TWI555871B - Method for film formation of ruthenium oxide film - Google Patents

Method for film formation of ruthenium oxide film Download PDF

Info

Publication number
TWI555871B
TWI555871B TW101140783A TW101140783A TWI555871B TW I555871 B TWI555871 B TW I555871B TW 101140783 A TW101140783 A TW 101140783A TW 101140783 A TW101140783 A TW 101140783A TW I555871 B TWI555871 B TW I555871B
Authority
TW
Taiwan
Prior art keywords
film
gas
compound
ruthenium
oxide film
Prior art date
Application number
TW101140783A
Other languages
English (en)
Chinese (zh)
Other versions
TW201333249A (zh
Inventor
野呂尚孝
芦澤宏明
原隼也
岩井隆晃
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW201333249A publication Critical patent/TW201333249A/zh
Application granted granted Critical
Publication of TWI555871B publication Critical patent/TWI555871B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/42Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a gas or vapour
    • H10P14/43Chemical deposition, e.g. chemical vapour deposition [CVD]
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/01Manufacture or treatment
    • H10B12/02Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03Making the capacitor or connections thereto
    • H10B12/033Making the capacitor or connections thereto the capacitor extending over the transistor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/60Capacitors
    • H10D1/68Capacitors having no potential barriers
    • H10D1/692Electrodes
    • H10D1/694Electrodes comprising noble metals or noble metal oxides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326Deposition processes
    • H10P14/6328Deposition from the gas or vapour phase
    • H10P14/6334Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Semiconductor Memories (AREA)
TW101140783A 2011-11-04 2012-11-02 Method for film formation of ruthenium oxide film TWI555871B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011242630 2011-11-04
JP2012214090A JP6114525B2 (ja) 2011-11-04 2012-09-27 酸化ルテニウム膜の成膜方法

Publications (2)

Publication Number Publication Date
TW201333249A TW201333249A (zh) 2013-08-16
TWI555871B true TWI555871B (zh) 2016-11-01

Family

ID=48223863

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101140783A TWI555871B (zh) 2011-11-04 2012-11-02 Method for film formation of ruthenium oxide film

Country Status (4)

Country Link
US (1) US20130115367A1 (https=)
JP (1) JP6114525B2 (https=)
KR (1) KR101493130B1 (https=)
TW (1) TWI555871B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6118149B2 (ja) * 2013-03-21 2017-04-19 東京エレクトロン株式会社 ルテニウム膜の形成方法および記憶媒体
KR101628843B1 (ko) * 2014-02-24 2016-06-10 영남대학교 산학협력단 원자층 증착법에 의한 루테늄 박막 형성 방법
CN120937114A (zh) * 2023-04-13 2025-11-11 周星工程股份有限公司 形成钌氧化物膜的方法及制造包括钌氧化物膜的半导体装置的方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6303809B1 (en) * 1999-12-10 2001-10-16 Yun Chi Organometallic ruthenium and osmium source reagents for chemical vapor deposition
CN1451780A (zh) * 2002-04-18 2003-10-29 田中贵金属工业株式会社 Cvd用原料化合物以及钌或钌化合物薄膜的化学气相蒸镀方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3224450B2 (ja) * 1993-03-26 2001-10-29 日本酸素株式会社 酸化ルテニウムの成膜方法
JP3676004B2 (ja) * 1996-11-28 2005-07-27 富士通株式会社 酸化ルテニウム膜の形成方法および半導体装置の製造方法
JP4152028B2 (ja) * 1999-01-25 2008-09-17 株式会社Adeka ルテニウム系薄膜の製造方法
KR100727372B1 (ko) * 2001-09-12 2007-06-12 토소가부시키가이샤 루테늄착체, 그 제조방법 및 박막의 제조방법
US6784096B2 (en) * 2002-09-11 2004-08-31 Applied Materials, Inc. Methods and apparatus for forming barrier layers in high aspect ratio vias
KR100505674B1 (ko) * 2003-02-26 2005-08-03 삼성전자주식회사 루테늄 박막을 제조하는 방법 및 이를 이용한 mim캐패시터의 제조방법
US20070014919A1 (en) * 2005-07-15 2007-01-18 Jani Hamalainen Atomic layer deposition of noble metal oxides
US20100047988A1 (en) * 2008-08-19 2010-02-25 Youn-Joung Cho Methods of forming a layer, methods of forming a gate structure and methods of forming a capacitor
JP4746141B1 (ja) * 2010-06-24 2011-08-10 田中貴金属工業株式会社 化学蒸着用の有機ルテニウム化合物及び該有機ルテニウム化合物を用いた化学蒸着方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6303809B1 (en) * 1999-12-10 2001-10-16 Yun Chi Organometallic ruthenium and osmium source reagents for chemical vapor deposition
CN1451780A (zh) * 2002-04-18 2003-10-29 田中贵金属工业株式会社 Cvd用原料化合物以及钌或钌化合物薄膜的化学气相蒸镀方法

Also Published As

Publication number Publication date
TW201333249A (zh) 2013-08-16
JP6114525B2 (ja) 2017-04-12
JP2013117067A (ja) 2013-06-13
KR101493130B1 (ko) 2015-02-12
KR20130049743A (ko) 2013-05-14
US20130115367A1 (en) 2013-05-09

Similar Documents

Publication Publication Date Title
JP4803578B2 (ja) 成膜方法
KR100960273B1 (ko) 반도체 장치의 제조 방법 및 기판 처리 장치
CN101395297B (zh) 钌膜的成膜方法以及计算机能够读取的存储介质
JP4753841B2 (ja) 半導体デバイスの製造方法
TWI555871B (zh) Method for film formation of ruthenium oxide film
CN101302608A (zh) 金属氧化膜的成膜
KR101171558B1 (ko) 성막 방법 및 기억 매체
JP6118149B2 (ja) ルテニウム膜の形成方法および記憶媒体
CN102317499A (zh) Cu膜的成膜方法和存储介质
JP5095230B2 (ja) SrTiO3膜の成膜方法およびコンピュータ読取可能な記憶媒体
JP2013199673A (ja) 酸化ルテニウム膜の成膜方法および酸化ルテニウム膜成膜用処理容器のクリーニング方法
WO2010095498A1 (ja) Cu膜の成膜方法および記憶媒体
TW200525616A (en) Film formation method and apparatus for semiconductor process
JP2010209425A (ja) Cu膜の成膜方法および記憶媒体
CN102348830A (zh) Cu膜的成膜方法和存储介质
JP2008205325A (ja) 半導体装置の製造方法、及び基板処理装置
JP5659041B2 (ja) 成膜方法および記憶媒体
JP2010212323A (ja) Cu膜の成膜方法および記憶媒体
JP2010192600A (ja) Cu膜の成膜方法および記憶媒体
JP2010202947A (ja) Cu膜の成膜方法および記憶媒体
JP2010189727A (ja) Cu膜の成膜方法および記憶媒体