TWI556264B - A conductive composition, and a circuit substrate in which a conductive film is formed by the composition - Google Patents

A conductive composition, and a circuit substrate in which a conductive film is formed by the composition Download PDF

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Publication number
TWI556264B
TWI556264B TW102117741A TW102117741A TWI556264B TW I556264 B TWI556264 B TW I556264B TW 102117741 A TW102117741 A TW 102117741A TW 102117741 A TW102117741 A TW 102117741A TW I556264 B TWI556264 B TW I556264B
Authority
TW
Taiwan
Prior art keywords
conductive
composition
film
bis
mass
Prior art date
Application number
TW102117741A
Other languages
English (en)
Chinese (zh)
Other versions
TW201401302A (zh
Inventor
Kazunobu Fukushima
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Publication of TW201401302A publication Critical patent/TW201401302A/zh
Application granted granted Critical
Publication of TWI556264B publication Critical patent/TWI556264B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00—Coating compositions based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/07—Aldehydes; Ketones
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing & Machinery (AREA)
TW102117741A 2012-05-22 2013-05-20 A conductive composition, and a circuit substrate in which a conductive film is formed by the composition TWI556264B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012116703 2012-05-22
JP2012214920 2012-09-27

Publications (2)

Publication Number Publication Date
TW201401302A TW201401302A (zh) 2014-01-01
TWI556264B true TWI556264B (zh) 2016-11-01

Family

ID=49623662

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102117741A TWI556264B (zh) 2012-05-22 2013-05-20 A conductive composition, and a circuit substrate in which a conductive film is formed by the composition

Country Status (5)

Country Link
JP (1) JP6002216B2 (ja)
KR (2) KR20160044065A (ja)
CN (2) CN104170021B (ja)
TW (1) TWI556264B (ja)
WO (1) WO2013175965A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6404558B2 (ja) * 2013-10-18 2018-10-10 国立大学法人大阪大学 樹脂硬化物の製造方法
JP2016146290A (ja) * 2015-02-09 2016-08-12 日立化成株式会社 導電性組成物、それを用いた導電性材料及び導電体
US10633550B2 (en) 2017-08-31 2020-04-28 Xerox Corporation Molecular organic reactive inks for conductive silver printing
US10814659B2 (en) 2018-06-28 2020-10-27 Xerox Corporation Methods for printing conductive objects

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0399299A2 (en) * 1989-05-26 1990-11-28 International Business Machines Corporation Electrically conductive polymeric materials and uses thereof
CN1746770A (zh) * 2004-09-09 2006-03-15 三星Sdi株式会社 光敏糊状物组合物
TW200911558A (en) * 2007-05-18 2009-03-16 Applied Nanotech Holdings Inc Metallic ink
JP2010146995A (ja) * 2008-12-22 2010-07-01 Hitachi Maxell Ltd 透明導電性シートの製造方法
JP2011086582A (ja) * 2009-10-19 2011-04-28 Hitachi Maxell Ltd 透明導電性シートの製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003140330A (ja) * 2001-11-05 2003-05-14 Nippon Paint Co Ltd 導電性パターニング組成物及びこれを用いた導電性パターン膜の製造方法
JP4382364B2 (ja) * 2002-04-24 2009-12-09 株式会社東芝 液体インク
JP2004123775A (ja) * 2002-09-30 2004-04-22 Taiyo Ink Mfg Ltd 感光性熱硬化性ペースト組成物
JP4411113B2 (ja) * 2004-03-24 2010-02-10 太陽インキ製造株式会社 感光性導電ペースト及びそれを用いて形成した導電体パターン
JP2008274096A (ja) * 2007-04-27 2008-11-13 Sanyo Chem Ind Ltd 導電インク組成物
JP5715851B2 (ja) * 2011-02-24 2015-05-13 東芝テック株式会社 ナノ粒子インク組成物を用いた印刷物の製造方法
JP5821244B2 (ja) * 2011-03-31 2015-11-24 大日本印刷株式会社 金属微粒子分散体、導電性基板及びその製造方法
JP5733513B2 (ja) * 2011-04-15 2015-06-10 ダイソー株式会社 金属微粒子含有光硬化性樹脂組成物及びその利用
JP2013196997A (ja) * 2012-03-22 2013-09-30 Toray Ind Inc 導電性組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0399299A2 (en) * 1989-05-26 1990-11-28 International Business Machines Corporation Electrically conductive polymeric materials and uses thereof
CN1746770A (zh) * 2004-09-09 2006-03-15 三星Sdi株式会社 光敏糊状物组合物
TW200911558A (en) * 2007-05-18 2009-03-16 Applied Nanotech Holdings Inc Metallic ink
JP2010146995A (ja) * 2008-12-22 2010-07-01 Hitachi Maxell Ltd 透明導電性シートの製造方法
JP2011086582A (ja) * 2009-10-19 2011-04-28 Hitachi Maxell Ltd 透明導電性シートの製造方法

Also Published As

Publication number Publication date
CN104170021B (zh) 2017-09-15
TW201401302A (zh) 2014-01-01
WO2013175965A1 (ja) 2013-11-28
KR20160044065A (ko) 2016-04-22
CN104170021A (zh) 2014-11-26
JPWO2013175965A1 (ja) 2016-01-12
JP6002216B2 (ja) 2016-10-05
KR20140126737A (ko) 2014-10-31
CN107274968A (zh) 2017-10-20

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