TWI558468B - Liquid film material dispensing device - Google Patents

Liquid film material dispensing device Download PDF

Info

Publication number
TWI558468B
TWI558468B TW103140646A TW103140646A TWI558468B TW I558468 B TWI558468 B TW I558468B TW 103140646 A TW103140646 A TW 103140646A TW 103140646 A TW103140646 A TW 103140646A TW I558468 B TWI558468 B TW I558468B
Authority
TW
Taiwan
Prior art keywords
tank
film material
path
pressure sensor
pressure
Prior art date
Application number
TW103140646A
Other languages
English (en)
Chinese (zh)
Other versions
TW201534401A (zh
Inventor
Jyun Nishimaki
Original Assignee
Sumitomo Heavy Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries filed Critical Sumitomo Heavy Industries
Publication of TW201534401A publication Critical patent/TW201534401A/zh
Application granted granted Critical
Publication of TWI558468B publication Critical patent/TWI558468B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work

Landscapes

  • Coating Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW103140646A 2014-03-11 2014-11-24 Liquid film material dispensing device TWI558468B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014047141A JP6436634B2 (ja) 2014-03-11 2014-03-11 液状の膜材料の吐出装置

Publications (2)

Publication Number Publication Date
TW201534401A TW201534401A (zh) 2015-09-16
TWI558468B true TWI558468B (zh) 2016-11-21

Family

ID=54076904

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103140646A TWI558468B (zh) 2014-03-11 2014-11-24 Liquid film material dispensing device

Country Status (4)

Country Link
JP (1) JP6436634B2 (ja)
KR (1) KR101730506B1 (ja)
CN (1) CN104907222B (ja)
TW (1) TWI558468B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107262330B (zh) * 2017-05-20 2019-05-07 郑州轻工业学院 一种带ccd计算机视觉定位的smt涂绘装置
JP6980339B2 (ja) * 2017-09-05 2021-12-15 住友重機械工業株式会社 液体材料吐出装置及び液体材料吐出方法
KR102008709B1 (ko) * 2017-12-27 2019-08-09 (주)임펙 엔터프라이즈 코팅액 공급 장치 및 방법과 이를 위한 토출밸브
JP6964010B2 (ja) * 2018-01-26 2021-11-10 日東シンコー株式会社 コーティング剤供給装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW343163B (en) * 1995-10-13 1998-10-21 Misuzu Saw Mfg Temperature controlling device for a flow coater
TW200410760A (en) * 2002-07-31 2004-07-01 Seiko Epson Corp Droplet discharge method and device, method of manufacturing liquid crystal device and liquid crystal device, and electronic apparatus
CN1629211A (zh) * 2003-12-01 2005-06-22 森泰浩 固体物质的表面改性方法以及经表面改性的固体物质
TW200716262A (en) * 2005-07-25 2007-05-01 Seiko Epson Corp Method of forming film, patterning and method of manufacturing electronic device using thereof
CN101903303A (zh) * 2007-12-20 2010-12-01 Beneq有限公司 用于形成气溶胶的装置以及用于涂覆玻璃的方法和设备
US20120304921A1 (en) * 2011-06-02 2012-12-06 Tokyo Ohka Kogyo Co., Ltd. Heating apparatus, coating apparatus and heating method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001314801A (ja) * 2000-05-09 2001-11-13 Seven Tec:Kk 液剤施工システム
JP2004087800A (ja) * 2002-08-27 2004-03-18 Tokyo Electron Ltd 成膜装置および成膜装置の供給ノズル吐出制御方法
JP2005131829A (ja) 2003-10-28 2005-05-26 Sony Corp 液体吐出性能維持方法及び液体吐出装置
JP4438678B2 (ja) * 2005-04-22 2010-03-24 セイコーエプソン株式会社 液滴吐出方法と液滴吐出装置、薄膜形成方法及びデバイス並びに電子機器
JP2007216108A (ja) 2006-02-15 2007-08-30 Hitachi Plant Technologies Ltd 塗布装置
US7770760B2 (en) * 2007-02-12 2010-08-10 Illinois Tool Works Inc. Modular system for the delivery of hot melt adhesive or other thermoplastic materials
JP2008264767A (ja) * 2007-03-28 2008-11-06 Toshiba Corp 液滴噴射塗布装置及び塗布体の製造方法
JP5169120B2 (ja) * 2007-10-05 2013-03-27 リコープリンティングシステムズ株式会社 液滴塗布装置
JP2012096524A (ja) * 2010-05-24 2012-05-24 Panasonic Corp 循環式インクジェット装置
JP2013110236A (ja) * 2011-11-21 2013-06-06 Sumitomo Heavy Ind Ltd 薄膜パターン形成装置及び薄膜パターン形成方法
JP5524154B2 (ja) * 2011-09-09 2014-06-18 東京エレクトロン株式会社 液処理装置及び液処理方法
JP5698638B2 (ja) 2011-09-27 2015-04-08 富士フイルム株式会社 液体付与装置及びインクジェット記録装置
US20140014683A1 (en) * 2012-07-13 2014-01-16 Nordson Corporation Hot melt dispensing unit and method with integrated flow control
JP2014030807A (ja) * 2012-08-06 2014-02-20 Sumitomo Heavy Ind Ltd 薄膜形成装置及び基板製造方法
CN203370688U (zh) * 2013-07-19 2014-01-01 中国科学院理化技术研究所 涂布装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW343163B (en) * 1995-10-13 1998-10-21 Misuzu Saw Mfg Temperature controlling device for a flow coater
TW200410760A (en) * 2002-07-31 2004-07-01 Seiko Epson Corp Droplet discharge method and device, method of manufacturing liquid crystal device and liquid crystal device, and electronic apparatus
CN1629211A (zh) * 2003-12-01 2005-06-22 森泰浩 固体物质的表面改性方法以及经表面改性的固体物质
TW200716262A (en) * 2005-07-25 2007-05-01 Seiko Epson Corp Method of forming film, patterning and method of manufacturing electronic device using thereof
CN101903303A (zh) * 2007-12-20 2010-12-01 Beneq有限公司 用于形成气溶胶的装置以及用于涂覆玻璃的方法和设备
US20120304921A1 (en) * 2011-06-02 2012-12-06 Tokyo Ohka Kogyo Co., Ltd. Heating apparatus, coating apparatus and heating method

Also Published As

Publication number Publication date
CN104907222B (zh) 2018-02-16
TW201534401A (zh) 2015-09-16
KR20150106323A (ko) 2015-09-21
JP2015170831A (ja) 2015-09-28
CN104907222A (zh) 2015-09-16
JP6436634B2 (ja) 2018-12-12
KR101730506B1 (ko) 2017-04-26

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MM4A Annulment or lapse of patent due to non-payment of fees