方法
US6528889B1 (en) Electronic circuit device having adhesion-reinforcing pattern on a circuit board for flip-chip mounting an IC chip
KR20030090481A (ko) 비도전성 접착제로 ｉｃ 칩을 기판에 본딩하는 방법과형성된 조립물
JP2000022039A (ja) 半導体装置及びその製造方法
US20130277828A1 (en) Methods and Apparatus for bump-on-trace Chip Packaging
CN103229609B (zh) 第二级互连结构及其制造方法
JP2010118522A (ja) 半導体装置および半導体装置の製造方法
JP2005311293A (ja) 半導体チップ、半導体装置、半導体装置の製造方法及び電子機器
JP3582513B2 (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
EP4090141A1 (en) Composite wiring substrate, semiconductor device, and method of manufacturing composite wiring substrate
JP2010153670A (ja) フリップチップ実装方法と半導体装置
KR101887306B1 (ko) 범프-온-트레이스 칩 패키징용 디바이스 및 그 형성 방법
JP4619104B2 (ja) 半導体装置
CN108305864A (zh) 新型端子
JP2007335652A (ja) 半導体装置、回路基板及びそれらの製造方法
JP2001189338A (ja) 半導体装置、半導体装置の製造方法及び試験方法