TWI564386B - 水性鹼性組合物及處理矽基板表面之方法 - Google Patents
水性鹼性組合物及處理矽基板表面之方法 Download PDFInfo
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- TWI564386B TWI564386B TW101128828A TW101128828A TWI564386B TW I564386 B TWI564386 B TW I564386B TW 101128828 A TW101128828 A TW 101128828A TW 101128828 A TW101128828 A TW 101128828A TW I564386 B TWI564386 B TW I564386B
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- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 238000005211 surface analysis Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- IDYFACFOJYNFAX-UHFFFAOYSA-J tetrafluoroantimony Chemical compound F[Sb](F)(F)F IDYFACFOJYNFAX-UHFFFAOYSA-J 0.000 description 1
- IAQRGUVFOMOMEM-ONEGZZNKSA-N trans-but-2-ene Chemical compound C\C=C\C IAQRGUVFOMOMEM-ONEGZZNKSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
- AQLJVWUFPCUVLO-UHFFFAOYSA-N urea hydrogen peroxide Chemical compound OO.NC(N)=O AQLJVWUFPCUVLO-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- ZTWTYVWXUKTLCP-UHFFFAOYSA-N vinylphosphonic acid Chemical compound OP(O)(=O)C=C ZTWTYVWXUKTLCP-UHFFFAOYSA-N 0.000 description 1
- NLVXSWCKKBEXTG-UHFFFAOYSA-N vinylsulfonic acid Chemical compound OS(=O)(=O)C=C NLVXSWCKKBEXTG-UHFFFAOYSA-N 0.000 description 1
- 238000003631 wet chemical etching Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/04—Aqueous dispersions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/34—Organic compounds containing sulfur
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/70—Surface textures, e.g. pyramid structures
- H10F77/703—Surface textures, e.g. pyramid structures of the semiconductor bodies, e.g. textured active layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Dispersion Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Inorganic Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Photovoltaic Devices (AREA)
- Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)
- Detergent Compositions (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161521386P | 2011-08-09 | 2011-08-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201313894A TW201313894A (zh) | 2013-04-01 |
| TWI564386B true TWI564386B (zh) | 2017-01-01 |
Family
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| TW101128828A TWI564386B (zh) | 2011-08-09 | 2012-08-09 | 水性鹼性組合物及處理矽基板表面之方法 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US20140134778A1 (enExample) |
| JP (1) | JP2014529641A (enExample) |
| KR (1) | KR101922855B1 (enExample) |
| CN (1) | CN103717687B (enExample) |
| IN (1) | IN2014CN00877A (enExample) |
| MY (1) | MY167595A (enExample) |
| PH (1) | PH12014500150A1 (enExample) |
| SG (1) | SG10201605697UA (enExample) |
| TW (1) | TWI564386B (enExample) |
| WO (1) | WO2013021296A1 (enExample) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015033815A1 (ja) | 2013-09-05 | 2015-03-12 | 株式会社Ｋｉｔ | 水素製造装置、水素製造方法、水素製造用シリコン微細粒子、及び水素製造用シリコン微細粒子の製造方法 |
| CN104427781B (zh) * | 2013-09-11 | 2019-05-17 | 花王株式会社 | 树脂掩模层用洗涤剂组合物及电路基板的制造方法 |
| KR102668708B1 (ko) * | 2016-09-05 | 2024-05-23 | 동우 화인켐 주식회사 | 폴리실리콘 식각액 조성물 및 반도체 소자의 제조 방법 |
| WO2018083534A1 (en) * | 2016-11-03 | 2018-05-11 | Total Marketing Services | Surface treatment of solar cells |
| US10934485B2 (en) | 2017-08-25 | 2021-03-02 | Versum Materials Us, Llc | Etching solution for selectively removing silicon over silicon-germanium alloy from a silicon-germanium/ silicon stack during manufacture of a semiconductor device |
| CN108550639B (zh) * | 2018-03-21 | 2020-08-21 | 台州市棱智塑业有限公司 | 一种硅异质结太阳能电池界面处理剂及处理方法 |
