SG10201605697UA - Aqueous alkaline compositions and method for treating the surface of silicon substrates - Google Patents

Aqueous alkaline compositions and method for treating the surface of silicon substrates

Info

Publication number
SG10201605697UA
SG10201605697UA SG10201605697UA SG10201605697UA SG10201605697UA SG 10201605697U A SG10201605697U A SG 10201605697UA SG 10201605697U A SG10201605697U A SG 10201605697UA SG 10201605697U A SG10201605697U A SG 10201605697UA SG 10201605697U A SG10201605697U A SG 10201605697UA
Authority
SG
Singapore
Prior art keywords
treating
aqueous alkaline
silicon substrates
alkaline compositions
compositions
Prior art date
Application number
SG10201605697UA
Other languages
English (en)
Inventor
Berthold Ferstl
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of SG10201605697UA publication Critical patent/SG10201605697UA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/34—Organic compounds containing sulfur
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/121—The active layers comprising only Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/70—Surface textures, e.g. pyramid structures
    • H10F77/703—Surface textures, e.g. pyramid structures of the semiconductor bodies, e.g. textured active layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/547—Monocrystalline silicon PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Photovoltaic Devices (AREA)
  • Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)
  • Detergent Compositions (AREA)
SG10201605697UA 2011-08-09 2012-07-12 Aqueous alkaline compositions and method for treating the surface of silicon substrates SG10201605697UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161521386P 2011-08-09 2011-08-09

Publications (1)

Publication Number Publication Date
SG10201605697UA true SG10201605697UA (en) 2016-09-29

Family

ID=47667939

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201605697UA SG10201605697UA (en) 2011-08-09 2012-07-12 Aqueous alkaline compositions and method for treating the surface of silicon substrates

Country Status (10)

Country Link
US (1) US20140134778A1 (enExample)
JP (1) JP2014529641A (enExample)
KR (1) KR101922855B1 (enExample)
CN (1) CN103717687B (enExample)
IN (1) IN2014CN00877A (enExample)
MY (1) MY167595A (enExample)
PH (1) PH12014500150A1 (enExample)
SG (1) SG10201605697UA (enExample)
TW (1) TWI564386B (enExample)
WO (1) WO2013021296A1 (enExample)

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WO2015033815A1 (ja) 2013-09-05 2015-03-12 株式会社Ｋｉｔ 水素製造装置、水素製造方法、水素製造用シリコン微細粒子、及び水素製造用シリコン微細粒子の製造方法
CN104427781B (zh) * 2013-09-11 2019-05-17 花王株式会社 树脂掩模层用洗涤剂组合物及电路基板的制造方法
KR102668708B1 (ko) * 2016-09-05 2024-05-23 동우 화인켐 주식회사 폴리실리콘 식각액 조성물 및 반도체 소자의 제조 방법
WO2018083534A1 (en) * 2016-11-03 2018-05-11 Total Marketing Services Surface treatment of solar cells
US10934485B2 (en) 2017-08-25 2021-03-02 Versum Materials Us, Llc Etching solution for selectively removing silicon over silicon-germanium alloy from a silicon-germanium/ silicon stack during manufacture of a semiconductor device
CN108550639B (zh) * 2018-03-21 2020-08-21 台州市棱智塑业有限公司 一种硅异质结太阳能电池界面处理剂及处理方法
WO2020055529A1 (en) * 2018-09-12 2020-03-19 Fujifilm Electronic Materials U.S.A., Inc. Etching compositions
KR102624328B1 (ko) * 2018-10-31 2024-01-15 상라오 신위안 웨동 테크놀러지 디벨롭먼트 컴퍼니, 리미티드 태양 전지 모듈
SG11202103910PA (en) 2018-11-15 2021-05-28 Entegris Inc Silicon nitride etching composition and method
CN109609290B (zh) * 2018-12-13 2021-04-09 蓝思科技（长沙）有限公司 一种玻璃抛光后用清洗剂和清洗方法
WO2020166676A1 (ja) * 2019-02-13 2020-08-20 株式会社トクヤマ 次亜塩素酸イオン、及びｐＨ緩衝剤を含む半導体ウェハの処理液
WO2020195343A1 (ja) * 2019-03-26 2020-10-01 富士フイルムエレクトロニクスマテリアルズ株式会社 洗浄液
CN110473936A (zh) * 2019-07-26 2019-11-19 镇江仁德新能源科技有限公司 一种单面湿法黑硅制绒方法
KR102869325B1 (ko) * 2019-09-10 2025-10-14 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 에칭 조성물
CN112745990B (zh) * 2019-10-30 2022-06-03 洛阳阿特斯光伏科技有限公司 一种无磷双组份清洗剂及其制备方法和应用
KR102752252B1 (ko) 2020-03-24 2025-01-10 동우 화인켐 주식회사 결정성 실리콘 식각액 조성물, 및 이를 이용한 패턴 형성 방법
CN112680229A (zh) * 2021-01-29 2021-04-20 深圳市百通达科技有限公司 一种湿电子化学的硅基材料蚀刻液及其制备方法
JP7760429B2 (ja) * 2022-03-29 2025-10-27 株式会社フジミインコーポレーテッド 表面処理組成物、表面処理方法、および半導体基板の製造方法
CN116536653A (zh) * 2023-05-09 2023-08-04 苏州尊恒半导体科技有限公司 一种高均匀度的晶圆化镀前处理方法

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Also Published As

Publication number Publication date
WO2013021296A1 (en) 2013-02-14
CN103717687A (zh) 2014-04-09
JP2014529641A (ja) 2014-11-13
IN2014CN00877A (enExample) 2015-04-03
TWI564386B (zh) 2017-01-01
CN103717687B (zh) 2016-05-18
TW201313894A (zh) 2013-04-01
KR101922855B1 (ko) 2019-02-27
KR20140057259A (ko) 2014-05-12
MY167595A (en) 2018-09-20
US20140134778A1 (en) 2014-05-15
PH12014500150A1 (en) 2014-02-24

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