| WO2020055529A1 (en) * | 2018-09-12 | 2020-03-19 | Fujifilm Electronic Materials U.S.A., Inc. | Etching compositions |
| KR102624328B1 (ko) * | 2018-10-31 | 2024-01-15 | 상라오 신위안 웨동 테크놀러지 디벨롭먼트 컴퍼니, 리미티드 | 태양 전지 모듈 |
| SG11202103910PA (en) | 2018-11-15 | 2021-05-28 | Entegris Inc | Silicon nitride etching composition and method |
| CN109609290B (zh) * | 2018-12-13 | 2021-04-09 | 蓝思科技（长沙）有限公司 | 一种玻璃抛光后用清洗剂和清洗方法 |
| WO2020166676A1 (ja) * | 2019-02-13 | 2020-08-20 | 株式会社トクヤマ | 次亜塩素酸イオン、及びｐＨ緩衝剤を含む半導体ウェハの処理液 |
| WO2020195343A1 (ja) * | 2019-03-26 | 2020-10-01 | 富士フイルムエレクトロニクスマテリアルズ株式会社 | 洗浄液 |
| CN110473936A (zh) * | 2019-07-26 | 2019-11-19 | 镇江仁德新能源科技有限公司 | 一种单面湿法黑硅制绒方法 |
| KR102869325B1 (ko) * | 2019-09-10 | 2025-10-14 | 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. | 에칭 조성물 |
| CN112745990B (zh) * | 2019-10-30 | 2022-06-03 | 洛阳阿特斯光伏科技有限公司 | 一种无磷双组份清洗剂及其制备方法和应用 |
| KR102752252B1 (ko) | 2020-03-24 | 2025-01-10 | 동우 화인켐 주식회사 | 결정성 실리콘 식각액 조성물, 및 이를 이용한 패턴 형성 방법 |
| CN112680229A (zh) * | 2021-01-29 | 2021-04-20 | 深圳市百通达科技有限公司 | 一种湿电子化学的硅基材料蚀刻液及其制备方法 |
| JP7760429B2 (ja) * | 2022-03-29 | 2025-10-27 | 株式会社フジミインコーポレーテッド | 表面処理組成物、表面処理方法、および半導体基板の製造方法 |
| CN116536653A (zh) * | 2023-05-09 | 2023-08-04 | 苏州尊恒半导体科技有限公司 | 一种高均匀度的晶圆化镀前处理方法 |
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| US20040077295A1 (en) * | 2002-08-05 | 2004-04-22 | Hellring Stuart D. | Process for reducing dishing and erosion during chemical mechanical planarization |
| JP2005268665A (ja) * | 2004-03-19 | 2005-09-29 | Fujimi Inc | 研磨用組成物 |
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| JP2007180451A (ja) * | 2005-12-28 | 2007-07-12 | Fujifilm Corp | 化学的機械的平坦化方法 |
| JP2008124222A (ja) * | 2006-11-10 | 2008-05-29 | Fujifilm Corp | 研磨液 |
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2012
- 2012-07-12 IN IN877CHN2014 patent/IN2014CN00877A/en unknown
- 2012-07-12 WO PCT/IB2012/053576 patent/WO2013021296A1/en not_active Ceased
- 2012-07-12 KR KR1020147003265A patent/KR101922855B1/ko not_active Expired - Fee Related
- 2012-07-12 CN CN201280038487.1A patent/CN103717687B/zh not_active Expired - Fee Related
- 2012-07-12 JP JP2014524461A patent/JP2014529641A/ja active Pending
- 2012-07-12 PH PH1/2014/500150A patent/PH12014500150A1/en unknown
- 2012-07-12 SG SG10201605697UA patent/SG10201605697UA/en unknown
- 2012-07-12 MY MYPI2013004626A patent/MY167595A/en unknown
- 2012-07-12 US US14/131,304 patent/US20140134778A1/en not_active Abandoned
- 2012-08-09 TW TW101128828A patent/TWI564386B/zh not_active IP Right Cessation
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| US20080254628A1 (en) * | 2005-08-05 | 2008-10-16 | Advanced Technology Materials, Inc. | High throughput chemical mechanical polishing composition for metal film planarization |
| US20090239777A1 (en) * | 2006-09-21 | 2009-09-24 | Advanced Technology Materials, Inc. | Antioxidants for post-cmp cleaning formulations |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013021296A1 (en) | 2013-02-14 |
| CN103717687A (zh) | 2014-04-09 |
| SG10201605697UA (en) | 2016-09-29 |
| JP2014529641A (ja) | 2014-11-13 |
| IN2014CN00877A (enExample) | 2015-04-03 |
| CN103717687B (zh) | 2016-05-18 |
| TW201313894A (zh) | 2013-04-01 |
| KR101922855B1 (ko) | 2019-02-27 |
| KR20140057259A (ko) | 2014-05-12 |
| MY167595A (en) | 2018-09-20 |
| US20140134778A1 (en) | 2014-05-15 |
| PH12014500150A1 (en) | 2014-02-24 |
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